CN101201775A - Testing clamp for circuit board - Google Patents
Testing clamp for circuit board Download PDFInfo
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- CN101201775A CN101201775A CNA2006101623950A CN200610162395A CN101201775A CN 101201775 A CN101201775 A CN 101201775A CN A2006101623950 A CNA2006101623950 A CN A2006101623950A CN 200610162395 A CN200610162395 A CN 200610162395A CN 101201775 A CN101201775 A CN 101201775A
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- platform
- circuit board
- heat
- radiating module
- electronic elements
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Abstract
The invention relates to a test clamp of a circuit board, which is used for testing the circuit board and dispersing the heat generated by a thermal electronic element on the circuit board. The invention comprises a fixing plate which holds the circuit board, a platform which carries a radiating module used for dispersing heat and a displacement mechanism to lead the platform to move between a preparatory position and a joint position. When the platform is positioned at the preparatory position, the radiating module and the thermal electronic element are in a separated state, and when the platform is positioned at the joint position, the radiating module affixes to the thermal electronic element to disperse heat. The radiating module of the invention can affix to the obverse side of a CPU chip without direct impact or single point impact on the CPU chip, thus avoiding damages caused by uneven stress.
Description
Technical field
The present invention relates to a kind of circuit board test clamp, refer in particular to a kind of test fixture that can progressively fit in the CPU (central processing unit) chip.
Background technology
The general motherboard of producing must take a decision as to whether defective products through trace routine after assembling is finished at present, it is to fix the test of being correlated with again behind the board under test by designing a test fixture, and be equiped with the radiating module main body of corresponding board under test, fit with CPU (central processing unit) chip, in order to the test of dispelling the heat with board under test.Yet this situation is often because the required radiating module difference of every product type causes the radiating module shape of each type and size also inequality, and is unfavorable for test jobs.
In addition, if manufacture and design company because the difference of radiating module shipment, cause CPU (central processing unit) chip (the Central Processing Unit on the product type, CPU) in the time of needn't be along with the main frame shipment, the tester then need be with the radiating module removal that originally locked on the CPU (central processing unit) chip, so, the problem of reworking will be caused, and one adorn one and also make the thread of original locking damage to some extent between tearing open.Moreover, when carrying out test jobs, radiating module is placed on the bakelite, and board under test is to move towards the direction of radiating module from top to bottom in the manpower mode, so that the CPU (central processing unit) chip of board under test and radiating module are done a pressing action that closely pastes.Yet the direct forward of this CPU (central processing unit) chip fits in the mode of radiating module, causes CPU (central processing unit) chip unbalance stress easily, and then causes damage, and test jobs also can't be proceeded.
A kind of general-purpose radiating module test fixture of being disclosed of TaiWan, China patent announcement M268578 case (hereinafter to be referred as 578 cases) and for example.In 578 cases, design has fixing frame plate on test fixture, fixing frame plate is provided with radiating module, fixing frame plate and be articulated on the test fixture by two hinges, when board under test is arranged on the test fixture, fixing frame plate so that the CPU (central processing unit) chip on the board under test is dispelled the heat, is avoided the overheated of CPU (central processing unit) chip in the test process towards the rotation of the position of CPU (central processing unit) chip and pressing thereon.Because fixing frame plate is to be arranged on the test fixture with rotatable relation, the radiating module that also promptly is positioned on the fixing frame plate is to come pressing CPU (central processing unit) chip with rotation mode, and such mode often makes radiating module first single-point in the pressing process strike the crystal grain on the CPU (central processing unit) chip easily, afterwards along with just little by little pressing on it of the rotation of fixing frame plate, because fixing frame plate is not to do the pressing action along the normal direction of CPU (central processing unit) chip, this makes CPU (central processing unit) chip unbalance stress equally and causes damage.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of circuit board test clamp, the CPU (central processing unit) chip that solves board under test in the known techniques directly radiating module direction on the test fixture moves to fit with radiating module is positive, there is no the progressively mechanism of guiding, therefore cause the problem of the damage of CPU (central processing unit) chip, also solve if the mode that radiating module is fitted with rotation is pressed on the CPU (central processing unit) chip, the first single-point of meeting strikes the crystal grain of CPU (central processing unit) chip, make CPU (central processing unit) chip unbalance stress, can cause the problem of damage equally.
To achieve these goals, the invention provides a kind of circuit board test clamp, in order to testing a circuit board, and the heat that produced of the heat-generating electronic elements that removes this circuit board of loosing, its characteristics are, include: fixing frame plate carries this circuit board; Platform carries a radiating module, and this radiating module removes heat in order to loose; And displacement mechanism, platform is moved between a ready position and an applying position, when this platform is positioned at this ready position, this radiating module and the separated attitude of this heat-generating electronic elements, when this platform was positioned at this applying position, this radiating module was covered on this heat-generating electronic elements and removes heat to loose.
Foregoing circuit board test fixture, its characteristics are that this radiating module also includes a heat radiation lamellar body, and when this platform was positioned at this applying position, this heat radiator was shown consideration for and is overlying on this heat-generating electronic elements to loose except that the heat that this heat-generating electronic elements was produced.
Foregoing circuit board test fixture, its characteristics are that this radiating module also includes a radiator fan, blow to this heat radiation lamellar body in order to produce an air-flow.
Foregoing circuit board test fixture, its characteristics are, also include at least one platform rail, and this platform rail is guided the mobile route of this platform, so that this radiating module closely connects and be covered on this heat-generating electronic elements with the path on vertical this heat-generating electronic elements surface.
Foregoing circuit board test fixture, its characteristics are that this displacement mechanism also includes: at least one leads-slanting section, this leads-slanting section have one first end and second end with respect to this first end; And at least one guide element, be located at this platform, this guide element slippage in this leads-slanting section and in the lump this platform of interlock move, when this guide element is positioned at this first end, this platform is positioned at this ready position, and when this guide element was positioned at this second end, this platform was positioned at this applying position.
Foregoing circuit board test fixture, its characteristics are that this guide element is a roller, the slippage on this leads-slanting section by this roller of this platform.
Foregoing circuit board test fixture, its characteristics are that this first end and this second end also are extended with one respectively and stagnate section, stagnate for this guide element.
The foregoing circuit board test fixture, its characteristics are, this displacement mechanism is a rotating cam, and this platform extends and is provided with a slide block, and this slide block fits in this rotating cam, and this rotating cam rotates between one first jiao of position and the one second jiao of position, when this rotating cam is positioned at this first jiao of position, this slide block of interlock makes this platform be positioned at this ready position, and when this rotating cam was positioned at this second jiao of position, this slide block of interlock made this platform be positioned at this applying position.
Effect of the present invention is, radiating module is progressively guided by displacement mechanism ground, and keep forward applying direction to move from bottom to up towards the CPU (central processing unit) chip, so that radiating module closely connects and is covered on the CPU (central processing unit) chip with the path of vertical centering control Central Processing Unit chip surface, so, radiating module can be covered on the CPU (central processing unit) chip in the front, radiating module can directly not clash into or single-point strikes the CPU (central processing unit) chip, avoids being damaged under the situation of unbalance stress.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the outside drawing of first embodiment of the invention;
Fig. 2 is the structural representation between first embodiment of the invention stationary platform and clamp base;
Fig. 3 A is positioned at the synoptic diagram of ready position for the first embodiment of the invention platform;
Fig. 3 B is positioned at the synoptic diagram of applying position for the first embodiment of the invention platform;
Fig. 4 A is positioned at the synoptic diagram of ready position for the second embodiment of the invention platform;
Fig. 4 B is positioned at the synoptic diagram of applying position for the second embodiment of the invention platform;
Fig. 5 A is positioned at the synoptic diagram of ready position for the third embodiment of the invention platform;
Fig. 5 B is positioned at the synoptic diagram of applying position for the third embodiment of the invention platform.
Wherein, Reference numeral:
100 circuit board test clamps 103,103 ' guide bracket
104 leads-slanting sections, 1,041 first ends
1,042 second ends 105,106 are stagnated section
110 fixing frame plates, 111 support columns
112 open 120 platforms
122 slide blocks
130,130 ', 130 " displacement mechanism
150 guide element 150A roller bearings
160 platform rails, 200 circuit boards
201 CPU (central processing unit) chips, 300 radiating modules
301 radiator fans, 302 heat radiation lamellar bodies
P1 ready position P2 applying position
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows.
See also Fig. 1, Fig. 2, disclosed circuit board test clamp 100 is in order to testing circuit board 200.Include a plurality of electronic components and heat-generating electronic elements on the circuit board 200, circuit board test clamp 100 of the present invention also can loose except that being positioned at the heat that heat-generating electronic elements produced on the circuit board 200, wherein, heat-generating electronic elements for example be the CPU (central processing unit) chip (Central Processing Unit, CPU), drawing chip (Graphic Chip), system logic chip group (System Chipset) or the integrated circuit (IC) chip of other kind.At this, heat-generating electronic elements will be with CPU (central processing unit) chip 201 as Application Example of the present invention.
Circuit board test clamp 100 of the present invention includes fixing frame plate 110, platform 120 and displacement mechanism 130.Fixing frame plate 110 is provided with many support columns 111, and in order to bearer circuit plate 200, and fixing frame plate 110 has at least one opening 112, so that fixing frame plate 110 is behind bearer circuit plate 200, the CPU (central processing unit) chip 201 of circuit board 200 exposes from opening 112.And platform 120 carries radiating module 300 corresponding to a side of CPU (central processing unit) chip 201, so that radiating module 300 is pressed on CPU (central processing unit) chip 201, and carries out heat interchange with it.Wherein, radiating module 300 includes radiator fan 301 and heat radiation lamellar body 302, and radiator fan 301 is positioned at the end face of heat radiation lamellar body 302, and can produce air-flow and blow to heat radiation lamellar body 302.Platform 120 is except carrying radiating module 300, also can be according to testing requirement, and carry connectivity port test module and disk drive test module etc., respectively in order to the connectivity port of testing circuit board 200, and the transmission state signal of 200 of disc driver and circuit boards etc.
In addition, platform 120 is provided with roller bearing 150A, circuit board test clamp 100 also includes at least one platform rail 160, establish corresponding to guide bracket 103 positions, and an end is fixed on the fixing frame plate 110, and for roller bearing 150A slippage, simultaneously, platform rail 160 can be subjected to the drive of roller bearing 150A and move along horizontal direction, and in the lump interlock fixing frame plate 110 along the same moved further of horizontal direction.The number of platform rail 160 is not as limit, and when the number of guide bracket 103 was 2, the number of platform rail 160 also should be 2 mutually.
See also Fig. 3 A and Fig. 3 B, and merge and to consult shown in Figure 1ly, when practical application, circuit board 200 is located at each support column 111 with on the precalculated position that places fixing frame plate 110, and CPU (central processing unit) chip 201 is exposed from opening 112, for radiating module 300 pressings.And the heat radiation lamellar body 302 bottom surfaces heat radiation masking foil that has been sticked, when platform 120 carrying radiating modules 300, and guide element 150 is positioned at first end 1041 of leads-slanting section 104, roller bearing 150A is positioned at an end of platform rail 160, platform 120 is positioned at ready position P1, radiating module 300 is parallel to CPU (central processing unit) chip 201, and forms a spacing with CPU (central processing unit) chip 201, and radiating module 300 is with CPU (central processing unit) chip 201 and separated attitude.When guide element 150 from first end 1041 along leads-slanting section 104 progressively toward second end 1042 when moving, platform 120 promptly and then moves towards the upper left side of drawing, and because the mobile system of roller bearing 150A is subject to platform rail 160, so roller bearing 150A promptly can interlock platform rail 160, fixing frame plate 110 and circuit board 200 move towards horizontal direction.Because platform 120 be same moved further with fixing frame plate 110, therefore, the radiating module 300 of platform 120 can keep the path of a positive applying closely to connect, and closely connects with the path on CPU (central processing unit) chip 201 surfaces on the vertical fixing grillage 110.
Be positioned at second end 1042 of leads-slanting section 104 at guide element 150, roller bearing 150A is positioned at the end in addition of platform rail 160, platform 120 promptly is positioned at applying position P2, heat radiation mould ancestral 300 heat radiation lamellar body 302 is covered on CPU (central processing unit) chip 201, so, radiating module 300 heat that just can loose and be produced except that CPU (central processing unit) chip 201.
See also shown in Fig. 4 A and Fig. 4 B, the present invention has disclosed second embodiment again, its general configuration is identical with first embodiment, different is, the displacement mechanism 130 ' of second embodiment is a linear cam, makes the platform 120 that carries radiating module 300 to move between ready position P1 and applying position P2.At this, linear cam is an application examples with guide bracket 103 ', but not as limit.
Wherein, the leads-slanting section 104 of guide bracket 103 ' end face is except being formed with first end 1041 and second end 1042, and first end 1041 and second end 1042 are extended with more respectively stagnates section 105,106, stagnates for roller 150.Similarly, inclination angle and height at design guide bracket 103 ' make when platform 120 is positioned at second end 1042 that the heat radiation lamellar body 302 of radiating module 300 is that the front is covered on CPU (central processing unit) chip 201.
When practical application, when platform 120 carries radiating module 300, and guide element 150 is positioned at the stagnation section 105 of guide bracket 103 ', roller bearing 150A is positioned at an end of platform rail 160, platform 120 is positioned on the ready position P1, radiating module 300 is parallel to CPU (central processing unit) chip 201, and forms a spacing with CPU (central processing unit) chip 201, and radiating module 300 is with CPU (central processing unit) chip 201 and separated attitude.
When guide element 150 enters leads-slanting section 104 and progressively moves toward second end 1042, platform 120 promptly and then moves, and roller bearing 150A also moves along platform rail 160, roller bearing 150A and interlock platform rail 160 are to move along horizontal direction, simultaneously, platform rail 160 also interlock fixing frame plate 110 along continuous straight runs move.Because platform 120 be same moved further with fixing frame plate 110, therefore, the radiating module 300 of platform 120 can keep the direction of a positive applying, closely connects with the path on CPU (central processing unit) chip 201 surfaces on the vertical fixing grillage 110.
Be positioned at stagnation section 106 at guide element 150, when roller bearing 150A is positioned at holding in addition of platform rail 160, platform 120 promptly is positioned at applying position P2, the heat radiation lamellar body 302 of radiating module 300 is covered on CPU (central processing unit) chip 201, so, radiating module 300 heat that just can loose and be produced except that CPU (central processing unit) chip 201.
See also shown in Fig. 5 A and Fig. 5 B, the present invention has disclosed the 3rd embodiment again, the displacement mechanism 130 of the 3rd embodiment " be rotating cam, rotating cam is defined as the parts with curved surface; utilize its rotation, can make another element one follower that predefined motion is provided.In more detail, platform 120 is provided with slide block 122, and slide block 122 surfaces fit in displacement mechanism 130 " the circumference place, and slide block 122 is in order to fit in displacement mechanism 130 " an end be arcuation so that slide block 122 can be with displacement mechanism 130 " the rotation campaign.
Along with displacement mechanism 130 " in the rotation of first jiao of position and second jiao of interdigit, slide block 122 can be subjected to interlock and along displacement mechanism 130 " circular path between ready position P1 and applying position P2, move, platform 120 also moves up and down thereupon.Therefore, when displacement mechanism 130 " when being positioned at first jiao of position, platform 120 is positioned at ready position P1, and when displacement mechanism 130 " when being positioned at second jiao of position, platform 120 is positioned at applying position P2, removes the heat of its generation to loose to be covered on CPU (central processing unit) chip 201.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (8)
1. circuit board test clamp, in order to testing a circuit board, and the heat that produced of the heat-generating electronic elements that removes this circuit board of loosing, it is characterized in that, include:
One fixing frame plate carries this circuit board;
One platform carries a radiating module, and this radiating module removes heat in order to loose; And
One displacement mechanism, platform is moved between a ready position and an applying position, when this platform is positioned at this ready position, this radiating module and the separated attitude of this heat-generating electronic elements, when this platform was positioned at this applying position, this radiating module was covered on this heat-generating electronic elements and removes heat to loose.
2. circuit board test clamp according to claim 1, it is characterized in that, this radiating module also includes a heat radiation lamellar body, and when this platform was positioned at this applying position, this heat radiator was shown consideration for and is overlying on this heat-generating electronic elements to loose except that the heat that this heat-generating electronic elements was produced.
3. circuit board test clamp according to claim 2 is characterized in that this radiating module also includes a radiator fan, blows to this heat radiation lamellar body in order to produce an air-flow.
4. circuit board test clamp according to claim 1, it is characterized in that, also include at least one platform rail, this platform rail is guided the mobile route of this platform, so that this radiating module closely connects and be covered on this heat-generating electronic elements with the path on vertical this heat-generating electronic elements surface.
5. circuit board test clamp according to claim 1 is characterized in that, this displacement mechanism also includes:
At least one leads-slanting section, this leads-slanting section have one first end and second end with respect to this first end; And
At least one guide element is located at this platform, this guide element slippage in this leads-slanting section and in the lump this platform of interlock move, when this guide element is positioned at this first end, this platform is positioned at this ready position, and when this guide element was positioned at this second end, this platform was positioned at this applying position.
6. circuit board test clamp according to claim 5 is characterized in that, this guide element is a roller, the slippage on this leads-slanting section by this roller of this platform.
7. circuit board test clamp according to claim 5 is characterized in that, this first end and this second end also are extended with one respectively and stagnate section, stagnate for this guide element.
8. circuit board test clamp according to claim 1, it is characterized in that, this displacement mechanism is a rotating cam, and this platform extends and is provided with a slide block, and this slide block fits in this rotating cam, and this rotating cam rotates between one first jiao of position and the one second jiao of position, when this rotating cam is positioned at this first jiao of position, this slide block of interlock makes this platform be positioned at this ready position, and when this rotating cam was positioned at this second jiao of position, this slide block of interlock made this platform be positioned at this applying position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101623950A CN101201775A (en) | 2006-12-14 | 2006-12-14 | Testing clamp for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101623950A CN101201775A (en) | 2006-12-14 | 2006-12-14 | Testing clamp for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101201775A true CN101201775A (en) | 2008-06-18 |
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ID=39516950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101623950A Pending CN101201775A (en) | 2006-12-14 | 2006-12-14 | Testing clamp for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101201775A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105425140A (en) * | 2015-12-17 | 2016-03-23 | 埃泰克汽车电子(芜湖)有限公司 | Testing device and testing method of PCB half-finished product |
| CN105783755A (en) * | 2016-03-15 | 2016-07-20 | 成都秦川科技发展有限公司 | Optical detection apparatus |
| CN110554299A (en) * | 2019-08-30 | 2019-12-10 | 大唐微电子技术有限公司 | Portable smart card module testing arrangement |
| CN113341182A (en) * | 2021-07-14 | 2021-09-03 | 格力电器(南京)有限公司 | Fixing device and fixing method for circuit board load function test |
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
| WO2024031978A1 (en) * | 2022-08-12 | 2024-02-15 | 中兴通讯股份有限公司 | Test clamp and test apparatus |
-
2006
- 2006-12-14 CN CNA2006101623950A patent/CN101201775A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105425140A (en) * | 2015-12-17 | 2016-03-23 | 埃泰克汽车电子(芜湖)有限公司 | Testing device and testing method of PCB half-finished product |
| CN105783755A (en) * | 2016-03-15 | 2016-07-20 | 成都秦川科技发展有限公司 | Optical detection apparatus |
| CN110554299A (en) * | 2019-08-30 | 2019-12-10 | 大唐微电子技术有限公司 | Portable smart card module testing arrangement |
| CN113341182A (en) * | 2021-07-14 | 2021-09-03 | 格力电器(南京)有限公司 | Fixing device and fixing method for circuit board load function test |
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
| WO2024031978A1 (en) * | 2022-08-12 | 2024-02-15 | 中兴通讯股份有限公司 | Test clamp and test apparatus |
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