CN213240416U - Temperature control bearing sheet structure and probe station - Google Patents
Temperature control bearing sheet structure and probe station Download PDFInfo
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- CN213240416U CN213240416U CN202021957507.3U CN202021957507U CN213240416U CN 213240416 U CN213240416 U CN 213240416U CN 202021957507 U CN202021957507 U CN 202021957507U CN 213240416 U CN213240416 U CN 213240416U
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- temperature control
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Abstract
The utility model discloses a control by temperature change holds piece structure and probe platform. A temperature control chip bearing structure is used for heating/cooling a chip, a TEC temperature control part is attached and connected to the lower side of a chip placing part along the vertical direction, and the upper side of the chip placing part is used for placing the chip; a probe station comprises the temperature control bearing sheet structure; and the chip is tested at high and low temperatures, so that the testing efficiency is improved compared with the heating or cooling of fluid.
Description
Technical Field
The utility model relates to a control by temperature change holds piece structure and probe platform.
Background
TEC, semiconductor Cooler (Thermoelectric Cooler) is made using the peltier effect of semiconductor materials. The peltier effect is a phenomenon in which, when direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat.
In the existing chip test occasion, in order to test the chip at high temperature, the chip is placed on a part connected with water circulation, and the chip is heated by using water temperature.
However, for a chip requiring high and low temperature tests, for example, the test environment temperature requires 80 degrees and 10 degrees, and at this time, the efficiency of heating or cooling by water circulation is low, and the test requirements for the chip cannot be met.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that chip high low temperature efficiency of software testing is low, the utility model provides a control by temperature change holds piece structure and probe station.
The technical scheme of the utility model is that: the utility model provides a piece structure is held in control by temperature change for heat up/cool down the chip, TEC temperature control portion along vertical direction laminating connect in putting piece portion downside, put piece portion upside and be used for placing the chip.
Further, the water cooling circulation part is connected to the lower side of the TEC temperature control part along the vertical direction.
Furthermore, the TEC temperature control part comprises a plurality of TEC temperature control plates and a heat conduction frame, and the plurality of TEC temperature control plates are limited in the limit holes preset in the heat conduction frame along the horizontal direction.
Furthermore, the plurality of TEC temperature control plates are respectively abutted against the release part and the water cooling circulating part along the vertical direction.
Furthermore, a first limiting protrusion arranged on the water cooling circulation part is matched with a first positioning hole on the heat conduction frame.
Furthermore, a second limiting bulge arranged on the water cooling circulation part is abutted between the TEC temperature control plate and the inner wall of the limiting hole along the horizontal direction.
Further, the TEC temperature control plates are N, and N is a positive integer greater than 3; one TEC temperature control plate is positioned at the geometric center of the placing piece part.
Furthermore, the piece placing part is circular, and the rest N-1 TEC temperature control plates are uniformly distributed along the circle center of the piece placing part.
Further, the heat conduction frame is a circular ring with the radius smaller than that of the sheet placing part.
A probe station comprises the temperature control bearing sheet structure.
The beneficial effects of the utility model reside in that: and the chip is tested at high and low temperatures, so that the testing efficiency is improved compared with the heating or cooling of fluid.
Drawings
FIG. 1 is a schematic view of the structure of a temperature control support sheet of the present invention;
FIG. 2 is a schematic structural view of a TEC temperature control part relative to a release part;
fig. 3 is a schematic view of a heat conduction frame structure.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention for those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific embodiments.
As shown in fig. 1, a temperature control chip bearing structure 100 is used for heating/cooling a chip, so as to facilitate the chip testing at different temperatures, a TEC temperature control portion 20 is attached to a lower side of a chip placing portion 30 along a vertical direction a, and an upper side of the chip placing portion 30 is used for placing the chip; the TEC temperature control section 20 is a temperature control module made by the peltier effect, and can heat/cool the sheet placing section 30 by changing the positive and negative poles of the direct current; compared with water flowing heating or cooling, the TEC temperature control part 20 has high heating/cooling efficiency; for water flowing heating/cooling, the same heating/cooling efficiency needs to be achieved, and the required water flowing speed is high, the danger is high, and the structure is complex.
By adopting the technical scheme, the high-low temperature control of the chip placing part 30 is facilitated, so that the high-low temperature test of the chip is realized, and the test efficiency is improved compared with the fluid heating or cooling.
As shown in fig. 1, a water cooling cycle part 40 is connected to a lower side of the TEC temperature control part 20 in a vertical direction a; only the water cooling cycle 40 is required to perform a cooling function, thereby simplifying the structure of the water cooling cycle 40.
As shown in fig. 2, the TEC temperature control portion 20 includes a plurality of TEC temperature control plates 21 and a heat conduction frame 22, and the plurality of TEC temperature control plates 21 are horizontally limited in a limiting hole 221 preset in the heat conduction frame 22.
By adopting the above technical scheme, the heat conduction frame 22 has a heat conduction function, so that heat generated by the plurality of TEC temperature control plates 21 is uniformly conducted to the plate placing part 30 or is uniformly cooled by absorbing heat from the plate placing part 30.
As shown in fig. 1 and 2, the plurality of TEC temperature control plates 21 respectively abut against the release portion 30 and the water cooling circulation portion 40 along the vertical direction a, so as to improve the temperature increasing/decreasing efficiency of the release portion 30 and the temperature decreasing efficiency of the TEC temperature control plates 21.
As shown in fig. 2, a first limiting protrusion (not shown) provided in the water-cooling circulation unit 40 is engaged with a first positioning hole (not shown) on the heat conduction frame 22, so as to limit the heat conduction frame 22 relative to the water-cooling circulation unit 40 in the horizontal plane direction, and position the TEC temperature control plate 21 accurately and reliably.
As shown in fig. 2, the second limiting protrusion 41 of the water cooling circulation part 40 horizontally abuts between the TEC temperature control plate 21 and the inner wall of the limiting hole 221, so as to horizontally position the TEC temperature control part 20; the TEC temperature control plates 21 are N, and N is a positive integer greater than 3; wherein a TEC temperature control plate 21 is located puts piece portion 30 geometric center to guarantee to put piece portion 30 geometric center and can directly be heated, be convenient for the heat to spread around.
As shown in fig. 1, the placing part 30 is circular, and the rest N-1 TEC temperature control plates 21 are uniformly distributed along the center of the placing part 30; since the chips to be tested are generally circularly arranged, in order to increase the utilization rate of the sheet placing part 30, the preferable scheme is to make the sheet placing part 30 into a circle matched with the chips; the arrangement can enhance the uniformity of heat transfer to the sheet placing part 30, thereby improving the consistency of the testing temperature of the chip.
As shown in fig. 1, the heat conduction frame 22 is a circular ring with a radius smaller than that of the plate-placing portion 30, and if the heat conduction frame 22 is a circular ring with a radius larger than that of the plate-placing portion 30, the heat conduction frame 22 will conduct heat out of the plate-placing portion 30, which is not beneficial to increasing the utilization rate of the temperature of the TEC temperature control plate 21 to the temperature rise of the plate-placing portion 30.
A probe station, comprising the temperature-controlled wafer structure 100; the temperature control wafer bearing structure 100 is used for a probe station, so that the temperature rise and fall of a chip to be tested are realized, and the efficiency of testing the chip at high and low temperatures is improved.
The above is the preferred embodiment of the present invention, and is not used to limit the protection scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments, as understood by those skilled in the art, are intended to be included within the scope of the present invention as claimed and claimed.
Claims (10)
1. The utility model provides a control by temperature change holds piece structure for heat up/cool down the chip, its characterized in that: the TEC temperature control part is attached to the lower side of the piece placing part along the vertical direction, and the upper side of the piece placing part is used for placing a chip.
2. The temperature control wafer structure of claim 1, wherein: the water cooling circulation part is connected to the lower side of the TEC temperature control part along the vertical direction.
3. The temperature-controlled support piece structure of claim 2, wherein: the TEC temperature control part comprises a plurality of TEC temperature control plates and a heat conduction frame, and the plurality of TEC temperature control plates are limited in a limit hole preset in the heat conduction frame along the horizontal direction.
4. The temperature control wafer structure of claim 3, wherein: the plurality of TEC temperature control plates are respectively abutted against the release part and the water cooling circulating part along the vertical direction.
5. The temperature control wafer structure of claim 4, wherein: the first limiting bulge arranged on the water cooling circulation part is matched with the first positioning hole on the heat conduction frame.
6. The temperature control wafer structure of claim 4, wherein: and a second limiting bulge arranged on the water cooling circulation part is abutted between the TEC temperature control plate and the inner wall of the limiting hole along the horizontal direction.
7. The temperature control wafer structure of claim 3, wherein: the TEC temperature control plates are N, and N is a positive integer greater than 3; one TEC temperature control plate is positioned at the geometric center of the placing piece part.
8. The temperature control wafer structure of claim 7, wherein: the piece placing part is circular, and the rest N-1 TEC temperature control plates are uniformly distributed along the circle center of the piece placing part.
9. The temperature control wafer structure of claim 8, wherein: the heat conduction frame is a circular ring with the radius smaller than that of the sheet placing part.
10. A probe station, characterized by: the probe station comprising the temperature controlled blade structure of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021957507.3U CN213240416U (en) | 2020-09-09 | 2020-09-09 | Temperature control bearing sheet structure and probe station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021957507.3U CN213240416U (en) | 2020-09-09 | 2020-09-09 | Temperature control bearing sheet structure and probe station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213240416U true CN213240416U (en) | 2021-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021957507.3U Active CN213240416U (en) | 2020-09-09 | 2020-09-09 | Temperature control bearing sheet structure and probe station |
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| CN (1) | CN213240416U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
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2020
- 2020-09-09 CN CN202021957507.3U patent/CN213240416U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115267503A (en) * | 2022-08-01 | 2022-11-01 | 镭神技术（深圳）有限公司 | Automatic chip testing equipment |
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