TWM600929U - Temperature control test system connected to cooling or heating equipment - Google Patents

Abstract

A temperature control test system connected with refrigeration or heating equipment, which includes: a temperature control module, a temperature test module, a temperature control module, an infusion tube and a power supply module, and a temperature is set on the outer peripheral wall of the machine Regulating unit and temperature display unit. The working fluid is stored in the containing tank. The temperature of the working fluid is between 0°C and 50°C. The test temperature display unit and the test temperature adjustment unit are assembled on the peripheral wall of the shell. A stage is set on the side, and the stage is used to place the object to be tested. A refrigeration chip and a water-cooled row structure are set in the shell. The working temperature of the refrigerated chip is between minus 50 degrees and 170 degrees. One end of the infusion tube is connected with a water-cooled row structure. , And the other end is set in the working fluid, and the accommodating tank is connected to the water-cooled row structure and forms a circulation loop; therefore, this creation uses a refrigerating chip as a temperature control element to improve the accuracy and temperature control of the temperature Uniformity.

Description

Temperature control test system connected to refrigeration or heating equipment

This creation is about a temperature control test system, especially a temperature control test system connected to refrigeration or heating equipment.

According to the semiconductor industry, for industrial electronic parts or electronic equipment and industrial control computers for special environmental applications, the weather resistance of components is particularly required, especially the requirements for high temperature and low temperature resistance usually take priority over performance And power consumption requirements, if electronic equipment fails due to high temperature or low temperature environment, the usual losses and potential dangers will definitely have a great impact. Not only the weather resistance of the chip itself has been tested, the detailed design of the overall electronic equipment must also In view of the high temperature and low temperature environment, it is inspected with more stringent standards.

In addition, in response to electronic devices that need to work in highly harsh environments, such as outdoor LED signage, outdoor Kiosks, LED street lights, automotive electronic equipment, aircraft, industrial computers and other electronic devices, most of the chip solutions used have more High temperature range requirements. Even in some environments with special operating temperatures, the temperature resistance requirements of electronic devices are often greater than 150 degrees or less than 0 degrees. In the face of such special high-temperature environment chip design, there are many design points that need to be considered.

However, during the chip temperature test, the heat dissipation function of the temperature tester is a problem that needs to be overcome. If the heat dissipation is not good, it will cause the temperature tester to overheat, which will cause the temperature tester to crash or test the electrical properties of the chip. Test errors, etc., and the structure of the current temperature testing machine cannot effectively discharge the heat energy. The heat energy will accumulate in the temperature testing machine, making it impossible to continue the wafer test during the testing of the wafer. After testing a certain amount of chips, the machine must be shut down to allow the thermal energy of the temperature tester to dissipate, which will cause inconvenience in chip testing and increase manufacturing costs.

Therefore, after observing the above-mentioned shortcomings, the creator of this case believes that there is still a need for further improvement of the low-temperature thermostat equipment, and this creation was born.

The main purpose of this creation is to provide a temperature control test system connected to refrigeration or heating equipment, which has the adjustment of a specific temperature gradient, so that the test object can be heated, kept constant, and cooled in this creation. At the same time, the creative system can handle a variety of temperature cycling (Thermail Cycling) conditions, including time and temperature gradient control.

In order to achieve the above-mentioned purpose, the temperature control test system for connecting refrigeration or heating equipment provided by this creation includes: a temperature control module, the temperature control module includes a machine, the outer peripheral wall of the machine The upper group is provided with a temperature adjustment unit and a temperature display unit. The interior of the machine is recessed with a containing tank, and a working fluid is stored in the containing tank. The temperature control module controls the temperature of the working fluid to be between 0 Between degrees and 50 degrees; a temperature test module, the temperature test module is electrically connected to the temperature control module, the temperature test module includes a housing, the peripheral wall of the housing is combined with a test temperature A display unit and a test temperature adjustment unit. One side of the housing is provided with a carrier, and at least one object to be tested is placed on the carrier, and at least a uniform cooling chip and a water cooling row structure are arranged in the housing. The cooling chip One side is connected to the carrier, the other side is connected to the water cooling row structure, the cooling chip is electrically connected to the test temperature display unit and the test temperature adjustment unit, and the working temperature of the cooling chip is minus 50 degrees At least two infusion tubes, one end of the infusion tubes is assembled with the water-cooled row structure, and the other end is set in the working fluid, so that the containing tank is connected to the water-cooled row structure and forms Circulating loop; and a power supply module, the power supply module provides electrical energy to the temperature control module and the temperature test module.

Preferably, the working temperature of the refrigeration chip is between minus 40 degrees and 150 degrees.

Preferably, there are a plurality of the cooling chips, the cooling chips are arranged in series, and the cooling chips are evenly distributed on one side of the carrier.

Preferably, there are a plurality of the cooling chips, the cooling chips are arranged in parallel, and the cooling chips are evenly distributed on one side of the carrier.

Preferably, the refrigerating chip includes a plurality of P-type semiconductor chips and N-type semiconductor chips arranged alternately in polarity, and the P-type semiconductor chips and the N-type semiconductor chips are electrically connected to two carrier boards.

Preferably, the working fluid system is a water-cooled fluid.

Preferably, the temperature control module further includes a timing unit, and the timing unit is electrically connected to the refrigeration chip.

Preferably, the temperature control module further includes a power-off unit, and the power-off unit is electrically connected to the temperature display unit.

Preferably, one side of the carrier boards is a cooling connection surface, and the other side is a heating connection surface.

Preferably, the temperature control module further includes an alarm unit, and the alarm unit is electrically connected to the temperature display unit and the power-off unit.

The temperature control test system for connecting refrigeration or heating equipment provided by this creation mainly relies on the arrangement of the water-cooled platoon structure, the infusion pipes and the working fluid, and the setting of the cooling chip, the water-cooled platoon The structure and the infusion pipes form a circulation loop, so that the refrigerating chip can effectively dissipate heat, thereby improving the accuracy and uniformity of temperature control.

(First embodiment) Hereinafter, with reference to the drawings, the implementation of the first embodiment of the temperature control test system connected with refrigeration or heating equipment of the present invention will be described.

Please refer to Figures 1 to 4. Figure 1 is a perspective view of the first embodiment of creation, Figure 2 is an exploded view of the first embodiment of creation, and Figure 3 is a partial cross-sectional view of the cooling chip of the first embodiment of creation Figure 4 is a schematic diagram of the system of the first embodiment of creation. This work discloses a temperature control test system 100 connected to refrigeration or heating equipment, which includes:

A temperature control module 10, the temperature control module 10 includes a machine 11, a temperature adjustment unit 12 and a temperature display unit 13 are assembled on the outer peripheral wall of the machine 11, and the interior of the machine 11 is concave A accommodating tank 14 is provided, and a working fluid 141 is stored in the accommodating tank 14. The temperature control module 10 controls the temperature of the working fluid 141 to be between 0 degrees and 50 degrees. In this embodiment, the working liquid 141 is a water-cooled liquid. In this embodiment, the temperature adjustment unit 12 adjusts the temperature of the working fluid 141, and the temperature display unit 13 displays the temperature of the working fluid 141 during operation; in addition, the machine 11 of this creation is an ice water machine Or trough temperature control equipment.

A temperature test module 20, the temperature test module 20 is electrically connected to the temperature control module 10, the temperature test module 20 includes a housing 21, the peripheral wall of the housing 21 is assembled with a test temperature display Unit 22 and a test temperature adjustment unit 23. One side of the housing 21 is provided with a carrier 30. The carrier 30 is used to place at least one object 200 to be tested. The housing 21 is equipped with at least a cold chip 40 and a Water-cooled row structure 50. One side of the cooling chip 40 is connected to the carrier 30, and the other side is connected to the water-cooled row structure 50. The cooling chip 40 is electrically connected to the test temperature display unit 22 and the test temperature adjustment Unit 23, the working temperature of the refrigerating chip 40 is between minus 50 degrees and 170 degrees.

In this embodiment, the carrier 30 is flat to increase the contact area for the cold and heat sources, so as to quickly dissipate heat, thereby improving the efficiency of heat and cold conduction. The test temperature display unit 22 displays when the cooling chip 40 is operating The test temperature adjusting unit 23 adjusts the working temperature of the refrigerating chip 40.

In addition, as shown in FIG. 3, the refrigerating chip 40 includes a plurality of P-type semiconductor chips 41 and N-type semiconductor chips 42 arranged in alternating polarities. The P-type semiconductor chips 41 and the N-type semiconductor chips 42 are The two carrier boards 43a, 43b are electrically connected. One side of the carrier boards 43a, 43b is a cooling connection surface, and the other side is a heating connection surface. The carrier boards 43a, 43b (ie, cooling The connection surface and the heating connection surface) are rough, and have a surface with multiple blind holes or a surface with multiple cut grooves to increase the contact area for the cold and heat source, so as to quickly dissipate heat, thereby improving the efficiency of cold and heat conduction. In this embodiment, the carrier plates 43a, 43b are arranged in a plane as an example, but it does not limit the implementation of this creation.

At least two infusion tubes 60. One end of the infusion tubes 60 is assembled with the water-cooled row structure 50, and the other end is set in the working fluid 141, so that the containing tank 14 is connected to the water-cooled row structure 50 and forms Circulation loop.

A power supply module 70 that provides electrical energy to the temperature control module 10 and the temperature test module 20.

In order to provide a further understanding of the structural features of this creation, the use of technical means and the expected effects, the method of use of this creation is described. I believe that we can have a deeper and specific understanding of this creation from this, as follows:

T4，此處A為軸射面積，而

為斯蒂芬一波茲曼常數，Qb為由一黑體軸射之全部能量率；又，一物體的反射率(Emissivity)定義為

= Q / A / (Q/A)b，其中Q/A為從該物體單位面積之熱軸射率，而(Q/A)b為在同溫時從一黑體每單位面積之熱軸射率；對一黑體

= 1，對所有物體

1，因此對一非黑體(Non-black body)的熱輻射率Q =

A

T4，由此可以了解，能提高輻射率的方法，可以藉由增加其面積A，或者改變其放射率

。更詳言之，本創作於使用狀態時，當電流通過該致冷晶片40，該致冷晶片40的每一P型半導體晶片41及N型半導體晶42片就會開始進行珀爾帖效應，使該等載板43a,43b間產生溫度差，這樣即可應用為致冷連接面及致熱連接面，端視對外的接觸面係選用致冷連接面或致熱連接面。 Please refer to FIG. 5 and FIG. 6, in conjunction with FIG. 1 to FIG. 4. FIG. 5 and FIG. 6 are schematic diagrams of the use state of the first embodiment of the creation. According to the Stenfan-Boltzman Law (Stenfan-Boltzman Law), it is stated that at absolute temperature T, the radiation rate from a black body is Qb = A

T4, where A is the axial shot area, and

Is the Stephen-Bozeman constant, Qb is the total energy rate projected by a black body; also, the reflectivity of an object (Emissivity) is defined as

= Q / A / (Q/A)b, where Q/A is the thermal axis of radiation per unit area of the object, and (Q/A)b is the thermal axis of radiation per unit area from a black body at the same temperature Rate; on a black body

= 1, for all objects

1. Therefore, the thermal emissivity for a non-black body Q =

A

T4, it can be understood that the method to increase the emissivity can be by increasing its area A or changing its emissivity

. In more detail, when the present invention is in use, when current passes through the cooling chip 40, each P-type semiconductor chip 41 and N-type semiconductor chip 42 of the cooling chip 40 will begin to undergo the Peltier effect. A temperature difference is generated between the carrier plates 43a, 43b, so that it can be used as a cooling connection surface and a heating connection surface. The external contact surface is a cooling connection surface or a heating connection surface.

In addition, the internal structure of the water-cooled row structure 50 is continuously curved (that is, the area A is increased), so that the working fluid 141 can smoothly pass through the water-cooled row structure 50 and flow back to the containing tank 14.

Please continue to refer to FIG. 5. In this embodiment, there are a plurality of the test objects 200, and the refrigerating chips 40 perform high temperature tests on the test objects 200. At this time, the refrigerating chips 40 The carrier board 43a on the top side of the cooling chip 40 is a heating connection surface, the carrier board 43b on the bottom side of the cooling chips 40 is a cooling connection surface, the heating connection surface is connected to the carrier 30, and the cooling connection The surface is connected to the water-cooled row structure 50, the waiting test object 200 is placed on the carrier 30, the working fluid 141 flows into the water-cooled row structure 50 through the infusion pipes 60, and the water-cooled row structure 50 flows from the refrigerating chips The refrigerating connection surface of 40 takes away heat and performs heat exchange, so that the temperature test module 20 performs a high temperature test on the waiting object 200, so as to effectively improve the constant temperature or heating effect of the refrigerated chips 40. In addition, the damage probability of the refrigerating chips 40 is reduced, and the refrigerating chips 40 are protected and the operation efficiency thereof is improved.

Please continue to refer to FIG. 6. In this embodiment, there are a plurality of the test objects 200, and the refrigerated chips 40 pass through the stage 30 to perform a low temperature test on the test objects 200. At this time, the The carrier 43a on the top side of the refrigerating chip 40 is a refrigeration connection surface, the carrier 43b on the bottom side of the refrigeration chip 40 is a heating connection surface, and the refrigeration connection surface is connected to the carrier 30. The heating connection surface is connected to the water-cooled row structure 50, the waiting test object 200 is placed on the carrier 30, the working fluid 141 flows into the water-cooled row structure 50 through the infusion pipes 60, and the water-cooled row structure 50 flows from The heating connection surfaces of the refrigerating chips 40 take away heat and perform heat exchange, so that the temperature test module 20 can perform low-temperature test on the waiting object 200, so as to effectively increase the constant temperature of the refrigerating chips 40 This reduces the probability of damage to the refrigerating chips 40, protects the refrigerated chips 40 and improves the efficiency of their operation.

Therefore, it can be further understood from the above description that this creation uses the arrangement of the water-cooled row structure 50 and the refrigeration chip 40, and the arrangement of the working fluid 141, the working fluid 141 flows into the fluid through the infusion tubes 60 In the water-cooled platoon structure 50, a circulation loop is formed; in addition, the internal structure of the water-cooled platoon structure 50 is continuously bent, so that the working fluid 141 can pass through the water-cooled platoon structure 50 smoothly, so as to conduct cold and heat conduction with the outside air , And perform heat exchange and cooling effects on the refrigerating chip 40, so that the temperature control test system 100 connected with refrigeration or heating equipment can effectively cycle temperature control reactions such as heating, constant temperature, and cooling.

(Second embodiment)

Please refer to FIG. 7, which is an exploded view of the second embodiment of the creation. The second embodiment is compared with the first embodiment. The main structural difference of the second embodiment is that there are a plurality of refrigerating chips 40, and the refrigerating chips 40 are arranged in series. Distributed on one side of the carrier 30.

Thereby, this embodiment can not only achieve the effects of the first embodiment, but also provide different structures, so as to increase the convenience and practicability in use.

(The third embodiment)

Please refer to FIG. 8, which is an exploded view of the third embodiment of the creation. Compared with the first and second embodiments, the main structural difference of the third embodiment is that the refrigerating chips 40 are plural, and the refrigerating chips 40 are arranged in parallel. The cooling chips 40 are evenly distributed on one side of the stage 30, so as to avoid a short circuit or open circuit of one of the cooling chips 40 in parallel, so that the current cannot flow through the other cooling chips 40, and the The cooling chip 40 cannot operate.

Thus, this embodiment can not only achieve the effects of the first and second embodiments, but also provide different structures, so that when one of the refrigerating chips 40 is damaged, the other refrigerating chips 40 can The sample system can work.

(Fourth embodiment)

Please refer to FIG. 9 and FIG. 10. FIG. 9 is a schematic diagram of the system of the fourth embodiment of the creation, and FIG. 10 is a schematic diagram of the use state of the fourth embodiment of the creation. The fourth embodiment is compared with the first, second, and third embodiments. The main structural difference of the fourth embodiment is that the temperature control module 10 further includes a timing unit 15 and a power-off unit 16. And an alarm unit 17, the timing unit 15 is electrically connected to the refrigeration chip 40, the power-off unit 16 is electrically connected to the temperature display unit 13, and the alarm unit 17 is electrically connected to the temperature display unit 13 and the Power-off unit 16. In this embodiment, the timing unit 15 adjusts the operating time of the refrigeration chip 40, and the power-off unit 16 controls the power supply module 70 to conduct current to the temperature control module 10 and the temperature test module 20 Whether or not, when the timing unit 15 is over, or when the power-off unit 16 is activated, the alarm unit 17 sounds to notify the user.

As a result, this embodiment can not only achieve the effects of the first, second and third embodiments, but also provide different structures to effectively control the temperature control of the connected refrigeration or heating device The test system 100 has the function of reminding the user of the test time of the test object 200 at the same time, and increases the convenience and practicability in use, thereby enhancing the application of the temperature control test system 100 connected to refrigeration or heating equipment Level.

It is worth mentioning that the use of the refrigeration chip 40 series has the following advantages: no excessive mechanical parts, no noise generation, small size, light weight, easy selection of the shape, and cooling or heating only by inputting current; importantly, The refrigerating chip 40 has the advantages of long life, simple operation and liquid maintenance.

It is worth mentioning that the temperature control module 10 and the temperature test module 20 are detachable or integrally modular, and therefore have the advantage of convenient maintenance; in addition, the cooling chip 40 has the advantages In order to be small in size, it can accurately control the performance (can make a relatively smooth temperature control curve), and can provide the temperature control test system 100 connected with cooling or heating equipment for heating or cooling conversion, if there are no other external factors, no need Even maintenance is not easy to damage.

Hereby, the characteristics of this creation and its expected effects are stated as follows:

The temperature control test system 100 connected with refrigeration or heating equipment of this invention is through the arrangement of the water-cooled row structure 50 and the refrigeration chip 40, and is matched with the arrangement of the working fluid 141. The working fluid 141 passes through the The infusion tube 60 flows into the water-cooled row structure 50, so as to form a circulation loop, so as to perform cold and heat conduction with the outside air, and perform heat exchange and cooling effects on the cooling chip 40, so that the cooling or heating device is connected The temperature control test system 100 achieves an effective cycle of temperature control reactions such as heating, constant temperature and cooling, and the temperature control test system 100 connected to refrigeration or heating equipment can handle a variety of temperature cycling (Thermail Cycling) conditions, including time, Control of temperature gradient.

In this way, this creative department has the following implementation and technical effects:

Firstly, the present invention allows the cooling chip 40 to effectively dissipate heat through the setting of the working fluid 141 and the arrangement of the water cooling row structure 50, so as to reduce the damage rate of the cooling chip 40.

Second, this creation uses the arrangement of the refrigeration chip 40 and the arrangement of the water-cooled row structure 50 and the working fluid 141 to make the temperature control test system 100 connected with refrigeration or heating equipment have better heat exchange Efficiency, and at the same time meet the heat dissipation requirements of high-efficiency and high-heating semiconductor equipment.

Third, in this creation, through the arrangement of the cooling chips 40 and the arrangement of the water cooling row structure 50 and the working fluid 141, the cooling chips 40 are evenly distributed on the carrier 30, thereby improving the carrier 30 The consistency of the temperature, so as to improve the accuracy of the test process.

To sum up, this creation has its excellent progress in similar products. At the same time, we have checked the domestic and foreign technical data on this type of structure. The same structure has not been found in the literature. Therefore, this At the time of creation, the new patent requirements were already in place, and Yan filed an application in accordance with the law.

However, the above are only the preferred and feasible embodiments of the present creation. If there is no obvious conflict between the embodiments, the features can be combined with each other and replaced. In addition, any equivalent structural changes made by applying the specification of this model and the scope of patent application should be included in the scope of patent of this creation.

100: Temperature control test system connected to refrigeration or heating equipment 10: Temperature control module 11: Machine 12: Temperature adjustment unit 13: Temperature display unit 14: holding tank 141: working fluid 15: Timing unit 16: Power-off unit 17: Alarm unit 20: Temperature test module 21: Shell 22: Test temperature display unit 23: Test temperature regulation unit 30: Stage 40: Refrigeration chip 41: P-type semiconductor wafer 42: N-type semiconductor wafer 43a, 43b: carrier board 50: Water cooling row structure 60: Infusion tube 70: Power supply module 200: DUT

Figure 1 is a perspective view of the first embodiment of the creation. Figure 2 is an exploded view of the first embodiment of the creation. Figure 3 is a partial cross-sectional view of the refrigerating chip of the first embodiment of the creation. Figure 4 is a schematic diagram of the system of the first embodiment of the creation. Figure 5 is a schematic diagram of the use state of the first embodiment of the creation. Figure 6 is a schematic diagram of the use state of the first embodiment of the creation. Figure 7 is an exploded view of the second embodiment of the creation. Figure 8 is an exploded view of the third embodiment of the creation. Fig. 9 is a schematic diagram of the system of the fourth embodiment of the creation. Fig. 10 is a schematic diagram of the use state of the fourth embodiment of the creation.

100: Temperature control test system connected to refrigeration or heating equipment

10: Temperature control module

11: Machine

12: Temperature adjustment unit

13: Temperature display unit

14: holding tank

141: working fluid

20: Temperature test module

21: Shell

22: Test temperature display unit

23: Test temperature regulation unit

30: Stage

60: Infusion tube

Claims (10)

A temperature control test system connected with refrigeration or heating equipment, which includes: A temperature control module, the temperature control module includes a machine, a temperature adjustment unit and a temperature display unit are assembled on the outer peripheral wall of the machine, and an accommodation groove is recessed inside the machine. A working liquid is stored in the containing tank, and the temperature control module controls the temperature of the working liquid to be between 0 degrees and 50 degrees; A temperature test module, the temperature test module is electrically connected to the temperature control module, the temperature test module includes a housing, a test temperature display unit and a test temperature regulator are assembled on the peripheral wall of the housing Unit, one side of the housing is provided with a carrier, the carrier is for placing at least one object to be tested, the housing is equipped with at least a uniform cooling chip and a water-cooling row structure, and one side of the cooling chip is connected to the carrier The other side of the table is connected to the water-cooled row structure, the refrigeration chip is electrically connected to the test temperature display unit and the test temperature adjustment unit, and the working temperature of the refrigeration chip is between minus 50 degrees and 170 degrees; At least two infusion tubes, one end of the infusion tubes is assembled with the water-cooled row structure, and the other end is set in the working fluid, so that the containing tank is connected with the water-cooled row structure and forms a circulation loop; and A power supply module, the power supply module provides electrical energy to the temperature control module and the temperature test module. For example, the temperature control test system connected with refrigeration or heating equipment of claim 1, wherein the working temperature of the refrigeration chip is between minus 40 degrees and 150 degrees. For example, the temperature control test system connected with refrigeration or heating equipment of claim 1, wherein the refrigeration chips are plural, the refrigeration chips are arranged in series, and the refrigeration chips are evenly distributed on the carrier One side. For example, the temperature control test system connected with refrigeration or heating equipment of claim 1, wherein the refrigeration chips are plural, the refrigeration chips are arranged in parallel, and the refrigeration chips are evenly distributed on the carrier One side. For example, the temperature control test system connected to refrigeration or heating equipment of claim 1, wherein the refrigeration chip includes a plurality of P-type semiconductor chips and N-type semiconductor chips arranged in alternating polarities, and the P-type semiconductor chips and The N-type semiconductor chips are electrically connected to the two carrier boards. For example, the temperature control test system connected with refrigeration or heating equipment of claim 1, wherein the working fluid system is a water-cooled fluid. For example, the temperature control test system connected to refrigeration or heating equipment of claim 1, wherein the temperature control module further includes a timing unit, and the timing unit is electrically connected to the refrigeration chip. For example, the temperature control test system connected with refrigeration or heating equipment of claim 1, wherein the temperature control module further includes a power-off unit, and the power-off unit is electrically connected to the temperature display unit. For example, the temperature control test system for connecting refrigeration or heating equipment of claim 5, wherein one side of the carrier boards is a cooling connection surface, and the other side is a heating connection surface. For example, the temperature control test system connected with refrigeration or heating equipment of claim 8, wherein the temperature control module further includes an alarm unit, and the alarm unit is electrically connected to the temperature display unit and the power-off unit.

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