CN219574756U - Water-cooled row - Google Patents

Abstract

The utility model relates to a water-cooled bar. The water-cooling row comprises an upper water tank, a cooling water tank, a middle water tank and a lower water tank which are sequentially communicated, wherein the upper water tank is provided with a liquid inlet, the cooling water tank is provided with a semiconductor refrigerating sheet, the lower water tank is provided with a liquid outlet, a temperature controller is arranged at the liquid outlet and is in signal connection with the semiconductor refrigerating sheet, and the temperature controller is used for controlling the start and stop of the semiconductor refrigerating sheet. The semiconductor refrigerating sheet has better cooling effect on the water cooling liquid in the cooling water tank, the water cooling liquid flowing into the cooling water tank is cooled to a large extent at the moment, the temperature of the water cooling liquid flowing into the lower water tank is gradually reduced, and after the temperature controller in the lower water tank detects that the temperature of the water cooling liquid reaches the temperature requirement of the water cooling liquid of the water cooling row, the temperature controller stops the refrigerating work of the semiconductor refrigerating sheet, so that the power consumption is reduced, and the energy is saved. The capacity of the water cooling liquid is improved, the heat dissipation effect of a heat source is further improved, and the problem of performance reduction of a computer caused by poor heat dissipation is solved.

Description

Water-cooled row

Technical Field

The utility model relates to the technical field of water cooling rows, in particular to a water cooling row.

Background

With the high-speed development of integration level and miniaturization of electronic devices, the performance of computers is continuously improved, so that the power and the heat flux density of computing cores such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like are continuously improved, and some high-performance computers gradually bear small-sized simulation computing tasks, so that the computing cores such as the CPU, the GPU and the like are larger in load, serious in heating and influence on the performance of the computers. Air-cooled heat sinks have failed to meet the heat dissipation requirements, and therefore, water-cooled heat sinks are increasingly being used in computers to meet the heat dissipation requirements.

A common water-cooled radiator consists of a water-cooled head, typically containing a water pump, a connecting hose, a water-cooled row, and a radiator fan. The water cooling head is contacted with heating elements such as a CPU and the like, and the water cooling liquid in the water cooling head absorbs heat from a heat source; the water cooling head is connected with the water cooling row through a connecting hose, and the flow of water cooling liquid between the water cooling head and the water cooling row is driven by a water pump; the water cooling row is provided with cooling liquid of a cooling fan.

As the performance of the computer continues to increase, the probability of bearing the high-load computing task is increased, so that the heating values of the CPU and the GPU will be larger, the temperature of the water cooling liquid in the water cooling radiator is increased, the water cooling liquid is difficult to be cooled to a larger extent by the water cooling row, the heat dissipation effect of the heat source is affected, and the performance of the computer is reduced.

Disclosure of Invention

Based on the above, a water cooling bar is provided to solve the problem that the water cooling bar is difficult to cool water cooling liquid to a large extent, and the heat dissipation effect of a heat source is affected, so that the performance of a computer is reduced.

The embodiment of the utility model provides a water-cooled bar, which comprises the following components in turn communicated with each other:

the upper water tank is provided with a liquid inlet;

the cooling water tank is provided with a semiconductor refrigerating sheet;

an intermediate water tank; and

the lower water tank, the lower water tank is provided with the liquid outlet, liquid outlet department is provided with the temperature controller, the temperature controller with semiconductor refrigeration piece signal connection, the temperature controller is logical to be controlled the start-stop of semiconductor refrigeration piece.

According to the water-cooling row provided by the embodiment of the utility model, the cooling water tank is added between the upper water tank and the middle water tank, so that the path length of water-cooling liquid in the water-cooling row is increased, and the cooling effect is improved; the water cooling liquid enters the upper water tank from the liquid inlet and then enters the cooling water tank, the semi-water cooling liquid flows from the cooling water tank to the middle water tank, flows from the middle water tank to the lower water tank, and finally leaves the water cooling row through the liquid outlet, so that the cooling of the water cooling liquid is realized. The temperature controller monitors the temperature in the lower water tank, when detecting that the temperature of the water-cooling liquid in the lower water tank is higher, the temperature controller starts the refrigeration work of the semiconductor refrigeration piece, the semiconductor refrigeration piece has better cooling effect to the water-cooling liquid in the cooling water tank, the water-cooling liquid in the cooling water tank is cooled by a large extent at this moment, the temperature of the water-cooling liquid in the lower water tank gradually decreases, and after the temperature controller in the lower water tank detects that the temperature of the water-cooling liquid reaches the water-cooling liquid temperature requirement of the water-cooling row, the temperature controller stops the refrigeration work of the semiconductor refrigeration piece, reduces power consumption and saves energy. The capacity of the water cooling liquid is improved, the heat dissipation effect of a heat source is further improved, and the problem of performance reduction of a computer caused by poor heat dissipation is solved.

In one embodiment, the outer wall of the cooling water tank is provided with a mounting groove, the semiconductor refrigerating piece is provided with a cold end, the semiconductor refrigerating piece is mounted in the mounting groove, and the cold end is abutted with the inner wall of the mounting groove. The mounting groove provides installation space for the installation of semiconductor refrigeration piece for the semiconductor refrigeration piece is more stable to be installed on cooling water tank, simultaneously for the cold junction of semiconductor refrigeration piece provide with the laminating space of cooling water tank heat transfer, make the cold junction of semiconductor refrigeration piece laminate with cooling water tank in the mounting groove, improve the heat transfer effect of cooling water tank and semiconductor refrigeration piece, and then improve the chilled effect of the water-cooling liquid in the cooling water tank by semiconductor refrigeration piece.

In one embodiment, the semiconductor refrigeration piece is provided with a refrigeration piece radiator, the semiconductor refrigeration piece is provided with a hot end, and the refrigeration piece radiator is connected with the hot end. The refrigerating fin radiator is used for radiating heat of the hot end of the semiconductor refrigerating fin, so that the radiating effect of the hot end of the semiconductor refrigerating fin is ensured, and the refrigerating capacity of the semiconductor refrigerating fin is improved.

In one embodiment, a heat-insulating gasket is disposed between the cooling water tank and the cooling fin radiator. The heat insulation sealing gasket prevents the cooling water tank from being directly connected with the refrigerating plate radiator, and avoids direct heat exchange between the cooling water tank and the refrigerating plate radiator, so that a smooth heat exchange path between the cooling water tank and the semiconductor refrigerating plate is ensured.

In one embodiment, a fixing column is fixedly connected between the cooling water tank, the heat insulation sealing gasket and the refrigerating fin radiator. The fixed column is in the same place coolant tank, heat-proof seal pad and refrigeration piece radiator fixed connection for coolant tank, heat-proof seal pad and refrigeration piece radiator's connection is stable, improves the structural stability of water-cooling row, when guaranteeing compact structure, also is convenient for dismouting and maintenance.

In one embodiment, the semiconductor cooling fin is provided with a cooling fin cooling fan, the cooling fin cooling fan is mounted on the fixing column, the cooling fin cooling fan faces the cooling fin radiator, the temperature controller is in signal connection with the cooling fin cooling fan, and the temperature controller is used for controlling the starting and stopping of the cooling fin cooling fan. The temperature controller monitors the temperature of the water in the lower water tank, when the temperature of the water cooling liquid in the lower water tank is detected to be higher, the temperature controller starts the semiconductor refrigerating sheet and the refrigerating sheet cooling fan, the refrigerating sheet cooling fan has a radiating effect on the semiconductor refrigerating sheet, the semiconductor refrigerating sheet has a better cooling effect on the water cooling liquid in the cooling water tank, the water cooling liquid flowing into the cooling water tank is cooled rapidly at the moment, the temperature of the water cooling liquid flowing into the lower water tank is reduced rapidly, and after the temperature of the water cooling liquid in the lower water tank is detected to reach the water cooling liquid temperature requirement of the water cooling row, the temperature controller stops the operation of the semiconductor refrigerating sheet and the refrigerating sheet cooling fan. Through the arrangement, the water cooling drain can quickly cool the water cooling liquid, meanwhile, the power consumption is reduced, and the energy is saved.

In one embodiment, the water cooling row further comprises a plurality of communicating pipes, the upper water tank, the cooling water tank, the middle water tank and the lower water tank are sequentially communicated by the plurality of communicating pipes, and the outer wall of each communicating pipe is connected with a first fin. Communicating pipe intercommunication water tank, coolant tank, middle water tank and lower water tank, the setting of first fin makes communicating pipe except the intercommunication effect, still has the radiating effect, further improves the ability of water-cooling row cooling water-cooling liquid.

In one embodiment, the water cooling row further comprises a cold row cooling fan, and the cold row cooling fan faces the communicating pipe. The cold row cooling fan dissipates heat of the communicating pipe, and when the temperature controller closes the semiconductor refrigerating sheet, the water cooling row can lean against the cold row cooling fan to cool the water cooling liquid in the communicating pipe, so that the cooling effect of the water cooling row is ensured.

In one embodiment, the communicating tube and the two sides of the first fin are respectively provided with a fastener, and the cold row cooling fan is fixed on the fastener. The fastener plays a protective role on one hand to communicating pipe and first fin, and on the other hand provides installation space for cold row radiator fan, improves water-cooling row overall structure intensity, improves water-cooling row life.

In one embodiment, a second fin is disposed within the cooling water tank. The second fins can increase the heat exchange area between the water cooling liquid in the cooling water tank and the cooling water tank, and further increase the refrigerating effect of the semiconductor refrigerating sheet on the water cooling liquid in the cooling water tank.

Drawings

Fig. 1 is a schematic view of a water-cooled bar according to an embodiment of the utility model.

Fig. 2 is a cross-sectional view of a water cooled bar according to an embodiment of the present utility model.

Fig. 3 is a schematic diagram of a lower water tank in a water-cooled row according to an embodiment of the utility model.

Fig. 4 is a side view of a lower water tank in a water cooled row according to an embodiment of the present utility model.

FIG. 5 is an exploded view of a water cooled bar according to an embodiment of the present utility model.

Fig. 6 is an enlarged partial schematic view at a in fig. 5.

FIG. 7 is another angular cross-sectional view of a water cooled bar according to an embodiment of the present utility model.

Fig. 8 is a cross-sectional view of a cooling water tank in a water cooled row according to an embodiment of the utility model.

Fig. 9 is a schematic diagram of a water cooling row according to an embodiment of the present utility model, in which semiconductor cooling fins and related accessories thereof are hidden, and a first fin is hidden to embody a communication pipe structure.

Fig. 10 is a schematic view showing a partial structure of a water-cooled bar according to an embodiment of the utility model.

Fig. 11 is a partially enlarged schematic illustration at a in fig. 10.

Reference numerals:

1. a water supply tank; 11. a liquid inlet;

2. a cooling water tank; 21. a mounting groove; 22. a second fin;

3. a semiconductor refrigeration sheet; 31. a cold end; 32. a hot end; 33. a cooling fin radiator; 34. a heat insulating gasket; 35. fixing the column; 36. cooling fin cooling fan;

4. an intermediate water tank;

5. a lower water tank; 51. a liquid outlet; 52. a water filling port; 53. a relief groove;

6. a temperature controller;

7. a communicating pipe; 71. a first fin; 72. a first pipeline; 73. a second pipeline; 74. a third pipeline;

8. a cold row cooling fan;

9. a fastener.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

With the high-speed development of integration level and miniaturization of electronic devices, the performance of computers is continuously improved, so that the power and the heat flux density of computing cores such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like are continuously improved, and some high-performance computers gradually bear small-sized simulation computing tasks, so that the computing cores such as the CPU, the GPU and the like are larger in load, serious in heating and influence on the performance of the computers. Air-cooled heat sinks have failed to meet the heat dissipation requirements, and therefore, water-cooled heat sinks are increasingly being used in computers to meet the heat dissipation requirements.

The inventor notices that as the performance of the computer continues to increase, the probability of bearing the high-load computing task is increased, so that the heating value of the CPU and the GPU is increased, the temperature of the water cooling liquid in the water cooling radiator is increased, the water cooling liquid is difficult to be cooled to a large extent by the water cooling exhaust, and the heat dissipation effect of the heat source is affected, so that the performance of the computer is reduced.

In order to alleviate the problem of higher temperature of water cooling liquid in the water cooling row, the inventor researches and discovers that a cooling water tank can be provided for the water cooling row in design, a semiconductor refrigerating sheet is arranged at the cooling water tank, a temperature controller is arranged at the lower water tank, and the temperature controller controls the start and stop of the semiconductor refrigerating sheet through the monitoring of the temperature of the water cooling liquid at the lower water tank.

In such water cooling row, the cooling water tank has increased the path length of water-cooling liquid in the water cooling row, and the semiconductor refrigeration piece has better cooling effect to the water-cooling liquid in the cooling water tank, and the temperature controller detects that the temperature of water-cooling liquid reaches the water-cooling liquid temperature requirement of water cooling row, and the temperature controller stops the refrigeration work of semiconductor refrigeration piece, reduces the consumption, the energy saving.

Referring to fig. 1 and 2, fig. 1 shows a schematic structure of a water-cooled bar according to an embodiment of the present utility model, and fig. 2 shows a cross-sectional view of a water-cooled bar according to an embodiment of the present utility model. The embodiment of the utility model provides a water cooling row, which comprises an upper water tank 1, a cooling water tank 2, a middle water tank 4 and a lower water tank 5 which are sequentially communicated, wherein the upper water tank 1 is provided with a liquid inlet 11; the cooling water tank 2 is provided with a semiconductor refrigerating sheet 3; the lower water tank 5 is provided with a liquid outlet 51, a temperature controller 6 is arranged at the liquid outlet 51, the temperature controller 6 is connected with the semiconductor refrigerating sheet 3 in a signal manner, and the temperature controller 6 is used for controlling the starting and stopping of the semiconductor refrigerating sheet 3.

According to the water-cooling row provided by the embodiment of the utility model, the cooling water tank 2 is added between the upper water tank 1 and the middle water tank 4, so that the path length of water-cooling liquid in the water-cooling row is increased, and the cooling effect is improved; the water-cooling liquid enters the upper water tank 1 from the liquid inlet 11 and then enters the cooling water tank 2, the semi-water-cooling liquid flows from the cooling water tank 2 to the middle water tank 4, flows from the middle water tank 4 to the lower water tank 5, and finally leaves the water-cooling row through the liquid outlet 51, so that the cooling of the water-cooling liquid is realized. The temperature controller 6 monitors the temperature in the lower water tank 5, when detecting that the temperature of the water cooling liquid in the lower water tank 5 is higher, the temperature controller 6 starts the refrigeration work of the semiconductor refrigeration piece 3, the semiconductor refrigeration piece 3 has better cooling effect to the water cooling liquid in the cooling water tank 2, the water cooling liquid flowing into the cooling water tank 2 at this moment is cooled to a great extent, the temperature of the water cooling liquid flowing into the lower water tank 5 is gradually reduced, and after the temperature controller 6 in the lower water tank 5 detects that the temperature of the water cooling liquid reaches the water cooling liquid temperature requirement of the water cooling row, the temperature controller 6 stops the refrigeration work of the semiconductor refrigeration piece 3, reduces the power consumption and saves energy. The capacity of the water cooling liquid is improved, the heat dissipation effect of a heat source is further improved, and the problem of performance reduction of a computer caused by poor heat dissipation is solved.

Specifically, the semiconductor refrigerating sheet 3 is also called a thermoelectric refrigerating sheet, and when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can absorb heat and release heat respectively, so that the purpose of refrigeration can be realized. The refrigeration technology for generating negative thermal resistance is used for providing refrigeration by using the uncooled water tank 2 in the water cooling row, and the reliability is higher.

Referring to fig. 3 and 4, fig. 3 is a schematic view showing the structure of the bottom wall 5 in the water-cooling row according to an embodiment of the present utility model, and fig. 4 is a side view showing the bottom wall 5 in the water-cooling row according to an embodiment of the present utility model. Specifically, in some embodiments, the lower water tank 5 is provided with a liquid outlet 51 and a water injection port 52, the liquid outlet 51 is disposed at the top of the upper water tank 1, the water injection port 52 is disposed at the bottom of the lower water tank 5, and the temperature controller 6 is disposed near the liquid outlet 51, so that the measured liquid outlet temperature is more accurate. The outer wall of the lower water tank 5 is provided with the groove 53 of stepping down, and the groove 53 of stepping down provides the space of placing for the upper water tank 1, just in time the upper water tank 1 is put into, so set up for the liquid inlet position and the liquid outlet position of water-cooling row are close to, compact structure is convenient for link to each other with other external component.

Referring to fig. 5 and 6, fig. 5 shows an exploded view of a water-cooled bar according to an embodiment of the present utility model, and fig. 6 shows an enlarged partial view at a in fig. 5. In some embodiments, the outer wall of the cooling water tank 2 is provided with a mounting groove 21, the semiconductor refrigeration piece 3 is provided with a cold end 31, the semiconductor refrigeration piece 3 is mounted in the mounting groove 21, and the cold end 31 is abutted with the inner wall of the mounting groove 21.

Specifically, the bottom of the semiconductor refrigeration piece 3 is a cold end 31, and the cold end 31 of the semiconductor refrigeration piece 3 is attached to the inner wall of the mounting groove 21, so that heat exchange is realized.

The mounting groove 21 provides installation space for the installation of semiconductor refrigeration piece 3 for semiconductor refrigeration piece 3 is more stable to be installed on coolant tank 2, simultaneously for the cold junction 31 of semiconductor refrigeration piece 3 provide the laminating space with coolant tank 2 heat transfer, make the cold junction 31 of semiconductor refrigeration piece 3 laminate with coolant tank 2 in mounting groove 21, improve coolant tank 2 and the heat transfer effect of semiconductor refrigeration piece 3, and then improve the effect that the water-cooling liquid in the coolant tank 2 was cooled by semiconductor refrigeration piece 3.

Referring to fig. 5 and 6, in some embodiments, a fixing column 35 is fixedly connected between the cooling water tank 2, the heat insulation packing 34, and the cooling fin radiator 33.

Specifically, fixing holes matched with the fixing columns 35 are formed in the cooling water tank 2, the heat insulation sealing gasket 34 and the refrigerating fin radiator 33, and the fixing columns 35 are in threaded connection with the fixing holes.

Through the arrangement, the cooling water tank 2, the heat insulation sealing gasket 34 and the refrigerating fin radiator 33 are fixedly connected together through the fixing column 35, so that the cooling water tank 2, the heat insulation sealing gasket 34 and the refrigerating fin radiator 33 are stably connected, the structural stability of the water cooling row is improved, the structure is compact, and meanwhile, the disassembly, the assembly and the maintenance are convenient. It will be appreciated that other fixing methods other than the fixing posts 35 provided in the above embodiments may be adopted, and will not be described herein.

In some embodiments, the semiconductor cooling fin 3 is provided with a cooling fin radiator fan 36, the cooling fin radiator fan 36 is mounted on the fixed column 35, the cooling fin radiator fan 36 faces the cooling fin radiator 33, the temperature controller 6 is in signal connection with the cooling fin radiator fan 36, and the temperature controller 6 is in signal connection with the control of the start and stop of the cooling fin radiator fan 36.

The temperature controller 6 monitors the water temperature in the lower water tank 5, when the temperature of the water cooling liquid in the lower water tank 5 is detected to be higher, the temperature controller 6 starts the semiconductor cooling fin 3 and the cooling fin radiator fan 36, the cooling fin radiator fan 36 has a radiating effect on the semiconductor cooling fin 3, the semiconductor cooling fin 3 has a better cooling effect on the water cooling liquid in the cooling water tank 2, the water cooling liquid flowing into the cooling water tank 2 is rapidly cooled at the moment, the temperature of the water cooling liquid flowing into the lower water tank 5 is rapidly reduced, and after the temperature controller 6 in the lower water tank 5 detects that the temperature of the water cooling liquid reaches the water cooling liquid temperature requirement of the water cooling drain, the temperature controller 6 stops the operation of the semiconductor cooling fin 3 and the cooling fin radiator fan 36. Through the arrangement, the water cooling drain can quickly cool the water cooling liquid, meanwhile, the power consumption is reduced, and the energy is saved.

Referring to fig. 7, fig. 7 shows another angular cross-sectional view of a water cooled bar in accordance with an embodiment of the present utility model. In some embodiments, the semiconductor cooling fin 3 is provided with a cooling fin radiator 33, the semiconductor cooling fin 3 is provided with a hot end 32, and the cooling fin radiator 33 is connected with the hot end 32.

Specifically, in some embodiments, the top of the semiconductor refrigeration sheet 3 is the hot end 32, and the top of the semiconductor refrigeration sheet 3 is directly connected to the refrigeration sheet radiator 33, and the refrigeration sheet radiator 33 has more fins, so that the heat exchange efficiency can be increased. The refrigerating fin radiator 33 radiates heat for the hot end 32 of the semiconductor refrigerating fin 3, so that the radiating effect of the hot end 32 of the semiconductor refrigerating fin 3 is ensured, and the refrigerating capacity of the semiconductor refrigerating fin 3 is improved.

Referring to fig. 8, fig. 8 shows a cross-sectional view of a cooling water tank 2 in a water cooled row according to an embodiment of the present utility model. In some embodiments, an insulating gasket 34 is provided between the cooling water tank 2 and the cold plate radiator 33.

Specifically, in some embodiments, after the semiconductor refrigeration piece 3 is placed in the installation groove 21, the cold end 31 of the semiconductor refrigeration piece is completely placed in the installation groove 21, the hot end 32 of the semiconductor refrigeration piece is placed outside the installation groove 21 and is wrapped by the heat insulation sealing gasket 34, the heat insulation sealing gasket 34 is square ring-shaped, and the top of the heat insulation sealing gasket 34 is flush with the top surface of the hot end 32 of the semiconductor refrigeration piece 3 to form a flat plane for placing and installing the refrigeration piece radiator 33. The heat insulation sealing gasket 34 prevents the cooling water tank 2 from being directly connected with the refrigerating plate radiator 33, and prevents the cooling water tank 2 from directly exchanging heat with the refrigerating plate radiator 33, so that the unblocked heat exchange path between the cooling water tank 2 and the semiconductor refrigerating plate 3 is ensured.

Referring to fig. 7 and 8, in some embodiments, a second fin 22 is disposed within the cooling water tank 2.

Specifically, in some embodiments, the second fins 22 in the cooling water tank 2 are fixedly provided in a plurality of, evenly spaced arrangement. The second fins 22 can increase the heat exchange area between the water-cooling liquid in the cooling water tank 2 and the cooling water tank 2, and further increase the effect of cooling the water-cooling liquid in the cooling water tank 2 by the semiconductor cooling fin 3.

Referring to fig. 9, 10 and 11, fig. 9 is a schematic structural view of a water cooling row according to an embodiment of the present utility model, in which the semiconductor refrigeration sheet 3 and its related accessories are hidden, and the first fins 71 are hidden to embody the structure of the communication tube 7, fig. 10 is a schematic structural view of a portion of the water cooling row according to an embodiment of the present utility model, and fig. 11 is a schematic enlarged partial view of a portion of fig. 10. In some embodiments, the water cooling row further comprises a plurality of communicating pipes 7, the plurality of communicating pipes 7 sequentially communicate the upper water tank 1, the cooling water tank 2, the middle water tank 4 and the lower water tank 5, and the outer wall of the communicating pipe 7 is connected with a first fin 71.

Specifically, in some embodiments, the communication pipe 7 includes a first pipe 72, a second pipe 73, and a third pipe 74, the first pipe 72 being used to communicate the upper tank 1 and the cooling tank 2, the second pipe 73 being used to communicate the cooling tank 2 and the intermediate tank 4, the third pipe 74 being used to communicate the intermediate tank 4 and the lower tank 5, the third pipe 74 being provided in a plurality and being disposed separately on both sides of the cooling tank 2. The communicating pipe 7 communicates the upper water tank 1, the cooling water tank 2, the middle water tank 4 and the lower water tank 5, and the arrangement of the first fins 71 enables the communicating pipe 7 to have a heat dissipation effect besides a communication effect, so that the capability of water cooling and water cooling liquid discharging is further improved.

Referring back to fig. 2 and 5, in some embodiments, the water cooling tower further includes a cooling tower cooling fan 8, and the cooling tower cooling fan 8 faces the communicating pipe 7. The cold row cooling fan 8 dissipates heat of the communicating pipe 7, and when the temperature controller 6 closes the semiconductor refrigerating sheet 3, the water cooling row can lean against the cold row cooling fan 8 to cool the water cooling liquid in the communicating pipe 7, so that the cooling effect of the water cooling row is ensured.

In some embodiments, the fastening members 9 are respectively disposed on two sides of the communication tube 7 and the first fin 71, and the cooling fan 8 is fixed on the fastening members 9.

The fastener 9 protects the communicating pipe 7 and the first fin 71, and provides a mounting space for the cooling fan 8, so that the overall structural strength of the water cooling row is improved, and the service life of the water cooling row is prolonged.

When the water-cooling row works, the water-cooling liquid absorbs heat at the heat source of the CPU and the like, enters the water-cooling row from the liquid inlet 11 of the upper water tank 1, flows through the cooling water tank 2 through the first pipeline 72, flows through the middle water tank 4 through the second pipeline 73, is split in the middle water tank 4, and enters the lower water tank 5 from the communicating pipes 7 at the two sides of the water-cooling row, namely the third pipeline 74. When the temperature controller 6 at the liquid outlet 51 of the lower water tank 5 detects that the temperature of the water cooling liquid is lower, the semiconductor refrigerating sheet 3 is closed, the water cooling liquid is cooled by the cold discharge cooling fan 8, and when the temperature controller 6 detects that the temperature of the water cooling liquid in the lower water tank 5 is higher, the semiconductor refrigerating sheet 3 and the cooling sheet cooling fan 36 are opened, so that the water cooling liquid is cooled to a large extent and rapidly. Under the condition that the computer load is not high, the semiconductor refrigerating sheet 3 is closed, so that the power consumption is reduced; under the condition that the computer load is higher and the temperature of the water cooling liquid is higher, the semiconductor refrigerating sheet 3 is started to cool the water cooling liquid, so that the calculation performance of the computer is ensured.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The water-cooling row is characterized by comprising the following components which are communicated in sequence:

the upper water tank is provided with a liquid inlet;

the cooling water tank is provided with a semiconductor refrigerating sheet;

an intermediate water tank; and

the lower water tank, the lower water tank is provided with the liquid outlet, liquid outlet department is provided with the temperature controller, the temperature controller with semiconductor refrigeration piece signal connection, the temperature controller is logical to be controlled the start-stop of semiconductor refrigeration piece.

2. The water cooled bar of claim 1 wherein the cooling water tank outer wall is provided with a mounting groove, the semiconductor cooling fin is provided with a cold end, the semiconductor cooling fin is mounted in the mounting groove, and the cold end abuts the mounting groove inner wall.

3. The water cooled bar of claim 1 wherein the semiconductor cooling fin is provided with a cooling fin heat sink, the semiconductor cooling fin is provided with a hot side, and the cooling fin heat sink is connected to the hot side.

4. A water cooled bar according to claim 3, wherein a heat insulating gasket is provided between the cooling water tank and the cooling fin radiator.

5. The water cooled bar of claim 4 wherein fixed columns are fixedly connected between the cooling water tank, the heat insulating gasket and the cooling fin radiator.

6. The water cooling bar according to claim 5, wherein the semiconductor cooling fin is provided with a cooling fin cooling fan, the cooling fin cooling fan is mounted on the fixing column, the cooling fin cooling fan faces the cooling fin radiator, the temperature controller is in signal connection with the cooling fin cooling fan, and the temperature controller is used for controlling the starting and stopping of the cooling fin cooling fan.

7. The water cooling bar according to claim 1, further comprising a plurality of communicating pipes, wherein the plurality of communicating pipes sequentially communicate the upper water tank, the cooling water tank, the intermediate water tank, and the lower water tank, and the communicating pipes are connected with first fins on outer walls thereof.

8. The water cooling bar as recited in claim 7 further comprising a cold bar cooling fan, said cold bar cooling fan being oriented toward said communication tube.

9. The water cooling tower as claimed in claim 8, wherein the communicating tube and the first fin are provided with fasteners on both sides, respectively, and the cooling tower cooling fan is fixed to the fasteners.

10. The water cooled bar of claim 1 wherein a second fin is disposed within the cooling water tank.