TW202001166A - Temperature adjusting system and method for liquid - Google Patents
Temperature adjusting system and method for liquid Download PDFInfo
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本發明係有關於一種液體溫度調節系統。更具體地來說,本發明有關於一種具有熱電模組的液體溫度調節系統。 The invention relates to a liquid temperature adjustment system. More specifically, the present invention relates to a liquid temperature adjustment system having a thermoelectric module.
在日常生活以及工業製造的需求中,常常需要使用到將液體(例如水或飲料)升溫或降溫的情形。舉例而言,沖泡完成的牛奶、或放置於室溫下的飲品需降溫,以及冷藏後的湯品需升溫。 In daily life and industrial manufacturing requirements, it is often necessary to increase or decrease the temperature of liquids (such as water or beverages). For example, the brewed milk or drinks placed at room temperature need to be cooled down, and the soup after refrigeration needs to be heated up.
一般而言,會利用壓縮機和冷媒來提供降溫的功能,但這種方式並不便利,且將會產生大量的震動和噪音。又部分使用者可能能會在液體中直接加入冰塊,這則會造成液體濃度的稀釋。另外,前述兩種方式都無法準確地控制溫度。同樣的,使用微波爐或瓦斯爐來升溫液體時,也會產生震動和噪音,且亦難以準確控制溫度。因此,如何解決前述問題始成一重要之課題。 Generally speaking, compressors and refrigerants are used to provide the cooling function, but this method is not convenient and will generate a lot of vibration and noise. Some users may be able to directly add ice cubes to the liquid, which will cause dilution of the liquid concentration. In addition, neither of the aforementioned two methods can accurately control the temperature. Similarly, when a microwave oven or gas stove is used to warm up the liquid, vibration and noise are generated, and it is difficult to accurately control the temperature. Therefore, how to solve the aforementioned problems has become an important issue.
為了解決上述習知之問題點,本發明提供一種液體溫度調節系統,包括一殼體、一第一熱電模組、一液體容納件、一第一散熱模組、以及一供電模組。殼體包括一開口。第一熱電模組設置於殼體中,並具有一第一表面 和相反於第一表面之一第二表面,其中液體容納件以可分離的方式接觸第一表面,而第一散熱模組則連接第二表面。供電模組電性連接第一熱電模組,且從供電模組流入第一熱電模組的電流方向為可改變的。 In order to solve the above-mentioned problems, the present invention provides a liquid temperature adjustment system, which includes a housing, a first thermoelectric module, a liquid container, a first heat dissipation module, and a power supply module. The housing includes an opening. The first thermoelectric module is disposed in the housing and has a first surface and a second surface opposite to the first surface, wherein the liquid container contacts the first surface in a detachable manner, and the first heat dissipation module is Connect the second surface. The power supply module is electrically connected to the first thermoelectric module, and the direction of the current flowing from the power supply module into the first thermoelectric module is changeable.
本發明一實施例中,液體容納件具有一底板,以可分離的方式接觸第一表面,且底板具有導熱材料,例如不銹鋼板、鎳板、鈦板、鍍鎳銅板、或陽極處理鋁板。第一熱電模組包括銻化鉍及其合金。第一散熱模組包括一風扇、一散熱鰭片、一水冷管線、一第一冷卻槽體、以及一第一冷卻液,其中第一冷卻液設置於第一冷卻槽體中。殼體上形成有至少一通孔,前述風扇設置於第一熱電模組和通孔之間。前述供電模組可包括一電池組件或一直流電源供應器。 In an embodiment of the present invention, the liquid container has a bottom plate that detachably contacts the first surface, and the bottom plate has a thermally conductive material, such as a stainless steel plate, a nickel plate, a titanium plate, a nickel-plated copper plate, or an anodized aluminum plate. The first thermoelectric module includes bismuth antimonide and its alloy. The first heat dissipation module includes a fan, a heat dissipation fin, a water cooling line, a first cooling tank, and a first cooling liquid, wherein the first cooling liquid is disposed in the first cooling tank. At least one through hole is formed on the casing, and the aforementioned fan is disposed between the first thermoelectric module and the through hole. The aforementioned power supply module may include a battery assembly or a DC power supply.
本發明另一實施例中,供電模組包括一發熱裝置、一第二熱電模組、以及一第二散熱模組。第二熱電模組貼附於發熱裝置上,且第二散熱模組設置於第二熱電模組上。第二熱電模組位於發熱裝置和第二散熱模組之間。於一些實施例中,供電模組更包括電性連接第二熱電模組之一連接端子,用以連接一外部裝置。 In another embodiment of the present invention, the power supply module includes a heating device, a second thermoelectric module, and a second heat dissipation module. The second thermoelectric module is attached to the heating device, and the second heat dissipation module is disposed on the second thermoelectric module. The second thermoelectric module is located between the heating device and the second heat dissipation module. In some embodiments, the power supply module further includes a connection terminal electrically connected to the second thermoelectric module for connecting an external device.
本發明更提供一種液體溫度調節方法,包括:提供前述液體溫度調節系統;將一液體注入液體容納件中;使液體容納件接觸第一熱電模組之第一表面;以及利用供電模組提供不同方向的電流進入第一熱電模組,使第一熱電模組之第一表面的溫度上升或下降。 The invention further provides a liquid temperature adjustment method, including: providing the aforementioned liquid temperature adjustment system; injecting a liquid into the liquid container; making the liquid container contact the first surface of the first thermoelectric module; and using the power supply module to provide different The current in the direction enters the first thermoelectric module, causing the temperature of the first surface of the first thermoelectric module to rise or fall.
100‧‧‧殼體 100‧‧‧Housing
110‧‧‧容置空間 110‧‧‧accommodation space
120‧‧‧頂面 120‧‧‧Top
121‧‧‧開口 121‧‧‧ opening
130‧‧‧底面 130‧‧‧Bottom
131‧‧‧通孔 131‧‧‧Through hole
200‧‧‧第一熱電模組 200‧‧‧The first thermoelectric module
210‧‧‧第一表面 210‧‧‧First surface
220‧‧‧第二表面 220‧‧‧Second surface
230‧‧‧陶瓷板 230‧‧‧ceramic plate
240‧‧‧電極 240‧‧‧electrode
250‧‧‧熱電元件 250‧‧‧thermoelectric element
260‧‧‧熱電元件 260‧‧‧thermoelectric element
300‧‧‧第一散熱模組 300‧‧‧The first cooling module
310‧‧‧風扇 310‧‧‧Fan
320‧‧‧散熱鰭片 320‧‧‧ Fin
330‧‧‧水冷管線 330‧‧‧Water cooling pipeline
340‧‧‧第一冷卻槽體 340‧‧‧The first cooling tank
350‧‧‧第一冷卻液 350‧‧‧ First coolant
400‧‧‧液體容納件 400‧‧‧Liquid container
410‧‧‧底板 410‧‧‧Bottom plate
420‧‧‧側壁 420‧‧‧Side wall
500‧‧‧供電模組 500‧‧‧Power supply module
510‧‧‧供電部 510‧‧‧Power Supply Department
511‧‧‧發熱裝置 511‧‧‧heating device
512‧‧‧第二熱電模組 512‧‧‧The second thermoelectric module
513‧‧‧第二散熱模組 513‧‧‧ Second cooling module
514‧‧‧發熱承載板 514‧‧‧heat bearing plate
515‧‧‧第二冷卻槽體 515‧‧‧Second cooling tank
516‧‧‧第二冷卻液 516‧‧‧second coolant
520‧‧‧連接端子 520‧‧‧Connecting terminal
600‧‧‧連接端子 600‧‧‧Connecting terminal
612‧‧‧第三熱電模組 612‧‧‧The third thermoelectric module
613‧‧‧第三散熱模組 613‧‧‧ Third cooling module
B‧‧‧基座 B‧‧‧Dock
D‧‧‧外部裝置 D‧‧‧External device
L‧‧‧液體 L‧‧‧Liquid
T‧‧‧液體溫度調節系統 T‧‧‧Liquid temperature regulating system
W1、W2、W3、W4、W5、W6‧‧‧導線 W1, W2, W3, W4, W5, W6‧‧‧ wire
第1圖係表示本發明一實施例之液體溫度調節系統的示意圖。 Figure 1 is a schematic diagram showing a liquid temperature adjustment system according to an embodiment of the present invention.
第2圖係表示本發明一實施例中之第一熱電模組的示意圖。 FIG. 2 is a schematic diagram showing a first thermoelectric module in an embodiment of the invention.
第3A圖係表示本發明一實施例之液體溫度調節系統的示意圖,其中供電模組供給之電流係沿第一方向進入第一熱電模組。 FIG. 3A is a schematic diagram showing a liquid temperature adjustment system according to an embodiment of the present invention, in which the current supplied by the power supply module enters the first thermoelectric module in the first direction.
第3B圖係表示本發明一實施例之液體溫度調節系統的示意圖,其中供電模組供給之電流係沿第二方向進入第一熱電模組,且第二方向相反於第一方向。 FIG. 3B is a schematic diagram of a liquid temperature adjustment system according to an embodiment of the present invention, in which the current supplied by the power supply module enters the first thermoelectric module along the second direction, and the second direction is opposite to the first direction.
第4圖係表示本發明另一實施例之液體溫度調節系統的示意圖。 Figure 4 is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the present invention.
第5A圖係表示本發明另一實施例之液體溫度調節系統的示意圖。 FIG. 5A is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.
第5B圖係表示本發明另一實施例之液體溫度調節系統的示意圖。 FIG. 5B is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.
第6A圖係表示本發明另一實施例之液體溫度調節系統的示意圖。 FIG. 6A is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the present invention.
第6B圖係表示本發明另一實施例之液體溫度調節系統的示意圖。 FIG. 6B is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.
以下說明本發明實施例之液體溫度調節系統以及液體溫度調節方法。然而,可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。 The liquid temperature adjustment system and liquid temperature adjustment method of the embodiments of the present invention are described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method, and are not intended to limit the scope of the present invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the disclosure. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the background or context of the relevant technology and this disclosure, and not in an idealized or excessively formal manner Interpretation, unless specifically defined here.
第1圖係表示本發明一實施例之液體溫度調節系統T的示意圖。請參閱第1圖,前述液體溫度調節系統T主要包括一殼體100、一第一熱電模組200、一第一散熱模組300、一液體容納件400、以及一供電模組500,其中殼體100、第一熱電模組200和第一散熱模組300可構成一基座B,且液體容納件100在裝載液體(例如水或飲料)後可放置於此基座B上。待供電模組200供給電力予基座B之後,液體容納件100中的液體即可升溫或降溫。以下說明前述各元件的具體結構和配置。 FIG. 1 is a schematic diagram showing a liquid temperature adjustment system T according to an embodiment of the present invention. Referring to FIG. 1, the aforementioned liquid temperature adjustment system T mainly includes a
如第1圖所示,殼體100為一中空盒體,其具有一容置空間110、一頂面120、一底面130、以及一連接部140。頂面120上形成有連通容置空間110和外部環境之一開口121,而底面130上則形成有連通容置空間110和外部環境的複數個通孔131。 As shown in FIG. 1, the
第一熱電模組200設置於殼體100的容置空間110中,並具有一第一表面210以及相反於第一表面210之一第二表面220。當第一熱電模組200設置於殼體100的容置空間110中時,第一熱電模組200的第一表面210會朝向前述開口121並由開口121顯露。於本實施例中,第一熱電模組200的尺寸會大於或等於開口121的尺寸,因此第一熱電模組200可完全遮蔽前述開口121。此外,第一熱電模組200更藉由導線W1、W2連接至殼體100上的連接部140。 The first
第2圖係表示第一熱電模組200的結構示意圖。如圖所示,第一熱電模組200包括兩片陶瓷板230、複數個電極240、以及複數個熱電元件250、260。前述電極240可利用鍍膜方式形成於陶瓷板230上,而熱電元件250、260則可藉由前述電極240彼此串聯。 FIG. 2 is a schematic diagram showing the structure of the first
於本實施例中,陶瓷板230包括氧化鋁,電極240包括銅,且熱電元件250、260包括銻化鉍(Bismuth telluride)及其合金(舉例而言,熱電元件250、260可分別包括N型銻化鉍(Bi2Te2.55Se0.45)和P型銻化鉍(Bi0.5Sb1.5Te3))。如此一來,可以在較低溫的範圍(例如低於300℃)中使液體升溫或降溫。於一些實施例中,熱電元件250、260亦可包括銻化鉛(Lead telluride)及其合金、或矽鍺合金(Silicon germanium)。 In this embodiment, the
請回到第1圖,第一散熱模組300包括一風扇310、至少一散熱鰭片320、以及至少一水冷管線330。散熱鰭片320和水冷管線330與第一熱電模組200的第二表面220接觸,而風扇310則設置於第一熱電模組200和殼體100的通孔131之間。 Please return to FIG. 1, the first
液體容納件400可包括一底板410和一側壁420,其中底板410包括金屬材料,例如可為不鏽鋼板、鎳板、鈦板、鍍鎳銅板或陽極處理鋁板。側壁420則連接前述底板410並圍繞出容納液體的空間,其材料例如可包括金屬、玻璃或陶瓷。 The
供電模組500包括一供電部510、一連接端子520、以及導線W3、W4,且供電部510經由導線W3、W4與連接端子520電性連接。 The
以下說明液體溫度調節系統T的使用方法。請參閱第3A圖,首先,使用者可將欲調整溫度之液體L注入液體容納件400中,並將前述液體容納件400放置於基座B的第一熱電模組200上,使液體容納件400的底板410接觸第一熱電模組200的第一表面210。應注意的是,於本實施例中,殼體100之頂面120和底面130之間的距離係大於第一熱電模組200和底面130之間的距離,因此開口121和第一熱電模組200可構成一凹陷,以利液體容納件400之定位。 The method of using the liquid temperature adjustment system T will be described below. Please refer to FIG. 3A. First, the user may inject the liquid L whose temperature is to be adjusted into the
接著,使用者可將供電模組500的連接端子520連接至殼體100上的連接部140,例如使導線W1、W2分別電性連接至導線W3、W4。於本實施例中,連接端子520和連接部140可利用磁吸方式連接,以方便使用者使用。舉例來說,連接部140可設有磁鐵,而連接端子520上則可具有磁性元件。 Then, the user can connect the
待連接端子520連接至連接部140後,供電部510可沿一第一方向供給電力至第一熱電模組200。具體而言,供電部510供給之電力可依據流經導線W3、導線W1、第一熱電模組200、導線W2、導線W4以構成一封閉迴路。此時,由於第一熱電模組200之熱電元件250、260中的載子作用,第一表面210之溫度將會下降,且第二表面220之溫度會上升。液體L中的熱量可透過液體容納件400之底板410傳導至第一熱電模組200,進而達到使液體L降溫的效果。 After the
同時,第一散熱模組300可運作來帶出第二表面220上的熱量,以使液體溫度調節系統T能夠穩定運作。舉例而言,散熱鰭片320可使散熱面積增加,冷卻液(例如油或水)流過水冷管線330可帶走第二表面220上的熱量,而風扇310則可將殼體100之容置空間110中的熱氣從通孔131吹出至外部環境。 At the same time, the first
請參閱第3B圖,當使用者欲利用液體溫度調節系統T將液體容納件400內之液體L的溫度升高時,可將導線W1、W2分別電性連接至導線W4、W3。供電部510供給之電力可依據流經導線W3、導線W2、第一熱電模組200、導線W1、導線W4而構成一封閉迴路。 Referring to FIG. 3B, when the user wants to use the liquid temperature adjustment system T to increase the temperature of the liquid L in the
此時,由於第一熱電模組200之熱電元件250、260中的載子作用,第一表面210之溫度將會上升,且第二表面220之溫度會下降。熱量可透過液體容納件400之底板410傳導至液體L,進而達到使液體L升溫的效果。 At this time, due to the carrier in the
需特別說明的是,雖然此時第二表面220之溫度會降低,但在長時間運作下,導線W1、W2和第一表面210的熱能仍會累積於容置空間110中,造成液體溫度調節系統T的效率降低。因此,第一散熱模組300仍可運作來帶出容置空間110中的熱量。 It should be noted that although the temperature of the
於一些實施例中,第一散熱模組300可省略風扇310、散熱鰭片320、及/或水冷管線330,以減少液體溫度調節系統T的整體尺寸。 In some embodiments, the first
請參閱第4圖,於本發明另一實施例中,液體溫度調節系統T的第一散熱模組300更可包括一第一冷卻槽體340和一第一冷卻液350。第一冷卻液350設置於第一冷卻槽體340中,且散熱鰭片320的至少一部分可浸泡於前述第一冷卻液350內,以增加散熱效率。 Please refer to FIG. 4. In another embodiment of the present invention, the first
前述供電模組500可包括供給直流電的各種裝置。舉例而言,如第5A圖所示,供電模組500的供電部510可包括電池組件。如第5B圖所示,於另一實施例中,供電模組500的供電部510可為一直流電源供應器。 The aforementioned
請參閱第6A圖,於本發明另一實施例中,供電模組500的供電部510係包括一發熱裝置511、複數個互相串聯的第二熱電模組512、一第二散熱模組513、以及一發熱承載板514。前述發熱裝置511例如可為烤爐、工業用壁爐、或家用電器。 Please refer to FIG. 6A. In another embodiment of the present invention, the
複數個互相串聯的第二熱電模組512貼附於發熱裝置511的底盤,且第二散熱模組513貼附於複數個互相串聯的第二熱電模組512下方。換言之,第二散熱模組513和發熱裝置511分別位於複數個互相串聯的第二熱電模組512的相反表面。於本實施例中,複數個互相串聯的第二熱電模組512的各單一 熱電模組之結構與第一熱電模組200的結構相同,且第二散熱模組513包括一散熱鰭片。 A plurality of second
於一些實施例中,第二散熱模組513亦可包括類似於前述第一散熱模組300的元件和配置,亦即可包含第二冷卻液槽體515及第二冷卻液516等元件。 In some embodiments, the second
如第6A圖所示,複數個互相串聯的第二熱電模組512經由導線W3、W4與連接端子520電性連接。藉由第二熱電模組512相反面的溫度差,可產生電流以供給至前述第一熱電模組200,進而使液體容納件400中的液體L升溫或降溫。 As shown in FIG. 6A, a plurality of second
請參閱第6B圖,於本發明另一實施例中,可於發熱裝置511的側壁另外加裝一第三熱電模組612及第三散熱模組613,再藉由導線W5、W6連接至另一連接端子600。外部裝置D(例如智慧型手機或平板電腦)可與此連接端子600電性連接,以使第二熱電模組512產生的電力可供給至前述外部裝置D。 Please refer to FIG. 6B. In another embodiment of the present invention, a third
綜上所述,本發明提供一種液體溫度調節系統,包括一殼體、一第一熱電模組、一液體容納件、一第一散熱模組、以及一供電模組。殼體包括一開口。第一熱電模組設置於殼體中,並具有一第一表面和相反於第一表面之一第二表面,其中液體容納件以可分離的方式接觸第一表面,而第一散熱模組則連接第二表面。供電模組電性連接第一熱電模組,且從供電模組流入第一熱電模組的電流方向為可改變的。 In summary, the present invention provides a liquid temperature adjustment system, which includes a housing, a first thermoelectric module, a liquid container, a first heat dissipation module, and a power supply module. The housing includes an opening. The first thermoelectric module is disposed in the housing and has a first surface and a second surface opposite to the first surface, wherein the liquid container contacts the first surface in a detachable manner, and the first heat dissipation module is Connect the second surface. The power supply module is electrically connected to the first thermoelectric module, and the direction of the current flowing from the power supply module into the first thermoelectric module is changeable.
本發明更提供一種液體溫度調節方法,包括:提供前述液體溫度調節系統;將一液體注入液體容納件中;使液體容納件接觸第一熱電模組之第 一表面;以及利用供電模組提供不同方向的電流進入第一熱電模組,使第一熱電模組之第一表面的溫度上升或下降。 The invention further provides a liquid temperature adjustment method, including: providing the aforementioned liquid temperature adjustment system; injecting a liquid into the liquid container; making the liquid container contact the first surface of the first thermoelectric module; and using the power supply module to provide different The current in the direction enters the first thermoelectric module, causing the temperature of the first surface of the first thermoelectric module to rise or fall.
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions, and retouching without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, devices, methods, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content of the present invention It is understood that current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes a combination of each patent application scope and embodiment.
雖然本發明以前述數個較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外,每個申請專利範圍建構成一獨立的實施例,且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。 Although the present invention is disclosed as the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make some changes and retouching without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application. In addition, each patent application scope is constructed as an independent embodiment, and various combinations of patent application scopes and embodiments are within the scope of the present invention.
100‧‧‧殼體 100‧‧‧Housing
110‧‧‧容置空間 110‧‧‧accommodation space
120‧‧‧頂面 120‧‧‧Top
121‧‧‧開口 121‧‧‧ opening
130‧‧‧底面 130‧‧‧Bottom
131‧‧‧通孔 131‧‧‧Through hole
200‧‧‧第一熱電模組 200‧‧‧The first thermoelectric module
210‧‧‧第一表面 210‧‧‧First surface
220‧‧‧第二表面 220‧‧‧Second surface
300‧‧‧第一散熱模組 300‧‧‧The first cooling module
310‧‧‧風扇 310‧‧‧Fan
320‧‧‧散熱鰭片 320‧‧‧ Fin
330‧‧‧水冷管線 330‧‧‧Water cooling pipeline
400‧‧‧液體容納件 400‧‧‧Liquid container
410‧‧‧底板 410‧‧‧Bottom plate
420‧‧‧側壁 420‧‧‧Side wall
500‧‧‧供電模組 500‧‧‧Power supply module
510‧‧‧供電部 510‧‧‧Power Supply Department
520‧‧‧連接端子 520‧‧‧Connecting terminal
B‧‧‧基座 B‧‧‧Dock
T‧‧‧液體溫度調節系統 T‧‧‧Liquid temperature regulating system
W1、W2、W3、W4‧‧‧導線 W1, W2, W3, W4‧‧‧ wire
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TWM275804U (en) * | 2005-03-30 | 2005-09-21 | Nat Chin Yi Inst Technology | Thermoelectric cooling/heating thermos container |
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