TW202001166A - Temperature adjusting system and method for liquid - Google Patents

Abstract

A temperature adjusting system for liquid is provided, including a housing, a first thermoelectric module, a liquid container, a first heat dissipation module, and a power supply module. The housing includes an opening. The first thermoelectric module is disposed in the housing, and has a first surface and a second surface opposite to the first surface. The liquid container detachably contacts the first surface, and the first heat dissipation module connects the second surface. The power supply module is electrically connected to the first thermoelectric module, and the direction of the current entering the first thermoelectric module is adjustable.

Description

Liquid temperature adjustment system and method

The invention relates to a liquid temperature adjustment system. More specifically, the present invention relates to a liquid temperature adjustment system having a thermoelectric module.

In daily life and industrial manufacturing requirements, it is often necessary to increase or decrease the temperature of liquids (such as water or beverages). For example, the brewed milk or drinks placed at room temperature need to be cooled down, and the soup after refrigeration needs to be heated up.

Generally speaking, compressors and refrigerants are used to provide the cooling function, but this method is not convenient and will generate a lot of vibration and noise. Some users may be able to directly add ice cubes to the liquid, which will cause dilution of the liquid concentration. In addition, neither of the aforementioned two methods can accurately control the temperature. Similarly, when a microwave oven or gas stove is used to warm up the liquid, vibration and noise are generated, and it is difficult to accurately control the temperature. Therefore, how to solve the aforementioned problems has become an important issue.

In order to solve the above-mentioned problems, the present invention provides a liquid temperature adjustment system, which includes a housing, a first thermoelectric module, a liquid container, a first heat dissipation module, and a power supply module. The housing includes an opening. The first thermoelectric module is disposed in the housing and has a first surface and a second surface opposite to the first surface, wherein the liquid container contacts the first surface in a detachable manner, and the first heat dissipation module is Connect the second surface. The power supply module is electrically connected to the first thermoelectric module, and the direction of the current flowing from the power supply module into the first thermoelectric module is changeable.

In an embodiment of the present invention, the liquid container has a bottom plate that detachably contacts the first surface, and the bottom plate has a thermally conductive material, such as a stainless steel plate, a nickel plate, a titanium plate, a nickel-plated copper plate, or an anodized aluminum plate. The first thermoelectric module includes bismuth antimonide and its alloy. The first heat dissipation module includes a fan, a heat dissipation fin, a water cooling line, a first cooling tank, and a first cooling liquid, wherein the first cooling liquid is disposed in the first cooling tank. At least one through hole is formed on the casing, and the aforementioned fan is disposed between the first thermoelectric module and the through hole. The aforementioned power supply module may include a battery assembly or a DC power supply.

In another embodiment of the present invention, the power supply module includes a heating device, a second thermoelectric module, and a second heat dissipation module. The second thermoelectric module is attached to the heating device, and the second heat dissipation module is disposed on the second thermoelectric module. The second thermoelectric module is located between the heating device and the second heat dissipation module. In some embodiments, the power supply module further includes a connection terminal electrically connected to the second thermoelectric module for connecting an external device.

The invention further provides a liquid temperature adjustment method, including: providing the aforementioned liquid temperature adjustment system; injecting a liquid into the liquid container; making the liquid container contact the first surface of the first thermoelectric module; and using the power supply module to provide different The current in the direction enters the first thermoelectric module, causing the temperature of the first surface of the first thermoelectric module to rise or fall.

100‧‧‧Housing

110‧‧‧accommodation space

120‧‧‧Top

121‧‧‧ opening

130‧‧‧Bottom

131‧‧‧Through hole

200‧‧‧The first thermoelectric module

210‧‧‧First surface

220‧‧‧Second surface

230‧‧‧ceramic plate

240‧‧‧electrode

250‧‧‧thermoelectric element

260‧‧‧thermoelectric element

300‧‧‧The first cooling module

310‧‧‧Fan

320‧‧‧ Fin

330‧‧‧Water cooling pipeline

340‧‧‧The first cooling tank

350‧‧‧ First coolant

400‧‧‧Liquid container

410‧‧‧Bottom plate

420‧‧‧Side wall

500‧‧‧Power supply module

510‧‧‧Power Supply Department

511‧‧‧heating device

512‧‧‧The second thermoelectric module

513‧‧‧ Second cooling module

514‧‧‧heat bearing plate

515‧‧‧Second cooling tank

516‧‧‧second coolant

520‧‧‧Connecting terminal

600‧‧‧Connecting terminal

612‧‧‧The third thermoelectric module

613‧‧‧ Third cooling module

B‧‧‧Dock

D‧‧‧External device

L‧‧‧Liquid

T‧‧‧Liquid temperature regulating system

W1, W2, W3, W4, W5, W6‧‧‧ wire

Figure 1 is a schematic diagram showing a liquid temperature adjustment system according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a first thermoelectric module in an embodiment of the invention.

FIG. 3A is a schematic diagram showing a liquid temperature adjustment system according to an embodiment of the present invention, in which the current supplied by the power supply module enters the first thermoelectric module in the first direction.

FIG. 3B is a schematic diagram of a liquid temperature adjustment system according to an embodiment of the present invention, in which the current supplied by the power supply module enters the first thermoelectric module along the second direction, and the second direction is opposite to the first direction.

Figure 4 is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the present invention.

FIG. 5A is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.

FIG. 5B is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.

FIG. 6A is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the present invention.

FIG. 6B is a schematic diagram showing a liquid temperature adjustment system according to another embodiment of the invention.

The liquid temperature adjustment system and liquid temperature adjustment method of the embodiments of the present invention are described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method, and are not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the disclosure. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the background or context of the relevant technology and this disclosure, and not in an idealized or excessively formal manner Interpretation, unless specifically defined here.

FIG. 1 is a schematic diagram showing a liquid temperature adjustment system T according to an embodiment of the present invention. Referring to FIG. 1, the aforementioned liquid temperature adjustment system T mainly includes a housing 100, a first thermoelectric module 200, a first heat dissipation module 300, a liquid accommodating member 400, and a power supply module 500, in which the housing The body 100, the first thermoelectric module 200, and the first heat dissipation module 300 may constitute a base B, and the liquid container 100 may be placed on the base B after loading liquid (such as water or beverage). After the power supply module 200 supplies power to the base B, the liquid in the liquid container 100 can be heated or cooled. The specific structure and arrangement of the aforementioned elements are explained below.

As shown in FIG. 1, the housing 100 is a hollow box body, which has an accommodating space 110, a top surface 120, a bottom surface 130, and a connecting portion 140. An opening 121 communicating with the accommodating space 110 and the external environment is formed on the top surface 120, and a plurality of through holes 131 communicating with the accommodating space 110 and the external environment are formed on the bottom surface 130.

The first thermoelectric module 200 is disposed in the accommodating space 110 of the housing 100 and has a first surface 210 and a second surface 220 opposite to the first surface 210. When the first thermoelectric module 200 is disposed in the accommodating space 110 of the housing 100, the first surface 210 of the first thermoelectric module 200 faces the opening 121 and is exposed by the opening 121. In this embodiment, the size of the first thermoelectric module 200 will be greater than or equal to the size of the opening 121, so the first thermoelectric module 200 can completely cover the opening 121. In addition, the first thermoelectric module 200 is further connected to the connecting portion 140 on the housing 100 via wires W1 and W2.

FIG. 2 is a schematic diagram showing the structure of the first thermoelectric module 200. As shown, the first thermoelectric module 200 includes two ceramic plates 230, a plurality of electrodes 240, and a plurality of thermoelectric elements 250, 260. The electrode 240 can be formed on the ceramic plate 230 by coating, and the thermoelectric elements 250 and 260 can be connected in series with each other through the electrode 240.

In this embodiment, the ceramic plate 230 includes alumina, the electrode 240 includes copper, and the thermoelectric elements 250 and 260 include bismuth antimony (Bismuth telluride) and its alloy (for example, the thermoelectric elements 250 and 260 may include N-types, respectively). Bismuth Antimonide (Bi ₂ Te _2.55 Se _0.45 ) and P-type Bismuth Antimonide (Bi _0.5 Sb _1.5 Te ₃ )). In this way, the liquid can be heated or cooled in a lower temperature range (eg, below 300°C). In some embodiments, the thermoelectric elements 250 and 260 may also include lead telluride and its alloy, or silicon germanium.

Please return to FIG. 1, the first heat dissipation module 300 includes a fan 310, at least one heat dissipation fin 320, and at least one water cooling line 330. The heat dissipation fin 320 and the water cooling line 330 are in contact with the second surface 220 of the first thermoelectric module 200, and the fan 310 is disposed between the first thermoelectric module 200 and the through hole 131 of the housing 100.

The liquid container 400 may include a bottom plate 410 and a side wall 420, wherein the bottom plate 410 includes a metal material, such as a stainless steel plate, a nickel plate, a titanium plate, a nickel-plated copper plate, or an anodized aluminum plate. The side wall 420 is connected to the bottom plate 410 and surrounds a space for containing liquid. The material of the side wall 420 may include metal, glass, or ceramic.

The power supply module 500 includes a power supply portion 510, a connection terminal 520, and wires W3, W4, and the power supply portion 510 is electrically connected to the connection terminal 520 via the wires W3, W4.

The method of using the liquid temperature adjustment system T will be described below. Please refer to FIG. 3A. First, the user may inject the liquid L whose temperature is to be adjusted into the liquid container 400, and place the aforementioned liquid container 400 on the first thermoelectric module 200 of the base B to make the liquid container The bottom plate 410 of 400 contacts the first surface 210 of the first thermoelectric module 200. It should be noted that in this embodiment, the distance between the top surface 120 and the bottom surface 130 of the housing 100 is greater than the distance between the first thermoelectric module 200 and the bottom surface 130, so the opening 121 and the first thermoelectric module 200 can form a recess to facilitate the positioning of the liquid container 400.

Then, the user can connect the connection terminal 520 of the power supply module 500 to the connection portion 140 on the housing 100, for example, electrically connect the wires W1, W2 to the wires W3, W4, respectively. In this embodiment, the connection terminal 520 and the connection portion 140 can be connected by a magnetic attraction method, which is convenient for users to use. For example, the connection part 140 may be provided with a magnet, and the connection terminal 520 may have a magnetic element.

After the connection terminal 520 is connected to the connection part 140, the power supply part 510 can supply power to the first thermoelectric module 200 in a first direction. Specifically, the power supplied by the power supply unit 510 may form a closed loop according to the flow of the wire W3, the wire W1, the first thermoelectric module 200, the wire W2, and the wire W4. At this time, due to the carriers in the thermoelectric elements 250 and 260 of the first thermoelectric module 200, the temperature of the first surface 210 will decrease, and the temperature of the second surface 220 will increase. The heat in the liquid L can be conducted to the first thermoelectric module 200 through the bottom plate 410 of the liquid container 400, thereby achieving the effect of cooling the liquid L.

At the same time, the first heat dissipation module 300 can operate to bring out the heat on the second surface 220, so that the liquid temperature adjustment system T can operate stably. For example, the heat dissipation fin 320 can increase the heat dissipation area, the cooling liquid (such as oil or water) flowing through the water cooling line 330 can take away the heat on the second surface 220, and the fan 310 can accommodate the housing 100 The hot air in the space 110 is blown out from the through hole 131 to the external environment.

Referring to FIG. 3B, when the user wants to use the liquid temperature adjustment system T to increase the temperature of the liquid L in the liquid container 400, the wires W1 and W2 can be electrically connected to the wires W4 and W3, respectively. The power supplied by the power supply unit 510 may form a closed loop according to the flow of the wire W3, the wire W2, the first thermoelectric module 200, the wire W1, the wire W4.

At this time, due to the carrier in the thermoelectric elements 250 and 260 of the first thermoelectric module 200, the temperature of the first surface 210 will increase, and the temperature of the second surface 220 will decrease. The heat can be conducted to the liquid L through the bottom plate 410 of the liquid container 400, thereby achieving the effect of increasing the temperature of the liquid L.

It should be noted that although the temperature of the second surface 220 will decrease at this time, under long-term operation, the heat energy of the wires W1, W2 and the first surface 210 will still accumulate in the accommodating space 110, resulting in liquid temperature regulation The efficiency of the system T is reduced. Therefore, the first heat dissipation module 300 can still operate to take out the heat in the accommodating space 110.

In some embodiments, the first heat dissipation module 300 may omit the fan 310, the heat dissipation fin 320, and/or the water cooling line 330, so as to reduce the overall size of the liquid temperature adjustment system T.

Please refer to FIG. 4. In another embodiment of the present invention, the first heat dissipation module 300 of the liquid temperature adjustment system T may further include a first cooling tank 340 and a first cooling liquid 350. The first cooling liquid 350 is disposed in the first cooling tank 340, and at least a portion of the heat dissipation fin 320 may be immersed in the first cooling liquid 350 to increase heat dissipation efficiency.

The aforementioned power supply module 500 may include various devices for supplying direct current. For example, as shown in FIG. 5A, the power supply part 510 of the power supply module 500 may include a battery assembly. As shown in FIG. 5B, in another embodiment, the power supply part 510 of the power supply module 500 may be a DC power supply.

Please refer to FIG. 6A. In another embodiment of the present invention, the power supply section 510 of the power supply module 500 includes a heating device 511, a plurality of second thermoelectric modules 512 connected in series, and a second heat dissipation module 513.和一热热载板514. The heating device 511 can be, for example, an oven, an industrial fireplace, or a home appliance.

A plurality of second thermoelectric modules 512 connected in series are attached to the chassis of the heating device 511, and a second heat dissipation module 513 is attached under the plurality of second thermoelectric modules 512 connected in series. In other words, the second heat dissipation module 513 and the heat generating device 511 are respectively located on opposite surfaces of the plurality of second thermoelectric modules 512 connected in series. In this embodiment, the structure of each single thermoelectric module of the plurality of second thermoelectric modules 512 connected in series is the same as that of the first thermoelectric module 200, and the second heat dissipation module 513 includes a heat dissipation fin.

In some embodiments, the second heat dissipation module 513 may also include components and configurations similar to those of the first heat dissipation module 300, that is, the second cooling liquid tank 515 and the second cooling liquid 516.

As shown in FIG. 6A, a plurality of second thermoelectric modules 512 connected in series are electrically connected to the connection terminal 520 via wires W3, W4. Due to the temperature difference on the opposite surface of the second thermoelectric module 512, current can be generated to be supplied to the first thermoelectric module 200, and the liquid L in the liquid container 400 can be heated or cooled.

Please refer to FIG. 6B. In another embodiment of the present invention, a third thermoelectric module 612 and a third heat dissipation module 613 may be additionally installed on the side wall of the heating device 511, and then connected to the other by wires W5, W6一连接terminal600。 One connection terminal 600. An external device D (for example, a smart phone or a tablet) can be electrically connected to the connection terminal 600 so that the power generated by the second thermoelectric module 512 can be supplied to the foregoing external device D.

In summary, the present invention provides a liquid temperature adjustment system, which includes a housing, a first thermoelectric module, a liquid container, a first heat dissipation module, and a power supply module. The housing includes an opening. The first thermoelectric module is disposed in the housing and has a first surface and a second surface opposite to the first surface, wherein the liquid container contacts the first surface in a detachable manner, and the first heat dissipation module is Connect the second surface. The power supply module is electrically connected to the first thermoelectric module, and the direction of the current flowing from the power supply module into the first thermoelectric module is changeable.

The invention further provides a liquid temperature adjustment method, including: providing the aforementioned liquid temperature adjustment system; injecting a liquid into the liquid container; making the liquid container contact the first surface of the first thermoelectric module; and using the power supply module to provide different The current in the direction enters the first thermoelectric module, causing the temperature of the first surface of the first thermoelectric module to rise or fall.

Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions, and retouching without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, devices, methods, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content of the present invention It is understood that current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes a combination of each patent application scope and embodiment.

Although the present invention is disclosed as the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make some changes and retouching without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application. In addition, each patent application scope is constructed as an independent embodiment, and various combinations of patent application scopes and embodiments are within the scope of the present invention.

100‧‧‧Housing

110‧‧‧accommodation space

120‧‧‧Top

121‧‧‧ opening

130‧‧‧Bottom

131‧‧‧Through hole

200‧‧‧The first thermoelectric module

210‧‧‧First surface

220‧‧‧Second surface

300‧‧‧The first cooling module

310‧‧‧Fan

320‧‧‧ Fin

330‧‧‧Water cooling pipeline

400‧‧‧Liquid container

410‧‧‧Bottom plate

420‧‧‧Side wall

500‧‧‧Power supply module

510‧‧‧Power Supply Department

520‧‧‧Connecting terminal

B‧‧‧Dock

T‧‧‧Liquid temperature regulating system

W1, W2, W3, W4‧‧‧ wire

Claims (17)

A liquid temperature regulating system includes: a housing including an opening; a first thermoelectric module, disposed in the housing, and having a first surface and a second surface, wherein the first surface is opposite to the A second surface; a liquid container, which contacts the first surface in a detachable manner; a first heat dissipation module, connected to the second surface; and a power supply module, electrically connected to the first thermoelectric module, wherein The direction of the current flowing from the power supply module into the first thermoelectric module is changeable. The liquid temperature adjustment system as described in item 1 of the patent application range, wherein the liquid container has a bottom plate that detachably contacts the first surface, and the bottom plate has a thermally conductive material. The liquid temperature adjustment system as described in item 2 of the patent application scope, wherein the bottom plate includes a stainless steel plate, a nickel plate, a titanium plate, a nickel-plated copper plate, or an anodized aluminum plate. The liquid temperature adjustment system as described in item 2 of the patent application scope, wherein the material of the liquid container except the bottom plate includes metal, glass or ceramic material. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the first thermoelectric module includes bismuth antimonide and its alloy. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the first heat dissipation module includes a fan. The liquid temperature regulating system as described in item 6 of the patent application scope, wherein at least one through hole is formed in the casing, and the fan is disposed between the first thermoelectric module and the through hole. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the first heat dissipation module includes a heat dissipation fin. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the first heat dissipation module includes a water-cooled pipeline. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the first heat dissipation module includes a first cooling tank and a first cooling liquid, and the cooling liquid is disposed in the first cooling tank. The liquid temperature regulating system as described in item 1 of the patent application scope, wherein the power supply module includes a battery assembly or a DC power supply. The liquid temperature adjustment system as described in item 1 of the patent application scope, wherein the power supply module includes a heating device and a plurality of second thermoelectric modules connected in series, and the second thermoelectric modules are attached to the heating device bottom of. The liquid temperature adjustment system as described in item 12 of the patent application range, wherein the power supply module further includes a second heat dissipation module, which is disposed on the second thermoelectric modules, and the second thermoelectric modules are disposed on Between the heating device and the second heat dissipation module. The liquid temperature adjustment system as described in item 12 of the patent application scope, wherein the first heat dissipation module includes a second cooling tank and a second cooling liquid, and the second cooling liquid is disposed in the second cooling tank in. The liquid temperature adjustment system as described in item 12 of the patent application range, wherein the power supply module further includes a third thermoelectric module and a connection terminal, the third thermoelectric module is disposed on the side wall of the heating device, and the The connection terminal is electrically connected to the third thermoelectric module for connecting an external device. The liquid temperature regulating system as described in item 12 of the patent application scope, wherein the heat generating device includes an oven, an industrial fireplace, or a household appliance. A liquid temperature adjustment method, comprising: providing a liquid temperature adjustment system as described in any one of patent application items 1 to 16; injecting a liquid into the liquid container; bringing the liquid container into contact with the first The first surface of a thermoelectric module; and using the power supply module to provide current in different directions into the first thermoelectric module to increase or decrease the temperature of the first surface of the first thermoelectric module.

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