CN212382516U - Feeding bottle constant temperature equipment - Google Patents
Feeding bottle constant temperature equipment Download PDFInfo
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- CN212382516U CN212382516U CN202022125946.4U CN202022125946U CN212382516U CN 212382516 U CN212382516 U CN 212382516U CN 202022125946 U CN202022125946 U CN 202022125946U CN 212382516 U CN212382516 U CN 212382516U
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- control box
- feeding bottle
- heat
- main control
- temperature
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- 239000004065 semiconductor Substances 0.000 claims abstract description 95
- 238000005057 refrigeration Methods 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 10
- 230000003678 scratch resistant effect Effects 0.000 claims description 4
- 239000008267 milk Substances 0.000 abstract description 88
- 210000004080 milk Anatomy 0.000 abstract description 88
- 235000013336 milk Nutrition 0.000 abstract description 88
- 239000000843 powder Substances 0.000 abstract description 62
- 239000007788 liquid Substances 0.000 abstract description 41
- 230000008859 change Effects 0.000 abstract description 10
- 230000033228 biological regulation Effects 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 206010012735 Diarrhoea Diseases 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000474 nursing effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000035764 nutrition Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
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Abstract
The utility model provides a feeding bottle constant temperature equipment relates to mother and infant articles for use field. The utility model provides a feeding bottle constant temperature equipment, includes the main control box, has set gradually semiconductor refrigeration piece and heat dissipation mechanism from top to bottom in the main control box, and the top of main control box is provided with the heat conduction metal plate body of laminating mutually with the semiconductor refrigeration piece, and the main control box still is provided with the control mainboard that is used for controlling each electronic parts in the main control box. The utility model discloses a temperature of the semiconductor refrigeration piece in the main control box is adjusted to the control mainboard can realize in a minute that the temperature of adjusting milk powder liquid in the feeding bottle falls to 37 degrees centigrade change from 100, and the control mainboard can carry out the regulation of temperature, really is fit for feeding the infant and uses, and it possesses higher practical function, low in manufacturing cost, and economy is suitable for, is convenient for promote in a large number.
Description
Technical Field
The utility model relates to a mother and infant articles for use field particularly, relates to a feeding bottle constant temperature equipment.
Background
Feeding bottles, as their name implies, are used as living goods for infants to soak milk powder or drink water. For infants, when the infants are infused with milk powder, the infants need proper temperature, and often feel anxious when the infants need to drink the milk powder, and cry if the infants cannot drink the milk powder in time.
At present, the milk powder is brewed by boiling water to be boiled and then can be drunk after natural cooling for a long time. If the milk powder is brewed by cold water or warm water, the milk powder is not easy to dissolve, and the nutrition can not be fully absorbed when the infant drinks the milk powder. If the milk powder is brewed by using boiled water and cold water, the belly-pulling is easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a feeding bottle constant temperature equipment, it can carry out temperature regulation to the milk powder liquid in the feeding bottle.
The embodiment of the utility model is realized like this:
the embodiment of the application provides a feeding bottle constant temperature equipment, including the main control box, semiconductor refrigeration piece and heat dissipation mechanism have set gradually from top to bottom in the main control box, the top of main control box be provided with the heat conduction metal plate body that semiconductor refrigeration piece was laminated mutually, the main control box still is provided with and is used for control the control mainboard of each electronic part in the main control box.
In some embodiments of the utility model, above-mentioned heat dissipation mechanism includes the exhaust fan, the exhaust fan is located the below of semiconductor refrigeration piece, the exhaust fan with the control mainboard is connected.
In some embodiments of the present invention, the heat dissipation mechanism further includes a heat dissipation plate disposed between the semiconductor cooling plate and the exhaust fan.
In some embodiments of the utility model, above-mentioned the main control box includes lid and base of mutual lock joint, the assembly breach has been seted up at the lid top, heat conduction metal plate body joint in the assembly breach.
In some embodiments of the present invention, the base is provided with an air inlet grille.
In some embodiments of the present invention, the cover is provided with a work indicator along a side wall thereof, and the work indicator is connected to the control main board.
In some embodiments of the utility model, above-mentioned still be provided with in the main control box with semiconductor refrigeration piece and the temperature controller of control mainboard connection.
In some embodiments of the present invention, the feeding bottle further comprises a feeding bottle disposed on the top of the heat conductive metal plate, wherein the feeding bottle is made of heat conductive metal.
In some embodiments of the present invention, the sidewall of the feeding bottle is coated with a ceramic layer.
In some embodiments of the present invention, the ceramic layer is externally laid with a scratch-resistant wear-resistant layer.
Compared with the prior art, the embodiment of the utility model has following advantage or beneficial effect at least:
the embodiment provides a feeding bottle constant temperature equipment, including the main control box, has set gradually semiconductor refrigeration piece and heat dissipation mechanism from top to bottom in the main control box, and the top of main control box is provided with the heat conduction metal plate body of laminating mutually with the semiconductor refrigeration piece, and the main control box still is provided with the control mainboard that is used for controlling each electronic parts in the main control box. The semiconductor refrigeration piece arranged in the main control box is a main component for controlling the heating or cooling of the milk powder liquid in the feeding bottle, and because the semiconductor refrigeration piece can raise the temperature of one end of the semiconductor refrigeration piece away from the feeding bottle when the milk powder liquid in the feeding bottle is cooled, a heat dissipation mechanism is additionally arranged below the semiconductor refrigeration piece, so that the whole device can continuously run, and meanwhile, when the cold end and the hot end of the semiconductor refrigeration piece reach a certain temperature difference, and the quantities of the two heat transfers are equal, a balance point can be reached, the forward and reverse heat transfers are mutually offset, the temperature of the cold end and the hot end can not continuously change at the moment, and in order to reach a lower temperature, the utility model adopts a mode of additionally arranging the heat dissipation mechanism to reduce the temperature of the hot end to realize the; the semiconductor refrigeration piece can adjust the current mode through connecting the control main board, so that the semiconductor refrigeration piece is attached to one end of the feeding bottle, and the heating and cooling operations can be realized at the same time; the heat conducting metal plate body arranged at the top of the main control box is a semiconductor refrigerating sheet and a temperature conducting medium of the milk bottle, and the temperature difference range of the semiconductor refrigerating sheet is from positive temperature 90 ℃ to negative temperature 130 ℃, so that the milk bottle is prevented from being damaged by overhigh or overlow single-point temperature, and heat transmitted by the semiconductor refrigerating sheet is diffused through the heat conducting metal plate body, so that the milk bottle placed at the top of the main control box can effectively absorb corresponding heat and transmit the heat to milk powder liquid, and the milk powder liquid can realize corresponding heating or cooling operation; the utility model discloses a temperature of the semiconductor refrigeration piece in the main control box is adjusted to the control mainboard can realize in a minute that the temperature of adjusting milk powder liquid in the feeding bottle falls to 37 degrees centigrade change from 100, and the control mainboard can carry out the regulation of temperature, really is fit for feeding the infant and uses, and it possesses higher practical function, low in manufacturing cost, and economy is suitable for, is convenient for promote in a large number.
In actual use, there are two use modes:
(1) the user firstly infuses milk powder, infuses the milk powder in the milk bottle with normal-temperature boiled water, places the milk bottle on the top of the main control box, and at the moment, because the milk powder is not completely infused, one side of the semiconductor refrigeration sheet, which is attached to the heat-conducting metal plate body, is a hot end by adjusting the control mainboard, the heat-conducting metal plate body evenly transfers the heat absorbed by the semiconductor refrigeration sheet to the high milk bottle, so that the temperature of the milk powder liquid in the milk bottle is rapidly raised, and the milk powder is rapidly diffused and infused in a high-temperature water body; the milk powder liquid after being boiled can not be used by infants due to overhigh temperature, a user sets one side of the semiconductor refrigeration sheet attached to the heat-conducting metal plate body as a cold end by adjusting the control mainboard, and the energy of the cold end is rapidly transmitted to the milk powder liquid in the feeding bottle through the heat-conducting metal plate body, so that the milk powder liquid can be rapidly cooled to the usable temperature in a short time; and finally, closing the electronic device in the main control box, and taking down the feeding bottle from the main control box to carry out feeding operation on the infant.
(2) Because some infants need to mix their skins and do not cooperate with feeding, the milk powder liquid flushed from the milk bottle is easy to be placed for too long time to cause excessive amount, and if the infants eat the milk powder liquid, diarrhea and other situations are easy to cause; at the moment, a user can place the feeding bottle on the top of the main control box, one side, attached to the heat-conducting metal plate body, of the semiconductor refrigerating sheet is a hot end through adjusting the control main board, the heat absorbed by the semiconductor refrigerating sheet is uniformly transferred to the feeding bottle through the heat-conducting metal plate body, and the temperature of milk powder liquid in the feeding bottle is rapidly raised to the usable temperature; and finally, closing the electronic device in the main control box, and taking down the feeding bottle from the main control box to carry out feeding operation on the infant.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall structure of the thermostat device according to the embodiment of the present invention;
fig. 2 is a schematic view of an explosion structure of the main control box according to an embodiment of the present invention;
fig. 3 is a schematic top view of the cover according to the embodiment of the present invention;
fig. 4 is a schematic view of a cross-sectional structure of a wall of a feeding bottle according to an embodiment of the present invention.
Icon: 1-a master control box; 101-semiconductor refrigerating sheet; 102-an exhaust fan; 103-a heat sink; 104-a cover body; 1041-a work light; 1042-an assembly notch; 105-a base; 1051-air inlet; 106-a thermally conductive metal plate body; 2-controlling the main board; 3-feeding bottle; 301-a ceramic layer; 302-scratch and wear resistant layer; 4-temperature adjusting knob; 5-a refrigeration button; 6-heating button.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention usually place when using, the present invention is only used for convenience of description and simplification of the description, but does not indicate or imply that the devices or elements indicated must have specific orientations, be constructed in specific orientations, and operate, and thus, the present invention should not be construed as being limited.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Examples
Referring to fig. 1, fig. 1 is a schematic view of an overall structure of a constant temperature device according to an embodiment of the present invention; fig. 2 is a schematic diagram of an explosion structure of the main control box 1 according to an embodiment of the present invention.
The embodiment provides a feeding bottle 3 constant temperature equipment, including main control box 1, from top to bottom has set gradually semiconductor refrigeration piece 101 and heat dissipation mechanism in main control box 1, and main control box 1's top is provided with the heat conduction metal plate body 106 of laminating mutually with semiconductor refrigeration piece 101, and main control box 1 still is provided with the control mainboard 2 that is used for controlling each electronic parts in main control box 1. The semiconductor refrigeration piece 101 arranged in the main control box 1 is a main component for controlling the heating or cooling of the milk powder liquid in the feeding bottle 3, because the semiconductor refrigeration piece 101 can raise the temperature of one end far away from the feeding bottle 3 when the milk powder liquid in the feeding bottle 3 is cooled, a heat dissipation mechanism is additionally arranged below the semiconductor refrigeration piece 101, so that the whole device can continuously run, meanwhile, when the cold end and the hot end of the semiconductor refrigeration piece 101 reach a certain temperature difference, the two heat transfer amounts are equal, a balance point can be reached, the forward and reverse heat transfer offsets each other, the temperature of the cold end and the hot end can not continuously change at the moment, and in order to reach a lower temperature, the utility model adopts the mode of additionally arranging the heat dissipation mechanism to reduce the temperature of the hot end to realize the purpose; the semiconductor refrigeration piece 101 can adjust the current mode through connecting the control main board 2, so that the semiconductor refrigeration piece 101 is attached to one end of the feeding bottle 3 to realize the operation of heating and cooling at the same time; the heat conducting metal plate body 106 arranged at the top of the main control box 1 is a temperature conducting medium of the semiconductor refrigerating sheet 101 and the milk bottle 3, and because the temperature difference range of the semiconductor refrigerating sheet 101 is from 90 ℃ of positive temperature to 130 ℃ of negative temperature, the single-point temperature of the semiconductor refrigerating sheet 101 is prevented from being too high or too low to damage the milk bottle 3, the heat transmitted by the semiconductor refrigerating sheet 101 is diffused through the heat conducting metal plate body 106, so that the milk bottle 3 placed at the top of the main control box 1 can effectively absorb corresponding heat and transmit the heat to milk powder liquid, and the milk powder liquid can realize corresponding heating or cooling operation; the utility model discloses a temperature of semiconductor refrigeration piece 101 in the main control box 1 is adjusted to control mainboard 2, can realize in one minute that the temperature of adjusting milk powder liquid in feeding bottle 3 falls to 37 degrees centigrade change from 100, and control mainboard 2 can carry out the regulation of temperature, really is fit for feeding the infant and uses, and this device it possesses higher practical function, low in manufacturing cost is honest and clean, and economy is suitable for, is convenient for promote in a large number. The heat conducting metal plate 106 in this embodiment is an aluminum alloy heat conducting metal plate, but is not limited thereto, and in other embodiments, a copper alloy heat conducting metal plate may be used, so that the aluminum alloy has a high heat conducting coefficient and a good heat conducting effect, and can more quickly transfer the energy transferred by the semiconductor chilling plate 101, so as to heat or cool the milk powder liquid; the control mainboard 2 is provided with a heating button and a refrigerating button 5 which extend out of the main control box 1, and the direction of current can be adjusted by pressing the buttons, so that the semiconductor refrigerating sheet 101 can realize refrigerating or heating operation on the same end face.
The semiconductor refrigeration piece 101 in this embodiment is a monocrystalline silicon refrigeration piece, and the semiconductor refrigeration piece 101 is also called a thermoelectric refrigeration piece, and is a heat pump. The semiconductor refrigeration sheet 101 is a heat transfer tool, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that the aim of refrigeration can be fulfilled; when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor refrigeration piece 101 is used as a special cold source, and has the following advantages and characteristics in technical application: 1. the device does not need any refrigerant, can continuously work, has no pollution source and no rotating part, can not generate a rotation effect, has no sliding part, is a solid piece, has no vibration and noise during working, has long service life and is easy to install. 2. The semiconductor refrigerating sheet 101 has two functions, namely refrigerating and heating, and the refrigerating efficiency is generally not high, but the heating efficiency is very high and is always more than 1; thus, one piece may be used instead of separate heating and cooling systems. 3. The semiconductor refrigerating plate 101 is a current transduction type plate, can realize high-precision temperature control through the control of input current, and can easily realize remote control, program control and computer control through temperature detection and control means, thereby being convenient for forming an automatic control system. 4. The semiconductor refrigerating sheet 101 has very small thermal inertia, the refrigerating and heating time is very short, and the maximum temperature difference can be achieved by the refrigerating sheet when the power is on for less than one minute under the condition that the heat dissipation of the hot end is good and the cold end is idle. 5. The temperature difference range of the semiconductor refrigerating sheet 101 can be realized from a positive temperature of 90 ℃ to a negative temperature of 130 ℃.
In actual use, there are two use modes:
(1) a user firstly infuses milk powder, infuses the milk powder in the milk bottle 3 with normal-temperature boiled water, places the milk bottle 3 on the top of the main control box 1, at the moment, because the milk powder is not completely infused, one side of the semiconductor refrigeration sheet 101, which is attached to the heat-conducting metal plate body 106, is a hot end by adjusting the control main board 2, the heat-conducting metal plate body 106 uniformly transfers the heat absorbed by the semiconductor refrigeration sheet 101 to the milk bottle 3, so that the temperature of the milk powder liquid in the milk bottle 3 is rapidly raised, and the milk powder is rapidly diffused and infused in a high-temperature water body; the milk powder liquid after being boiled can not be used by infants due to overhigh temperature, a user sets one side of the semiconductor refrigeration sheet 101, which is attached to the heat-conducting metal plate body 106, as a cold end by adjusting the control mainboard 2, and the energy of the cold end is rapidly transmitted to the milk powder liquid in the milk bottle 3 through the heat-conducting metal plate body 106, so that the milk powder liquid can be rapidly cooled to the usable temperature in a short time; and finally, the electronic device in the main control box 1 is closed, and the feeding bottle 3 is taken down from the main control box 1 to feed the infant.
(2) Because some infants need to change their skins and do not cooperate with feeding, the milk powder liquid flushed from the milk bottle 3 is easy to be left for too long to cause excessive amount, and if the infants eat the milk powder liquid, diarrhea and other situations are easy to cause; at this time, the user can place the feeding bottle 3 on the top of the main control box 1, and adjust the control main board 2 to make one side of the semiconductor refrigeration sheet 101 attached to the heat-conducting metal plate body 106 be a hot end, the heat-conducting metal plate body 106 uniformly transfers the heat absorbed by the semiconductor refrigeration sheet 101 to the feeding bottle 3, so that the temperature of the milk powder liquid in the feeding bottle 3 is rapidly raised to the usable temperature; and finally, the electronic device in the main control box 1 is closed, and the feeding bottle 3 is taken down from the main control box 1 to feed the infant.
In some embodiments of the present invention, as shown in fig. 2, the heat dissipation mechanism includes an exhaust fan 102, the exhaust fan 102 is located below the semiconductor cooling plate 101, and the exhaust fan 102 is connected to the control main board 2.
In some embodiments of the present invention, as shown in fig. 2, the heat dissipation mechanism further includes a heat dissipation plate 103 disposed between the semiconductor cooling plate 101 and the exhaust fan 102. The heat sink 103 is a device for dissipating heat of an electronic component in an electrical appliance, which is made of aluminum alloy, brass or bronze, and is generally made into a plate shape, a sheet shape, a plurality of sheet shapes, etc., generally, a layer of heat-conducting silicone grease is coated on the contact surface of the electronic component and the heat sink 103 when the heat sink 103 is in use, so that heat emitted by the component is more effectively conducted to the heat sink 103 and then dissipated to the surrounding air through the heat sink 103; the heat radiating fins 103 are attached to the bottom of the semiconductor chilling plate 101, and when the bottom of the semiconductor chilling plate 101 is a hot end, the heat radiating fins 103 can effectively conduct and radiate heat radiated by the semiconductor chilling plate, and then the heat is exhausted by the exhaust fan 102.
In some embodiments of the present invention, as shown in fig. 2 and fig. 3, the main control box 1 includes a cover 104 and a base 105 fastened to each other, an assembly notch 1042 is opened on the top of the cover 104, and the heat conducting metal plate 106 is fastened in the assembly notch 1042.
In this embodiment, the cover 104 and the base 105 are fixed by bolts, and the cover 104 is rectangular, and the top thereof is provided with a circular assembling notch 1042, a circular heat-conducting metal plate 106 is clamped in the assembling notch 1042, and the heat-conducting metal plate 106 can be disassembled and replaced, thereby prolonging the service life of the utility model.
In some embodiments of the present invention, as shown in fig. 2, the base 105 is provided with a grill for air intakes 1051. The base 105 is provided with the air inlet 1051, so that heat dissipation and air exhaust of the whole device can be facilitated, and the phenomenon that hot air is accumulated in the main control box 1 to cause damage to internal parts is avoided.
In some embodiments of the present invention, as shown in fig. 2, the cover 104 is provided with a work indicator 1041 along its side wall, and the work indicator 1041 is connected with the control motherboard 2.
The lid 104 in this embodiment has seted up the installing port along its lateral wall, and work pilot lamp 1041 is installed in the installing port and is connected with control mainboard 2, and control mainboard 2 is connected through the wire and indoor socket and realizes the power supply, and when the main control box 1 circular telegram operation, work pilot lamp 1041 then lights, and the user of being convenient for looks over the utility model discloses whether circular telegram work.
In some embodiments of the present invention, as shown in fig. 1, a temperature controller connected to the semiconductor refrigeration chip 101 and the control main board 2 is further disposed in the main control box 1.
The temperature controller in this embodiment is connected in with semiconductor refrigeration piece 101, and temperature controller is used for controlling the temperature of semiconductor refrigeration piece 101, and temperature controller has temperature regulation knob 4, and it has three gears, is respectively: the temperature of the main control box 1 is adjusted and controlled conveniently by a user at 55 ℃, 37 ℃ and 0 ℃, a through hole is formed in the side wall of the main control box 1, and the temperature adjusting knob 4 extends out of the through hole, so that the user can adjust the temperature conveniently.
In some embodiments of the present invention, as shown in fig. 1 and 4, the nursing bottle 3 is placed on top of the heat-conducting metal plate 106, and the nursing bottle 3 is made of heat-conducting metal.
The feeding bottle 3 in the present embodiment is made of an aluminum alloy heat conductive metal, but is not limited thereto, and may be made of a copper alloy in other embodiments; the aluminum alloy has fine heat conductivity, and the heat that semiconductor refrigeration piece 101 transmitted can carry out effective transmission for milk powder liquid through the bottle.
In some embodiments of the present invention, as shown in fig. 1 and 4, the sidewall of the feeding bottle 3 is coated with a ceramic layer 301. The ceramic layer 301 can be used for heat preservation and insulation of the feeding bottle 3.
In some embodiments of the present invention, as shown in fig. 1 and 4, a scratch-resistant and wear-resistant layer 302 is laid on the outside of the ceramic layer 301. The ceramic layer 301 can be protected from being scratched by external sharp objects by arranging the scratch-resistant wear-resistant layer 302 outside the ceramic layer 301, so that the attractiveness of the feeding bottle 3 is ensured.
To sum up, the embodiment of the utility model provides a 3 constant temperature equipment of feeding bottle, including main control box 1, from top to bottom in the main control box 1 set gradually semiconductor refrigeration piece 101 and heat dissipation mechanism, the top of main control box 1 is provided with the heat conduction metal plate body 106 of laminating mutually with semiconductor refrigeration piece 101, and main control box 1 still is provided with the control mainboard 2 that is used for controlling each electronic parts in the main control box 1. The semiconductor refrigeration piece 101 arranged in the main control box 1 is a main component for controlling the heating or cooling of the milk powder liquid in the feeding bottle 3, because the semiconductor refrigeration piece 101 can raise the temperature of one end far away from the feeding bottle 3 when the milk powder liquid in the feeding bottle 3 is cooled, a heat dissipation mechanism is additionally arranged below the semiconductor refrigeration piece 101, so that the whole device can continuously run, meanwhile, when the cold end and the hot end of the semiconductor refrigeration piece 101 reach a certain temperature difference, the two heat transfer amounts are equal, a balance point can be reached, the forward and reverse heat transfer offsets each other, the temperature of the cold end and the hot end can not continuously change at the moment, and in order to reach a lower temperature, the utility model adopts the mode of additionally arranging the heat dissipation mechanism to reduce the temperature of the hot end to realize the purpose; the semiconductor refrigeration piece 101 can adjust the current mode through connecting the control main board 2, so that the semiconductor refrigeration piece 101 is attached to one end of the feeding bottle 3 to realize the operation of heating and cooling at the same time; the heat conducting metal plate body 106 arranged at the top of the main control box 1 is a temperature conducting medium of the semiconductor refrigerating sheet 101 and the milk bottle 3, and because the temperature difference range of the semiconductor refrigerating sheet 101 is from 90 ℃ of positive temperature to 130 ℃ of negative temperature, the single-point temperature of the semiconductor refrigerating sheet 101 is prevented from being too high or too low to damage the milk bottle 3, the heat transmitted by the semiconductor refrigerating sheet 101 is diffused through the heat conducting metal plate body 106, so that the milk bottle 3 placed at the top of the main control box 1 can effectively absorb corresponding heat and transmit the heat to milk powder liquid, and the milk powder liquid can realize corresponding heating or cooling operation; the utility model discloses a temperature of semiconductor refrigeration piece 101 in the main control box 1 is adjusted to control mainboard 2, can realize in one minute that the temperature of adjusting milk powder liquid in feeding bottle 3 falls to 37 degrees centigrade change from 100, and control mainboard 2 can carry out the regulation of temperature, really is fit for feeding the infant and uses, and this device it possesses higher practical function, low in manufacturing cost is honest and clean, and economy is suitable for, is convenient for promote in a large number.
In actual use, there are two use modes:
(1) a user firstly infuses milk powder, infuses the milk powder in the milk bottle 3 with normal-temperature boiled water, places the milk bottle 3 on the top of the main control box 1, at the moment, because the milk powder is not completely infused, one side of the semiconductor refrigeration sheet 101, which is attached to the heat-conducting metal plate body 106, is a hot end by adjusting the control main board 2, the heat-conducting metal plate body 106 uniformly transfers the heat absorbed by the semiconductor refrigeration sheet 101 to the milk bottle 3, so that the temperature of the milk powder liquid in the milk bottle 3 is rapidly raised, and the milk powder is rapidly diffused and infused in a high-temperature water body; the milk powder liquid after being boiled can not be used by infants due to overhigh temperature, a user sets one side of the semiconductor refrigeration sheet 101, which is attached to the heat-conducting metal plate body 106, as a cold end by adjusting the control mainboard 2, and the energy of the cold end is rapidly transmitted to the milk powder liquid in the milk bottle 3 through the heat-conducting metal plate body 106, so that the milk powder liquid can be rapidly cooled to the usable temperature in a short time; and finally, the electronic device in the main control box 1 is closed, and the feeding bottle 3 is taken down from the main control box 1 to feed the infant.
(2) Because some infants need to change their skins and do not cooperate with feeding, the milk powder liquid flushed from the milk bottle 3 is easy to be left for too long to cause excessive amount, and if the infants eat the milk powder liquid, diarrhea and other situations are easy to cause; at this time, the user can place the feeding bottle 3 on the top of the main control box 1, and adjust the control main board 2 to make one side of the semiconductor refrigeration sheet 101 attached to the heat-conducting metal plate body 106 be a hot end, the heat-conducting metal plate body 106 uniformly transfers the heat absorbed by the semiconductor refrigeration sheet 101 to the feeding bottle 3, so that the temperature of the milk powder liquid in the feeding bottle 3 is rapidly raised to the usable temperature; and finally, the electronic device in the main control box 1 is closed, and the feeding bottle 3 is taken down from the main control box 1 to feed the infant.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a feeding bottle constant temperature equipment, its characterized in that, includes the master control box, semiconductor refrigeration piece and heat dissipation mechanism have set gradually from top to bottom in the master control box, the top of master control box be provided with the heat conduction metal plate body that semiconductor refrigeration piece was laminated mutually, the master control box still is provided with and is used for control the control mainboard of each electronic parts in the master control box.
2. The feeding bottle thermostatic device according to claim 1, wherein the heat dissipation mechanism includes an exhaust fan, the exhaust fan is located below the semiconductor refrigeration sheet, and the exhaust fan is connected with the control main board.
3. The thermostatic device for feeding bottle as claimed in claim 2, wherein the heat dissipating mechanism further comprises a heat sink disposed between the semiconductor cooling plate and the exhaust fan.
4. The feeding bottle thermostatic device according to claim 1, wherein the main control box comprises a cover body and a base which are fastened with each other, an assembly notch is formed in the top of the cover body, and the heat-conducting metal plate body is clamped in the assembly notch.
5. A feeding bottle thermostat according to claim 4 wherein the base is provided with an air inlet grille.
6. A feeding bottle thermostatic device according to claim 4, wherein the cover body is provided with a work indicator lamp along a side wall thereof, and the work indicator lamp is connected with the control main board.
7. The feeding bottle thermostatic device according to claim 1, wherein a temperature controller connected with the semiconductor refrigeration sheet and the control main board is further arranged in the main control box.
8. The thermostatic device for feeding bottles of claim 1, further comprising a feeding bottle placed on top of said heat conductive metal plate, said feeding bottle being made of heat conductive metal.
9. A feeding bottle thermostat according to claim 8 wherein the side wall of the bottle is coated with a ceramic layer.
10. The thermostatic device for feeding bottles of claim 9, wherein a scratch-resistant and wear-resistant layer is laid on the outside of the ceramic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022125946.4U CN212382516U (en) | 2020-09-24 | 2020-09-24 | Feeding bottle constant temperature equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022125946.4U CN212382516U (en) | 2020-09-24 | 2020-09-24 | Feeding bottle constant temperature equipment |
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| Publication Number | Publication Date |
|---|---|
| CN212382516U true CN212382516U (en) | 2021-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022125946.4U Expired - Fee Related CN212382516U (en) | 2020-09-24 | 2020-09-24 | Feeding bottle constant temperature equipment |
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| CN (1) | CN212382516U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111972996A (en) * | 2020-09-24 | 2020-11-24 | 浙江蓝萧科技有限公司 | Feeding bottle constant temperature equipment |
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2020
- 2020-09-24 CN CN202022125946.4U patent/CN212382516U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111972996A (en) * | 2020-09-24 | 2020-11-24 | 浙江蓝萧科技有限公司 | Feeding bottle constant temperature equipment |
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