CN115254641A

CN115254641A - Airflow sorting equipment for semiconductor wafers

Info

Publication number: CN115254641A
Application number: CN202211194498.0A
Authority: CN
Inventors: 胡冬云; 梅力
Original assignee: Jiangsu Zhuoyu Intelligent Technology Co ltd
Current assignee: Jiangsu Zhuoyu Intelligent Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2022-11-01

Abstract

The application discloses airflow separation equipment for semiconductor wafer for the letter sorting equipment field contains first transmission assembly and second transmission assembly, first transmission assembly and second transmission assembly are end to end connection vertical arrangement mode, first transmission assembly and second transmission assembly's centre is provided with the letter sorting subassembly, install first support and second support on the first transmission assembly, install first camera and second camera on first support and the second support respectively, be provided with the upset subassembly between first support and the second support, the upset subassembly is used for the upset operation to the wafer, and this application can be intelligent overturn the wafer through being provided with the upset subassembly to the convenience is carried out two-sided to the wafer and is detected, utilizes the letter sorting subassembly simultaneously, shifts the wafer that meets the requirements to next process.

Description

Airflow sorting equipment for semiconductor wafers

Technical Field

The application is applied to the field of sorting equipment and is named as airflow sorting equipment for semiconductor wafers.

Background

The semiconductor wafer is called a semiconductor silicon wafer, is a precise electronic component, and can be subjected to various processes such as slicing, lapping, polishing, layer increasing, photoetching, doping, heat treatment, probing, scribing and the like in the production process of the semiconductor wafer, so that the surface of the wafer can generate defects and burrs;

however, the existing sorting equipment can only identify the defects of the wafers, the sorting is mainly carried out manually, meanwhile, the existing equipment can only identify the defects of one side, and if the two sides are identified, the two sides also need to be turned over manually, which is time-consuming and labor-consuming.

Therefore, there is a need for an apparatus for sorting semiconductor wafers by air flow, which can achieve automatic sorting and intelligent flipping.

Disclosure of Invention

It is an object of the present invention to provide an air flow sorting apparatus for semiconductor wafers that solves the problems set forth in the background above.

According to an aspect of the application, an air current sorting equipment of semiconductor wafer is provided, contains first transmission subassembly and second transmission subassembly, first transmission subassembly and second transmission subassembly are end to end connection vertical arrangement mode, the centre of first transmission subassembly and second transmission subassembly is provided with the letter sorting subassembly, install first support and second support on the first transmission subassembly, install first camera and second camera on first support and the second support respectively, be provided with the upset subassembly between first support and the second support, the upset subassembly is used for the upset operation to the wafer.

In one embodiment, the first transmission assembly comprises a support part and a transmission shaft connected to two ends of the support part through bearings, space rings are arranged on the transmission shaft at two ends, the transmission shaft is divided into two ends through the space rings, a main belt and an auxiliary belt are respectively connected to two sections of the transmission shaft in a transmission mode, and a gap is formed between the main belt and the auxiliary belt.

In one embodiment, the sorting assembly comprises a lower bracket arranged between the first conveying assembly and the second conveying assembly, a motor is mounted at the upper end of the lower bracket, an upper bracket is mounted at the output end of the motor, a second telescopic rod is mounted at one end of the upper bracket, and a manipulator is mounted at the lower end of the second telescopic rod.

In one embodiment, the turnover assembly includes a base plate mounted on the support portion, the base plate having a first telescoping bar mounted thereon, the first telescoping bar being positioned between the first bracket and the second bracket, the first telescoping bar being positioned below the gap.

In one embodiment, a first fixing plate is mounted on one uniform side of the first support and the second support, a cylinder is mounted on the first fixing plate, a push plate is mounted at the output end of the cylinder, a first baffle is mounted on the inner side of the first support and the second support, and a cushion pad is mounted on the inner side of the first baffle.

In one embodiment, a second fixing plate is mounted on one side of the supporting portion, which is located on the auxiliary belt, a blower is mounted on the second fixing plate, and a second baffle is mounted on the supporting portion, which is located on the side opposite to the second fixing plate.

In one embodiment, the gas flow sorting equipment for semiconductor wafers further comprises an intelligent sorting system, wherein the intelligent sorting system comprises an intelligent control module, an intelligent detection module and an intelligent execution module, the intelligent control module, the intelligent detection module and the intelligent execution module are respectively connected in a wireless mode, the intelligent control module comprises a data recording module, a data calculation module and a logic judgment module, the intelligent detection module comprises a quality detection module, the quality detection module comprises a front detection unit and a back detection unit, and the intelligent execution module comprises a conveying control module, a material pushing module and a sorting transfer module.

In one embodiment, the operation of the intelligent sorting system comprises the steps of:

firstly, starting an intelligent sorting system, and sequentially placing wafers on a main belt by a worker;

secondly, pushing the wafer to a designated position by using a pushing assembly;

thirdly, acquiring the front defect state of the wafer by using a first camera;

fourthly, turning the wafer by using the turning assembly;

fifthly, acquiring the reverse defect state of the wafer by using a second camera;

a sixth step of blowing the defective wafer onto the main belt using a blowing assembly;

and step seven, sorting the intact wafer to the second transmission assembly by using the sorting assembly.

Compared with the prior art, the beneficial effect that this application reaches is: this application is through being provided with the upset subassembly, can be intelligent overturn the wafer to the convenience carries out two-sided detection to the wafer, utilizes the letter sorting subassembly simultaneously, shifts the wafer that meets the requirements to next procedure.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

In the drawings:

FIG. 1 is a schematic overall structure of the present application;

FIG. 2 is a schematic view of a portion of the structure of FIG. 1 at A;

FIG. 3 is a schematic view of a partial structure at B of FIG. 2;

FIG. 4 is a schematic diagram of the interrelationship of the modules of the present application;

in the figure: 1. a first transmission assembly; 2. a second transmission assembly; 3. a waste bin; 4. a lower bracket; 5. an upper bracket; 6. a manipulator; 7. a controller; 8. a motor; 9. a space ring; 10. a main belt; 11. an auxiliary belt; 12. a first bracket; 13. a second bracket; 14. a first camera; 15. a second camera; 16. a first baffle plate; 17. a cushion pad; 18. a first fixing plate; 19. a cylinder; 20. pushing the plate; 21. a drive shaft; 22. a second baffle; 23. a second fixing plate; 24. a fan; 25. a wafer; 26. a base plate; 27. a first telescopic rod; 28. a second telescopic rod; 29. a gap; 30. a support portion.

Detailed Description

The following disclosure provides many different embodiments or examples for implementing different features of the application. To simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

Referring to fig. 1, the present application provides the following technical solutions: an airflow sorting device for semiconductor wafers comprises a first transmission assembly 1 and a second transmission assembly 2, wherein the first transmission assembly 1 and the second transmission assembly 2 are used for transmitting wafers 25, the first transmission assembly 1 and the second transmission assembly 2 are vertically arranged in an end-to-end connection mode, the tail end of the first transmission assembly 1 is adjacent to the starting end of the second transmission assembly 2, a sorting assembly is arranged at the joint of the first transmission assembly 1 and the second transmission assembly 2 and used for picking up qualified wafers 25 on the first transmission assembly 1 onto the second transmission assembly 2, and the tail end of the second transmission assembly 2 is connected to a next process so as to facilitate the circulation of the qualified wafers 25;

as shown in fig. 2, the first transmission assembly 1 includes a support portion 30 and transmission shafts 21 bearing-connected to two ends of the support portion 30, wherein the transmission shafts 21 at two ends are respectively provided with a space ring 9, so that the transmission shaft 21 is divided into two sections by the space ring 9, a main belt 10 is transmission-connected to one section of the transmission shaft 21, an auxiliary belt 11 is transmission-connected to the other end of the transmission shaft 21, and the transmission shaft 21 at one end is connected to a driving end, so that the transmission shaft 21 can drive the main belt 10 and the auxiliary belt 11 to synchronously transmit in one direction under the driving of the driving portion;

as shown in fig. 2, a first bracket 12 and a second bracket 13 are sequentially fixed along the transmission direction of the first transmission assembly 1, a first camera 14 and a second camera 15 are respectively mounted on the first bracket 12 and the second bracket 13, and both the first camera 14 and the second camera 15 are used for detecting defects on the surface of the wafer 25, because the defects of the wafer 25 are small, the wafer is usually collected by a camera with a microscope;

a first baffle 16 is fixed on the first bracket 12 and the second bracket 13, the first baffle 16 is positioned at one side of the auxiliary belt 11, a buffer cushion 17 is adhered at the inner side of the first baffle 16, and a gap 29 is generated between the main belt 10 and the auxiliary belt 11 due to the existence of the spacer ring 9, so that when the wafer 25 is contacted with the buffer cushion 17, a certain protection effect can be exerted on the wafer 25, and the center of the wafer 25 is just positioned at the position of the gap 29;

the pushing assemblies are fixed on the right sides of the first support 12 and the second support 13 and comprise a first fixing plate 18 fixed on the right sides of the first support 12 and the second support 13, an air cylinder 19 is fixed on the first fixing plate 18, and a pushing plate 20 is fixed at the output end of the air cylinder 19, so that when the air cylinder 19 extends, the pushing plate 20 can push the wafer 25 and enable one end of the wafer 25 to be in contact with the cushion pad 17, and the pushing assemblies are located on the right sides of the first support 12 and the second support 13, so that the wafer 25 can be conveniently detected after being positioned;

as shown in fig. 3, an inverting assembly is fixed on the supporting portion 30, the inverting assembly includes a base plate 26 fixed on the supporting portion 30, a first extension bar 27 is fixed on the base plate 26, the first extension bar 27 is located between the first bracket 12 and the second bracket 13, and the center of the first extension bar 27 is located at the position of the gap 29, so that the first extension bar 27 can extend from the gap 29 and act on the wafer 25;

as shown in fig. 2, a blowing assembly is fixed on the supporting portion 30, the blowing assembly includes a second fixing plate 23 fixed on the supporting portion 30, the second fixing plate 23 is located at one side of the auxiliary belt 11, a blower 24 is fixed on the second fixing plate 23, an air outlet of the blower 24 faces to the inside, a second baffle 22 is fixed at the opposite side of the second fixing plate 23, and a cushion pad 17 is also adhered at the inside of the second baffle 22, so that the blower 24 can blow the defective wafer 25 to one side of the second baffle 22;

as shown in fig. 1, a waste material box 3 is arranged at the end of the first transmission component 1, and a wafer 25 blown onto the main belt 10 by a fan 24 enters the waste material box 3 along with the transmission of the main belt 10 for subsequent reinspection;

as shown in fig. 1, the sorting assembly comprises a lower bracket 4, a motor 8 is fixed at the upper end of the lower bracket 4, an upper bracket 5 is fixed at the output end of the motor 8, the upper bracket 5 can be driven to rotate by the rotation of the motor 8, a second telescopic rod 28 is fixed at one end of the upper bracket 5, and a manipulator 6 is fixed at the output end of the second telescopic rod 28, so that the manipulator 6 can move up and down under the driving of the second telescopic rod 28;

a controller 7 is fixed on the lower bracket 4, and an intelligent sorting system is arranged in the controller 7 and is used for controlling each electric appliance so that each electric appliance can work cooperatively;

the intelligent sorting system comprises an intelligent control module, an intelligent detection module and an intelligent execution module, wherein the intelligent control module comprises a data recording module, a data calculation module and a logic judgment module, the intelligent detection module comprises a quality detection module, the quality detection module comprises a front detection unit and a back detection unit, and the intelligent execution module comprises a conveying control module, a material pushing module and a sorting transfer module;

the data recording module is used for recording acquired data in real time, the data calculating module is used for calculating the acquired data and judging the quality and burr conditions of the wafer 25, the logic judging module is used for judging according to the quality and burr conditions of the wafer 25 and determining a subsequent processing strategy, the front detection unit is electrically connected with the first camera 14 and is used for detecting the front defect condition of the wafer 25, the back detection unit is electrically connected with the second camera 15 and is used for detecting the back defect condition of the wafer 25, the conveying control module is electrically connected with the first conveying assembly 1 and the second conveying assembly 2 and is used for controlling the conveying of the wafer 25, the material pushing module is electrically connected with the cylinder 19, the first telescopic rod 27 and the fan 24 and is used for pushing the wafer 25 to move and turn over transversely, and the sorting transferring module is electrically connected with the motor 8, the second telescopic rod 28 and the manipulator 6 and is used for controlling the manipulator 6 to convey the wafer 25 from the first conveying assembly 1 to the second conveying assembly 2;

the real-time monitoring by the sets of image capturing devices distributed on the first transport assembly 1 and the second transport assembly 2 is performed throughout the transport of the wafers 25 to determine the real-time position of all of the wafers 25.

Principle of operation

When the wafers 25 need to be transported, workers place the wafers 25 on the main belt 10 at even intervals and then transport the wafers through the first transport assembly 1;

when the wafer 25 is shot by the first camera 14, the wafer 25 is positioned right in front of the first group of push plates 20, at this time, the air cylinder 19 drives the push plates 20 to extend forwards and pushes the wafer 25 to lean against the cushion pad 17, so that the position of the wafer 25 is defined, and at this time, the wafer 25 spans between the main belt 10 and the auxiliary belt 11, which is convenient for the accurate shooting of the subsequent first camera 14;

when the wafer 25 reaches the position right below the first camera 14, stopping the first transmission assembly 1 for 5 seconds, and performing front-side quality detection on the wafer 25 through the first camera 14;

then the first transmission component 1 continues to operate, the position of the wafer 25 is acquired in real time through the image acquisition device, when the wafer 25 reaches the position below the first telescopic rod 27, the first telescopic rod 27 starts to extend, then the front end of the wafer 25 is propped against, and the wafer 25 slowly rises, meanwhile, the wafer 25 is driven by the first transmission component 1 to move forwards, so that the rear end of the wafer 25 continuously moves forwards, the front end of the first telescopic rod 27 rises, and when the rear end of the wafer 25 exceeds the front end of the wafer, the wafer 25 is turned over, so that the reverse side is realized;

when the reverse side of the wafer 25 succeeds, the first telescopic rod 27 returns to the original position quickly, and the wafer 25 continues to be conveyed forwards;

when the wafer 25 reaches the shooting range of the second camera 15, the second group of air cylinders 19 is controlled to extend, so that the second group of push plates 20 are driven to extend, the wafer 25 is pushed to be in contact with the cushion pad 17 again, and the first transmission assembly 1 drives the wafer 25 to continuously transmit in the process of pushing the wafer 25;

when the wafer 25 reaches the position right below the second camera 15, stopping the first transmission assembly 1 for 5 seconds, and performing reverse-side quality detection on the wafer 25 through the second camera 15;

when the front and back sides of the wafer 25 are detected, the wafer is continuously conveyed along with the first conveying assembly 1;

if the surface of the wafer 25 is defective, the fan 24 is turned on, and the wafer 25 is blown to the second baffle 22 by the large wind force of the fan 24 and drops into the waste material box 3 along with the continuous transmission of the main belt 10;

if the surface of the wafer 25 is not defective, the blower 24 is not turned on, and the wafer 25 is transferred to the end of the first transfer unit 1;

through the above operations, sorting of the wafers 25 is achieved;

when the wafer 25 without defects reaches the end of the first transfer unit 1, the wafer 25 is picked up onto the second transfer unit 2 by the carrier unit and reaches the next process following the transfer by the second transfer unit 2.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; may be directly connected, may be internal to the two elements or may be in an interactive relationship between the two elements. The above terms are understood in the present application by those of ordinary skill in the art as appropriate.

The foregoing detailed description is directed to an apparatus for sorting semiconductor wafers by airflow according to embodiments of the present application, and the principles and implementations of the present application are described herein using specific examples, which are provided only to help understand the technical solutions and their core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. An air flow sorting apparatus for semiconductor wafers, characterized by: the automatic sorting machine comprises a first transmission assembly (1) and a second transmission assembly (2), wherein the first transmission assembly (1) and the second transmission assembly (2) are vertically arranged in an end-to-end connection mode, and a sorting assembly is arranged between the first transmission assembly (1) and the second transmission assembly (2);

a first support (12) and a second support (13) are mounted on the first transmission assembly (1), and a first camera (14) and a second camera (15) are mounted on the first support (12) and the second support (13) respectively;

an overturning assembly is arranged between the first support (12) and the second support (13), and is used for overturning the wafer (25).

2. An air flow sort apparatus for semiconductor wafers as set forth in claim 1, wherein: first transmission assembly (1) is connected including supporting part (30) and bearing transmission shaft (21), both ends at supporting part (30) both ends be provided with space ring (9) on transmission shaft (21), space ring (9) will transmission shaft (21) divide into both ends, two sections transmissions respectively on transmission shaft (21) are connected with main belt (10) and assist belt (11), form clearance (29) between main belt (10) and the assistance belt (11).

3. An apparatus as claimed in claim 1 for air flow sorting semiconductor wafers, wherein: the sorting assembly comprises a lower support (4) arranged between a first transmission assembly (1) and a second transmission assembly (2), a motor (8) is installed at the upper end of the lower support (4), an upper support (5) is installed at the output end of the motor (8), a second telescopic rod (28) is installed at one end of the upper support (5), and a mechanical arm (6) is installed at the lower end of the second telescopic rod (28).

4. An air flow sort apparatus for semiconductor wafers as set forth in claim 2, wherein: the turnover assembly comprises a bottom plate (26) installed on the supporting portion (30), a first telescopic rod (27) is installed on the bottom plate (26), the first telescopic rod (27) is located between the first support (12) and the second support (13), and the first telescopic rod (27) is located below the gap (29).

5. An apparatus as claimed in claim 4 for air flow sorting semiconductor wafers, wherein: a first fixing plate (18) is mounted on one side of each of the first support (12) and the second support (13), an air cylinder (19) is mounted on the first fixing plate (18), and a push plate (20) is mounted at the output end of the air cylinder (19);

a first baffle (16) is installed on the inner sides of the first support (12) and the second support (13), and a cushion pad (17) is installed on the inner side of the first baffle (16).

6. An air flow sort apparatus for semiconductor wafers as set forth in claim 5, wherein: a second fixing plate (23) is arranged on one side, located on the auxiliary belt (11), of the supporting part (30), and a fan (24) is arranged on the second fixing plate (23);

and a second baffle (22) is arranged on the supporting part (30) at one side opposite to the second fixing plate (23).

7. An air flow sort apparatus for semiconductor wafers as set forth in claim 6, wherein: the airflow sorting equipment for the semiconductor wafers further comprises an intelligent sorting system, wherein the intelligent sorting system comprises an intelligent control module, an intelligent detection module and an intelligent execution module, and the intelligent control module, the intelligent detection module and the intelligent execution module are respectively in wireless connection;

the intelligent control module comprises a data recording module, a data calculating module and a logic judging module, the intelligent detection module comprises a quality detection module, the quality detection module comprises a front detection unit and a back detection unit, and the intelligent execution module comprises a conveying control module, a material pushing module and a sorting transferring module.

8. An air flow sort apparatus for semiconductor wafers as set forth in claim 7, wherein: the operation of the intelligent sorting system comprises the following steps:

firstly, starting an intelligent sorting system, and sequentially placing wafers (25) on a main belt (10) by a worker;

secondly, pushing the wafer (25) to a specified position by using a pushing assembly;

thirdly, acquiring the front defect state of the wafer (25) by using the first camera (14);

fourthly, turning over the wafer (25) by using a turning assembly;

fifthly, acquiring the reverse defect state of the wafer (25) by using a second camera (15);

a sixth step of blowing the defective wafer (25) onto the main belt (10) by using a blowing assembly;

and a seventh step of sorting the intact wafer (25) onto the second transport assembly (2) by means of the sorting assembly.