CN115243520A - Radiator structure for piezoelectric fan system and fin arrangement method thereof - Google Patents
Radiator structure for piezoelectric fan system and fin arrangement method thereof Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 9
- 238000009991 scouring Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 19
- 230000000737 periodic effect Effects 0.000 abstract description 7
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- H—ELECTRICITY
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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Abstract
The invention discloses a radiator structure for a piezoelectric fan system and a fin arrangement method thereof. According to the flow field characteristics induced by the vibration of the piezoelectric fan, fins with different shapes and densities are arranged at different positions of the flow field, so that the convection coefficient and the heat dissipation capacity of the surface of the radiator are improved. Compared with a common uniform fin arrangement method, the method has the advantages that the flow field distribution characteristics induced by the periodic resonance of the piezoelectric fan blades are fully considered, the cooling airflow generated by the fan can be fully utilized, higher heat dissipation efficiency can be obtained under the condition of the same heat dissipation area, and a new idea is provided for the subsequent piezoelectric fan heat dissipation system research and the engineering application of the heat dissipater.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of high-power-density integrated circuits, and particularly relates to a radiator structure for a piezoelectric fan system and a fin arrangement method of the radiator structure.
Background
With the rapid development of microelectronic technology, the performance of various electronic devices is rapidly improved. Meanwhile, the energy consumption and the heat productivity of various electronic devices are greatly improved. In addition, the current electronic equipment tends to be miniaturized gradually, so that the heat dissipation capacity in a unit volume is increased sharply, and the working performance of the micro electronic component is seriously affected even the micro electronic component is failed due to overhigh temperature, so that an efficient and stable heat management mode needs to be adopted for a heat source of the electronic component, and the reliability of the equipment is guaranteed. At present, a cooling scheme for microelectronic devices is generally that a piezoelectric fan is used in cooperation with a fin-type radiator, and the piezoelectric fan is used for generating stable cooling airflow by periodic resonance, so that the convection heat exchange effect on the surface of a fin is enhanced. However, under the condition that the characteristic mechanisms of the flow field and the temperature field excited by the piezoelectric fan are not considered, the arrangement method of the fins of the radiator only adopts the plate-shaped straight ribs which are arranged in parallel at equal intervals or the columnar needles which are arranged uniformly, the arrangement method does not conform to the characteristics of the flow field and the temperature field induced by the periodic vibration of the piezoelectric fan, and the heat dissipation capability of fluid in the flow field cannot be fully utilized, so that the heat dissipation efficiency is not high under the condition of the same heat dissipation area.
Chinese patent application CN201811306122.8 discloses a piezoelectric fan heat dissipation closed module, which includes three parts, namely a piezoelectric fan array, a heat dissipation fin and a heat source module. The heat source module transfers heat to the interior of the radiating fins in a heat conduction process, the piezoelectric fan is excited by periodic resonant motion to generate cooling airflow, the heat convection effect of air and the surface of the radiator is enhanced, and then the heat source module is cooled. However, the above solutions all adopt a method of arranging the plate-shaped straight ribs in parallel at equal intervals, and this method cannot fully utilize the cooling airflow generated by the periodic vibration of the piezoelectric fan blades, and it is found through numerical research that the cooling airflow can only perform efficient cooling heat dissipation on the front end of the heat sink, and most of the cooling airflow cannot reach the tail of the heat sink smoothly, so that it is impossible to achieve higher heat dissipation efficiency under the condition of the same heat dissipation area.
Therefore, there is a need in the art for a fin arrangement method for improving heat exchange efficiency of a heat sink under the same heat dissipation area, so that the fin arrangement method can fully utilize cooling airflow induced by resonance of a piezoelectric fan to improve cooling efficiency of a high power density integrated circuit.
Disclosure of Invention
The technical problem solved by the invention is as follows: a heat sink structure for a piezoelectric fan system and a fin arrangement method thereof are provided, which can make full use of cooling airflow generated by a fan and can obtain higher heat dissipation efficiency under the condition of the same heat dissipation area.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a heat sink structure for a piezoelectric fan system, comprising: one surface of the radiator is provided with fins and a piezoelectric fan, the other surface of the radiator is provided with a heat source module, and the distribution area of the fins comprises a plate-shaped straight rib parallel arrangement area, a columnar needle rib combined structure arrangement area and a columnar needle rib local encryption arrangement area.
Preferably, the plate-shaped straight rib parallel arrangement area is located in an upstream laminar flow section of the radiator flow field, the columnar pin rib combined structure arrangement area is located in a midstream vortex section of the radiator flow field, and the columnar pin rib local encryption arrangement area is located in a downstream turbulent flow section of the radiator flow field.
Preferably, the heat source module is disposed on a bottom surface of the heat sink, and the heat inside the heat source module is conducted to the fins of the heat sink to cool and dissipate the heat from the heat source module.
Preferably, the piezoelectric fan is arranged in the parallel arrangement area of the plate-shaped straight ribs, and the inverse piezoelectric effect of the piezoelectric ceramic is utilized to drive the blades to generate resonance under the driving of the alternating electric field, so that the airflow is output from the end of each blade to the front.
A method for arranging fins of a radiator for a piezoelectric fan system is characterized in that fins with different shapes and densities are arranged at different positions of a flow field according to the flow field characteristics generated by vibration of a piezoelectric fan, so that the surface convection coefficient and the heat dissipation capacity of the radiator are improved.
Preferably, plate-shaped straight-rib parallel fins are arranged on the flow field upstream laminar flow section of the radiator; a cross-shaped structure formed by columnar pin fin fins is arranged at the midstream vortex section of the flow field; and cylindrical pin fin fins with different densities are arranged at the downstream turbulence section of the flow field of the radiator.
Preferably, the length of the plate-shaped straight rib parallel fins is not more than half of the length of the piezoelectric fan blade. The size and the interval of the columnar pin fin ensure that the blade does not collide with the fin in the process of periodic vibration of the blade. And (3) solving the vibration range of the piezoelectric fan blade according to the motion trajectory equation of the piezoelectric fan blade along with time in a first-order mode by using a Green integral formula, and ensuring the normal operation of the piezoelectric fan when the cross structure is positioned outside the vibration range.
Preferably, the equation of the motion trajectory of the piezoelectric fan blade in the first-order mode with time is as follows:
where l represents the length of the fan blade, x represents the abscissa of a point on the blade, and Y represents the position of the fan blade (x) Representing the maximum displacement of the point.
Preferably, the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity at two sides is high and the flow velocity at the middle is low, the transverse spacing of the columnar pin fin close to the two side wall surfaces at the downstream of the flow field is reduced for encryption, and the columnar pin fin at the middle adopts a staggered arrangement mode to improve the scouring effect of airflow on the fins.
Has the beneficial effects that: compared with the prior art, the invention has the following advantages:
(1) Compared with the common uniform fin arrangement method, the radiator structure for the piezoelectric fan system and the fin arrangement method thereof fully consider the flow field distribution characteristics generated by the periodic resonance of the piezoelectric fan blades, can fully utilize the cooling airflow generated by the fan, can obtain higher radiating efficiency under the condition of the same radiating area, and provide a new thought for the subsequent research of the piezoelectric fan radiating system and the engineering application of the radiator.
(2) The invention combines two heat dissipation modes of the radiator and the piezoelectric fan, firstly conducts heat generated by a heating device or a module in the electronic product to the fins of the radiator, and provides high-speed and stable airflow to cool and dissipate the heat of the radiating fins by the piezoelectric fan. The piezoelectric fan is used as a novel active cooling heat dissipation device, has low space occupancy rate, low power consumption and high heat dissipation efficiency, and is very suitable for the development trend of high density and integration of the current electronic products.
(3) The invention comprehensively considers two factors of wind speed and wind direction, arranges parallel plate-shaped straight ribs at the inlet section with parallel wind direction and uniform wind speed, and adopts columnar pin fin fins to form a cross structure in the range from the waist part to the end part of the blade due to the phenomenon of local vortex, thereby enhancing the scouring effect of the fin surface and the airflow; the columnar needle ribs are adopted in the downstream area with obvious wind direction change, the local encryption processing is adopted in the high-speed area, and the staggered arrangement method is adopted in the low-speed area. Through the radiator with the specially arranged fins, the flow field generated by vibration of the piezoelectric fan is fully utilized, higher radiating strength can be obtained under the condition of the same radiating area, and the radiating efficiency of the radiator is improved.
Drawings
FIG. 1 is a schematic view of a heat sink fin structure for a piezoelectric fan system;
FIG. 2 is a schematic diagram of a heat sink structure for a piezoelectric fan system and a method of arranging fins thereof;
FIG. 3 is a graph of a velocity vector distribution of a flow field generated by vibration of a piezoelectric fan;
FIG. 4 is a top view of a method of arranging fins according to an embodiment of the present invention;
FIG. 5 is a plan view of a method of arranging heat dissipating fins according to a comparative example of the present invention;
FIG. 6 is a comparison of the heat transfer coefficient of the surfaces of the heat sinks of the examples and comparative examples of the present invention.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples, which are carried out in the light of the technical solutions of the present invention, and it should be understood that these examples are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
A radiator structure for a piezoelectric fan system comprises a radiator 7, fins, a heat source module 4 and a piezoelectric fan 5, wherein the fins and the piezoelectric fan 5 are arranged on one surface of the radiator 7, and the heat source module 4 is arranged on the other surface of the radiator 7. The heat source module 4 is disposed on the bottom surface of the heat sink 7, and conducts heat inside the heat source module 4 to the fins of the heat sink 7, so as to cool and dissipate the heat from the heat source module 4.
The fins on the radiator 7 comprise a plate-shaped straight rib parallel arrangement area 1 located on an upstream laminar flow section of an airflow channel, a columnar pin rib combined structure arrangement area 2 located on a midstream vortex flow section, and a columnar pin rib local encryption arrangement area 3 located on a downstream turbulent flow section, wherein the plate-shaped straight rib parallel arrangement area 1 is located in an upstream range of the flow field, the columnar pin rib combined structure arrangement area 2 is located in a range from the waist part to the end part of a piezoelectric fan blade, and the columnar pin rib local encryption arrangement area 3 is located in a downstream range of the flow field.
The piezoelectric fan 5 is arranged near the plate-shaped straight rib parallel arrangement area 1, and directly drives the blades to generate resonance under the driving of an alternating electric field by utilizing the inverse piezoelectric effect of piezoelectric ceramics, and high-speed and stable airflow is output forwards from the blade ends to directly cool parts needing heat dissipation.
As shown in fig. 3, the velocity vector distribution diagram of the flow field generated by the vibration of the piezoelectric fan of the present invention shows that the air flow at the upstream part of the flow field flows in parallel and has a low flow velocity. The air flow speed is gradually increased after the excitation action of the back-and-forth vibration of the piezoelectric fan. Turbulent eddies are formed from the air flow from the waist to the end part of the blade, and the air flow speed in the local range of the eddies is obviously higher. In the downstream part of the flow field, the air flow continues to flow forward under the action of the vibration of the fan and gradually exhibits a diffusive flow phenomenon in which the outer flow velocity is high and the inner flow velocity is low.
In the invention, the flow field is divided into three parts, namely an upstream range (namely an upstream laminar flow section), a range from the waist part to the end part of the fan (namely a midstream vortex section) and a downstream range of the flow field (namely a downstream turbulent flow section) according to the distribution characteristics of the flow field, and different fin arrangement schemes are adopted aiming at different parts.
The invention also discloses a radiator fin arrangement method for the piezoelectric fan system, fins with different shapes and densities are arranged at different positions of the airflow channel according to the flow field characteristics induced by the vibration of the piezoelectric fan, and the improvement of the surface convection coefficient and the heat dissipation capacity of the radiator is realized.
S1: arranging plate-shaped straight rib parallel fins on an upstream laminar flow section of a flow field of the radiator;
the upstream range (upstream laminar flow section) of the flow field is an inlet section with parallel wind directions and uniform wind speed, for the airflow of the inlet section, the plate-shaped straight ribs can better fit most of cooling airflow, the flow loss generated by the airflow is smaller, and more cooling airflow can be smoothly guided to the middle and downstream. The height and the thickness of the plate-shaped straight rib fins can be set according to actual working conditions, the height of the plate-shaped straight rib fins is matched with the width of the piezoelectric fan blades, and the height of the straight ribs is preferably not less than the width of the blades; the length is preferably not more than half of the piezoelectric fan, the fin spacing can be determined according to the situation, usually the fin spacing is within the range of 2-10 mm, and researches show that the phenomenon of uneven flow field distribution and local heat dissipation deterioration can be caused by larger spacing.
S2: arranging columnar pin rib fins at a midstream vortex section of a flow field to form a cross structure;
the midstream vortex section is a range from the waist to the end of the double-blade in the embodiment, and a composite structure composed of a plurality of pin-rib fins 9 is adopted due to the local vortex phenomenon, and the cross section of the composite structure can be a cross-shaped structure, a rectangular structure or a circular structure.
The cross structure formed by the columnar pin fin 9 is designed according to the positioning and flow direction of the local vortex, and can be well attached to the cooling gas around the fin. The size and the interval of the columnar pin ribs in the structure can be determined according to actual working conditions, but the blade does not collide with the fins in the structure in the process that the blade vibrates periodically. According to the motion trail equation of the piezoelectric fan blade in a first-order mode along with time:
where l represents the length of the fan blade, x represents the abscissa of a point on the blade, and Y represents the position of the fan blade (x) Representing the maximum displacement of the point. The vibration range of the blade can be obtained by utilizing the Green integral formula for the curve equation, and the piezoelectric fan can be ensured to normally operate when the cross structure is positioned outside the vibration range.
S3: arranging columnar pin fin fins with different densities at a downstream turbulence section of a radiator flow field
In the downstream range of the flow field, the size and the direction of the airflow downstream of the channel are changed drastically, so that the columnar pin fin 9 is adopted in the section, the local encryption processing is adopted in the high-speed area, the staggered arrangement method is adopted in the low-speed area, the high-speed area is positioned on the left side and the right side of the section, and the low-speed area is positioned in the middle of the section. The numerical method researches find that the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity at two sides is higher and the flow velocity at the middle is lower, so that the transverse spacing of the columnar needle ribs at the downstream of the channel, which are close to the two side wall surfaces, is reduced for encryption, the fins at the middle can adopt a staggered arrangement method to improve the scouring effect of airflow on the fins, and the heat dissipation efficiency of the radiator is further improved. The size and the spacing of the columnar pin fin 9 can be set according to actual working conditions, and only the fact that the convection heat transfer area is increased in a high-flow-velocity area is needed.
Verifying the structure and method of the invention, a comparative example relative to the invention shown in fig. 5 is provided, in which the fins of the heat sink at the downstream of the flow field are all arranged at equal intervals by adopting plate-shaped straight ribs 6, and the characteristic is that the total heat dissipation area of the heat sink is kept equal to that of the embodiment. Fig. 6 shows the values of the average heat transfer coefficient of the surface of the heat sink, which is an index of the cooling ability of the comparative example and the present invention.
Fig. 6 shows values of the average heat transfer coefficient of the radiator surface, which is an index representing the cooling capacity. In the comparative example, the heat sink fins at the downstream of the channel all adopt plate-shaped straight ribs, and the airflow passes directly between the plates, so that the retention time is extremely short. In addition, since all the plate-shaped straight ribs are arranged in parallel at equal intervals, and the distribution characteristics of the flow direction and the flow velocity in the flow field are not considered, it can be understood that the cooling capacity of the comparative example is lower than that of the method for arranging the fins of the piezoelectric fan radiator. As can be seen from fig. 6, the surface average heat transfer coefficient of the example is improved by almost one time compared with the comparative example, which shows that the cooling capacity of the piezoelectric fan radiator fin arrangement method of the present invention is superior to that of the plate-shaped straight rib arrangement method.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.
Claims (10)
1. A heat sink structure for a piezoelectric fan system, comprising: one surface of the radiator (7) is provided with fins and a piezoelectric fan (5), and the distribution area of the fins comprises a plate-shaped straight rib parallel arrangement area (1), a columnar pin rib combined structure arrangement area (2) and a columnar pin rib local encryption arrangement area (3).
2. A heat sink structure for a piezoelectric fan system as claimed in claim 1, wherein: the plate-shaped straight rib parallel arrangement area (1) is located at an upstream laminar flow section of a radiator flow field, the columnar pin rib combined structure arrangement area (2) is located at a midstream vortex section of the radiator flow field, and the columnar pin rib local encryption arrangement area (3) is located at a downstream turbulent flow section of the radiator flow field.
3. A heat sink structure for a piezoelectric fan system as claimed in claim 1, wherein: the heat source module (4) is arranged on the bottom surface of the radiator (7), and heat inside the heat source module (4) is conducted to the fins of the radiator (7) to cool and radiate the heat source module (4).
4. The heat sink structure for a piezoelectric fan system as claimed in claim 2, wherein: the piezoelectric fan (5) is arranged in the plate-shaped straight rib parallel arrangement area (1), and drives the blades to generate resonance under the driving of an alternating electric field by utilizing the inverse piezoelectric effect of piezoelectric ceramics, so that airflow is output forwards from the ends of the blades.
5. A method of heat sink fin placement for a piezoelectric fan system, characterized by: according to the flow field characteristics induced by the vibration of the piezoelectric fan, fins with different shapes and densities are arranged at different positions of the flow field, so that the surface convection coefficient and the heat dissipation capacity of the radiator are improved.
6. The heat sink fin arranging method for a piezoelectric fan system as claimed in claim 1, wherein: a plate-shaped straight rib parallel fin (8) is arranged at the upstream laminar flow section of the flow field of the radiator (7); a cross structure formed by columnar pin fin fins (9) is arranged at the midstream vortex section of the flow field; in the downstream turbulence section of the radiator flow field, columnar pin fin fins (9) with different densities are arranged.
7. A heat sink fin placement method for a piezoelectric fan system as recited in claim 6, wherein: the length of the plate-shaped straight rib parallel fins (8) is not more than half of the length of the blades of the piezoelectric fan (5).
8. The heat sink fin arranging method for a piezoelectric fan system as claimed in claim 7, wherein: for a motion trajectory equation of the piezoelectric fan blade along with time in a first-order mode, a Green integral formula is utilized to obtain a blade vibration range, and when the cross-shaped structure is located outside the vibration range, the piezoelectric fan can be guaranteed to normally operate.
9. The heat sink fin arranging method for a piezoelectric fan system as claimed in claim 8, wherein:
the equation of the motion track of the piezoelectric fan blade along with the time in the first-order mode is as follows:
where l represents the length of the fan blade, x represents the abscissa of a point on the blade, and Y represents the position of the fan blade (x) Representing the maximum displacement of the point.
10. The heat sink fin arranging method for a piezoelectric fan system as claimed in claim 6, wherein: the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity at two sides is high and the flow velocity at the middle is low, the transverse spacing of the columnar pin fin (9) close to the two side wall surfaces at the downstream of the flow field is reduced for encryption, and the columnar pin fin (9) at the middle adopts a staggered arrangement mode to improve the scouring effect of airflow on the fins.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102620268A (en) * | 2012-03-14 | 2012-08-01 | 重庆邮电大学 | Non-uniformly distributed semiconductor illumination radiator |
| CN206365202U (en) * | 2016-12-12 | 2017-07-28 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of new high power electronic device air cooling equipment |
| JP2018022868A (en) * | 2016-07-26 | 2018-02-08 | 三菱電機株式会社 | Electronic apparatus cooler |
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
| CN109950218A (en) * | 2017-12-20 | 2019-06-28 | 广东工业大学 | A kind of radiator and cooling system |
| CN213818423U (en) * | 2020-12-29 | 2021-07-27 | 北京经纬恒润科技股份有限公司 | Electronic equipment and heat dissipation device thereof |
-
2022
- 2022-07-27 CN CN202210896100.1A patent/CN115243520A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620268A (en) * | 2012-03-14 | 2012-08-01 | 重庆邮电大学 | Non-uniformly distributed semiconductor illumination radiator |
| JP2018022868A (en) * | 2016-07-26 | 2018-02-08 | 三菱電機株式会社 | Electronic apparatus cooler |
| CN206365202U (en) * | 2016-12-12 | 2017-07-28 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of new high power electronic device air cooling equipment |
| CN109950218A (en) * | 2017-12-20 | 2019-06-28 | 广东工业大学 | A kind of radiator and cooling system |
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
| CN213818423U (en) * | 2020-12-29 | 2021-07-27 | 北京经纬恒润科技股份有限公司 | Electronic equipment and heat dissipation device thereof |
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