CN220693610U - Immersed liquid cooling heat abstractor based on double jet flow exciter - Google Patents
Immersed liquid cooling heat abstractor based on double jet flow exciter Download PDFInfo
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- CN220693610U CN220693610U CN202322314943.9U CN202322314943U CN220693610U CN 220693610 U CN220693610 U CN 220693610U CN 202322314943 U CN202322314943 U CN 202322314943U CN 220693610 U CN220693610 U CN 220693610U
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- 239000007788 liquid Substances 0.000 title claims abstract description 99
- 238000001816 cooling Methods 0.000 title claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 238000007654 immersion Methods 0.000 claims description 25
- 230000004907 flux Effects 0.000 claims description 13
- 239000000110 cooling liquid Substances 0.000 claims description 8
- 230000009977 dual effect Effects 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 description 12
- 239000012530 fluid Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an immersed liquid cooling heat dissipation device based on a double-jet exciter, which comprises the double-jet exciter, a connector, a jet plate and a heat sink heat dissipation plate, wherein the double-jet exciter is communicated with the jet plate through the connector; the jet flow plate is provided with jet holes, the heat sink and the heat dissipation plate are provided with mounting positions of the parts to be dissipated, and the jet holes are distributed corresponding to the mounting positions of the parts to be dissipated; the heat sink heat dissipation plate is provided with a liquid inlet, a liquid outlet, an immersed liquid cooling heat dissipation cavity communicated with the liquid inlet and the liquid outlet, and a part to be heat-dissipated is arranged in the immersed liquid cooling heat dissipation cavity. According to the utility model, the cooling medium in the double-jet exciter is injected into the immersed liquid cooling heat dissipation cavity of the heat sink heat dissipation plate at intervals in a jet mode, the jet interacts with the cooling medium in the immersed liquid cooling heat dissipation cavity in a cross flow mode to generate vortex, so that the mixing of the two parts of cooling medium is enhanced, the turbulence degree of the cooling medium is improved, the thermal boundary layer on the surface of a part to be heat-dissipated is further damaged, and the heat exchange capacity of the immersed liquid cooling heat dissipation cavity is improved.
Description
Technical Field
The utility model belongs to the technical field of liquid cooling, and particularly relates to an immersed liquid cooling heat dissipation device based on a double-jet actuator.
Background
In recent years, with the development of data center computing force, the heat flux density of high-performance chips has been in an increasing trend with the continuous increase of high-performance requirements. As the technology of GPU advances and performance improves, its power consumption increases accordingly, resulting in an increase in the amount of heat generated. The use of these high power and high heat GPUs in data centers and high performance computing presents challenges, requiring effective heat dissipation and thermal management measures to ensure stable operation of the GPU and avoid overheating problems.
Conventional air-cooled cooling has been difficult to address the thermal management issues of high heat flux density by means of fans to enhance air convection. Liquid cooling is becoming a developing trend to solve the heat dissipation problem. At present, more liquid cooling technologies are used, such as cold plate heat exchange and single-phase immersed liquid cooling. Along with the higher and higher heat flux density of the chip, the heat productivity of the electronic device is also increased, the heat dissipation of the liquid cooling cold plate needs to increase the flow of the system, so that the liquid cooling system pipelines and terminal equipment are increased, and even if the flow is further increased for the chip with high heat flux density, the cold plate is difficult to meet the heat dissipation requirement of the chip with high heat flux density. For the micro-scale micro-channel radiator, the heat exchange effect is good and can reach 300W/cm 2 But has large processing difficulty, high cost, small micro-runner scale and easy particle blocking.
The single-phase immersion cooling is a passive full-liquid immersion cooling technology, wherein electronic equipment is completely immersed in a cooling working medium, for a single-phase immersion system, cooling liquid is always kept in a liquid state in the heat exchange process, heat dissipation of the electronic equipment is realized through system circulation, heat can be directly transferred to the cooling liquid, in order to ensure stable operation of the equipment, the cooling liquid can only select dielectric liquid, and the dielectric liquid presents poor thermal properties, so that the cooling capacity of immersion liquid cooling is limited.
Therefore, the conventional liquid cooling plate technology has the following disadvantages: 1. the chip is isolated from cooling liquid through a thermal interface material, only the part of the core can be cooled, and the part which cannot be cooled still exists, so that the temperature consistency is poor; 2. the liquid cooling cold plate structure has the advantages that the pressure drop of the system is large, the flow of the system is required to be increased when heat dissipation is carried out, the liquid cooling system pipelines and tail end equipment are increased, and the pumping work is increased; 3. the micro-fluidic channel is small in size and is easy to block by particles.
In addition, the conventional large-space Tank passive immersion cooling technology is adopted at present, the whole server is immersed in the Tank body, and the system circulation is realized only through a pipeline communicated with the Tank to take away heat, so that even heat dissipation at a system level can be realized, but due to the complex structure of electronic equipment, a flowing dead zone can be formed locally, and the temperature of the zone is overhigh. The cooling liquid can only select dielectric liquid, the thermal property is poor, and the heat dissipation efficiency is low.
Disclosure of Invention
In view of the foregoing drawbacks and deficiencies of the prior art, it is an object of the present utility model to at least address one or more of the above-identified problems of the prior art, in other words, to provide an immersion liquid cooled heat sink based on a dual jet actuator that meets one or more of the aforementioned needs.
In order to achieve the aim of the utility model, the utility model adopts the following technical scheme:
an immersed liquid cooling heat dissipation device based on a double-jet exciter comprises the double-jet exciter, a connector, a jet plate and a heat sink heat dissipation plate, wherein the double-jet exciter is communicated with the jet plate through the connector; the jet flow plate is provided with jet holes, the heat sink and the heat dissipation plate are provided with mounting positions of the parts to be dissipated, and the jet holes are distributed corresponding to the mounting positions of the parts to be dissipated; the heat sink heat dissipation plate is provided with a liquid inlet, a liquid outlet, an immersed liquid cooling heat dissipation cavity communicated with the liquid inlet and the liquid outlet, and a part to be heat-dissipated is arranged in the immersed liquid cooling heat dissipation cavity.
As a preferable scheme, the inner cavity of the double-jet exciter is divided into two cavities by a vibrating diaphragm, and each cavity is provided with a liquid inlet and a connector interface.
As a preferable scheme, the jet plate is provided with two jet cavities which are in one-to-one correspondence with the cavities and are communicated through connectors;
wherein each jet cavity is provided with a plurality of jet holes.
Preferably, the two jet cavities are not communicated with each other.
As a preferable scheme, the jet flow cavity is of a bent flow channel structure, and the two jet flow cavities are mutually symmetrical in center.
Preferably, the jet hole is a conical hole.
Preferably, the cooling liquid flowing surface from the liquid inlet to the liquid outlet of the heat sink heat dissipation plate is perpendicular to the jet flow direction of the jet flow plate.
As a preferable scheme, a radiating block array is arranged in the immersed liquid cooling radiating cavity of the heat sink radiating plate, and the radiating block array is positioned between the liquid inlet and the mounting position of the part to be radiated or between the mounting position of the part to be radiated and the liquid outlet.
Preferably, the outer side of the heat sink and the heat dissipation plate is provided with heat dissipation ribs.
As an optimal scheme, the mounting position of the to-be-cooled piece is of a mounting groove structure, and the to-be-cooled piece is of a high heat flux chip.
Compared with the prior art, the utility model has the beneficial effects that:
(1) The consistency of the temperature of the parts to be cooled is effectively improved: based on the application of single-phase immersion liquid cooling technology, a double-jet exciter is provided, the double-jet exciter is matched with a jet plate, so that cooling medium in the double-jet exciter is injected into an immersion liquid cooling heat dissipation cavity of a heat sink heat dissipation plate at intervals in a jet mode, the synthetic jet injected at intervals interacts with the cooling medium in the immersion liquid cooling heat dissipation cavity in a cross flow mode, vortex is generated at two ends of the immersion liquid cooling heat dissipation cavity, mixing of the two parts of cooling medium is enhanced, the turbulence degree of the cooling medium is improved, a thermal boundary layer on the surface of a piece to be heat-dissipated is further damaged, more heat is taken away, and finally the heat exchange capacity of the immersion liquid cooling heat dissipation cavity is improved;
(2) The local heat dissipation effect is remarkable, because intermittent jet flow is arranged in the immersed liquid cooling heat dissipation cavity of the heat sink heat dissipation plate, the surface of a part to be heat-dissipated in the immersed liquid cooling heat dissipation cavity is doped with transverse and longitudinal cooling mediums, the turbulence degree of the cooling mediums is gradually increased, the damage to a thermal boundary layer is gradually increased, and meanwhile, the jet flow directly impacts the inner wall of the immersed liquid cooling heat dissipation cavity, so that the heat exchange capacity of the inner wall of the immersed liquid cooling heat dissipation cavity is improved; the damage of the jet flow and the incoming flow interaction to the thermal boundary layer and the direct impact of the jet flow on the inner wall of the microchannel radiator are mutually combined to further improve the heat radiation capability of reducing the temperature of a piece to be radiated (such as a high heat flux chip);
(3) The pressure drop of the double jet impact to the piece to be cooled is obviously reduced, the pressure drop is greatly reduced while the heat transfer performance is improved, and an efficient cooling mode is provided for solving the cooling problem of the chip with high heat flux density.
Drawings
Fig. 1 is a schematic structural diagram of an immersion liquid cooling heat dissipating device according to embodiment 1 of the present utility model;
FIG. 2 is an exploded view of an immersion liquid cooling heat sink according to embodiment 1 of the present utility model;
fig. 3 is a schematic structural view of a connector according to embodiment 1 of the present utility model;
FIG. 4 is a schematic structural view of a jet plate according to embodiment 1 of the present utility model;
fig. 5 is a schematic structural view of a heat sink and a heat spreader according to embodiment 1 of the present utility model.
Detailed Description
In order to more clearly illustrate the embodiments of the present utility model, specific embodiments of the present utility model will be described below with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the utility model, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
Example 1:
as shown in fig. 1 to 5, the immersion liquid cooling heat dissipating device based on the dual-jet actuator of the present embodiment includes a dual-jet actuator 1, a connector 2, a jet plate 3, and a heat sink heat dissipating plate 4.
Specifically, the dual-jet exciter 1 is divided into an upper part and a lower part, the upper part and the lower part correspond to the upper cavity 11 and the lower cavity 12 in sequence, the vibration elastic sheet 10 (namely the vibration diaphragm) is positioned at the middle position of the exciter, the whole exciter is divided into the upper cavity and the lower cavity, a sealing ring 13 is arranged between the outer shell of the exciter and the vibration elastic sheet, the upper part and the lower part of the exciter are respectively provided with a liquid inlet 14 and a connector interface 15, and the connector interface 15 is used for communicating the cavities and the connectors. Wherein, the vibrating diaphragm adopts a piezoelectric ceramic piece, and other vibrating diaphragms in the prior art can also be adopted; the shape of the vibrating diaphragm may be circular or square, etc.
The connector 2 of this embodiment has a flow passage inside, which connects the cavity of the actuator and the fluidic plate, respectively. Wherein, there are two connectors 2, and each cavity corresponds to connect one connector.
The jet plate 3 of this embodiment is located under the exciter, two jet cavities 31 are provided at the upper part of the jet plate 3, fluid pressed from the exciter enters the jet cavities through the connector to be collected, the two jet cavities are not interfered with (i.e. are not communicated with) each other, a plurality of jet holes 30 are provided in the jet cavities, and the jet holes are conical holes. The jet flow cavity is of a bent flow channel structure, and the two jet flow cavities are mutually symmetrical in center.
The heat sink and radiating plate 4 of this embodiment is located under the jet plate 3, the middle part of the heat sink and radiating plate 4 is provided with a substrate mounting groove 41, the chip substrate 5 is mounted in the substrate mounting groove 41, and the chip 6 is located under the jet hole. In addition, the top of the heat sink and radiating plate 4 is of an open structure, so that an immersed liquid cooling radiating cavity is formed; the two sides are provided with a liquid inlet 4a and a liquid outlet 4b, a cylindrical radiating block array 7 (i.e. a micro rib array structure) is arranged between the liquid inlet and the liquid outlet and between the liquid inlet and the chip 6, and the outer surface of the heat sink radiating plate is provided with micro ribs 8.
The cooling liquid flowing surface (i.e. horizontal surface) from the liquid inlet to the liquid outlet of the heat sink and heat dissipation plate 4 is perpendicular to the jet flow direction (vertical direction) of the jet flow plate.
The immersion liquid cooling heat dissipation device of the embodiment has two heat dissipation modes: a normal mode and an excitation mode.
For the conventional mode, the chip is directly assembled at a specific reserved position of the heat sink and the fluid is introduced from the liquid inlet of the immersed liquid cooling heat dissipation cavity, the heat generated by the chip can be transferred to the heat sink, the fluid timely takes away the heat through convection heat exchange, and the micro-rib array structures at the two ends of the heat sink can increase the turbulence of the fluid inlet and outlet and indirectly improve the heat exchange efficiency of the fluid and the chip;
for the excitation mode, the excitation mode is entered as the chip heat flow load increases. In the excitation mode, the heat radiation performance of the heat radiation device can be regulated and controlled in real time by adjusting the input frequency and voltage parameters of the double-jet exciter without changing the incoming flow condition of the heat sink and the heat radiation plate.
The vibration shrapnel in the cavity of the exciter periodically vibrates, so that two liquid flows in from the liquid inlet of the exciter are driven by the exciter to periodically and alternately flow into the connector and the jet cavity in turn, and finally are sprayed to the surface of the chip. The exciter causes jet pressure change, and the pressure change enables liquid in 2 cavities of the jet exciter to be ejected out through the jet hole array on the jet plate alternately in a periodic manner to form synthetic jet; the synthetic jet flow and the cooling fluid from the liquid inlet of the immersed liquid cooling heat dissipation cavity are interacted to improve the flow and the convection heat exchange effect between the micro-rib structure surface and the heat sink heat dissipation plate, thereby realizing the enhancement of heat dissipation performance.
The immersed liquid cooling heat dissipation device of the embodiment has the following advantages:
(1) The two streams of liquid driven in the exciter alternately impact the surface of the chip, and compared with the constant jet, the jet impact standing point on the surface of the chip can alternately appear at different positions, so that the thermal boundary layers at different positions on the surface of the chip can be periodically damaged, the temperature of the chip is reduced, and more heat is taken away;
(2) The mixed flow is formed by the double jet flow and the cross flow in the immersed liquid cooling heat dissipation cavity, and the space heat exchange of the longitudinal direction and the transverse direction of the chip is maximum;
(3) The heat transfer is enhanced by the double jet flow and the cross flow, and the heat exchange efficiency is greatly improved by combining the micro-rib array structure of the immersed liquid cooling heat dissipation cavity;
(4) In the excitation mode, the heat radiation performance of the heat radiation device can be regulated and controlled in real time by adjusting the input frequency and voltage parameters of the synthetic jet exciter without changing the incoming flow condition of the heat sink and the heat radiation plate, and the heat radiation device is easier to adjust than a pump;
(5) When the chip is in low load, the conventional mode can meet the heat dissipation requirement of the chip, and when the chip is in high heat flux density load, the excitation mode is started to meet the heat dissipation requirement;
(6) The cylindrical micro-rib array in the heat sink radiator plays a role in increasing the turbulence of fluid in the micro-channel and weakening the thermal boundary layer on the surface of the chip;
(7) The side surface and the bottom outer surface of the heat sink heat dissipation plate adopt an array structure of aluminum (copper or stainless steel) heat dissipation ribs, so that the heat of a chip in the heat sink heat dissipation plate can be timely transferred to the external environment; the whole heat sink and radiating plate can play the role of a temperature equalizing plate.
(8) The structural dimensions of the heat sink and the heat dissipation plate, the chip and the substrate are flexibly adjusted, so that the purpose of submerged liquid cooling local heat exchange is realized.
(9) The dual jet flow combines the mixed flow of the cross flow and the heat radiation structure of the heat radiation fins, has obvious heat radiation advantage on the chip with high heat flux density, is easy to integrate, can realize local arrangement and solves the problem of local heat radiation of the chip with high heat flux density.
Example 2:
the immersion liquid cooling heat dissipating device based on the dual-jet actuator of the present embodiment is different from embodiment 1 in that:
the two cavities of the exciter can be provided with no external liquid inlet, so that the structure can be further simplified, and the heat exchange can be carried out by means of liquid in the cavities of the exciter alternately flowing and sucking from the jet plate and continuously mixing with the fluid of the heat dissipation device, so that a certain heat dissipation effect can be achieved; meeting the requirements of different applications;
other structures can be referred to embodiment 1.
Example 3:
the immersion liquid cooling heat dissipating device based on the dual-jet actuator of the present embodiment is different from embodiment 1 in that:
the substrate mounting grooves of the heat sink and the heat dissipation plate can be designed into a plurality of grooves, so that the requirements of actual working conditions are met;
for example, according to the heat dissipation requirement of the high heat flux GPU chip, the whole heat dissipation device can form a shell structure according to the size of the GPU display card, so that the integrated assembly in a Tank cabinet is facilitated;
other structures can be referred to embodiment 1.
It should be noted that the above embodiments can be freely combined as needed. The foregoing is only illustrative of the preferred embodiments and principles of the present utility model, and changes in specific embodiments will occur to those skilled in the art upon consideration of the teachings provided herein, and such changes are intended to be included within the scope of the utility model as defined by the claims.
Claims (10)
1. The immersion liquid cooling heat dissipation device based on the double-jet exciter is characterized by comprising the double-jet exciter, a connector, a jet plate and a heat sink heat dissipation plate, wherein the double-jet exciter is communicated with the jet plate through the connector; the jet flow plate is provided with jet holes, the heat sink and the heat dissipation plate are provided with mounting positions of the parts to be dissipated, and the jet holes are distributed corresponding to the mounting positions of the parts to be dissipated; the heat sink heat dissipation plate is provided with a liquid inlet, a liquid outlet, an immersed liquid cooling heat dissipation cavity communicated with the liquid inlet and the liquid outlet, and a part to be heat-dissipated is arranged in the immersed liquid cooling heat dissipation cavity.
2. An immersion liquid cooling heat sink according to claim 1 wherein the internal cavity of the dual jet actuator is divided by a vibrating diaphragm into two cavities, each cavity being provided with a liquid inlet and a connector interface.
3. The submerged liquid-cooled heat sink of claim 2, wherein the jet plate has two jet cavities, the jet cavities being in one-to-one correspondence with the cavities and being in communication via a connector;
wherein each jet cavity is provided with a plurality of jet holes.
4. A submerged liquid-cooled heat sink according to claim 3, wherein the two jet chambers are not in communication with each other.
5. An immersion liquid cooling heat sink according to claim 3 wherein the jet flow chamber is of a bent flow path structure and the two jet flow chambers are centrally symmetrical to each other.
6. A submerged liquid-cooled heat sink as claimed in claim 3 wherein the jet aperture is a tapered aperture.
7. An immersion liquid cooling heat sink according to any one of claims 1 to 6 wherein the cooling liquid flow surface from the liquid inlet to the liquid outlet of the heat sink heat spreader is perpendicular to the jet flow direction of the jet plate.
8. An immersion liquid cooling heat sink according to any one of claims 1-6 wherein a heat sink array is disposed in the immersion liquid cooling cavity of the heat sink plate, the heat sink array being located between the liquid inlet and the mounting location of the heat sink or between the mounting location of the heat sink and the liquid outlet.
9. An immersion liquid cooling heat sink as claimed in any one of claims 1 to 6 wherein heat dissipating fins are provided on the outside of the heat sink heat dissipating plate.
10. An immersion liquid cooling heat sink according to any one of claims 1 to 6 wherein the mounting location of the heat sink is a mounting groove structure and the heat sink is a high heat flux chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322314943.9U CN220693610U (en) | 2023-08-28 | 2023-08-28 | Immersed liquid cooling heat abstractor based on double jet flow exciter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322314943.9U CN220693610U (en) | 2023-08-28 | 2023-08-28 | Immersed liquid cooling heat abstractor based on double jet flow exciter |
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| Publication Number | Publication Date |
|---|---|
| CN220693610U true CN220693610U (en) | 2024-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322314943.9U Active CN220693610U (en) | 2023-08-28 | 2023-08-28 | Immersed liquid cooling heat abstractor based on double jet flow exciter |
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| Country | Link |
|---|---|
| CN (1) | CN220693610U (en) |
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2023
- 2023-08-28 CN CN202322314943.9U patent/CN220693610U/en active Active
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