CN115226323A - 低温共烧陶瓷基板表面焊盘及其制备方法 - Google Patents
低温共烧陶瓷基板表面焊盘及其制备方法 Download PDFInfo
- Publication number
- CN115226323A CN115226323A CN202210690352.9A CN202210690352A CN115226323A CN 115226323 A CN115226323 A CN 115226323A CN 202210690352 A CN202210690352 A CN 202210690352A CN 115226323 A CN115226323 A CN 115226323A
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- ceramic substrate
- porcelain
- ceramic
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 79
- 239000000758 substrate Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 35
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 25
- 239000002344 surface layer Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 13
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 238000000227 grinding Methods 0.000 claims abstract description 10
- 238000011049 filling Methods 0.000 claims abstract description 8
- 238000000462 isostatic pressing Methods 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 238000004080 punching Methods 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000011148 porous material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010344 co-firing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210690352.9A CN115226323A (zh) | 2022-06-17 | 2022-06-17 | 低温共烧陶瓷基板表面焊盘及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210690352.9A CN115226323A (zh) | 2022-06-17 | 2022-06-17 | 低温共烧陶瓷基板表面焊盘及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115226323A true CN115226323A (zh) | 2022-10-21 |
Family
ID=83608080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210690352.9A Pending CN115226323A (zh) | 2022-06-17 | 2022-06-17 | 低温共烧陶瓷基板表面焊盘及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115226323A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116031172A (zh) * | 2023-01-09 | 2023-04-28 | 上海泽丰半导体科技有限公司 | 大尺寸陶瓷基板制作方法及大尺寸陶瓷基板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286555A (ja) * | 1999-03-30 | 2000-10-13 | Sumitomo Metal Electronics Devices Inc | セラミック基板及びその製造方法 |
US6525275B1 (en) * | 1996-08-05 | 2003-02-25 | Ibiden Co., Ltd. | Multilayer printed circuit boards |
US20090251869A1 (en) * | 2008-04-02 | 2009-10-08 | Hitachi Metals, Ltd. | Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate |
CN104129920A (zh) * | 2014-07-29 | 2014-11-05 | 研创光电科技(赣州)有限公司 | 一种共烧玻璃陶瓷材料及制备方法与利用共烧玻璃陶瓷材料制作led封装用基板的方法 |
CN108831869A (zh) * | 2018-06-06 | 2018-11-16 | 江苏省宜兴电子器件总厂有限公司 | 一种共烧陶瓷外壳焊盘制备的方法 |
-
2022
- 2022-06-17 CN CN202210690352.9A patent/CN115226323A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6525275B1 (en) * | 1996-08-05 | 2003-02-25 | Ibiden Co., Ltd. | Multilayer printed circuit boards |
JP2000286555A (ja) * | 1999-03-30 | 2000-10-13 | Sumitomo Metal Electronics Devices Inc | セラミック基板及びその製造方法 |
US20090251869A1 (en) * | 2008-04-02 | 2009-10-08 | Hitachi Metals, Ltd. | Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate |
CN104129920A (zh) * | 2014-07-29 | 2014-11-05 | 研创光电科技(赣州)有限公司 | 一种共烧玻璃陶瓷材料及制备方法与利用共烧玻璃陶瓷材料制作led封装用基板的方法 |
CN108831869A (zh) * | 2018-06-06 | 2018-11-16 | 江苏省宜兴电子器件总厂有限公司 | 一种共烧陶瓷外壳焊盘制备的方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116031172A (zh) * | 2023-01-09 | 2023-04-28 | 上海泽丰半导体科技有限公司 | 大尺寸陶瓷基板制作方法及大尺寸陶瓷基板 |
CN116031172B (zh) * | 2023-01-09 | 2024-02-13 | 上海泽丰半导体科技有限公司 | 大尺寸陶瓷基板制作方法及大尺寸陶瓷基板 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230802 Address after: Room 404, 4th Floor, Building 1, No. 201 and 221, Cuibo Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201306 Applicant after: SHANGHAI ZENFOCUS SEMI-TECH Co.,Ltd. Address before: Room 404, 4th Floor, Building 1, No. 201 and 221, Cuibo Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201306 Applicant before: SHANGHAI ZENFOCUS SEMI-TECH Co.,Ltd. Applicant before: Shanghai Zefeng semiconductor testing Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221021 |
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RJ01 | Rejection of invention patent application after publication |