CN115180956A - 一种低成本高性能硅质瓷坯料配方 - Google Patents
一种低成本高性能硅质瓷坯料配方 Download PDFInfo
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- CN115180956A CN115180956A CN202210880951.7A CN202210880951A CN115180956A CN 115180956 A CN115180956 A CN 115180956A CN 202210880951 A CN202210880951 A CN 202210880951A CN 115180956 A CN115180956 A CN 115180956A
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- 229910052573 porcelain Inorganic materials 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 95
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 50
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 50
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000004597 plastic additive Substances 0.000 claims abstract description 42
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910017053 inorganic salt Inorganic materials 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 229910021487 silica fume Inorganic materials 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000010456 wollastonite Substances 0.000 claims abstract description 10
- 229910052882 wollastonite Inorganic materials 0.000 claims abstract description 10
- 239000000654 additive Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 72
- 235000012239 silicon dioxide Nutrition 0.000 claims description 30
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 28
- 239000006004 Quartz sand Substances 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 22
- 238000005245 sintering Methods 0.000 claims description 20
- 239000012752 auxiliary agent Substances 0.000 claims description 19
- 239000011863 silicon-based powder Substances 0.000 claims description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 16
- 239000003963 antioxidant agent Substances 0.000 claims description 16
- 230000003078 antioxidant effect Effects 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- 239000000428 dust Substances 0.000 claims description 14
- 239000000395 magnesium oxide Substances 0.000 claims description 14
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 14
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 14
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- NCJRLCWABWKAGX-UHFFFAOYSA-N [Si].[Ca].[Ba] Chemical compound [Si].[Ca].[Ba] NCJRLCWABWKAGX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052878 cordierite Inorganic materials 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 239000010431 corundum Substances 0.000 claims description 6
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004576 sand Substances 0.000 claims description 5
- 238000005121 nitriding Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000003763 carbonization Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims 5
- 239000002075 main ingredient Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 13
- 238000005452 bending Methods 0.000 abstract description 9
- 229910003481 amorphous carbon Inorganic materials 0.000 abstract description 7
- 235000015895 biscuits Nutrition 0.000 abstract description 7
- 229910052799 carbon Inorganic materials 0.000 abstract description 7
- 229910002804 graphite Inorganic materials 0.000 abstract description 7
- 239000010439 graphite Substances 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000002844 melting Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 238000005260 corrosion Methods 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 229920000049 Carbon (fiber) Polymers 0.000 description 6
- 239000004917 carbon fiber Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 150000007522 mineralic acids Chemical class 0.000 description 6
- 150000007524 organic acids Chemical class 0.000 description 6
- 235000005985 organic acids Nutrition 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 235000011121 sodium hydroxide Nutrition 0.000 description 6
- 239000002689 soil Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
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Abstract
本发明涉及电瓷技术领域，尤其涉及一种低成本高性能硅质瓷坯料配方，主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。本发明得主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25°C环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa。
Description
技术领域
本发明涉及硅质瓷技术领域，尤其涉及一种低成本高性能硅质瓷坯料配方。
背景技术
硅质瓷即为含硅化合物无机材料，主要包括碳化硅陶瓷和氮化硅陶瓷。碳化硅陶瓷具有优良的常温力学性能，较高的抗弯强度、优良的抗氧化性、良好的耐腐蚀性、高的抗磨损以及较低的摩擦系数，碳化硅陶瓷的高温力学性能是已知陶瓷材料中最佳的。氮化硅陶瓷是一种烧结时不收缩的无机材料陶瓷。氮化硅的强度很高，尤其是热压氮化硅，是世界上最坚硬的物质之一。具有高强度、低密度、耐高温等性质。
公开号为CN102838343B的发明公开了一种高硅质瓷中强度电瓷坯料配方，其所包含的组分及重量组分比为：东胜土20～22份、江津粘土16～20份、泾阳土16～20份、铝矾土3～6份、永川土16～20份、石英粉24～26份。上述配方的主要技术指标为：干燥强度≥5MPa；弯曲强度≥110MPa；烧成温度范围≥40K；开口孔隙率：0.000％；体积密度：≥2.55g/cm3；耐受电压：≥35kV/mm，其各项性能超过GB8411中强瓷标准，该料方满足了160kN以下绝缘子的要求。
但是上述技术方案存在以下缺陷：上述坯料配方成分复杂，加工步骤不明确，导致整体加工成本较高，无法在材料行业得到广泛普及。
发明内容
本发明针对背景技术中存在的技术问题，提出一种低成本高性能硅质瓷坯料配方。
本发明的技术方案：一种低成本高性能硅质瓷坯料配方，本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
优选的，主料硅灰矿石还包括刚玉砂；按重量份数计，主料包括10份刚玉砂与90份硅灰矿石。
优选的，主料硅灰矿石还包括堇青石；按重量份数计，主料包括5份堇青石与95份硅灰矿石。
优选的，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、5份碳化硅矿石、5份氮化硅矿石、10份二氧化硅、15份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
优选的，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、10份碳化硅矿石、10份氮化硅矿石、10份二氧化硅、5份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
与现有技术相比，本发明的上述技术方案具有如下有益的技术效果：主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa。相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
具体实施方式
实施例一
本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
在本实施例中，主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa，相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
实施例二
本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
进一步的，主料硅灰矿石还包括刚玉砂；按重量份数计，主料包括10份刚玉砂与90份硅灰矿石。
在本实施例中，主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa，相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
实施例三
本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
进一步的，主料硅灰矿石还包括堇青石；按重量份数计，主料包括5份堇青石与95份硅灰矿石。
在本实施例中，主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa，相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
实施例四
本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
进一步的，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、5份碳化硅矿石、5份氮化硅矿石、10份二氧化硅、15份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
在本实施例中，主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa，相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
实施例五
本实施例提出的一种低成本高性能硅质瓷坯料配方，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比。
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂。
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐。
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂。无机助剂包括硅钡钙脱氧剂。无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
进一步的，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、10份碳化硅矿石、10份氮化硅矿石、10份二氧化硅、5份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
在本实施例中，主料和辅料混合后形成坯料，坯料经压制、挤压、注浆或其他成型方法制成素坯。在塑性添加剂的化合所用下，硅灰矿石混合物热解为多孔的炭，液态或气态的硅与无定型碳或石墨反应生成碳化硅，并且包括氮化反应得到的氮化硅矿石。反应生成的碳化硅多晶、碳化硅粉和氮化硅连成一体，过量的硅填充了微孔得到无气孔的制品。25℃环境下弯曲强度可达400～600MPa,熔点为1410℃，强度250MPa，弹性模量约为115MPa，相较于现有技术而言，本发明的配方保持了碳纤维的最初取向，并且硅质瓷坯料机械性能与其他工艺获得的陶瓷坯料相仿，在添加了氮化硅矿石后，胚料极耐高温，强度一直可以维持到1200℃的高温而不下降，受热后不会熔成融体，一直到1410℃才会分解，并有惊人的耐化学腐蚀性能，能耐几乎所有的无机酸和30％以下的烧碱溶液，也能耐很多有机酸的腐蚀；同时又是一种高性能电绝缘材料，用途广泛，前景广阔，性能高造价成本低，并且原材料取材丰富。
一种低成本高性能硅质瓷坯料配方，该配方的加工方法如下：
S1、将纯硅粉压制成所需形状的生坯，放入氮化炉经预氮化烧结处理，制得氮化硅矿石。
S2、将纯硅粉压制成所需形状的生坯，放入碳化炉经预氮化烧结处理，制得氮化硅矿石。
S3、按特定配方的重量份数，将成比例的粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂加入混料机器中进行混料。
S4、按特定配方的重量份数，将成比例的塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂加入S3混料完毕的混合物中，进行化学反应。
S5、反应完毕后，对混合物进行混合均匀，搅拌至湿度均匀后形成可进行铸造加工或者浇筑加工的硅质瓷坯料。
应当理解的是，本发明的上述具体实施方式仅仅用于示例性说明或解释本发明的原理，而不构成对本发明的限制。因此，在不偏离本发明的精神和范围的情况下所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。此外，本发明所附权利要求旨在涵盖落入所附权利要求范围和边界、或者这种范围和边界的等同形式内的全部变化和修改例。
Claims (6)
1.一种低成本高性能硅质瓷坯料配方，其特征在于，坯料包括主料和辅料；主料包括硅灰矿石；辅料包括塑性添加剂、水、无机助剂和无机盐；按重量份数计，每100份主料与13份辅料进行配比；
硅灰矿石包括粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂；
按重量份数计，主料硅灰矿石包括40-80份纯硅粉、5-20份碳化硅矿石、5-20份氮化硅矿石、10-20份二氧化硅和15-25份石英砂；按重量份数计，辅料包括30份塑性添加剂、40份水、20份无机助剂和10份无机盐；
塑性添加剂包括塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂；按重量份数计，每10份塑性添加剂中包括4份塑性烧结剂、2份抗氧化剂、2份硅烷偶联剂、1份缓凝剂和1份反絮凝剂；
无机助剂包括硅钡钙脱氧剂；
无机盐包括碳酸钠和氧化镁；按重量份数计，无机盐包括4份碳酸钠和6份氧化镁。
2.根据权利要求1所述的一种低成本高性能硅质瓷坯料配方，其特征在于，主料硅灰矿石还包括刚玉砂；按重量份数计，主料包括10份刚玉砂与90份硅灰矿石。
3.根据权利要求1所述的一种低成本高性能硅质瓷坯料配方，其特征在于，主料硅灰矿石还包括堇青石；按重量份数计，主料包括5份堇青石与95份硅灰矿石。
4.根据权利要求1所述的一种低成本高性能硅质瓷坯料配方，其特征在于，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、5份碳化硅矿石、5份氮化硅矿石、10份二氧化硅、15份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
5.根据权利要求1所述的一种低成本高性能硅质瓷坯料配方，其特征在于，按重量份数计，每100份硅质瓷坯料包括60份纯硅粉、10份碳化硅矿石、10份氮化硅矿石、10份二氧化硅、5份石英砂、1.5份塑性添加剂、2份水、1份无机助剂和0.5份无机盐。
6.根据权利要求1-5任一项所述的一种低成本高性能硅质瓷坯料配方，其特征在于，该配方的加工方法如下：
S1、将纯硅粉压制成所需形状的生坯，放入氮化炉经预氮化烧结处理，制得氮化硅矿石；
S2、将纯硅粉压制成所需形状的生坯，放入碳化炉经预氮化烧结处理，制得氮化硅矿石；
S3、按特定配方的重量份数，将成比例的粒径1mm-3mm的纯硅粉、粒径5mm-8mm的碳化硅矿石、粒径5mm-8mm的氮化硅矿石、粒径4mm-9mm的二氧化硅和粒径1mm-2mm的石英砂加入混料机器中进行混料；
S4、按特定配方的重量份数，将成比例的塑性烧结剂、抗氧化剂、硅烷偶联剂、缓凝剂和反絮凝剂加入S3混料完毕的混合物中，进行化学反应；
S5、反应完毕后，对混合物进行混合均匀，搅拌至湿度均匀后形成可进行铸造加工或者浇筑加工的硅质瓷坯料。
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