CN115178825A - High-efficient display device of reflow oven temperature - Google Patents
High-efficient display device of reflow oven temperature Download PDFInfo
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- CN115178825A CN115178825A CN202210797842.9A CN202210797842A CN115178825A CN 115178825 A CN115178825 A CN 115178825A CN 202210797842 A CN202210797842 A CN 202210797842A CN 115178825 A CN115178825 A CN 115178825A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a high-efficiency display device for the temperature of a reflow oven, and particularly relates to the technical field of reflow ovens. According to the invention, by arranging the parameter comparison module, the data collection module and the integration module, the display device can obtain the best data of the current PCB processing through the data conditions tested by the display device after the PCB is processed for many times, so that the defects of the PCB processing caused by the experience of a user or network data are avoided, the actual use effect of the display device is ensured, and meanwhile, the welding effect of the reflow oven body on the PCB and the safety in use are provided.
Description
Technical Field
The invention relates to the technical field of reflow furnaces, in particular to a high-efficiency display device for the temperature of a reflow furnace.
Background
In the reflow soldering process, the factors influencing the soldering quality of the product are mainly reflected in the technical parameters of the speed of a conveyor belt, the stability of the conveyor belt, the transverse difference of temperature, the temperature stability of a temperature zone, the convective heat conductivity and the like, in the reflow soldering process, a PCB (printed circuit board) is not heated at a constant temperature, but passes through the different set temperature zones at a set speed, the PCB and components and consumables attached to the PCB are subjected to a variable temperature effect at the same time to finally form a welding point, and under the condition, the speed of the conveyor belt, the convective heat conductivity of a reflow oven and the set temperature of the temperature zone have the greatest influence on a temperature curve, so that the three technical parameters of the reflow oven are very important to test and analyze.
The moving speed of the PCB in the reflow oven is determined by the conveying speed of the conveyor belt, the conveying speed is high, the residence time of the PCB in each heating area is short, the speed is generally relatively fixed, the welding speed of the whole production shift and even the whole batch of products is unchanged from a certain angle, the residence time of the PCB in each heating area is longer, the heating of the heating area is more sufficient, in the automatic production, the production efficiency and the production rhythm are considered, the conveying belt speed is set in a reasonable range, namely, the key indexes of a temperature curve can be ensured to meet the requirements, the production efficiency can be maximized, under the condition that the conveying belt speed is unchanged, the temperature of each heating area of the reflow oven is set to be higher, the temperature rise of the PCB in the temperature area is higher, and the temperature of each temperature area of the reflow oven is equivalent to the temperature curve despite that the set temperature of each reflow oven is different.
However, at present, the temperature inside the reflow soldering furnace is monitored and displayed to ensure the soldering effect of the PCB inside the reflow soldering furnace, but in actual operation and application, due to the difference of the materials of the PCB circuit boards, the difference of the temperature and the difference of the transmission speed, the required temperature is different during the period, in most cases, the temperature inside the reflow soldering furnace needs to be adjusted according to the experience of an operator, however, the rigor of the reflow soldering furnace is proved to have a leak, and the reflow soldering furnace is not suitable for most operators, so that the actual soldering effect of the PCB is greatly limited, the soldering quality is affected, and the use safety of the reflow soldering furnace is difficult to ensure.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a high-efficiency display device for the temperature of a reflow oven, and the technical problems to be solved by the invention are as follows: at present, the temperature in the reflow soldering furnace is monitored and displayed to ensure the welding effect of the PCB inside the reflow soldering furnace, but in the actual operation and application process, because the PCB circuit board materials are different, the temperature is different and the transmission speed is different, the required temperature is different in the period, in most cases, the temperature in the reflow soldering furnace needs to be adjusted according to the experience of an operator, however, the rigor of the reflow soldering furnace is proved to have a leak, and the reflow soldering furnace is not suitable for most operators, so that the actual welding effect of the PCB is greatly limited, the welding quality is influenced, and the safety in the use process is difficult to ensure.
In order to achieve the purpose, the invention provides the following technical scheme: a high-efficiency display device for the temperature of a reflow oven comprises a reflow oven body, wherein a reflow oven controller is arranged on the upper surface of the reflow oven body, the upper surface of the reflow oven body is provided with a processor, the output end of the processor is respectively and electrically connected with the reflow oven body and the input end of the reflow oven controller through leads, the front side of the processor is provided with a plurality of monitoring pipelines, the other ends of the monitoring pipelines are fixedly connected with the upper surface of the reflow oven body, the other end of the monitoring pipeline is positioned in the reflow furnace body, a plurality of cabin doors are arranged on the front surface of the reflow furnace body, the left side surface of the reflow oven body is provided with a slot, the output end of the processor is electrically connected with the input end of the data processing center, the output end of the data processing center is respectively and electrically connected with the input ends of the integration module and the data collection module, the input ends of the integration module and the data collection module are electrically connected with the input end of the parameter comparison module, the output end of the parameter comparison module is respectively and electrically connected with the input ends of the data collection module and the calculation module, the output end of the data collection module is electrically connected with the input end of the processor through the data processing center, the input end of the calculation module is respectively and electrically connected with the input ends of the parameter comparison module and the temperature control module, the input end of the temperature control module is electrically connected with the output end of the processor, the output end of the temperature control module is electrically connected with the input end of the temperature curve display module, the input of the temperature curve display module is respectively and electrically connected with the input ends of the transmission module and the temperature acquisition module, the output ends of the temperature acquisition module and the transmission module are electrically connected with the input end of the feedback module, and the output end of the feedback module is electrically connected with the input end of the processor.
As a further scheme of the invention: the temperature acquisition module comprises a heating area acquisition module, a constant temperature area acquisition module and a cooling area acquisition module.
As a further scheme of the invention: the temperature rising area acquisition module is used for acquiring the temperature of a temperature rising area, the temperature rising area aims to heat products in a furnace cavity, but cannot be heated too fast, otherwise, a PCB or a component can be burnt out, a solvent in a welding flux can be quickly lost, the welding quality is reduced, meanwhile, the temperature rising cannot be too slow, and an active agent cannot reach enough temperature, so that the temperature rising slope of the temperature rising area is set differently according to different used tin pastes, the slope of the tin paste is generally 1-2 ℃/S, the constant temperature area acquisition module is used for acquiring the temperature of a constant temperature area, the constant temperature area has two purposes, firstly, the active agent flows along with rosin by heating and reacts with an oxide on the surface of a welded metal, and the weldability of the surface of the welded metal is ensured during welding, secondly, the temperature of all components on the PCB is guaranteed to be the same before the welding stage, but because the heat absorption capacity of the components on the PCB is greatly different, the components are guaranteed to absorb heat fully, the cooling area acquisition module is used for acquiring the temperature of the cooling area, the purpose of the cooling area is to accelerate the solidification of molten solder to form a welding point with high hardness, high strength and good glossiness, but too high cooling speed causes too high temperature difference between the substrate and the components, thermal expansion mismatching is generated, the substrate is deformed or the welding point and the welding point are split, too low cooling speed causes the welding point to be molten in the solder, cu30Sn8 and Cu3Sn are increased, a welding point with dull and rough is generated, and the cooling slope is generally (3-5) DEG C/S according to the difference of solder pastes and is cooled to be below 100 ℃.
As a further scheme of the invention: the temperature curve display module is used for detecting the temperature in the heating area acquisition module, the constant temperature area acquisition module and the cooling area acquisition module, correspondingly displaying the welding condition and the temperature of the PCB in the corresponding temperature in the form of a temperature curve, and the transmission module is used for transmitting the PCB in the reflow oven body and penetrating the PCB through different areas to complete the welding of the PCB.
As a further scheme of the invention: the feedback module collects and feeds back the state and temperature expressed by the PCB when the PCB passes through different areas in the transmission process, and synchronously transmits the state and temperature to the processor, and the data transmitted to the feedback module is collected and stored by the data processing center and is timely transmitted when the data needs to be compared or integrated.
As a further scheme of the invention: the data acquisition system comprises a data acquisition module, an integration module, a parameter comparison module, a calculation module and a data transmission module, wherein the data acquisition module acquires data in a network, transmits processing data to the parameter comparison module when meeting the same condition with the current PCB to be processed, the integration module acquires current data collected by a data processing center and transmits the current data to the parameter comparison module, the parameter comparison module acquires the optimal condition of the network and the actual condition of the current PCB and transmits the data to the calculation module after unified comparison, the calculation module compares the data and the actual data in the network to obtain a compromise selection scheme after difference, and transmits the scheme data and the PCB processing data obtained by the scheme to a temperature control module and a processor respectively.
According to the above scheme, the following problems need to be noted:
A. the conveying speed of the guide rail and the temperature of each temperature zone cannot be changed at will, and the temperature of the temperature zones is matched with the speed of the conveying belt.
B. The time interval between the circuit boards entering the temperature area cannot be too short, and generally, the interval between the two circuit boards is more than 500 mm.
C. The stirring time of the solder paste cannot be too long, otherwise, the dense tube legs are easy to be short-circuited when the solder paste is brushed.
D. The purpose of the tin paste when the temperature returns is to return the tin paste to the room temperature, a digital table can be used for measuring the actual temperature of the tin paste when the temperature is uncertain, and if the temperature of the tin paste is not returned to the room temperature and the tin paste is opened, the tin paste can absorb moisture in the air, so that tin beads are formed during welding.
E. The temperature and humidity of the solder paste printing and mounting area should meet the process requirements, otherwise, the welding quality is affected.
The invention has the beneficial effects that:
according to the invention, by arranging the parameter comparison module, the data collection module and the integration module, when the same conditions as the current PCB are met, the processing data are transmitted into the parameter comparison module, the integration module collects the current data collected by the data processing center and transmits the current data into the parameter comparison module, as the parameter comparison module collects and uniformly compares the network optimal conditions and the actual conditions of the current PCB and transmits the data into the calculation module, the calculation module compares the data in the network with the actual data to obtain a scheme after the difference is obtained, and transmits the scheme data and the PCB processing data obtained by the scheme into the temperature control module and the processor respectively, the display device can obtain the optimal data processed by the current PCB through the data conditions tested by the display device after the PCB is processed for many times, the defect of processing the PCB caused by the experience of a user or network data is avoided, the actual use effect of the display device is ensured, and the welding effect of the reflow oven body on the PCB and the safety in use are provided.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a block diagram of the system of the present invention;
FIG. 3 is a system block diagram of a temperature acquisition module of the present invention;
in the figure: the device comprises a reflow oven body 1, a reflow oven controller 2, a processor 3, a monitoring pipeline 4, a cabin door 5, a slot 6, a data processing center 7, an integration module 8, a data collection module 9, a parameter comparison module 10, a calculation module 11, a temperature control module 12, a temperature curve display module 13, a transmission module 14, a temperature collection module 15, a temperature rise region collection module 151, a constant temperature region collection module 152, a cooling region collection module 153 and a feedback module 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the present invention provides a high efficiency display device for reflow oven temperature, comprising a reflow oven body 1, a reflow oven controller 2 disposed on the upper surface of the reflow oven body 1, a processor 3 disposed on the upper surface of the reflow oven body 1, an output terminal of the processor 3 electrically connected to the input terminals of the reflow oven body 1 and the reflow oven controller 2, respectively, a plurality of monitoring management devices disposed on the front surface of the processor 3, the other terminals of the monitoring pipelines 4 are fixedly connected to the upper surface of the reflow oven body 1, the other terminals of the monitoring pipelines 4 are disposed in the reflow oven body 1, a plurality of cabin doors 5 disposed on the front surface of the reflow oven body 1, a slot 6 is disposed on the left side surface of the reflow oven body 1, an output terminal of the processor 3 is electrically connected to an input terminal of a data processing center 7, an output terminal of the data processing center 7 is electrically connected to input terminals of the integrating module 8 and the data collecting module 9, input terminal of the integrating module 8 and the data collecting module 9 are electrically connected to an input terminal of the parameter comparing module 10, an output terminal of the data collecting module 12, an input terminal of the data collecting module 12 and an input terminal 12, an input terminal 12 of the data collecting module 12 and a temperature comparing module 12, respectively, an output of the feedback module 16 is electrically connected to an input of the processor 3.
The temperature acquisition module 15 includes an elevated temperature region acquisition module 151, a constant temperature region acquisition module 152, and a cooling region acquisition module 153.
The temperature rising area acquisition module 151 is used for acquiring the temperature of a temperature rising area, the temperature rising area aims to heat products in a furnace cavity, but cannot be heated too fast, otherwise, a PCB or a component can be burnt out, a solvent in a welding flux can be quickly lost, the welding quality is reduced, meanwhile, the temperature rising cannot be too slow, and an active agent cannot reach enough temperature, so that the temperature rising slope of the temperature rising area is set differently according to different used tin pastes, generally, the slope of the tin paste is 1-2 ℃/S, the constant temperature area acquisition module 152 is used for acquiring the temperature of a constant temperature area, the constant temperature area has two purposes, firstly, the active agent flows along with rosin by heating and reacts with an oxide on the surface of a welded metal, and the weldability of the surface of the welded metal is ensured during welding, secondly, the temperature of all components on the PCB is guaranteed to be the same before the welding stage, but because the heat absorption capacity of the components on the PCB is greatly different, the components are guaranteed to absorb heat sufficiently, the cooling area acquisition module 153 is used for acquiring the temperature of the cooling area, the purpose of the cooling area is to accelerate the solidification of molten solder to form a welding point with high hardness, high strength and good glossiness, but too high cooling speed causes too high temperature difference between the substrate and the components, thermal expansion mismatching is generated, the substrate is deformed or the welding point and the welding point are split, too low cooling speed causes the welding point to be molten in the solder, cu30Sn8 and Cu3Sn are increased, a welding point with dull and rough is generated, and the cooling slope is generally (3-5) DEG C/S according to the difference of solder pastes and is cooled to be below 100 ℃.
The temperature curve display module 13 is used for detecting the temperatures in the heating area acquisition module 151, the constant temperature area acquisition module 152 and the cooling area acquisition module 153, correspondingly displaying the soldering condition and the temperature of the PCB circuit board in the corresponding temperature in the form of a temperature curve, and the transmission module 14 is used for transmitting the PCB circuit board in the reflow oven body 1 and penetrating the PCB circuit board through different areas to complete the soldering of the PCB circuit board.
The feedback module 16 collects and feeds back the state and temperature of the PCB when the PCB passes through different areas during transmission, and synchronously transmits the state and temperature to the processor 3, and the data processing center 7 collects and stores the data transmitted thereto, and transmits the data in time when the data needs to be compared or integrated.
Data in a network are collected during data collection, when the same conditions as those of a currently processed PCB are met, the processed data are transmitted into a parameter comparison module 10, a current data collected by a data processing center 7 is collected by an integration module 8 and transmitted into the parameter comparison module 10, the optimal conditions of the network and the actual conditions of the current PCB are collected and uniformly compared by the parameter comparison module 10 and then transmitted into an operation module 11, the operation module 11 compares the data in the network and the actual data, a compromise selection scheme is obtained after difference is obtained, and the scheme data and the PCB processing data obtained by the scheme are respectively transmitted into a temperature control module 12 and a processor 3.
According to the above scheme, the following problems need to be noted:
A. the conveying speed of the guide rail and the temperature of each temperature zone cannot be changed at will, and the temperature of the temperature zones is matched with the speed of the conveying belt.
B. The time interval for the circuit board to enter the temperature area cannot be too short, and generally, the interval between the two circuit boards is more than 500 mm.
C. The stirring time of the solder paste cannot be too long, otherwise, the dense tube legs are easy to be short-circuited when the solder paste is brushed.
D. The purpose of the tin paste when the temperature returns is to return the tin paste to the room temperature, a digital table can be used for measuring the actual temperature of the tin paste when the temperature is uncertain, and if the temperature of the tin paste is not returned to the room temperature and the tin paste is opened, the tin paste can absorb moisture in the air, so that tin beads are formed during welding.
E. The temperature and humidity of the solder paste printing and mounting area should meet the process requirements, otherwise, the welding quality is affected.
Through setting up parameter contrast module 10, data collection module 9 and integration module 8, make this display device can obtain the best data of current PCB circuit board processing through the data condition that self experimented out after processing PCB circuit board many times, avoid having a defect in the processing that leads to PCB circuit board through user's experience or network data, when having ensured this display device in-service use effect, the security when providing reflow oven body 1 to the welding effect of PCB circuit board and using.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (6)
1. The utility model provides a high-efficient display device of reflow oven temperature, includes reflow oven body (1), its characterized in that: the upper surface of the reflow oven body (1) is provided with a reflow oven controller (2), the upper surface of the reflow oven body (1) is provided with a processor (3), the output end of the processor (3) is respectively and electrically connected with the input ends of the reflow oven body (1) and the reflow oven controller (2) through a lead, the front surface of the processor (3) is provided with a plurality of monitoring management, the other ends of a plurality of monitoring pipelines (4) are all fixedly connected with the upper surface of the reflow oven body (1), the other ends of the monitoring pipelines (4) are positioned in the reflow oven body (1), the front surface of the reflow oven body (1) is provided with a plurality of cabin doors (5), the left side surface of the reflow oven body (1) is provided with a slot (6), the output end of the processor (3) is electrically connected with the input end of a data processing center (7), the output end of the data processing center (7) is respectively and electrically connected with the input ends of an integration module (8) and a data collection module (9), the input end of the integration module (8) and the data collection module (9) are respectively and the input end of a parameter comparison module (10), and the input end of the data collection module (9) are electrically connected with the input end of a parameter comparison module (10), and a data collection module (11), the input of calculation module (11) is connected with the input electricity of parameter contrast module (10) and temperature control module (12) respectively, the input of temperature control module (12) is connected with the output electricity of treater (3), the output of temperature control module (12) is connected with the input electricity of temperature curve display module (13), the input of temperature curve display module (13) is connected with the input electricity of transfer module (14) and temperature acquisition module (15) respectively, the output of temperature acquisition module (15) and transfer module (14) all is connected with the input electricity of feedback module (16), the output of feedback module (16) is connected with the input electricity of treater (3).
2. The efficient display device for the reflow furnace temperature of claim 1, wherein: the temperature acquisition module (15) comprises an elevated temperature area acquisition module (151), a constant temperature area acquisition module (152) and a cooling area acquisition module (153).
3. The efficient display device for the reflow furnace temperature of claim 2, wherein: the temperature-raising area acquisition module (151) is used for acquiring the temperature of a temperature-raising area, the temperature-raising area is used for heating products in the furnace cavity, the constant-temperature area acquisition module (152) is used for acquiring the temperature of a constant-temperature area, and the constant-temperature area has two purposes;
the purpose is as follows: the activator flows along with the rosin by heating and reacts with the oxide on the surface of the welded metal to ensure the weldability of the surface of the welded metal during welding;
purpose two: ensuring that all components on the PCB reach the same temperature before the welding stage;
the cooling zone acquisition module (153) is used for acquiring the temperature of the cooling zone, and the purpose of the cooling zone is to accelerate the solidification of the molten solder.
4. The efficient display device for the reflow furnace temperature of claim 2, wherein: the temperature curve display module (13) is used for detecting the temperatures in the heating area acquisition module (151), the constant temperature area acquisition module (152) and the cooling area acquisition module (153), correspondingly displaying the welding condition and the temperature of the PCB in the corresponding temperature in a temperature curve mode, and the transmission module (14) is used for transmitting the PCB in the reflow oven body (1) and penetrating the PCB through different areas to complete the welding of the PCB.
5. The efficient display device for the reflow furnace temperature of claim 1, wherein: the feedback module (16) collects and feeds back the state and temperature of the PCB when the PCB passes through different areas in the transmission process, and synchronously transmits the state and temperature to the processor (3), and the data processing center (7) collects and stores the data transmitted to the feedback module and transmits the data in time when the data needs to be compared or integrated.
6. The efficient display device for the temperature of the reflow furnace of claim 1, wherein: the data in the network are collected during data collection, when the data are identical to the PCB processed currently, the processed data are transmitted into the parameter comparison module (10), the integration module (8) collects the current data collected by the data processing center (7) and transmits the current data into the parameter comparison module (10), the parameter comparison module (10) collects the optimal condition of the network and the actual condition of the current PCB and transmits the data to the calculation module (11) after unified comparison, the calculation module (11) compares the data and the actual data in the network, a compromise selection scheme is obtained after the difference is obtained, and the scheme data and the PCB processed data obtained by the scheme are transmitted into the temperature control module (12) and the processor (3) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210797842.9A CN115178825B (en) | 2022-07-06 | 2022-07-06 | High-efficient display device of backward flow stove temperature |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210797842.9A CN115178825B (en) | 2022-07-06 | 2022-07-06 | High-efficient display device of backward flow stove temperature |
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| CN115178825B CN115178825B (en) | 2023-09-26 |
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| JPS55139171A (en) * | 1979-09-21 | 1980-10-30 | Sekisui Chem Co Ltd | Manufacturing apparatus of solar heat collecting plate |
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