CN112872527A - Welding method and system based on central temperature prediction curve of reflow soldering area - Google Patents
Welding method and system based on central temperature prediction curve of reflow soldering area Download PDFInfo
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- CN112872527A CN112872527A CN202110038387.XA CN202110038387A CN112872527A CN 112872527 A CN112872527 A CN 112872527A CN 202110038387 A CN202110038387 A CN 202110038387A CN 112872527 A CN112872527 A CN 112872527A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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Abstract
The application discloses a welding method and a system based on a central temperature prediction curve of a reflow soldering area, comprising the following steps of: acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into a plurality of large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function; acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace; predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
Description
Technical Field
The application relates to the technical field of reflow soldering of an electronic manufacturing soldering process, in particular to a soldering method and a system based on a central temperature prediction curve of a reflow soldering area.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
In the production of electronic products such as integrated circuit boards, a printed circuit board mounted with various electronic components is required to be placed in a reflow furnace, the electronic components are automatically soldered on the circuit board by heating, and reflow soldering reflow, also called reflow process, is a process in which after the melting point of solder paste is reached, liquid tin reflows to component pins to form solder joints under the action of liquid surface tension and soldering flux of the solder paste, so that the circuit board pads and the components are soldered into a whole. As a key process in the production of the integrated circuit board, the setting of a reasonable temperature curve is the key for ensuring the reflow soldering quality, otherwise, the improper temperature curve can cause the PCB to have the defects of incomplete soldering, insufficient soldering, component tilting, excessive soldering tin balls and the like, and the product quality is seriously influenced.
At present, most of the work in the aspect of temperature curve setting is controlled and adjusted through experimental tests, in the existing reflow process, a sensing device is generally used for obtaining a temperature curve to set process parameters, namely, an operator determines the total energy application amount and the energy application position through visual observation and subjective experience based on a visual data set of time and temperature of each sensor in the heating process. Because the quality of the electronic element product subjected to reflow soldering is directly influenced by the subjective experience of an operator, the optimal temperature meeting the process requirements is sought only through an experimental method, the efficiency is low, and the external conditions such as parameter setting, operator training and the like need to be continuously changed for support, so that the manpower and financial resources are greatly wasted.
Disclosure of Invention
In order to overcome the defects of the prior art, the application provides a welding method and a welding system based on a central temperature prediction curve of a reflow welding area;
in a first aspect, the present application provides a method of soldering based on a predicted temperature curve of a center of a reflow soldering region;
the welding method based on the central temperature prediction curve of the reflow soldering area comprises the following steps:
acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
In a second aspect, the present application provides a solder system based on a predicted temperature profile of a center of a reflow solder region;
welding system based on central temperature prediction curve of reflow soldering region includes:
an acquisition module configured to: acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
a prediction curve calculation module configured to: acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
a welding module configured to: predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
In a third aspect, the present application further provides an electronic device, including: one or more processors, one or more memories, and one or more computer programs; wherein a processor is connected to the memory, the one or more computer programs are stored in the memory, and when the electronic device is running, the processor executes the one or more computer programs stored in the memory, so as to make the electronic device execute the method according to the first aspect.
In a fourth aspect, the present application also provides a computer-readable storage medium for storing computer instructions which, when executed by a processor, perform the method of the first aspect.
In a fifth aspect, the present application also provides a computer program (product) comprising a computer program for implementing the method of any of the preceding first aspects when run on one or more processors.
Compared with the prior art, the beneficial effects of this application are:
effectively optimizes the welding process of the reflow oven and improves the welding efficiency and the product quality to a certain extent.
Advantages of additional aspects of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a schematic cross-sectional view of a reflow oven of the present application;
FIG. 2 is a sigmoid activation function image of the present application;
FIG. 3 is a transition curve of the furnace environment temperature interval with constant temperature zones at two ends and no heating source in the middle;
FIG. 4 is a graph showing the temperature curves in the zones of the reflow oven of the present application and the temperature curve of the center of the welding area measured in a certain experiment;
FIG. 5 is a flow chart of the optimal welding coefficient Q solution of the present application;
FIG. 6 is a comparison graph of the central temperature curve of the welding area and the prediction of different values of the welding coefficient Q in a certain experiment of the present application;
FIG. 7 is a graph of predicted weld zone center temperature under other given conditions plotted using the resulting optimal weld coefficient Q-0.021 of the present application;
FIG. 8 is a flowchart of the conveyor speed interval and maximum speed solution of the present application;
FIG. 9 is a schematic view of a furnace temperature profile of the present application;
FIG. 10 is a flowchart of the present application for minimum solution of the area covered by temperatures above 217 deg.C to the peak temperature;
FIG. 11 is a minimum area solution flow diagram of the present application;
FIG. 12 is a temperature map of the portion of the present application where the optimal solution temperature exceeds 217 deg.C;
FIG. 13 is a temperature flip chart of any set of portions of the present application with temperatures exceeding 217 deg.C.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and it should be understood that the terms "comprises" and "comprising", and any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Mainly solves three problems: firstly, according to a heat conduction rule, how to obtain a first order ordinary differential equation of a temperature curve function of a welding central area on the displacement of a temperature distribution function in a furnace; secondly, how to set the related parameters of the temperature distribution function in the furnace and the temperature of each small temperature zone; finally, how to obtain a smooth interval temperature transition curve between the small temperature zones.
Example one
The embodiment provides a welding method based on a central temperature prediction curve of a reflow soldering area;
the welding method based on the central temperature prediction curve of the reflow soldering area comprises the following steps:
s100: acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
s200: acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
s300: predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
The small temperature zone refers to a certain continuous heating zone with heating function, the gap refers to a certain continuous zone without heating source, and the large temperature zone refers to a certain continuous zone formed by combining the small temperature zone and the gap. The reflow furnace can be functionally divided into 4 large temperature zones: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone (as shown in figure 1), wherein a plurality of small temperature zones are arranged in each large temperature zone. Specific dimensions of 11 small temperature zones in a reflow furnace and areas in front of and behind the reflow furnace are shown in table 1, the length of each small temperature zone is 30.5cm, and a gap of 5cm is formed between adjacent small temperature zones. The parameter adjusting ranges of each temperature zone of the reflow oven are shown in table 2.
TABLE 1 specific dimensions of 11 small temperature zones and zones in front and rear of a reflow furnace
TABLE 2 Adjustable range of parameters for a reflow oven
As one or more embodiments, the method further comprises:
s400: predicting a minimum parameter interval of a reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; and welding the electronic element on the circuit board in the reflow oven according to the minimum parameter interval of the reflow area when the solder paste is melted.
As one or more embodiments, the method further comprises:
s500: predicting a most symmetrical parameter interval around the reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the most symmetrical parameter interval of the left and right reflow areas when the solder paste is melted.
As one or more embodiments, the S200: acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of temperature areas of the reflow soldering furnace; the method specifically comprises the following steps:
s201: comparing the heat conduction law with a specific heat capacity formula to obtain a first-order ordinary differential equation of the ambient temperature T (x) in the welding furnace of the small temperature zone and the temperature f (x) in the welding center area;
s202: utilizing the Sigmoid function to perform gap transition between the small temperature areas to obtain a smooth interval temperature transition curve function;
s203: for the small temperature zone and the small temperature zone gap with the temperature difference larger than the set threshold, linear combination is carried out by utilizing an exponential function and a linear function, the actual concave function is approached, and a temperature distribution function is obtained:
s204: obtaining furnace environment temperature distribution T (x) according to the first-order ordinary differential equation, the smooth interval temperature transition curve, the temperature distribution function, the actual reflow soldering size of the reflow furnace and the number of temperature zones;
the furnace internal environment temperature distribution T (x) refers to a furnace internal environment temperature distribution function of a furnace front area, a furnace rear area and all small temperature areas of the reflow furnace;
s205: and obtaining the optimal welding coefficient Q based on the furnace environment temperature distribution T (x) and the welding center area temperature f (x).
Further, the step S201: comparing the heat conduction law with a specific heat capacity formula to obtain a first-order ordinary differential equation of the ambient temperature T (x) in the welding furnace of the small temperature zone and the temperature f (x) in the welding center area; the first order ordinary differential equation specifically means:
wherein Q represents a welding coefficient, v represents a speed of the conveyor belt, x represents a displacement calculated from a stokehole area,
represents the first derivative of the ambient temperature T (x) in the welding furnace of the small temperature area.
Further, the step S202: utilizing the Sigmoid function to transit the gap between the small temperature zone and the small temperature zone to obtain a smooth interval temperature transition curve; the smooth interval temperature transition curve specifically refers to:
x represents the displacement calculated from the stokehole area, TFront temp. zoneRepresenting the temperature, T, set in the preceding large temperature zoneRear temperature zoneRepresenting the temperature, x, set in the latter large temperature zoneFront 1Represents the displacement at the beginning of the gap 1, xRear 1Representing the displacement at the end of the gap 1.
Further, the step S203: for the small temperature zone and the small temperature zone gap with the temperature difference larger than the set threshold, linear combination is carried out by utilizing an exponential function and a linear function, and an actual concave function is approached to obtain a temperature distribution function;
x represents the displacement calculated from the stokehole area, TFront temp. zoneRepresenting the temperature, T, set in the preceding large temperature zoneRear temperature zoneRepresenting the temperature, x, set in the latter large temperature zoneFront sideRepresents the displacement, x, of the beginning of the small temperature zone 8Rear endThe displacement representing the end of the small temperature zone 11, TT4 representing the temperature value set by the small temperature zone 8-9, and TT5 representing the temperature value set by the small temperature zone 10-11.
Further, the specific step S203 includes:
s2031: as can be understood from the first order ordinary differential equation reasoning in S201, the smaller the temperature difference between the ambient temperature t (x) in the welding furnace and the temperature f (x) in the welding center region, the smaller the first derivative of the ambient temperature t (x) in the welding furnace, so that under the conditions that TT4 is 255 ℃, TT5 is 25 ℃ and the ambient temperature is 25 ℃, the concave function has a falling slope, so that in this interval, the temperature difference is smaller and smaller, the first derivative of t (x) is smaller and smaller, and at this time, the ambient temperature t (x) in the welding furnace is inevitably a concave function.
S2032: the coordinate [ x ] is known by using a rectangular coordinate system of the displacement and the ambient temperature T (x) in the welding furnaceFront side，TT4]，[xRear end，TT5]Substituted into a linear function
Will coordinate [ x ]Front side，TT4]，[xRear end，TT5]Substituting the exponential function to obtain
Therefore, the ambient temperature T (x) in the welding furnace is T1(x) And T2(x) Linear combination of
T(x)＝p·T1(x)+(1-p)·T2(x)
S2033: by traversing the value of p, it can be determined that the variance is minimal when p is 0.8, and the function is most appropriate, resulting in a temperature distribution function:
x represents the displacement calculated from the stokehole area, TFront temp. zoneRepresenting the temperature, T, set in the preceding large temperature zoneRear temperature zoneRepresenting the temperature, x, set in the latter large temperature zoneFront sideRepresents the displacement, x, of the beginning of the small temperature zone 8Rear endThe displacement representing the end of the small temperature zone 11, TT4 representing the temperature value set by the small temperature zone 8-9, and TT5 representing the temperature value set by the small temperature zone 10-11.
Further, the S205: obtaining an optimal welding coefficient Q based on the furnace environment temperature distribution T' (x) and the welding central area temperature f (x); the method comprises the following specific steps:
s2051: measuring the central temperature curve f of the welding area by using a sensor1(x)；
S2052: using the temperature curve f in the center of the welding zone1(x) Setting temperature parameters of each small temperature area and the furnace passing speed of a conveyor belt;
s2053: f predicted from previous interval1(x) The last temperature value is assigned to the initial temperature value predicted in the next interval, and the numerical value of the ordinary differential equation provided by matlab is used for solvingThe ode45 function solves the solution ordinary differential equation of each position;
s2054: and (3) through traversing the welding coefficient G, selecting a group of temperature curves which are most similar to the measured welding area central temperature curve f (x) by using the variance, determining and evaluating the optimal welding coefficient Q and drawing a prediction curve.
Further, the step S204: obtaining furnace environment temperature distribution T (x) according to the actual reflow soldering size and temperature zone number of the reflow furnace, a first-order ordinary differential equation, the smooth interval temperature transition curve and the temperature distribution function; the method specifically comprises the following steps:
it will be appreciated that after setting the temperature of each temperature zone and the furnace speed of the conveyor belt, the temperature at the center of the weld zone at certain locations can be measured by temperature sensors, referred to as the furnace temperature profile (i.e., the weld zone center temperature profile).
As one or more embodiments, the S300: predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; according to the speed interval under the set temperature parameter, welding the electronic element on the circuit board in the reflow oven; the method specifically comprises the following steps:
s301: setting temperature parameters of each small temperature zone, the fastest temperature rise and fall speed, time between temperatures, the maximum temperature value and a conveyor belt speed interval;
s302: enumerating speed, storing discretized samples of the central temperature prediction curve of the welding area into an array, judging whether the process limit is met, traversing speed, recording the speed interval meeting the conditions and outputting.
As one or more embodiments, the S400: predicting a minimum parameter interval of a reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; according to the minimum parameter interval of the reflow area when the solder paste is melted, welding the electronic element on the circuit board in the reflow furnace; the method specifically comprises the following steps:
s401: setting temperature prediction intervals of all small temperature zones, the fastest temperature rise and fall speed, time between temperatures, the maximum temperature value and a conveyor belt speed prediction interval;
s402: enumerating speed, and storing discretization sampling of the central temperature prediction curve of the welding area into an array;
s403: judging whether the process limit is met, calculating the shadow area of the part exceeding 217 ℃, searching the temperature of each small temperature zone and the speed of the conveyor belt which enable the shadow area to be minimum, and outputting the temperature and the speed.
As one or more embodiments, the S500: predicting a most symmetrical parameter interval around the reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; according to the most symmetrical parameter interval of the left and right reflow areas when the solder paste is melted, welding the electronic element on the circuit board in the reflow furnace; the method specifically comprises the following steps:
s501: setting temperature intervals of all small temperature areas, the fastest temperature rise and fall speed, sampling time intervals between two adjacent actual measurements, the maximum temperature value and the speed interval of a conveyor belt;
s502: discretizing and sampling a welding center temperature prediction curve;
sampling according to a sampling time interval t of 0.5s by using discretization sampling to obtain a discretization array of a welding center temperature curve;
by traversing the head and tail of the array, find t at the critical point time of f (x) ═ 217 DEG C1And t2；
Calculating a critical point t1And t2To a central point
Variance of each pair of furnace temperature values in bilaterally symmetrical intervals
Selecting an optimal solution which not only meets the process conditions, but also has the minimum variance and a smaller area;
s503: and selecting two groups of prediction results for visual analysis.
The interior of the reflow furnace is provided with a plurality of small temperature areas, and the reflow furnace can be divided into 4 large temperature areas functionally: preheating zone, constant temperature zone, reflux zone, cooling zone (as shown in figure 1). The two sides of the circuit board are lapped on a conveyor belt and enter the furnace at a constant speed for heating and welding.
There are 11 small temperature zones in a reflow furnace, a furnace front zone and a furnace rear zone (as shown in figure 1), each small temperature zone is 30.5cm in length, a gap of 5cm is arranged between adjacent small temperature zones, and the furnace front zone and the furnace rear zone are both 25cm in length.
After the reflow furnace is started, the temperature of the air in the furnace can be stabilized in a short time, and then the reflow furnace can be used for welding. The gaps among the furnace front area, the furnace rear area and the small temperature areas are not specially controlled in temperature, the temperature of the gaps is related to the temperature of the adjacent temperature areas, and the temperature near the boundary of each temperature area can be influenced by the temperature of the adjacent temperature areas. In addition, the temperature of the production plant was maintained at 25 ℃.
After the temperature of each temperature zone and the furnace passing speed of the conveyor belt are set, the temperature of the center of the welding area at certain positions can be tested through a temperature sensor, and the temperature is called a furnace temperature curve (namely a temperature curve of the center of the welding area). For example: according to the data of the furnace temperature curve in a certain experiment, the set temperature of each temperature zone is respectively 175 ℃ (the small temperature zone is 1-5), 195 ℃ (the small temperature zone is 6), 235 ℃ (the small temperature zone is 7), 255 ℃ (the small temperature zone is 8-9) and 25 ℃ (the small temperature zone is 10-11); the passing speed of the conveyor belt is 70 cm/min.
In actual production, the product quality can be controlled by adjusting the set temperature of each temperature zone and the furnace passing speed of the conveyor belt. On the basis of the experimental set temperature, the set temperature of each small temperature zone can be adjusted within the range of +/-10 ℃. During adjustment, the temperature in the small temperature zone 1-5 is required to be kept consistent, the temperature in the small temperature zone 8-9 is required to be kept consistent, and the temperature in the small temperature zone 10-11 is required to be kept at 25 ℃. The furnace passing speed of the conveyor belt is adjusted within the range of 65-100 cm/min.
In reflow oven circuit board soldering production, the oven temperature profile should meet certain requirements, i.e. process margins (see table 3).
TABLE 3 Process limits
S201: and obtaining a first-order ordinary differential equation of the ambient temperature in the welding furnace of the small temperature area and the temperature of the welding central area according to the comparison of the heat conduction rule and the specific heat capacity formula.
The center of the welding area is regarded as mass point, the influence of the welding coefficient by the temperature is ignored, the set temperature of each heating area is the temperature in the corresponding area furnace, and the heat convection is not considered in the welding process.
The heat conduction law describes the relationship between temperature difference and heat flow density:
the specific heat capacity equation represents the amount of heat absorbed or released per unit mass of an object changing per unit temperature:
according to (1) and (2), a
C·dT＝q·dt (3)
Namely, it is
q＝-k[T(x)-f(x)] (4)
Wherein T (x) is a furnace environment temperature distribution function, f (x) is a function of the central temperature of the welding area measured in the experiment, and a first order ordinary differential equation of the temperature of the welding area can be obtained by the following steps:
is provided with
Obtaining temperature set values of each temperature zone and welding for the welding coefficient QFirst order ordinary differential equation of points:
s202: and (4) utilizing the gap transition of the Sigmoid function between the small temperature zones to obtain a smooth interval temperature transition curve. There is a 5cm gap temperature distribution between adjacent small temperature zones that conforms to the sigmoid function, which is an activation function as shown in fig. 2.
The Sigmoid function is defined by the following equation:
the gap temperature between the two intervals can be transited by using a sigmoid activation function shown in fig. 3, the two ends are constant temperature areas, and the middle is a transition curve of the furnace environment temperature interval without a heating source, as shown in fig. 3.
At this time, the Sigmoid function is subjected to translational transformation and telescopic transformation to obtain an analytic expression
S203: for the special gap with the excessive temperature difference between the small temperature zone and the small temperature zone, it can be inferred by using the first order ordinary differential equation stated in S201 that the smaller the temperature difference between the ambient temperature t (x) in the welding furnace and the temperature f (x) in the welding center region, the smaller the first derivative of the ambient temperature t (x) in the welding furnace, so that under the conditions of TT4 being 255 ℃, TT5 being 25 ℃ and the ambient temperature being 25 ℃, the concave function has a slope of a drop, so that in this interval, the first derivative of t (x) is smaller and smaller as the temperature difference is smaller, and at this time, the ambient temperature t (x) in the welding furnace is inevitably a concave function.
The coordinate [ x ] is known by using a rectangular coordinate system of the displacement and the ambient temperature T (x) in the welding furnaceFront side，TT4]，[xRear end，TT5]Substituting into the linear function can obtain:
will coordinate [ x ]Front side，TT4]，[xRear end，TT5]Substituting the exponential function yields:
therefore, the ambient temperature T (x) in the welding furnace is T1(x) And T2(x) Linear combination of (a):
T(x)＝p·T1(x)+(1-p)·T2(x)
by traversing the values of P, it can be determined that the function is most appropriate when P is 0.8, as shown by the variance of the furnace temperature curve predicted in table 4 and the fitted furnace temperature curve at different P.
TABLE 4 variance of predicted furnace temperature curve and fitted furnace temperature curve at different P
The temperature distribution function is thus obtained:
because the temperature of the small temperature zone 9 to the small temperature zone 10 is changed from 255 ℃ to 25 ℃ within 5cm, and the gap between the small temperature zone and the cooling zone is only 5cm, considering that the temperature does not drop steeply in a small interval, the heat of the internal environment temperature of the small temperature zone 9 to the small temperature zone 10 needs to be considered to be transferred in a gradual diffusion mode, and simultaneously considering that the internal environment temperature of the furnace is changed linearly in the interval.
S204: to summarize S201, S202, and S203, the furnace internal ambient temperature distribution t (x) is obtained.
From the above analysis, the furnace ambient temperature distribution function can be obtained:
s205: obtaining a welding coefficient Q which best meets the actual condition by utilizing the furnace environment temperature distribution T (x) and a central temperature curve f (x) of a welding area measured in an experiment:
s2051: measuring the central temperature curve f of the welding area by using a sensor or other tools1(x) In that respect Furnace environment temperature distribution T (x) and a welding area central temperature curve f (x) in a certain experiment, as shown in figure 4, the temperature set by each temperature zone is respectively 175 ℃ (the small temperature zones 1-5), 195 ℃ (the small temperature zone 6), 235 ℃ (the small temperature zone 7), 255 ℃ (the small temperature zones 8-9) and 25 ℃ (the small temperature zones 10-11); the passing speed of the conveyor belt is 70 cm/min. The furnace temperature curve of each temperature zone of the reflow furnace and the central temperature curve of the welding area measured in a certain experiment are shown in FIG. 4.
S2052: measuring the temperature curve f of the welding center area measured by a sensor in the experiment1(x) And substituting the temperature parameter of each small temperature area and the speed of the conveyor belt passing through the furnace into a formula (6) together with the temperature distribution T (x) of the environment in the furnace, assigning the last temperature value of f (x) predicted in the previous interval to the initial temperature value predicted in the next interval, and solving the ordinary differential equation at each position by using the numerical value of the ordinary differential equation provided by matlab to solve the ode45 function or other methods for solving the differential equation. The minimum weld coefficient Q solves the flow chart as shown in fig. 5.
S2054: through traversing the welding coefficient Q, a group of temperature curves which are most similar to the central temperature curve f (x) of the welding area measured in the experiment are selected by using methods such as variance and the like, the optimal welding coefficient Q is determined and evaluated, and a prediction curve is drawn.
When the furnace temperature curves with different Q values are fitted by f (x), the variance between the curve and the corresponding value of the predicted furnace temperature curve is calculated, and the variance when the Q value is-0.021 is the minimum, namely the best fitting is obtained, the fitting comparison condition between the curves with three Q values and the furnace temperature curve which is obtained in advance is taken in fig. 4, and the table 5 shows the variance between the curves which are calculated under the condition that part of the extracted furnace temperature curves with different Q values and the furnace temperature curve which is obtained in advance.
TABLE 5 variance of furnace temperature curve and fitted furnace temperature curve under different Q
FIG. 6 is a graph comparing the temperature profile at the center of the weld zone with different weld coefficients Qpredicted for random experiments. After the optimal welding coefficient Q value is determined, the temperature change condition of the welding area center under any condition can be determined.
S301: setting conditions in practical application scenes such as temperature parameters of small temperature zones, the fastest temperature rise and fall speed, time between temperature, the maximum temperature value, a conveyor belt speed interval and the like in the system;
the temperature change condition of the center of the welding area can be obtained by changing the set values of the temperature of each temperature zone to 173 ℃ (the small temperature zones 1-5), 198 ℃ (the small temperature zones 6), 230 ℃ (the small temperature zones 7) and 257 ℃ (the small temperature zones 8-9) on the assumption that the furnace passing speed of the conveyor belt is 78 cm/min. The predicted weld center temperature curve under other given conditions plotted when the obtained optimal weld coefficient Q is-0.021 is used, as shown in fig. 7.
Under the condition of temperature setting of each temperature zone, traversing every 0.1cm/min from small to large by using the established welding center temperature curve model, finding out the maximum conveying belt furnace passing speed which meets the process limit of the table 1 under the conditions that the temperature of all temperature zones is determined and the welding center temperature curve is unique, and accelerating the industrial production speed.
For the boundary conditions (1) and (2), the temperature rise and fall speed is required to be not more than 3 ℃/s, and whether the temperature rise and fall speed meets the requirements or not is judged
If not, immediately abandoning the speed; if so, saving the speed; finally, a maximum speed value meeting all the conditions is obtained;
for the boundary condition (3), t is found for 150 ℃ and 190 ℃1And t2Determine whether or not to satisfy
60≤t2-t1≤120 (11)
If not, immediately discarding the t1And t2(ii) a If so, saving the t1And t2；
For the boundary condition (4), find two t's corresponding to 217 deg.C1And t2Determine whether or not to satisfy
40≤|t2-t1|≤90 (12)
If not, then the t is discarded1And t2(ii) a If so, saving the t1And t2；
For the boundary condition (5), find the maximum value T of f (x)maxDetermine whether or not to satisfy
240≤Tmax≤250 (13)
If not, then the T is discardedmax(ii) a If so, saving the Tmax。
Step (2-2): enumerating speed, storing discretized samples of the central temperature curve T (x) of the welding area into an array, judging whether the process limit is met, recording a speed interval and outputting. The flowchart for solving the conveyor speed interval and the maximum speed is shown in fig. 8.
The temperature setting values of the temperature zones are respectively 182 ℃ (the small temperature zones 1-5), 203 ℃ (the small temperature zone 6), 237 ℃ (the small temperature zone 7) and 254 ℃ (the small temperature zones 8-9). The speed range of the conveyer belt which meets the setting of 65 cm/min-75.4 cm/min and the maximum speed v of the conveyer belt can be obtained according to the flowmax＝75.4cm/min。
In the welding process, the time for the temperature of the center of the welding area to exceed 217 ℃ is not suitable to be too long, and the peak temperature is not suitable to be too high. The tin paste is prepared by mixing metal tin powder, soldering flux and other chemical substances, wherein the tin can be independently present in the form of small tin beads, after the tin paste passes through a reflow oven, the tin paste passes through a reflow oven and is subjected to different temperatures of several temperature zones, the small tin beads are melted at a temperature higher than 217 ℃, and countless small particles are melted into a whole through catalysis of the soldering flux and other substances, namely the small particles are returned to a flowing liquid state again, so that the process is what is commonly called reflow, and the reflow process means a process that the tin powder is returned to the liquid state from the previous solid state and then returned to the solid state from a cooling zone. The ideal weld center temperature profile should minimize the area covered (shaded in fig. 9) beyond 217 c to the peak temperature.
S401: the system is provided with conditions in practical application scenes such as temperature prediction intervals of all small temperature zones, the fastest temperature rise and fall speed, time between temperature, the maximum temperature value, a conveyor belt speed prediction interval and the like.
S402: the parameters when enumerated are as follows:
(a) the furnace environment temperature TT1 of the small temperature zone 1-5 takes 165 ℃ as a starting point, the step length is 5 ℃, and the temperature is 185 ℃ as an end point;
(b) the furnace environment temperature TT2 of the small temperature zone 6 takes 185 ℃ as a starting point, the step length is 5 ℃ and the temperature is 205 ℃ as an end point;
(c) the furnace environment temperature TT3 of the small temperature zone 7 takes 225 ℃ as a starting point, the step length is 5 ℃ and the temperature is 245 ℃ as an end point;
(d) the furnace environment temperature TT4 of the small temperature zone 8-9 takes 245 ℃ as a starting point, 5 ℃ of step length and 265 ℃ as an end point;
(e) the conveyor speed v starts at 60cm/min and ends at a step length of 1cm/min and 100 cm/min.
S403: enumerating speed, and storing discretized samples of the welding area center temperature curve T (x) into an array. Traversing the speed v and the set values TT1, TT2, TT3 and TT4 of the temperatures of the small temperature areas 1-5, 6, 7 and 8-9, enumerating the five conditions, calculating the corresponding welding area central temperature curve f (x), selecting the welding central temperature curve meeting the limit, and calculating the shadow area of the part with the temperature higher than 217 DEG C
After sampling and dispersing
Judging whether the process limit is met, calculating the shadow area of the part exceeding 217 ℃, searching the temperature of each small temperature zone and the speed of the conveyor belt which enable the shadow area to be minimum, and outputting the temperature and the speed. The flow chart for the minimum solution of the area covered by the temperature above 217 c to the peak temperature is shown in fig. 10. Finally, the temperature zone and the speed parameter corresponding to the welding center temperature curve which meets the process limit and minimizes the shadow area are obtained. The temperature zones and velocity parameters corresponding to smaller shadow areas are shown in table 6.
TABLE 6 Small temperature zone and speed parameter corresponding to smaller shadow area
The optimal interval is that when TT1 is 185 ℃, TT2 is 200 ℃, TT3 is 240 ℃, TT4 is 265 ℃ and the speed is about 96cm/min, the minimum area is 825.72cm2. In addition to meeting the process limits of table 1, it is also desirable that the weld center temperature profile be as symmetric as possible on both sides of the center line at peak temperature over 217 c (see fig. 9).
S501: the system is provided with conditions in actual life, such as temperature intervals of small temperature zones, the fastest temperature rise and fall speed, time between temperatures, the maximum temperature value, a conveyor belt speed interval and the like.
The welding center temperature curves of more than 217 ℃ on both sides of the central line with the peak temperature are ensured to be symmetrical as much as possible. Five conditions of v, TT1, TT2, TT3 and TT4 need to be traversed simultaneously, and parameters in enumeration are defined as S402.
S502: the method comprises the steps of sampling a welding center temperature curve in a discretization mode, obtaining a discretization array of the welding center temperature curve by sampling according to a time interval t of 0.5s through the discretization sampling method, and searching for f (x) through traversing the head and the tail of the array) T at 217 deg.C critical point1And t2Calculating a critical point t1And t2To a central point
Variance of each pair of furnace temperature values in bilaterally symmetrical intervals
The optimal solution which not only meets the process conditions, but also has the minimum variance and smaller area is selected. A flow chart of a system for predicting the most symmetrical parameter interval of the left and right reflow areas when the solder paste is melted is shown in fig. 11. The small temperature zone and the speed parameter corresponding to the minimum variance and the small variance with the smaller shadow area are finally obtained by prediction according to the flow chart, and are shown in table 7. The optimal parameters are as follows: TT1 was 170 ℃, TT2 was 195 ℃, TT3 was 225 ℃, TT4 was 265 ℃, speed was 85cm/min, minimum variance was 2040.87.
TABLE 7 Small temperature zone and speed parameter for smaller variance
S502: and selecting two groups of prediction results for visual analysis.
In order to verify the reliability of the result of theoretical calculation, the optimal and any two groups of predicted welding area central temperature curves are selected for the final result to be subjected to visual analysis, the area with the temperature higher than 217 ℃ is selected, the median time is taken as a symmetry axis, the right side is turned to the left, the light color part in figure 12 is a non-overlapping area of the area, and the variance used for evaluating the size of the non-overlapping area is obtained after difference square
It can be seen from fig. 12 and 13 that the area of the non-overlapping area of the optimal solution is obviously smaller than the area of the non-overlapping area corresponding to any group of welding area central temperature curves, and the rationality of the variance on the evaluation of the symmetric interval is verified.
The optimum solution temperature exceeds the temperature inversion diagram of the 217 ℃ portion as shown in fig. 12.
Any one set of temperature inversion plots for the 217 ℃ portion is shown in fig. 13.
Example two
The embodiment provides a welding system based on a central temperature prediction curve of a reflow soldering area;
welding system based on central temperature prediction curve of reflow soldering region includes:
an acquisition module configured to: acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
a prediction curve calculation module configured to: acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
a welding module configured to: predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
It should be noted here that the above-mentioned obtaining module, the prediction curve calculating module and the welding module correspond to steps S100 to S300 in the first embodiment, and the above-mentioned modules are the same as the examples and application scenarios realized by the corresponding steps, but are not limited to the disclosure of the first embodiment. It should be noted that the modules described above as part of a system may be implemented in a computer system such as a set of computer-executable instructions.
In the foregoing embodiments, the descriptions of the embodiments have different emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The proposed system can be implemented in other ways. For example, the above-described system embodiments are merely illustrative, and for example, the division of the above-described modules is merely a logical division, and in actual implementation, there may be other divisions, for example, multiple modules may be combined or integrated into another system, or some features may be omitted, or not executed.
EXAMPLE III
The present embodiment also provides an electronic device, including: one or more processors, one or more memories, and one or more computer programs; wherein, a processor is connected with the memory, the one or more computer programs are stored in the memory, and when the electronic device runs, the processor executes the one or more computer programs stored in the memory, so as to make the electronic device execute the method according to the first embodiment.
It should be understood that in this embodiment, the processor may be a central processing unit CPU, and the processor may also be other general purpose processors, digital signal processors DSP, application specific integrated circuits ASIC, off-the-shelf programmable gate arrays FPGA or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and so on. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory may include both read-only memory and random access memory, and may provide instructions and data to the processor, and a portion of the memory may also include non-volatile random access memory. For example, the memory may also store device type information.
In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or instructions in the form of software.
The method in the first embodiment may be directly implemented by a hardware processor, or may be implemented by a combination of hardware and software modules in the processor. The software modules may be located in ram, flash, rom, prom, or eprom, registers, among other storage media as is well known in the art. The storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor. To avoid repetition, it is not described in detail here.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
Example four
The present embodiments also provide a computer-readable storage medium for storing computer instructions, which when executed by a processor, perform the method of the first embodiment.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. The welding method based on the central temperature prediction curve of the reflow soldering area is characterized by comprising the following steps of:
acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
2. A soldering method based on a prediction curve of the temperature of the center of a reflow soldering region according to claim 1, wherein the method further comprises:
predicting a minimum parameter interval of a reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; and welding the electronic element on the circuit board in the reflow oven according to the minimum parameter interval of the reflow area when the solder paste is melted.
3. A soldering method based on a prediction curve of the temperature of the center of a reflow soldering region according to claim 1, wherein the method further comprises:
predicting a most symmetrical parameter interval around the reflow area when the solder paste melts according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the most symmetrical parameter interval of the left and right reflow areas when the solder paste is melted.
4. A soldering method based on a prediction curve of central temperature of a reflow soldering region as set forth in claim 1, wherein the prediction curve of central temperature of a reflow soldering region is obtained based on an actual reflow size of the reflow furnace and the number of small temperature regions; the method specifically comprises the following steps:
comparing the heat conduction law with a specific heat capacity formula to obtain a first-order ordinary differential equation of the ambient temperature T (x) in the welding furnace of the small temperature zone and the temperature f (x) in the welding center area;
utilizing the Sigmoid function to perform gap transition between the small temperature areas to obtain a smooth interval temperature transition curve function;
for the small temperature zone and the small temperature zone gap with the temperature difference larger than the set threshold, linear combination is carried out by utilizing an exponential function and a linear function, the actual concave function is approached, and a temperature distribution function is obtained:
obtaining furnace environment temperature distribution T (x) according to the first-order ordinary differential equation, the smooth interval temperature transition curve, the temperature distribution function, the actual reflow soldering size of the reflow furnace and the number of temperature zones; the furnace internal environment temperature distribution T (x) refers to a furnace internal environment temperature distribution function of a furnace front area, a furnace rear area and all small temperature areas of the reflow furnace;
and obtaining the optimal welding coefficient Q based on the furnace environment temperature distribution T (x) and the welding center area temperature f (x).
5. A soldering method based on a prediction curve of the central temperature of a reflow soldering region as set forth in claim 1, wherein the speed interval under the set temperature parameter is predicted based on the prediction curve of the central temperature of the reflow soldering region; according to the speed interval under the set temperature parameter, welding the electronic element on the circuit board in the reflow oven; the method specifically comprises the following steps:
setting temperature parameters of each small temperature zone, the fastest temperature rise and fall speed, time between temperatures, the maximum temperature value and a conveyor belt speed interval;
enumerating speed, storing discretized samples of the central temperature prediction curve of the welding area into an array, judging whether the process limit is met, traversing speed, recording the speed interval meeting the conditions and outputting.
6. A soldering method based on a prediction curve of the central temperature of a reflow soldering region according to claim 2, wherein a minimum parameter interval of a reflow area when the solder paste is melted is predicted based on the prediction curve of the central temperature of the reflow soldering region; according to the minimum parameter interval of the reflow area when the solder paste is melted, welding the electronic element on the circuit board in the reflow furnace; the method specifically comprises the following steps:
setting temperature prediction intervals of all small temperature zones, the fastest temperature rise and fall speed, time between temperatures, the maximum temperature value and a conveyor belt speed prediction interval;
enumerating speed, and storing discretization sampling of the central temperature prediction curve of the welding area into an array;
judging whether the process limit is met, calculating the shadow area of the part exceeding 217 ℃, searching the temperature of each small temperature zone and the speed of the conveyor belt which enable the shadow area to be minimum, and outputting the temperature and the speed.
7. A soldering method according to claim 3 based on a central temperature prediction curve of a reflow soldering region, wherein the most symmetrical parameter region around the reflow area when the solder paste is melted is predicted from the central temperature prediction curve of the reflow soldering region; according to the most symmetrical parameter interval of the left and right reflow areas when the solder paste is melted, welding the electronic element on the circuit board in the reflow furnace; the method specifically comprises the following steps:
setting temperature intervals of all small temperature areas, the fastest temperature rise and fall speed, sampling time intervals between two adjacent actual measurements, the maximum temperature value and the speed interval of a conveyor belt;
discretizing and sampling a welding center temperature prediction curve; sampling according to a sampling time interval t of 0.5s by using discretization sampling to obtain a discretization array of a welding center temperature curve; by traversing the head and tail of the array, find t at the critical point time of f (x) ═ 217 DEG C1And t2(ii) a Calculating a critical point t1And t2To a central point
Variance of each pair of furnace temperature values in bilaterally symmetrical intervals
Selecting an optimal solution which not only meets the process conditions, but also has the minimum variance and a smaller area;
and selecting two groups of prediction results for visual analysis.
8. Welding system based on regional central temperature prediction curve of reflow soldering, characterized by includes:
an acquisition module configured to: acquiring the actual reflow soldering size and the number of small temperature zones of the reflow oven; the reflow furnace is divided into 4 large temperature areas: a preheating zone, a constant temperature zone, a reflux zone and a cooling zone; each large temperature area comprises a plurality of small temperature areas; each small temperature zone is a continuous heating zone with a heating function;
a prediction curve calculation module configured to: acquiring a central temperature prediction curve of a reflow soldering area according to the actual reflow soldering size and the number of small temperature areas of the reflow soldering furnace;
a welding module configured to: predicting a speed interval under a set temperature parameter according to a central temperature prediction curve of a reflow soldering area; and welding the electronic elements on the circuit board in the reflow oven according to the speed interval under the set temperature parameter.
9. An electronic device, comprising: one or more processors, one or more memories, and one or more computer programs; wherein a processor is connected to the memory, the one or more computer programs being stored in the memory, the processor executing the one or more computer programs stored in the memory when the electronic device is running, to cause the electronic device to perform the method of any of the preceding claims 1-7.
10. A computer-readable storage medium storing computer instructions which, when executed by a processor, perform the method of any one of claims 1 to 7.
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