CN114894319A - Temperature control method, device and system, computer equipment and storage medium - Google Patents
Temperature control method, device and system, computer equipment and storage medium Download PDFInfo
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- G05D23/19—Control of temperature characterised by the use of electric means
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Abstract
The present disclosure provides a temperature control method, apparatus, system, computer device and storage medium, wherein the method comprises: acquiring a plurality of thermal imaging images containing a temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine; determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image; performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine; and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
Description
Technical Field
The disclosure relates to the technical field of temperature control of reflow soldering machines, in particular to a temperature control method, a temperature control device, a temperature control system, computer equipment and a storage medium.
Background
The reflow soldering machine makes the solder paste heated and melted by providing a heating environment, so that the circuit board and the surface-mounted component are combined together through the solder paste to complete the welding of the circuit board. Therefore, controlling the temperature in the reflow soldering machine becomes an important link affecting the soldering effect.
In the related art, when controlling the temperature in the reflow soldering machine, a plurality of temperature measuring elements (such as thermocouples and the like) are often used to obtain the temperature at each position in the reflow soldering machine, a furnace temperature curve is fitted according to the measured temperature at each position, and temperature control is performed according to the furnace temperature curve.
Disclosure of Invention
The embodiment of the disclosure at least provides a temperature control method, a device, a system, computer equipment and a storage medium.
In a first aspect, an embodiment of the present disclosure provides a temperature control method, including:
acquiring a plurality of thermal imaging images containing a temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image;
performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
Therefore, compared with the method for measuring the temperature by using a thermocouple, the method for measuring the temperature of the temperature measuring circuit board by using the thermal imaging image acquisition device in the reflow soldering machine has the advantages that the temperature of the temperature measuring circuit board can be determined in real time due to no need of heat exchange, so that errors caused by heat exchange can be avoided; on the other hand, the target temperature data of the target detection points of the temperature measurement circuit board are used for temperature curve fitting, and compared with the temperature curve fitting method using the temperature of the whole area, the temperature change condition of the temperature measurement circuit board in the reflow soldering machine can be reflected more accurately, so that a more accurate and effective target fitting curve can be provided for subsequent temperature adjustment, and the temperature control can be carried out based on the target fitting curve.
In a possible embodiment, the determining target temperature data of a target detection point of the thermometric circuit board in the thermal imaging image includes:
determining edge position information of the temperature measuring circuit board in the thermal imaging image;
determining target position information of the target detection point based on a preset relative position relationship between the target detection point and the edge position information;
and determining target temperature data of the target detection point based on temperature data corresponding to the target position information in the thermal imaging image.
Therefore, on the basis of the relative position relation between the preset target detection point and the edge position information, the target position information of the target detection point can be accurately determined on the basis of determining the edge position information of the temperature measurement circuit board, and therefore the target temperature data of the target detection point can be accurately determined on the basis of the thermal imaging image.
In a possible embodiment, the determining the edge position information of the thermometric circuit board in the thermal imaging image comprises:
and inputting the thermal imaging image into a pre-trained first target neural network to obtain edge position information which is output by the first target neural network and corresponds to the temperature measurement circuit board.
Therefore, the trained neural network is used for determining the edge position information of the temperature measurement circuit board, so that the edge of the temperature measurement circuit board can be accurately determined, and the target temperature data of the target detection point can be more accurately determined in the following process.
In one possible embodiment, the temperature control of different position areas of the reflow soldering machine based on the target fitting curve includes:
determining a fitting parameter value of a fitting parameter corresponding to the target fitting curve based on the target fitting curve;
and under the condition that the fitting parameter value does not meet the preset condition, adjusting the temperature adjusting parameter corresponding to the reflow soldering machine so as to control the temperature of different position areas of the reflow soldering machine.
In this way, the fitting parameter value of the fitting parameter corresponding to the target fitting curve is determined, and the temperature adjusting parameter is adjusted under the condition that the fitting parameter value does not meet the preset condition, so that the temperatures of different position areas of the reflow soldering machine can be accurately controlled.
In a possible embodiment, the temperature adjusting parameter includes at least one of a conveyor belt speed, a return air rate, a part volume, a finished product placing interval and a temperature corresponding to each temperature area in the reflow soldering machine;
the fitting parameters comprise at least one of preheating climbing slope, wetting temperature, temperature climbing slope, peak temperature and acting time of each temperature area in the reflow soldering machine.
In a possible embodiment, the adjusting the corresponding temperature adjustment parameter of the reflow soldering machine includes:
aiming at any one fitting parameter, determining a target difference value between a fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the target difference values corresponding to the fitting parameters.
Therefore, the temperature adjusting parameters are adjusted based on the target difference of each fitting parameter, so that the temperatures of different position areas of the reflow soldering machine can be accurately controlled.
In a possible embodiment, the adjusting the temperature adjustment parameter corresponding to the reflow soldering machine based on the target difference value corresponding to each fitting parameter includes:
inputting the target difference values corresponding to the fitting parameters into a second target neural network trained in advance to obtain parameter adjustment information output by the second target neural network;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the parameter adjusting information.
Therefore, the trained neural network is used for determining the parameter adjusting information when the temperature adjusting parameters are adjusted, so that the parameter adjusting information corresponding to each temperature adjusting parameter can be more accurately determined, and the temperature adjusting parameters corresponding to the reflow soldering machine can be adjusted based on the determined parameter adjusting information.
In a second aspect, an embodiment of the present disclosure further provides a temperature control device, including:
the acquisition module is used for acquiring a plurality of thermal imaging images containing the temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
the determining module is used for determining target temperature data of a target detection point of the temperature measuring circuit board in the thermal imaging image;
the generating module is used for carrying out temperature fitting on the basis of the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and the control module is used for controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
In one possible embodiment, the determining module, when determining target temperature data of a target detection point of the thermometric circuit board in the thermographic image, is configured to:
determining edge position information of the temperature measuring circuit board in the thermal imaging image;
determining target position information of the target detection point based on a preset relative position relationship between the target detection point and the edge position information;
and determining target temperature data of the target detection point based on temperature data corresponding to the target position information in the thermal imaging image.
In one possible embodiment, the determining module, when determining the edge position information of the thermometric circuit board in the thermographic image, is configured to:
and inputting the thermal imaging image into a pre-trained first target neural network to obtain edge position information which is output by the first target neural network and corresponds to the temperature measurement circuit board.
In one possible embodiment, the control module, when performing temperature control of different location areas of the reflow soldering machine based on the target fitted curve, is configured to:
determining a fitting parameter value of a fitting parameter corresponding to the target fitting curve based on the target fitting curve;
and under the condition that the fitting parameter value does not meet the preset condition, adjusting the temperature adjusting parameter corresponding to the reflow soldering machine so as to control the temperature of different position areas of the reflow soldering machine.
In a possible embodiment, the temperature adjusting parameter includes at least one of a conveyor belt speed, a return air rate, a part volume, a finished product placing interval and a temperature corresponding to each temperature area in the reflow soldering machine;
the fitting parameters comprise at least one of preheating climbing slope, wetting temperature, temperature climbing slope, peak temperature and acting time of each temperature area in the reflow soldering machine.
In one possible embodiment, the control module, when adjusting the corresponding temperature adjustment parameter of the reflow soldering machine, is configured to:
aiming at any one fitting parameter, determining a target difference value between a fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the target difference values corresponding to the fitting parameters.
In one possible embodiment, the control module, when adjusting the temperature adjustment parameter corresponding to the reflow soldering machine based on the target difference value corresponding to each fitting parameter, is configured to:
inputting the target difference values corresponding to the fitting parameters into a second target neural network trained in advance to obtain parameter adjustment information output by the second target neural network;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the parameter adjusting information.
In a third aspect, an embodiment of the present disclosure further provides a temperature control system, including: an industrial personal computer, a heating device, a cooling device, a transmission device, an air flow control device, a thermal imaging image acquisition device, a sensor, wherein the industrial personal computer performs the steps as described above in the first aspect, or in any one of the possible embodiments of the first aspect, when in operation.
In a fourth aspect, an embodiment of the present disclosure further provides a computer device, including: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating via the bus when the computer device is running, the machine-readable instructions when executed by the processor performing the steps of the first aspect described above, or any possible implementation of the first aspect.
In a fifth aspect, this disclosed embodiment further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and the computer program is executed by a processor to perform the steps in the first aspect or any one of the possible implementation manners of the first aspect.
For the description of the effects of the temperature control device, the temperature control system, the computer device, and the computer-readable storage medium, reference is made to the description of the temperature control method, which is not repeated herein.
In order to make the aforementioned objects, features and advantages of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly described below, and the drawings herein incorporated in and forming a part of the specification illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the technical solutions of the present disclosure. It is appreciated that the following drawings depict only certain embodiments of the disclosure and are therefore not to be considered limiting of its scope, for those skilled in the art will be able to derive additional related drawings therefrom without the benefit of the inventive faculty.
FIG. 1 is a flow chart illustrating a method of temperature control provided by an embodiment of the present disclosure;
FIG. 2 is a schematic diagram illustrating a target fit curve in a temperature control method provided by an embodiment of the present disclosure;
FIG. 3 is a flow chart illustrating temperature adjustment in a temperature control method provided by an embodiment of the disclosure;
FIG. 4 is a schematic diagram illustrating an architecture of a temperature control apparatus provided by an embodiment of the present disclosure;
fig. 5 shows a schematic structural diagram of a computer device provided by an embodiment of the present disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions in the embodiments of the present disclosure will be described clearly and completely with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present disclosure, presented in the figures, is not intended to limit the scope of the claimed disclosure, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the disclosure without making creative efforts, shall fall within the protection scope of the disclosure.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The term "and/or" herein merely describes an associative relationship, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the term "at least one" herein means any one of a plurality or any combination of at least two of a plurality, for example, including at least one of A, B, C, and may mean including any one or more elements selected from the group consisting of A, B and C.
According to research, when the temperature in the reflow soldering machine is controlled, a plurality of temperature measuring elements (such as thermocouples and the like) are often adopted to obtain the temperature of each position in the reflow soldering machine, a furnace temperature curve is fitted according to the measured temperature of each position, and temperature control is carried out according to the furnace temperature curve.
Based on the research, the disclosure provides a temperature control method, a device, a system, computer equipment and a storage medium, wherein the temperature of the temperature measurement circuit board is measured by a thermal imaging image acquisition device in the reflow soldering machine, and compared with the temperature measurement by using a thermocouple, the temperature of the temperature measurement circuit board can be determined in real time without heat exchange, so that errors caused by the heat exchange can be avoided; on the other hand, the target temperature data of the target detection points of the temperature measurement circuit board are used for temperature curve fitting, and compared with the temperature curve fitting method using the temperature of the whole area, the temperature curve fitting method can reflect the temperature change condition of the temperature measurement circuit board in the reflow soldering machine more accurately, so that a more accurate and effective target fitting curve can be provided for subsequent temperature adjustment, and temperature control can be performed based on the target fitting curve.
To facilitate understanding of the present embodiment, first, a temperature control method disclosed in the embodiments of the present disclosure is described in detail, where an execution subject of the temperature control method provided in the embodiments of the present disclosure is generally a computer device with certain computing capability, and the computer device includes, for example: a terminal device, which may be a User Equipment (UE), a mobile device, a User terminal, a Personal Digital Assistant (PDA), a handheld device, a computing device, a vehicle-mounted device, a wearable device, an industrial Personal computer, or a server or other processing device. In some possible implementations, the temperature control method may be implemented by a processor calling computer readable instructions stored in a memory.
Referring to fig. 1, a flowchart of a temperature control method provided in an embodiment of the present disclosure is shown, where the method includes S101 to S104, where:
s101: acquiring a plurality of thermal imaging images containing a temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein the different thermographic images correspond to different location areas of the reflow soldering machine.
S102: and determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image.
S103: performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; and different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine.
S104: and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
The following is a detailed description of the above steps.
For S101, the thermal imaging image acquisition device may be, for example, a thermal imager or other device, the thermal imaging image acquisition device may perform infrared radiation detection on the shot target area, and convert infrared radiation of the target area into a thermal imaging image through signal processing, photoelectric conversion and other processing methods, where different colors in the thermal imaging image represent different temperatures; the temperature measuring Circuit Board is a Circuit Board for measuring temperature, and may be, for example, a Printed Circuit Board (PCB).
Specifically, a plurality of thermal imaging image acquisition devices can be deployed in the reflow soldering machine to measure the temperature data of the temperature measurement circuit board in different position areas, so as to obtain a plurality of thermal imaging images, wherein the position areas inside the reflow soldering machine can be divided into a plurality of areas such as a heating area, a constant temperature area (also called a soaking area), a welding area (also called a reflow area or reflow area), a cooling area and the like according to the temperature change conditions corresponding to the different areas.
S102: and determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image.
Here, the target detection point may be a welding point of the temperature measurement circuit board, where the component to be welded is welded, and the temperature of the welding point is detected, so that the temperature of the welding point during welding can be better controlled later.
In one possible embodiment, the following steps a 1-A3 may be used in determining the target temperature data:
a1: and determining the edge position information of the temperature measuring circuit board in the thermal imaging image.
Specifically, when determining the edge position information of the temperature measurement circuit board, any one of the following manners may be adopted:
mode 1, determining edge position information of temperature measuring circuit board based on edge detection algorithm
Here, the edge detection algorithm may be, for example, an algorithm such as a corner detection algorithm.
Specifically, the temperature measurement circuit board is often rectangular, so that four vertexes of the temperature measurement circuit board can be detected by the corner detection algorithm, and the edge position information of the temperature measurement circuit board in the thermal imaging image can be determined by connecting the four vertexes.
Mode 2, determining edge position information of the temperature measurement circuit board based on neural network
Here, a first target Neural network having an object recognition function may be trained in advance, and the edge information of the temperature measurement circuit board may be recognized using the first target Neural network, where a network type of the first target Neural network may be a Neural network capable of deep learning, such as a Convolutional Neural Network (CNN).
Specifically, the thermal imaging image may be input to a first target neural network trained in advance, so as to obtain edge position information output by the first target neural network and corresponding to the temperature measurement circuit board.
Specifically, when the first target neural network is trained, first sample data and first labeling data corresponding to the first sample data may be obtained; inputting the first sample data into the first target neural network to obtain sample edge position information output by the first target neural network; and determining a first loss value of the training based on the sample edge position information and the first marking data, and updating the network parameters of the first target neural network to be trained based on the first loss value.
Therefore, the trained neural network is used for determining the edge position information of the temperature measurement circuit board, so that the edge of the temperature measurement circuit board can be accurately determined, and the target temperature data of the target detection point can be more accurately determined in the following process.
A2: and determining the target position information of the target detection point based on the preset relative position relationship between the target detection point and the edge position information.
After the edge position information of the temperature measuring circuit board is obtained, the target position information of the target detection point in the thermal imaging image can be determined according to the relative position relation.
A3: and determining target temperature data of the target detection point based on temperature data corresponding to the target position information in the thermal imaging image.
Here, after the target position information of the target detection point is determined, the temperature data corresponding to the target position information may be used as the target temperature data corresponding to the target detection point.
Therefore, on the basis of the relative position relation between the preset target detection point and the edge position information, the target position information of the target detection point can be accurately determined on the basis of determining the edge position information of the temperature measurement circuit board, and therefore the target temperature data of the target detection point can be accurately determined on the basis of the thermal imaging image.
S103: performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; and different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine.
Here, the horizontal axis of the target fitting curve corresponds to the time of the target detection points of the temperature measurement circuit board in the reflow soldering machine, and the vertical axis of the target fitting curve corresponds to the target temperature data of the target detection points of the temperature measurement circuit board.
For example, a schematic diagram of the target fitting curve may be as shown in fig. 2, an abscissa represents time of the temperature measuring circuit board in the reflow soldering machine, an ordinate represents temperature of the temperature measuring circuit board, a temperature in an elevated temperature region of the reflow soldering machine is raised to 160 degrees at most, a temperature in a preheating region (i.e., a constant temperature region) is raised to 180 degrees at most, a temperature in a rapid elevated temperature region is raised to 217 degrees at most, the rapid elevated temperature region functions to rapidly raise a current temperature to a temperature capable of performing soldering, a temperature in a reflow region (i.e., a welding region) is raised to 240 degrees at most (a maximum temperature of the target fitting curve is 235 to 245 degrees), and then the temperature starts to decrease, and enters a cooling region to continue cooling at 217 degrees.
S104: and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
In one possible embodiment, the temperature control of the different location areas of the reflow soldering machine can be performed by the following steps B1-B2:
b1: and determining the fitting parameter value of the fitting parameter corresponding to the target fitting curve based on the target fitting curve.
Here, the fitting parameters include at least one of a preheat ramp slope, a soak temperature, a temperature ramp slope, a spike temperature, and a time during which each temperature zone in the reflow soldering machine is respectively applied.
The preheating climbing slope represents the temperature change condition of the temperature measuring circuit board during preheating in the preheating zone; the immersion temperature is the starting temperature of the constant temperature zone (i.e., the preheating zone in fig. 2), such as 160 degrees in fig. 2; the temperature climbing slope is used for representing the temperature change condition of the rapid temperature rising area, and because the area enables the soldering flux in the solder paste to play a role and be properly dispersed by keeping relatively stable temperature, the temperature climbing slope cannot be too high or too low; the peak temperature characterizes the maximum temperature of the recirculation zone; the action time of each temperature area comprises the action time of an elevated temperature area, a preheating area, a rapid elevated temperature area, a reflux area and a cooling area.
For example, when determining the acting time of the temperature rising region, the acting time of the temperature rising region may be determined to be 100 seconds based on the target fitting curve as shown in fig. 2.
B2: and under the condition that the fitting parameter value does not meet the preset condition, adjusting the temperature adjusting parameter corresponding to the reflow soldering machine so as to control the temperature of different position areas of the reflow soldering machine.
Here, for any one of the fitting parameters, when it is detected that an absolute value of a difference between a fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter is greater than a preset value, it may be determined that the fitting parameter value corresponding to the fitting parameter does not satisfy a preset condition; the temperature adjusting parameters comprise at least one of the speed of the conveyor belt, the air return rate, the volume of parts, the placing distance of finished products and the temperature corresponding to each temperature area in the reflow soldering machine.
Specifically, the initial parameter values of the temperature adjustment parameters may be determined by corresponding sensors, and the parameter values of the adjusted temperature adjustment parameters may also be determined by corresponding sensors, for example, the speed of the conveyor belt before adjustment may be determined by a speed sensor, and the speed of the conveyor belt after adjustment may also be determined by the speed sensor.
In this way, the fitting parameter value of the fitting parameter corresponding to the target fitting curve is determined, and the temperature adjusting parameter is adjusted under the condition that the fitting parameter value does not meet the preset condition, so that the temperatures of different position areas of the reflow soldering machine can be accurately controlled.
In one possible embodiment, when adjusting the corresponding temperature adjustment parameter of the reflow soldering machine, the following steps B21 to B22 can be performed:
b21: and aiming at any one fitting parameter, determining a target difference value between the fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter.
B22: and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the target difference values corresponding to the fitting parameters.
Here, a target mathematical model of the fitting parameter and each temperature adjustment parameter may be established in advance, a target association relationship between the fitting parameter and each temperature adjustment parameter may be determined based on the established target mathematical model, and the temperature adjustment parameter corresponding to the reflow soldering machine may be adjusted based on the target association relationship and the target difference.
For example, taking the target mathematical model as a polynomial regression model as an example, after the polynomial regression model corresponding to the fitting parameters and the temperature adjustment parameters is established, whether the current temperature adjustment parameters and the fitting parameters have significant association relationship can be determined based on a polynomial regression equation significance judgment formula, and then the fitting parameters and the target association relationship between the temperature adjustment parameters having significant association relationship with the fitting parameters can be obtained by establishing a reaction surface model, so as to adjust the temperature adjustment parameters corresponding to the reflow soldering machine based on the target association relationship and the target difference.
Therefore, the temperature adjusting parameters are adjusted based on the target difference of each fitting parameter, so that the temperatures of different position areas of the reflow soldering machine can be accurately controlled.
In a possible implementation manner, when adjusting the temperature adjustment parameters corresponding to the reflow soldering machine, the target difference values corresponding to the fitting parameters respectively may be input into a second target neural network trained in advance, so as to obtain parameter adjustment information output by the second target neural network; and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the parameter adjusting information.
Here, a second target Neural network may be trained in advance, and parameter adjustment information corresponding to the target difference value may be predicted using the trained second target Neural network, and a network type of the second target Neural network may be a Neural network capable of deep learning, such as a Convolutional Neural Network (CNN).
Specifically, when the second target neural network is trained, second sample data (sample difference values corresponding to each fitting parameter) and second labeled data (labeled adjustment information corresponding to the sample difference values) corresponding to the second sample data may be obtained; inputting the second sample data into the second target neural network to obtain sample adjustment information output by the second target neural network; and determining a second loss value of the training based on the sample adjusting information and the second marking data, and updating the network parameters of a second target neural network to be trained based on the second loss value.
Therefore, the trained neural network is used for determining the parameter adjusting information when the temperature adjusting parameters are adjusted, so that the parameter adjusting information corresponding to each temperature adjusting parameter can be more accurately determined, and the temperature adjusting parameters corresponding to the reflow soldering machine can be adjusted based on the determined parameter adjusting information.
Referring to fig. 3, a flowchart for performing temperature adjustment in the temperature control method provided in the embodiment of the present disclosure is shown. Specifically, temperature data acquisition can be performed based on a thermal imaging device, and temperature fitting can be performed based on the acquired target temperature data to generate a target fitting curve; determining parameter values of fitting parameters based on the target fitting curve, and adjusting the parameter values of temperature adjusting parameters based on the determined parameter values of the fitting parameters, wherein the parameter values of the temperature adjusting parameters can be obtained through a sensor; and determining whether the parameter value of the adjusted fitting parameter meets a preset condition, if not, continuing to adjust the parameter value of the temperature adjusting parameter, and if so, ending the adjustment.
For the detailed description of the above steps, reference is made to the above related contents, which are not repeated herein.
Compared with the method for measuring the temperature by using a thermocouple, the temperature control method provided by the embodiment of the disclosure can determine the temperature of the temperature measuring circuit board in real time because heat exchange is not needed as the temperature measuring circuit board is measured by the thermal imaging image acquisition device in the reflow soldering machine, thereby avoiding errors caused by heat exchange; on the other hand, the target temperature data of the target detection points of the temperature measurement circuit board are used for temperature curve fitting, and compared with the temperature curve fitting method using the temperature of the whole area, the temperature change condition of the temperature measurement circuit board in the reflow soldering machine can be reflected more accurately, so that a more accurate and effective target fitting curve can be provided for subsequent temperature adjustment, and the temperature control can be carried out based on the target fitting curve.
It will be understood by those skilled in the art that in the method of the present invention, the order of writing the steps does not imply a strict order of execution and any limitations on the implementation, and the specific order of execution of the steps should be determined by their function and possible inherent logic.
Based on the same inventive concept, a temperature control device corresponding to the temperature control method is also provided in the embodiments of the present disclosure, and as the principle of solving the problem of the device in the embodiments of the present disclosure is similar to the temperature control method in the embodiments of the present disclosure, the implementation of the device may refer to the implementation of the method, and repeated details are not repeated.
Referring to fig. 4, a schematic diagram of an architecture of a temperature control apparatus provided in an embodiment of the present disclosure is shown, where the apparatus includes: an acquisition module 401, a determination module 402, a generation module 403 and a control module 404; wherein the content of the first and second substances,
the obtaining module 401 is configured to obtain multiple thermal imaging images including the temperature measurement circuit board, which are captured by a thermal imaging image collecting device inside the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
a determining module 402, configured to determine target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image;
a generating module 403, configured to perform temperature fitting based on the target temperature data of the target detection points, and generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and a control module 404, configured to perform temperature control of different location areas of the reflow soldering machine based on the target fitting curve.
In one possible implementation, the determining module 402, when determining target temperature data of a target detection point of the thermometric circuit board in the thermographic image, is configured to:
determining edge position information of the temperature measuring circuit board in the thermal imaging image;
determining target position information of the target detection point based on a preset relative position relationship between the target detection point and the edge position information;
and determining target temperature data of the target detection point based on temperature data corresponding to the target position information in the thermal imaging image.
In one possible embodiment, the determining module 402, when determining the edge position information of the thermometric circuit board in the thermal imaging image, is configured to:
and inputting the thermal imaging image into a pre-trained first target neural network to obtain edge position information which is output by the first target neural network and corresponds to the temperature measurement circuit board.
In one possible embodiment, the control module 404, when performing temperature control of different location areas of the reflow soldering machine based on the target fitting curve, is configured to:
determining a fitting parameter value of a fitting parameter corresponding to the target fitting curve based on the target fitting curve;
and under the condition that the fitting parameter value does not meet the preset condition, adjusting the temperature adjusting parameter corresponding to the reflow soldering machine so as to control the temperature of different position areas of the reflow soldering machine.
In a possible embodiment, the temperature adjusting parameter includes at least one of a conveyor belt speed, a return air rate, a part volume, a finished product placing interval and a temperature corresponding to each temperature area in the reflow soldering machine;
the fitting parameters comprise at least one of preheating climbing slope, wetting temperature, temperature climbing slope, peak temperature and acting time of each temperature area in the reflow soldering machine.
In one possible embodiment, the control module 404, when adjusting the corresponding temperature adjustment parameter of the reflow soldering machine, is configured to:
aiming at any one fitting parameter, determining a target difference value between a fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the target difference values corresponding to the fitting parameters.
In one possible embodiment, the control module 404, when adjusting the temperature adjustment parameter corresponding to the reflow soldering machine based on the target difference value corresponding to each fitting parameter, is configured to:
inputting the target difference values corresponding to the fitting parameters into a second target neural network trained in advance to obtain parameter adjustment information output by the second target neural network;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the parameter adjusting information.
Compared with the temperature measurement by using a thermocouple, the temperature control device provided by the embodiment of the disclosure can determine the temperature of the temperature measurement circuit board in real time because heat exchange is not needed, thereby avoiding errors caused by heat exchange; on the other hand, the target temperature data of the target detection points of the temperature measurement circuit board are used for temperature curve fitting, and compared with the temperature curve fitting method using the temperature of the whole area, the temperature change condition of the temperature measurement circuit board in the reflow soldering machine can be reflected more accurately, so that a more accurate and effective target fitting curve can be provided for subsequent temperature adjustment, and the temperature control can be carried out based on the target fitting curve.
The description of the processing flow of each module in the device and the interaction flow between the modules may refer to the related description in the above method embodiments, and will not be described in detail here.
Based on the same technical concept, the embodiment of the present disclosure further provides a temperature control system, including: the temperature control system comprises an industrial personal computer, a heating device, a cooling device, a transmission device, an air flow control device, a thermal imaging image acquisition device and a sensor, wherein the industrial personal computer executes the steps of the temperature control method in any embodiment when running.
Based on the same technical concept, the embodiment of the disclosure also provides computer equipment. Referring to fig. 5, a schematic structural diagram of a computer device 500 provided in the embodiment of the present disclosure includes a processor 501, a memory 502, and a bus 503. The memory 502 is used for storing execution instructions and includes a memory 5021 and an external memory 5022; the memory 5021 is also referred to as an internal memory, and is used for temporarily storing operation data in the processor 501 and data exchanged with an external storage 5022 such as a hard disk, the processor 501 exchanges data with the external storage 5022 through the memory 5021, and when the computer device 500 operates, the processor 501 communicates with the storage 502 through the bus 503, so that the processor 501 executes the following instructions:
acquiring a plurality of thermal imaging images containing a temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image;
performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
The embodiments of the present disclosure also provide a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor to perform the steps of the temperature control method described in the above method embodiments. The storage medium may be a volatile or non-volatile computer-readable storage medium.
The embodiments of the present disclosure also provide a computer program product, where the computer program product carries a program code, and instructions included in the program code may be used to execute the steps of the temperature control method in the foregoing method embodiments, which may be referred to specifically in the foregoing method embodiments, and are not described herein again.
The computer program product may be implemented by hardware, software or a combination thereof. In an alternative embodiment, the computer program product is embodied in a computer storage medium, and in another alternative embodiment, the computer program product is embodied in a Software product, such as a Software Development Kit (SDK), or the like.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the system and the apparatus described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. In the several embodiments provided in the present disclosure, it should be understood that the disclosed system, apparatus, and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present disclosure. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Finally, it should be noted that: the above-mentioned embodiments are merely specific embodiments of the present disclosure, which are used for illustrating the technical solutions of the present disclosure and not for limiting the same, and the scope of the present disclosure is not limited thereto, and although the present disclosure is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive of the technical solutions described in the foregoing embodiments or equivalent technical features thereof within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present disclosure, and should be construed as being included therein. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (11)
1. A method of temperature control, comprising:
acquiring a plurality of thermal imaging images containing a temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
determining target temperature data of a target detection point of the temperature measurement circuit board in the thermal imaging image;
performing temperature fitting based on the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
2. The method of claim 1, wherein determining target temperature data for target detection points of the thermometric circuit board in the thermographic image comprises:
determining edge position information of the temperature measuring circuit board in the thermal imaging image;
determining target position information of the target detection point based on a preset relative position relationship between the target detection point and the edge position information;
and determining target temperature data of the target detection point based on temperature data corresponding to the target position information in the thermal imaging image.
3. The method of claim 2, wherein determining edge location information of the thermometric circuit board in the thermographic image comprises:
and inputting the thermal imaging image into a pre-trained first target neural network to obtain edge position information which is output by the first target neural network and corresponds to the temperature measurement circuit board.
4. The method of any one of claims 1 to 3, wherein the controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve comprises:
determining a fitting parameter value of a fitting parameter corresponding to the target fitting curve based on the target fitting curve;
and under the condition that the fitting parameter value does not meet the preset condition, adjusting the temperature adjusting parameter corresponding to the reflow soldering machine so as to control the temperature of different position areas of the reflow soldering machine.
5. The method of claim 4, wherein the temperature regulating parameters include at least one of conveyor speed, air return rate, part volume, finished product placement spacing, and temperature associated with each temperature zone in the reflow soldering machine;
the fitting parameters comprise at least one of preheating climbing slope, wetting temperature, temperature climbing slope, peak temperature and acting time of each temperature area in the reflow soldering machine.
6. The method of claim 4 or 5, wherein said adjusting a corresponding temperature adjustment parameter of said reflow soldering machine comprises:
aiming at any one fitting parameter, determining a target difference value between a fitting parameter value of the fitting parameter and a target fitting value corresponding to the fitting parameter;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the target difference values corresponding to the fitting parameters.
7. The method of claim 6, wherein the adjusting the temperature adjustment parameters corresponding to the reflow soldering machine based on the target difference value corresponding to each fitting parameter comprises:
inputting the target difference values corresponding to the fitting parameters into a second target neural network trained in advance to obtain parameter adjustment information output by the second target neural network;
and adjusting the temperature adjusting parameters corresponding to the reflow soldering machine based on the parameter adjusting information.
8. A temperature control apparatus, comprising:
the acquisition module is used for acquiring a plurality of thermal imaging images containing the temperature measurement circuit board, which are shot by a thermal imaging image acquisition device in the reflow soldering machine; wherein different thermal imaging images correspond to different position areas of the reflow soldering machine;
the determining module is used for determining target temperature data of a target detection point of the temperature measuring circuit board in the thermal imaging image;
the generating module is used for carrying out temperature fitting on the basis of the target temperature data of the target detection points to generate a target fitting curve; the target fitting curve is a curve of the temperature of the target detection point changing along with time; different curve segments of the target fitting curve are used for representing the temperature change conditions of the target detection points in different position areas of the reflow soldering machine;
and the control module is used for controlling the temperature of different position areas of the reflow soldering machine based on the target fitting curve.
9. A temperature control system comprising an industrial personal computer, a heating device, a cooling device, a transmission device, an air flow control device, a thermal imaging image acquisition device, a sensor, wherein the industrial personal computer performs the steps of the temperature control method according to any one of claims 1 to 7 when in operation.
10. A computer device, comprising: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating over the bus when the computer device is running, the machine-readable instructions when executed by the processor performing the steps of the temperature control method of any one of claims 1 to 7.
11. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, carries out the steps of the temperature control method according to any one of claims 1 to 7.
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