JP3634076B2 - Reflow condition setting method - Google Patents

Reflow condition setting method Download PDF

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Publication number
JP3634076B2
JP3634076B2 JP20673496A JP20673496A JP3634076B2 JP 3634076 B2 JP3634076 B2 JP 3634076B2 JP 20673496 A JP20673496 A JP 20673496A JP 20673496 A JP20673496 A JP 20673496A JP 3634076 B2 JP3634076 B2 JP 3634076B2
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JP
Japan
Prior art keywords
reflow
temperature
circuit board
printed circuit
measurement
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Expired - Fee Related
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JP20673496A
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Japanese (ja)
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JPH1051127A (en
Inventor
攻 山崎
昌弘 谷口
一美 石本
耕一 永井
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品が搭載されかつ接合箇所にクリーム半田が付与されたプリント回路基板を加熱し、半田を再溶融させて電子部品を半田付けする際のリフロー条件の設定方法に関するものである。
【０００２】
【従来の技術】
プリント回路基板に電子部品を実装して半田付けする方法においては、一般的に表面実装部品を搭載したプリント回路基板をリフロー装置に挿入し、一括してリフロー半田付けしており、また挿入実装部品が搭載されている場合には、表面実装部品をリフローで一括半田付けした後挿入実装部品を局所的に後付け半田付けしている。
【０００３】
上記表面実装部品をリフローで一括して半田付けするリフロー装置は、所定の温度に加熱した熱風やパネルヒータの輻射熱によって、プリント回路基板全体を均一に加熱することにより半田を再溶融させて電子部品を半田付けするように構成されており、そのリフロー装置において信頼性の高い半田付けを行うためには熱風やパネルヒータの温度やプリント回路基板の移送速度等のリフロー条件を最適に設定する必要がある。
【０００４】
従来、リフロー条件の設定に際しては、プリント回路基板の１又は数カ所に温度測定用熱電対を取付け、各測定箇所の温度を記録計で計測・表示するようにし、各測定位置で所望の温度プロファイルが得られるまでリフロー条件を逐次変更することにより最適のリフロー条件に設定していた。なお、記録計は温度に応じて記録針が動いて記録紙に温度変化を表示するように構成されており、温度を同時に測定して記録表示できるのは記録針の数（最大でも８本）だけである。
【０００５】
【発明が解決しようとする課題】
しかしながら、近年プリント回路基板に表面実装部品や挿入実装部品が混在して搭載された状態で一括リフロー半田付けできるように、接合箇所に対して局所的に熱風を吹き付けて加熱するリフロー方法が提案されており、さらに弱耐熱電子部品が混在している場合にそのボディ部に対して局所的に冷風を吹き付けることにより熱損傷を確実に防止し、弱耐熱電子部品が混在して搭載されている場合にも一括リフロー半田付けする方法も考えられている。
【０００６】
このようなリフロー方法においてそのリフロー条件を設定するには、上記従来方法では対応することができず、適当なリフロー条件に設定したリフロー装置に実際にプリント回路基板を挿入してリフロー半田付けを行い、半田付けしたプリント回路基板の半田付け状態や電子部品の損傷の有無等を検査するという作業を、適正な半田付け状態が得られるまで何度も繰り返して最適なリフロー条件を設定するしかなく、リフロー条件の設定に多大な手間と時間を要するという問題がある。
【０００７】
なお、プリント回路基板の温度分布をサーモグラフィーによって測定することも考えられるが、リフロー状態のプリント回路基板をカメラで撮像する際には遮蔽ガラスを介して撮像しなければならず、実際には充分な検出精度を得ることができず、実用できない。
【０００８】
本発明は、上記従来の問題点に鑑み、プリント回路基板の各部分を局所的に異なった温度に管理してリフロー半田付けするためのリフロー条件の設定を能率的に行うことができるリフロー条件設定方法を提供することを目的としている。
【０００９】
【課題を解決するための手段】
本発明のリフロー条件設定方法は、電子部品を搭載したプリント回路基板のリフロー条件設定方法において、所定の多数の測定位置に温度測定用熱電対を取付けたプリント回路基板をリフロー炉に挿入し、リフロー炉を運転して各測定位置の温度を温度計測部で計測し、チップ立ち現象を生じたときにチップ立ち現象が生じた箇所の温度プロファイルを前記温度計測部で計測した結果に基づき画面表示すると共に、これに併せて同一座標上に前記箇所におけるチップ立ち現象が生じない場合の適正な温度プロファイルを画面表示し、両温度プロファイルの比較に基づいてリフロー条件を設定することを特徴とする。これにより、プリント回路基板の各部分を局所的に異なった温度に管理してリフロー半田付けするためのリフロー条件の設定を能率的に行うことができる。
【００１０】
なお、温度計測部で計測した結果をデータ処理してプリント基板上の温度分布を画面上に、等温線図状に表示すると、温度分布状態を一目して把握することができ、またプリント回路基板上の一部又は全部をモニタカメラで撮像し、リフロー中のプリント回路基板上の挙動を画面表示することにより、温度プロファイルと実際の挙動を同時に把握することができ、容易に短時間で適正なリフロー条件に設定できる。
【００１１】
また、プリント回路基板上の温度分布と温度プロファイルとプリント回路基板上の挙動に関するデータを入力データとするリフロー条件設定ソフトを用いて最適のリフロー条件を設定すると、表示された測定結果に基づいて簡単に最適のリフロー条件に設定することができる。
【００１３】
【発明の実施の形態】
以下、本発明のリフロー条件設定方法の一実施形態を図１〜図４を参照して説明する。
【００１４】
図１において、１は生産ラインにおけるリフロー炉と基本的に同一構成のリフロー炉で、炉運転制御手段２にて任意のリフロー条件にて運転可能に構成されている。３はリフロー炉１内に挿入配置したプリント回路基板であり、ＱＦＰやチップ部品などの表面実装部品３ａと、アルミ電解コンデンサやスイッチ部品などの挿入実装部品３ｂとが混合して搭載されている。このプリント回路基板３は挿入実装部品３ｂのボディ部が下面側に位置する姿勢でリフロー炉１に挿入される。そして、リフロー炉１内では図示しないパネルヒータ等にて雰囲気温度が保持されるとともに熱風加熱手段にて表面実装部品３ａや挿入実装部品３ｂのリード部とプリント回路基板３の電極との接合箇所に向けて矢印の如く熱風を吹き付け、接合箇所を局所的に所定のリフロー温度に加熱するように構成されるとともに、冷風冷却手段にて挿入実装部品３ｂのボディ部等に向けて破線矢印の如く冷風を吹き付けて熱破損を防止するように構成されている。４はリフロー炉１の適所に配設したモニタカメラであり、リフロー中のプリント回路基板３上の挙動を撮像するように配設されている。
【００１５】
プリント回路基板３には、接合箇所を含めて温度管理すべき領域の全面にわたって数１０〜１００箇所以上の多数の測定箇所に、図２に詳細に示すように、温度測定用熱電対５が取付けられている。各温度測定用熱電対５から引き出されたリード線５ａは温度計測部６に接続され、この温度計測部６にて各測定箇所の温度が検出され、デジタル信号としてパソコン７に入力されている。また、モニタカメラ４による映像信号は画像処理手段８にて画像データに変換されてパソコン７に入力されている。
【００１６】
パソコン７は、予め入力されている部品形状及びその配置データと、温度に関する入力データに基づいて、図３に示すように、プリント回路基板３上の任意の位置の電子部品の画像と、その電子部品の近傍の等温線図状の温度分布の画像とを画面分割で表示したり、画面切換によって表示したりできるように構成されている。また、モニタカメラ４で撮像した画像データと温度に関する入力データに基づいて、図４に示すように、リフロー中の電子部品の挙動とその電子部品の配置位置おける温度プロファイルとを画面分割で表示したり、画面切換によって表示したりできるように構成されている。また、図示はしていないが、その他の形態で必要なデータを画像表示できるように構成され、さらにこれらの画像の表示結果に基づいてリフロー条件を設定するための所要の指令やデータを入力するように構成されている。
【００１７】
９はリフロー条件設定手段で、パソコン７からの指示及び入力データに基づいて最適のリフロー条件を設定するように構成された人工知能機能を持ったリフロー条件設定ソフトを備えており、設定されたリフロー条件を炉運転制御手段２に出力するように構成されている。
【００１８】
次に、以上の構成のリフロー条件設定装置の動作を説明する。表面実装部品３ａと挿入実装部品３ｂが混在して搭載され、多数の温度測定用熱電対５が取付けられたプリント回路基板３をリフロー炉１に挿入配置し、そのプリント回路基板３における各種電子部品の配置構成に応じて適当に設定されたリフロー条件に基づいて炉運転制御手段２にてリフローを行う。そのリフロー過程において、各温度測定箇所の温度が温度計測部６で計測され、また電子部品等の挙動がモニタカメラ４にて撮像され、それらのデータがそれぞれパソコン７に入力される。
【００１９】
リフロー条件の設定作業者は、パソコン７を操作して人工知能機能を持ったリフロー条件設定ソフトを備えたリフロー条件設定手段９を作動させ、そのリフロー条件設定ソフトに基づいて必要な指令やデータを入力する。その際に、図３に示すような画面表示を行って、表示された各電子部品の形状と等温線図状の温度分布から所要の温度分布となっているか否かをチェックしたり、また図４に示すようなリフロー中の電子部品３ａの挙動と、その時の温度プロファイルとを画面表示して、例えば図示のような「チップ立ち」と呼ばれるような現象を生じた時の、「チップ立ち」が生じた箇所の温度プロファイルを一点鎖線で示した前記箇所における「チップ立ち」が生じない場所の適正な温度プロファルとともに表示してそれらの比較でチェックしたりし、それらの結果に基づいて必要なデータを入力することにより、リフロー条件設定手段９にて、より適切なリフロー条件が自動設定される。
【００２０】
こうして設定されたリフロー条件を炉運転制御手段２に入力し、上記と同様にリフローを行うという動作を複数回繰り返すことにより、容易かつ短時間に最適なリフロー条件を設定することができ、さらに人工知能機能を持ったリフロー条件設定ソフトを用いることにより熟練作業者でなくても最適なリフロー条件を設定することができる。
【００２１】
なお、上記実施形態では、人工知能機能を持ったリフロー条件設定ソフトを備えたリフロー条件設定手段９を有する例を示したが、リフロー条件設定ソフトはそれに限らず種々のソフトを用いることができ、さらにリフロー条件設定作業者が熟練作業者である場合には、パソコン７にて温度計測結果だけを画像表示し、又は温度計測結果とリフロー中の挙動とを画像表示することにより、それらの結果から最適なリフロー条件を設定することもできる。
【００２２】
【発明の効果】
本発明によれば、能率的にリフロー条件を設定することができる。
【図面の簡単な説明】
【図１】本発明のリフロー条件設定装置の一実施形態の概略構成図である。
【図２】同実施形態におけるプリント回路基板への温度測定用熱電対の取付状態を示す縦断面図である。
【図３】同実施形態における表示画像の一例の説明図である。
【図４】同実施形態における表示画像の他の例の説明図である。
【符号の説明】
１ リフロー炉
２ 炉運転制御手段
３ プリント回路基板
３ａ 表面実装部品（電子部品）
３ｂ 挿入実装部品（電子部品）
４ モニタカメラ
５ 温度測定用熱電対
６ 温度計測部
７ パソコン
８ 画像処理手段
９ リフロー条件設定手段[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component by heating the printed circuit board solder paste is applied to the mounted and joints, but about the re melt the solder set how reflow conditions for soldering an electronic component is there.
[0002]
[Prior art]
In a method of mounting and soldering electronic components on a printed circuit board, generally, a printed circuit board on which surface mount components are mounted is inserted into a reflow device, and reflow soldering is performed collectively. Is mounted, the surface mounted components are soldered together by reflow, and then the inserted mounted components are locally soldered later.
[0003]
The reflow device that solders the surface mount components together by reflow is an electronic component that reheats the entire printed circuit board by hot air heated to a predetermined temperature or the radiant heat of the panel heater to remelt the solder. In order to perform highly reliable soldering in the reflow apparatus, it is necessary to optimally set the reflow conditions such as the temperature of the hot air, the panel heater, and the transfer speed of the printed circuit board. is there.
[0004]
Conventionally, when setting reflow conditions, thermocouples for temperature measurement are attached to one or several places on a printed circuit board, and the temperature at each measurement point is measured and displayed by a recorder, and a desired temperature profile is obtained at each measurement position. The optimum reflow condition was set by sequentially changing the reflow condition until it was obtained. The recorder is configured to display the temperature change on the recording paper by moving the recording needle according to the temperature. The number of recording needles (maximum of eight) can be recorded and displayed at the same time. Only.
[0005]
[Problems to be solved by the invention]
However, in recent years, a reflow method has been proposed in which hot air is blown locally to heat the joints so that batch reflow soldering can be performed in a state where surface mount components and insertion mount components are mixedly mounted on the printed circuit board. In addition, when weak heat-resistant electronic components are mixed, it is possible to reliably prevent thermal damage by blowing cold air locally on the body, and when weak heat-resistant electronic components are mixed and mounted. In addition, a method of batch reflow soldering is also considered.
[0006]
In such a reflow method, the reflow conditions cannot be set by the conventional method described above, and the printed circuit board is actually inserted into the reflow apparatus set to an appropriate reflow condition and reflow soldering is performed. The process of inspecting the soldered state of the printed circuit board that has been soldered and the presence or absence of damage to electronic components, etc., must be repeated many times until an appropriate soldering state is obtained, and optimal reflow conditions must be set. There is a problem that it takes a lot of labor and time to set reflow conditions.
[0007]
Although it is conceivable to measure the temperature distribution of the printed circuit board by thermography, when a printed circuit board in a reflow state is imaged with a camera, it must be imaged through a shielding glass, which is actually sufficient. The detection accuracy cannot be obtained and is not practical.
[0008]
In view of the above-described conventional problems, the present invention is able to efficiently set a reflow condition for reflow soldering by managing each part of a printed circuit board at a locally different temperature and reflow soldering. It is an object of the present invention to provide a mETHODS.
[0009]
[Means for Solving the Problems]
The reflow condition setting method of the present invention is a reflow condition setting method for a printed circuit board on which an electronic component is mounted. A printed circuit board having temperature measurement thermocouples attached to a predetermined number of measurement positions is inserted into a reflow furnace, and reflow is performed. The temperature at each measurement position is measured by the temperature measurement unit by operating the furnace, and when the chip standing phenomenon occurs, the temperature profile of the place where the chip standing phenomenon has occurred is displayed on the screen based on the result of the temperature measurement unit measuring At the same time, an appropriate temperature profile when no chip standing phenomenon occurs at the same location on the same coordinate is displayed on the screen, and the reflow condition is set based on the comparison of both temperature profiles. Thereby, it is possible to efficiently set the reflow conditions for reflow soldering by managing each part of the printed circuit board locally at different temperatures.
[0010]
In addition, if the results measured by the temperature measurement unit are processed and the temperature distribution on the printed circuit board is displayed on the screen in an isotherm diagram, the temperature distribution state can be grasped at a glance, and the printed circuit board By capturing part or all of the above with a monitor camera and displaying the behavior on the printed circuit board during reflow on the screen, the temperature profile and actual behavior can be grasped at the same time. Reflow conditions can be set.
[0011]
In addition, if the optimum reflow conditions are set using the reflow condition setting software that takes as input data the temperature distribution on the printed circuit board, the temperature profile, and the behavior on the printed circuit board, it is easy based on the displayed measurement results. The optimal reflow conditions can be set.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a reflow condition setting how the present invention with reference to FIGS.
[0014]
In FIG. 1, reference numeral 1 denotes a reflow furnace having basically the same configuration as a reflow furnace in a production line, and is configured to be operable under arbitrary reflow conditions by a furnace operation control means 2. Reference numeral 3 denotes a printed circuit board inserted and arranged in the reflow furnace 1, in which a surface mount component 3a such as a QFP or a chip component and an insert mount component 3b such as an aluminum electrolytic capacitor or a switch component are mixed and mounted. This printed circuit board 3 is inserted into the reflow furnace 1 in such a posture that the body portion of the insertion mounting component 3b is located on the lower surface side. In the reflow furnace 1, the ambient temperature is maintained by a panel heater (not shown), and hot air heating means is used to join the lead portions of the surface mounting component 3 a and the insertion mounting component 3 b and the electrodes of the printed circuit board 3. It is configured to blow hot air as indicated by an arrow and locally heat the joining portion to a predetermined reflow temperature, and cool air as indicated by a broken line arrow toward the body portion of the insertion component 3b by the cold air cooling means. To prevent thermal damage. Reference numeral 4 denotes a monitor camera disposed at an appropriate position in the reflow furnace 1 and is disposed so as to image the behavior on the printed circuit board 3 during reflow.
[0015]
As shown in detail in FIG. 2, thermocouples 5 for temperature measurement are attached to the printed circuit board 3 at a large number of measurement locations of several tens to 100 or more over the entire surface of the region to be temperature controlled including the junctions. It has been. Lead wires 5a drawn out from the thermocouples 5 for temperature measurement are connected to a temperature measurement unit 6, and the temperature measurement unit 6 detects the temperature of each measurement location and inputs it to the personal computer 7 as a digital signal. The video signal from the monitor camera 4 is converted into image data by the image processing means 8 and input to the personal computer 7.
[0016]
As shown in FIG. 3, an image of an electronic component at an arbitrary position on the printed circuit board 3 and its electronic data are displayed on the personal computer 7 based on the component shape and arrangement data input in advance and the input data related to temperature. An image of the temperature distribution in the shape of an isotherm near the part can be displayed by dividing the screen or displayed by switching the screen. Further, based on the image data captured by the monitor camera 4 and the input data related to the temperature, as shown in FIG. 4, the behavior of the electronic component during reflow and the temperature profile at the arrangement position of the electronic component are displayed in a divided screen. Or display by screen switching. Although not shown, it is configured so that necessary data can be displayed in other forms, and necessary commands and data for setting reflow conditions are input based on the display results of these images. It is configured as follows.
[0017]
Reflow condition setting means 9 is provided with reflow condition setting software having an artificial intelligence function configured to set an optimum reflow condition based on an instruction from PC 7 and input data. The condition is output to the furnace operation control means 2.
[0018]
Next, the operation of the reflow condition setting device having the above configuration will be described. A printed circuit board 3 on which a surface mount component 3a and an insert mount component 3b are mixedly mounted and a large number of thermocouples 5 for temperature measurement are attached is inserted into the reflow furnace 1, and various electronic components in the printed circuit board 3 are arranged. Reflow is performed by the furnace operation control means 2 based on reflow conditions appropriately set according to the arrangement configuration. In the reflow process, the temperature at each temperature measurement point is measured by the temperature measurement unit 6, the behavior of the electronic component or the like is imaged by the monitor camera 4, and the data is input to the personal computer 7.
[0019]
The reflow condition setting operator operates the personal computer 7 to operate the reflow condition setting means 9 having the reflow condition setting software having the artificial intelligence function, and inputs necessary commands and data based on the reflow condition setting software. input. At that time, a screen display as shown in FIG. 3 is performed to check whether the required temperature distribution is obtained from the displayed shape of each electronic component and the temperature distribution in the isotherm diagram, The behavior of the electronic component 3a during reflow as shown in FIG. 4 and the temperature profile at that time are displayed on the screen , and the “chip standing” when a phenomenon called “chip standing” as shown in FIG. or to check their comparative displayed with proper temperature Purofaru location "tombstone" does not occur in the location denoted by the one-dot chain line a temperature profile of a portion occurs, necessary based on these results By inputting data, the reflow condition setting means 9 automatically sets a more appropriate reflow condition.
[0020]
By inputting the reflow conditions set in this way into the furnace operation control means 2 and repeating the reflow operation a plurality of times in the same manner as described above, the optimum reflow conditions can be set easily and in a short time. By using reflow condition setting software having an intelligent function, it is possible to set the optimum reflow condition even if it is not a skilled worker.
[0021]
In the above embodiment, an example is shown in which the reflow condition setting means 9 is provided with reflow condition setting software having an artificial intelligence function. However, the reflow condition setting software is not limited thereto, and various software can be used. Further, when the reflow condition setting operator is a skilled worker, only the temperature measurement result is displayed on the personal computer 7 or the temperature measurement result and the behavior during the reflow are displayed as an image. Optimal reflow conditions can also be set.
[0022]
【The invention's effect】
According to the present invention , the reflow condition can be set efficiently.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an embodiment of a reflow condition setting device of the present invention.
FIG. 2 is a longitudinal sectional view showing a state in which a thermocouple for temperature measurement is attached to the printed circuit board in the same embodiment.
FIG. 3 is an explanatory diagram illustrating an example of a display image according to the embodiment.
FIG. 4 is an explanatory diagram of another example of a display image in the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Reflow furnace 2 Furnace operation control means 3 Printed circuit board 3a Surface mount component (electronic component)
3b Insertion mounting parts (electronic parts)
4 monitor camera 5 thermocouple 6 for temperature measurement temperature measurement unit 7 personal computer 8 image processing means 9 reflow condition setting means

Claims (2)

電子部品を搭載したプリント回路基板のリフロー条件設定方法において、所定の多数の測定位置に温度測定用熱電対を取付けたプリント回路基板をリフロー炉に挿入し、リフロー炉を運転して各測定位置の温度を温度計測部で計測し、チップ立ち現象を生じたときにチップ立ち現象が生じた箇所の温度プロファイルを前記温度計測部で計測した結果に基づき画面表示すると共に、これに併せて同一座標上に前記箇所におけるチップ立ち現象が生じない場合の適正な温度プロファイルを画面表示し、両温度プロファイルの比較に基づいてリフロー条件を設定することを特徴とするリフロー条件設定方法。In the method for setting reflow conditions for a printed circuit board with electronic components, a printed circuit board with temperature measurement thermocouples attached to a predetermined number of measurement positions is inserted into the reflow furnace, and the reflow furnace is operated to The temperature is measured by the temperature measurement unit, and when the chip standing phenomenon occurs, the temperature profile of the place where the chip standing phenomenon has occurred is displayed on the screen based on the result of the measurement by the temperature measuring unit, and at the same time, on the same coordinate. A reflow condition setting method comprising: displaying an appropriate temperature profile when no chip standing phenomenon occurs at the location, and setting a reflow condition based on a comparison of both temperature profiles. 電子部品を搭載したプリント回路基板のリフロー条件設定方法において、所定の多数の測定位置に温度測定用熱電対を取付けたプリント回路基板をリフロー炉に挿入し、リフロー炉を運転して各測定位置の温度を温度計測部で計測する一方、リフロー中のプリント回路基板上の挙動をモニタカメラで撮像し、このプリント回路基板上の挙動を画面表示し、チップ立ち現象を生じたときにチップ立ち現象が生じた箇所の温度プロファイルを前記温度計測部で計測した結果に基づき画面表示すると共に、これに併せて同一座標上に前記箇所におけるチップ立ち現象が生じない場合の適正な温度プロファイルを画面表示し、両温度プロファイルの比較に基づいてリフロー条件を設定することを特徴とするリフロー条件設定方法。In the method for setting reflow conditions for a printed circuit board with electronic components, a printed circuit board with temperature measurement thermocouples attached to a predetermined number of measurement positions is inserted into the reflow furnace, and the reflow furnace is operated to While the temperature is measured by the temperature measurement unit, the behavior on the printed circuit board during reflow is imaged with a monitor camera, the behavior on the printed circuit board is displayed on the screen, and the chip standing phenomenon occurs when the chip standing phenomenon occurs. While displaying the temperature profile of the generated location on the screen based on the result of measurement by the temperature measurement unit, in addition to this, the appropriate temperature profile when the chip standing phenomenon at the location does not occur on the same coordinate is displayed on the screen, A reflow condition setting method, wherein a reflow condition is set based on a comparison between both temperature profiles.
JP20673496A 1996-08-06 1996-08-06 Reflow condition setting method Expired - Fee Related JP3634076B2 (en)

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JP4911337B2 (en) * 2005-09-27 2012-04-04 オムロン株式会社 Heating condition setting method, heating condition determination method, recording medium, heating device, display device, drawing support device, and operation control device
JP2007171107A (en) * 2005-12-26 2007-07-05 Fujitsu Ltd Inner furnace temperature measurement method
DE102012217288A1 (en) * 2012-09-25 2014-03-27 Siemens Aktiengesellschaft Measuring temperature distribution in reflow soldering furnace, comprises measuring temperature of furnace by introducing test plate into printed circuit boards, and attaching a dummy of a structural member on upper side of the test plate
JP6200182B2 (en) * 2013-03-29 2017-09-20 株式会社デンソー Substrate heating device and soldering device
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