CN115178825B - High-efficient display device of backward flow stove temperature - Google Patents
High-efficient display device of backward flow stove temperature Download PDFInfo
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- CN115178825B CN115178825B CN202210797842.9A CN202210797842A CN115178825B CN 115178825 B CN115178825 B CN 115178825B CN 202210797842 A CN202210797842 A CN 202210797842A CN 115178825 B CN115178825 B CN 115178825B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a high-efficiency display device for the temperature of a reflow oven, and particularly relates to the technical field of reflow ovens. According to the application, through setting the parameter comparison module, the data collection module and the integration module, the display device can obtain the optimal data of the current PCB processing through the data conditions of the PCB after being processed for many times, so that the defect of the PCB processing caused by experience or network data of a user is avoided, the actual use effect of the display device is ensured, and meanwhile, the welding effect of the reflow oven body on the PCB and the safety during use are provided.
Description
Technical Field
The application relates to the technical field of reflow ovens, in particular to a high-efficiency display device for the temperature of a reflow oven.
Background
In the reflow soldering process, the factors influencing the welding quality of the product are mainly reflected in the technical parameters such as the speed of a conveyor belt, the stability of the conveyor belt, the transverse difference of temperature, the temperature stability of a temperature area, the convection heat conductivity and the like, in the reflow soldering process, a PCB (printed circuit board) is not heated at a constant temperature, but passes through the temperature areas with different settings at a set speed, the PCB body, components and consumables attached to the PCB body undergo a changing temperature effect at the same time, and finally welding spots are formed, and in this case, the speed of the conveyor belt, the convection heat conductivity of a reflow oven and the influence of the setting temperature of the temperature areas on a temperature curve are the greatest, so that the test analysis of the three technical parameters of the reflow oven is very important.
The moving speed of the PCB circuit board in the reflow oven is determined by the conveying speed of the conveying belt, the conveying speed is high, the stay time of the PCB in each heating area is short, the speed is generally relatively fixed, from a certain angle, the stay time of the PCB circuit board in each heating area is longer, the heating on the heating area is more sufficient, the production efficiency and the production rhythm are considered in automatic production, the speed of the conveying belt is set in a reasonable range, the key index of a temperature curve can be ensured to meet the requirement, the production efficiency can be ensured to be maximized, the temperature of each heating area of the reflow oven is set higher, the temperature rise of the PCB in the temperature area is higher, whether the temperature of each heating area of the reflow oven is a hot air reflow oven or an infrared reflow oven, and the effect of each temperature area on the temperature curve is equivalent although the set temperature of each temperature area of the reflow oven is different.
However, at present, the temperature in the reflow oven is monitored and displayed to ensure the welding effect of the PCB circuit board in the reflow oven, but in actual operation and application, the required temperature is different in the period due to the difference of the materials of the PCB circuit boards and the difference of the conveying speed, and in most cases, the temperature in the reflow oven needs to be adjusted according to the experience of an operator, however, the strict property of the reflow oven is proved to have loopholes, and the reflow oven is not suitable for most operators, so that the actual welding effect of the PCB circuit board is greatly limited, the welding quality is influenced, and the use safety of the PCB circuit board is difficult to ensure.
Disclosure of Invention
In order to overcome the defects in the prior art, the application provides a high-efficiency display device for the temperature of a reflow oven, which aims to solve the technical problems that: at present, the temperature in the reflow oven is monitored and displayed to ensure the welding effect of the PCB circuit board in the reflow oven, but in actual operation and application, the temperature and the conveying speed are different due to the difference of the materials of the PCB circuit boards, the required temperature is different in the period, and in most cases, the temperature in the reflow oven needs to be adjusted according to the experience of an operator, however, the strict nature of the reflow oven is proved to have loopholes, and the reflow oven is not suitable for most operators, so that the actual welding effect of the PCB circuit board is greatly limited, the welding quality is influenced, and the safety problem in use is difficult to ensure.
In order to achieve the above purpose, the present application provides the following technical solutions: the utility model provides a high-efficient display device of backward flow stove temperature, includes the backward flow stove body, the upper surface of backward flow stove body is provided with the backward flow stove controller, the upper surface of backward flow stove body is provided with the treater, the output of treater is connected with the input of backward flow stove body and backward flow stove controller respectively through the wire, the front of treater is provided with a plurality of control pipeline, the other end of a plurality of control pipeline all is connected with the upper surface fixed of backward flow stove body, the other end of control pipeline is located the backward flow stove body, the front of backward flow stove body is provided with a plurality of cabin door, the slot has been seted up to the left surface of backward flow stove body, the output of treater is connected with the input of data processing center, the output of data processing center is connected with the input of integration module and data collection module respectively, the input of integration module and data collection module are all connected with the input of parameter comparison module respectively, the output of parameter comparison module is connected with the input of data collection module and calculation module respectively, the output of data collection module is connected with the input of calculation module through the temperature control module and the input of data processing center, the temperature control module is connected with the input of calculation module and the input of calculation module respectively, the output end of the feedback module is electrically connected with the input end of the processor.
As a further aspect of the application: the temperature acquisition module comprises a heating area acquisition module, a constant temperature area acquisition module and a cooling area acquisition module.
As a further aspect of the application: the temperature rising area collecting module is used for collecting the temperature of a temperature rising area, the purpose of the temperature rising area is to heat a product in a furnace chamber, but the temperature rising area cannot be heated too fast, otherwise, a PCB board or a component is burnt, a solvent in welding flux is lost fast, the welding quality is reduced, and meanwhile, the temperature rising is not too slow, and an active agent cannot reach enough temperature, so that the temperature rising slope of the temperature rising area is set differently according to different used solder pastes, the slope of the solder paste is generally 1-2 ℃/S, the constant temperature area collecting module is used for collecting the temperature of a constant temperature area, the constant temperature area has two purposes, firstly, the active agent flows along with rosin through heating, reacts with oxides on the surface of a welded metal, the weldability of the surface of the welded metal is ensured during welding, secondly, all components on the PCB reach the same temperature before the welding stage, but because the heat absorption capacity of the components on the PCB is greatly different, the components are required to absorb heat fully, the cooling area acquisition module is used for acquiring the temperature of a cooling area, the cooling area aims to accelerate solidification of molten solder to form a welding point with high hardness, high strength and good glossiness, but the cooling speed is too high to cause too high temperature difference between a substrate and the components, a thermal expansion mismatch condition is generated, the substrate is deformed or the welding point and the welding point are split, the welding point is fused in solder due to too low cooling speed, cu30Sn8 and Cu3Sn are increased, a dull and rough welding point appears, and the cooling slope is generally (3-5) DEG C/S and is cooled to below 100 ℃ according to the difference of solder paste.
As a further aspect of the application: the temperature curve display module is used for detecting the temperatures in the heating area acquisition module, the constant temperature area acquisition module and the cooling area acquisition module, correspondingly displaying the welding condition and the temperature of the PCB circuit board in the corresponding temperatures in a temperature curve mode, and the transmission module is used for transmitting the PCB circuit board in the reflow oven body and penetrating the PCB circuit board through different areas so as to finish welding the PCB circuit board.
As a further aspect of the application: the feedback module collects and feeds back the state and the temperature which are displayed by the PCB when the PCB passes through different areas in the conveying process, and synchronously transmits the state and the temperature to the processor, and the data processing center collects and stores the data transmitted to the feedback module and timely transmits the data when the data are required to be compared or integrated.
As a further aspect of the application: the data collection module collects data in the network, when the situation that the data are identical to the current processed PCB is met, the processed data are transmitted to the parameter comparison module, the integration module collects current data collected by the data processing center and transmits the current data to the parameter comparison module, the parameter comparison module collects and uniformly compares the optimal network situation and the actual situation of the current PCB and transmits the optimal network situation and the actual situation of the current PCB to the calculation module, the calculation module compares the data in the network with the actual data to obtain a scheme for selecting the difference, and the scheme data and the PCB processed data obtained by the scheme are respectively transmitted to the temperature control module and the processor.
According to the above scheme, attention is paid to the following problems:
A. the rail transport speed, the temperature of each temperature zone cannot be changed at will, and the temperature of the temperature zone and the speed of the conveyor belt are matched.
B. The time interval of the circuit board entering the warm area cannot be too short, and the interval between two circuit boards is generally about 500mm or more.
C. The stirring time of the solder paste cannot be too long, otherwise, when the solder paste is brushed, the dense tube legs are easy to short.
D. The purpose of the solder paste is to return to room temperature, and the actual temperature of the solder paste can be measured by using a digital meter when uncertainty is caused, if the solder paste does not return to room temperature and is opened, moisture in the air can be absorbed, and tin balls are formed during welding.
E. The temperature and humidity of the solder paste printing and mounting area should meet the process requirements, otherwise the welding quality is affected.
The application has the beneficial effects that:
according to the application, the parameter comparison module, the data collection module and the integration module are arranged, when the situation same as the situation of the current processed PCB is met, the processing data are transmitted into the parameter comparison module, the integration module collects the current data collected by the data processing center and transmits the current data into the parameter comparison module, and the parameter comparison module collects and uniformly compares the optimal network situation and the actual situation of the current PCB and transmits the current data into the calculation module, so that the calculation module compares the data in the network with the actual data to obtain a scheme for selecting the difference, and transmits the scheme data and the PCB processing data obtained by the scheme into the temperature control module and the processor respectively, so that the display device can obtain the optimal data of the current PCB processing through the data situation experimental by the display device after the PCB is processed for a plurality of times, the defect of PCB processing caused by experience or network data of a user is avoided, and the welding effect of the PCB body on the PCB and the safety during use are provided.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of the present application;
FIG. 2 is a system block diagram of the present application;
FIG. 3 is a system block diagram of a temperature acquisition module of the present application;
in the figure: the device comprises a reflow oven body 1, a reflow oven controller 2, a processor 3, a monitoring pipeline 4, a cabin door 5, a slot 6, a data processing center 7, an integration module 8, a data collection module 9, a parameter comparison module 10, an algorithm module 11, a temperature control module 12, a temperature curve display module 13, a transmission module 14, a temperature acquisition module 15, a heating area acquisition module 151, a constant temperature area acquisition module 152, a cooling area acquisition module 153 and a feedback module 16.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1-3, the application provides a high-efficiency reflow oven temperature display device, which comprises a reflow oven body 1, wherein the upper surface of the reflow oven body 1 is provided with a reflow oven controller 2, the upper surface of the reflow oven body 1 is provided with a processor 3, the output end of the processor 3 is respectively and electrically connected with the input ends of the reflow oven body 1 and the reflow oven controller 2 through wires, the front surface of the processor 3 is provided with a plurality of monitoring pipelines 4, the other ends of the plurality of monitoring pipelines 4 are fixedly connected with the upper surface of the reflow oven body 1, the other ends of the monitoring pipelines 4 are positioned in the reflow oven body 1, the front surface of the reflow oven body 1 is provided with a plurality of cabin doors 5, the left side surface of the reflow oven body 1 is provided with a slot 6, the output end of the processor 3 is electrically connected with the input end of a data processing center 7, the output end of the data processing center 7 is respectively and electrically connected with the input ends of an integrating module 8 and a data collecting module 9, the input ends of the integrating module 8 and the data collecting module 9 are respectively and electrically connected with the input ends of a parameter comparing module 10, the output ends of the parameter comparing module 10 are respectively and electrically connected with the input ends of a temperature controlling module 12 of the data collecting module 11 and a temperature controlling module 12 of the temperature controlling module 13, the temperature comparing module is electrically connected with the input end of the temperature controlling module 13 and the temperature controlling module 13 of the temperature controlling module is electrically connected with the input end of the temperature controlling module 7 and the temperature controlling module 12 of the temperature controlling module through the data collecting module 13, the output ends of the temperature acquisition module 15 and the transmission module 14 are electrically connected with the input end of the feedback module 16, and the output end of the feedback module 16 is electrically connected with the input end of the processor 3.
The temperature acquisition module 15 includes a temperature rise region acquisition module 151, a constant temperature region acquisition module 152, and a cooling region acquisition module 153.
The temperature-raising zone collection module 151 is used for collecting the temperature of a temperature-raising zone, the purpose of the temperature-raising zone is to heat a product in a furnace chamber, but the temperature-raising zone cannot be heated too fast, otherwise, a PCB board or a component can be burnt, the solvent in a welding flux can be lost fast, the welding quality is reduced, meanwhile, the temperature-raising is not too slow, and an active agent can not reach enough temperature, so that the temperature-raising slope of the temperature-raising zone is set differently according to different used tin pastes, the slope of the tin pastes is generally 1-2 ℃/S, the constant-temperature zone collection module 152 is used for collecting the temperature of a constant-temperature zone, the constant-temperature zone has two purposes, firstly, the active agent can react with oxides on the surface of a welded metal along with rosin by heating, the weldability of the surface of the welded metal is ensured, secondly, the same temperature can be ensured to be reached before the welding stage of all components on the PCB, but the heat absorption capacity of the components on the PCB is greatly different, the cooling zone collection module 153 is used for collecting the temperature of a cooling zone, the cooling zone is accelerated, the cooling zone is generally has the hardness, the cooling temperature of the cooling zone is generally 1-2 ℃/S, the cooling zone is higher than the cooling zone, the cooling zone is formed by the cooling zone is 5, the cooling zone is not expanded by the cooling zone is higher than the cooling zone, the cooling zone is 5, the cooling zone is not cooled by the cooling zone cooling pad, and the cooling zone is not expanded by the cooling zone is 5, the cooling zone is cooled by the cooling zone is 5, and has the cooling temperature, and has the cooling temperature gradient, and the cooling temperature is higher is the cooling temperature.
The temperature curve display module 13 is used for detecting the temperatures in the heating area acquisition module 151, the constant temperature area acquisition module 152 and the cooling area acquisition module 153, correspondingly displaying the welding condition and the temperature of the PCB circuit board in the corresponding temperatures in a temperature curve mode, and the transmission module 14 is used for transmitting the PCB circuit board in the reflow oven body 1 and penetrating the PCB circuit board through different areas so as to finish welding the PCB circuit board.
The feedback module 16 collects and feeds back the state and temperature of the PCB when the PCB passes through different areas in the transmission process, and synchronously transmits the state and temperature to the processor 3, and the data processing center 7 collects and stores the data transmitted thereto and timely transmits the data when the data needs to be compared or integrated.
The data collection module 9 collects data in a network, when the situation that the data are identical to the current processed PCB is met, the processed data are transmitted to the parameter comparison module 10, the integration module 8 collects current data collected by the data processing center 7 and transmits the current data to the parameter comparison module 10, the parameter comparison module 10 collects and uniformly compares the optimal network situation and the actual situation of the current PCB and transmits the optimal network situation and the actual situation of the current PCB to the calculation module 11, the calculation module 11 compares the data in the network with the actual data to obtain a compromise selection scheme after difference, and the scheme data and the PCB processed data obtained by the scheme are respectively transmitted to the temperature control module 12 and the processor 3.
According to the above scheme, attention is paid to the following problems:
A. the rail transport speed, the temperature of each temperature zone cannot be changed at will, and the temperature of the temperature zone and the speed of the conveyor belt are matched.
B. The time interval of the circuit board entering the warm area cannot be too short, and the interval between two circuit boards is generally about 500mm or more.
C. The stirring time of the solder paste cannot be too long, otherwise, when the solder paste is brushed, the dense tube legs are easy to short.
D. The purpose of the solder paste is to return to room temperature, and the actual temperature of the solder paste can be measured by using a digital meter when uncertainty is caused, if the solder paste does not return to room temperature and is opened, moisture in the air can be absorbed, and tin balls are formed during welding.
E. The temperature and humidity of the solder paste printing and mounting area should meet the process requirements, otherwise the welding quality is affected.
Through setting up parameter contrast module 10, data collection module 9 and integration module 8 for this display device can obtain the best data of current PCB circuit board processing through the data condition that self experiments after processing PCB circuit board many times, avoid leading to the processing of PCB circuit board to have the defect through user's experience or network data, when having ensured this display device actual use effect, provided the welding effect of reflow oven body 1 to PCB circuit board and the security when using.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (6)
1. The utility model provides a high-efficient display device of backward flow stove temperature, includes backward flow stove body (1), its characterized in that: the upper surface of the reflow oven body (1) is provided with a reflow oven controller (2), the upper surface of the reflow oven body (1) is provided with a processor (3), the output end of the processor (3) is respectively and electrically connected with the input ends of the reflow oven body (1) and the reflow oven controller (2) through wires, the front surface of the processor (3) is provided with a plurality of monitoring pipelines (4), the other ends of the plurality of monitoring pipelines (4) are fixedly connected with the upper surface of the reflow oven body (1), the other ends of the monitoring pipelines (4) are positioned in the reflow oven body (1), the front surface of the reflow oven body (1) is provided with a plurality of cabin doors (5), the left side surface of the reflow oven body (1) is provided with a slot (6), the output end of the processor (3) is electrically connected with the input end of a data processing center (7), the output end of the data processing center (7) is respectively and electrically connected with the input ends of an integrating module (8) and a data collecting module (9), the other ends of the integrating module (8) and the data collecting module (9) are respectively and the input ends of a data collecting module (10) are electrically connected with the input end of the integrating module (10 respectively and the data collecting module (10), the output of data collection module (9) is connected with the input electricity of treater (3) through data processing center (7), the input of calculation module (11) is connected with the input electricity of parameter contrast module (10) and control by temperature change module (12) respectively, the input of control by temperature change module (12) is connected with the output electricity of treater (3), the output of control by temperature change module (12) is connected with the input electricity of temperature curve display module (13), the input of temperature curve display module (13) is connected with the input electricity of delivery module (14) and temperature acquisition module (15) respectively, the output of temperature acquisition module (15) and delivery module (14) is connected with the input electricity of feedback module (16) all, the output of feedback module (16) is connected with the input electricity of treater (3).
2. The efficient reflow oven temperature display device according to claim 1, wherein: the temperature acquisition module (15) comprises a heating area acquisition module (151), a constant temperature area acquisition module (152) and a cooling area acquisition module (153).
3. The high-efficiency reflow oven temperature display device according to claim 2, wherein: the temperature-raising zone acquisition module (151) is used for acquiring the temperature of a temperature-raising zone, the purpose of the temperature-raising zone is to heat a product in the furnace chamber, the constant temperature zone acquisition module (152) is used for acquiring the temperature of a constant temperature zone, and the constant temperature zone has two purposes;
the purpose is as follows: the active agent flows along with rosin through heating to react with oxide on the surface of the welded metal, so that the weldability of the surface of the welded metal during welding is ensured;
second purpose is: ensuring that all components on the PCB reach the same temperature before the welding stage;
the cooling zone acquisition module (153) is used for acquiring the temperature of a cooling zone, and the purpose of the cooling zone is to accelerate solidification of molten solder.
4. The high-efficiency reflow oven temperature display device according to claim 2, wherein: the temperature curve display module (13) is used for detecting temperatures in the heating area acquisition module (151), the constant temperature area acquisition module (152) and the cooling area acquisition module (153) and correspondingly displaying welding conditions and temperatures of the PCB circuit boards in corresponding temperatures in a temperature curve mode, and the conveying module (14) is used for conveying the PCB circuit boards in the reflow oven body (1) and penetrating the PCB circuit boards through different areas so as to finish welding the PCB circuit boards.
5. The efficient reflow oven temperature display device according to claim 1, wherein: the feedback module (16) collects and feeds back the state and the temperature represented by the PCB circuit board in the conveying process when the PCB circuit board passes through different areas, the state and the temperature are synchronously transmitted into the processor (3), and the data processing center (7) collects and stores the data transmitted to the data processing center and timely transmits the data when the data are required to be compared or integrated.
6. The efficient reflow oven temperature display device according to claim 1, wherein: the data collection module (9) collects data in a network, when the situation that the data are identical to the current processed PCB is met, the processed data are transmitted into the parameter comparison module (10), the integration module (8) collects the current data collected by the data processing center (7) and transmits the current data into the parameter comparison module (10), the parameter comparison module (10) collects and uniformly compares the optimal network situation and the actual situation of the current PCB and transmits the optimal network situation and the actual situation into the calculation module (11), and the calculation module (11) compares the data in the network with the actual data to obtain a compromise selection scheme after the difference, and the scheme data and the PCB processed data obtained by the scheme are respectively transmitted into the temperature control module (12) and the processor (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210797842.9A CN115178825B (en) | 2022-07-06 | 2022-07-06 | High-efficient display device of backward flow stove temperature |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210797842.9A CN115178825B (en) | 2022-07-06 | 2022-07-06 | High-efficient display device of backward flow stove temperature |
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| Publication Number | Publication Date |
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| CN115178825A CN115178825A (en) | 2022-10-14 |
| CN115178825B true CN115178825B (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210797842.9A Active CN115178825B (en) | 2022-07-06 | 2022-07-06 | High-efficient display device of backward flow stove temperature |
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| JP2018085485A (en) * | 2016-11-25 | 2018-05-31 | 富士通株式会社 | Reflow soldering device, and reflow treatment method |
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| CN112872527A (en) * | 2021-01-12 | 2021-06-01 | 山东师范大学 | Welding method and system based on central temperature prediction curve of reflow soldering area |
| CN113051327A (en) * | 2021-03-29 | 2021-06-29 | 武汉艺洁环保科技有限公司 | Instrument data automatic acquisition multi-stage processing system |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55139171A (en) * | 1979-09-21 | 1980-10-30 | Sekisui Chem Co Ltd | Manufacturing apparatus of solar heat collecting plate |
| JP2000190074A (en) * | 1998-12-22 | 2000-07-11 | Matsushita Electric Ind Co Ltd | High temperature solder dip treatment device |
| CN201455487U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
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| CN112872527A (en) * | 2021-01-12 | 2021-06-01 | 山东师范大学 | Welding method and system based on central temperature prediction curve of reflow soldering area |
| CN113051327A (en) * | 2021-03-29 | 2021-06-29 | 武汉艺洁环保科技有限公司 | Instrument data automatic acquisition multi-stage processing system |
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| CN115178825A (en) | 2022-10-14 |
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