CN101799428B - Ball grid array welding spot remelting test method - Google Patents
Ball grid array welding spot remelting test method Download PDFInfo
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- CN101799428B CN101799428B CN 201010147980 CN201010147980A CN101799428B CN 101799428 B CN101799428 B CN 101799428B CN 201010147980 CN201010147980 CN 201010147980 CN 201010147980 A CN201010147980 A CN 201010147980A CN 101799428 B CN101799428 B CN 101799428B
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Abstract
The invention relates to a ball grid array welding spot remelting test method comprising the following steps: using a marking device to make marks on ball grid array welding points which are welded and arranged on a designated area or one surface of a circuit board; obtaining the mark image and storing; finishing ball grid array welding other areas on the circuit board with a on the other surface; obtaining the mark image again; and comparing with the obtained image. The invention also relates to a marking device used in the above method. The ball grid array welding spot remelting test method and the marking device of the invention have the beneficial effect that the invention is favourable for adjusting production steps as early as possible and adopt effective measures so as to eliminate unreliable welding hidden dangers and improve production quality.
Description
Technical field
The device that the present invention relates to method of testing and use in the method more particularly, relates to a kind of ball grid array welding spot remelting test.
Background technology
Along with the miniaturization of electronic product, multifunction with and circuit board on the components and parts densification, (BGA Ball Grid Array, BGA) application of packaging is more and more widely for BGA.Complicated along with electronic product; The circuit board of two-sided layout BGA; The negative and positive jigsaw processing mode that comprises the BGA device also gets more and more (this technology is the processing technology of mobile phone board main flow), and simultaneously, the circuit board of positive Reflow Soldering, back side wave-soldering technology is also just by large batch of employing.Because these circuit boards are adding meeting twice entering tin stove welding (twice Reflow Soldering or wave-soldering of a Reflow Soldering) usually in man-hour, the BGA device unavoidably occurs and bear secondary back welding high temperature or wave-soldering welding high temperature.Common situation comprises: two-sided all layouts have the circuit board of BGA device; When welding second through reflow ovens; If first BGA device does not adopt provision for thermal insulation; First BGA device stands reflow soldering high temperature again one time, can cause soldered ball remelting (after remelting refers to that the BGA solder joint is welded on the circuit board, the BGA soldered ball that causes of in subsequent technique, being heated/fusing once more); Circuit board for single face layout BGA device; Assembling process is to adopt the mode of negative and positive jigsaw to add man-hour; If the BGA device is not adopted provision for thermal insulation, must there be a BGA device on the cell board will experience the high temperature of twice reflow soldering, also can cause the remelting of BGA soldered ball.Tin just might appear moving back in the BGA solder joint generation remelting (mainly being at twice) of twice high temperature or the encapsulation distortion causes the solder joint cracking if stand.Because the solder joint of BGA device is positioned at the device package bottom; Solder joint is invisible; So the process inspection of BGA device solder joint just becomes the difficult point in the production run; The method of at present common detection to the BGA solder joint is an X-ray check, but X-ray check can only carry out off-line analysis, and the variation that takes place for BGA solder joint in the packaging technology process then can't detect.Therefore existing method of testing all can't realize on-line testing, and for BGA solder joint in the welding process whether remelting having taken place can't clearly judge, influence is to the accurate analysis of BGA welding point defect genesis mechanism.Simultaneously some to the demanding client of product reliability can require to assemble producer take provision for thermal insulation to the protection of BGA device to avoid the remelting of BGA solder joint; But whether effect of heat insulation has reached the effect of avoiding remelting, does not still have simple effective method directly to judge at present.
Summary of the invention
The technical matters that the present invention will solve is; Can't judge to the above-mentioned of prior art whether its BGA solder joint in welding for the second time the defective of remelting takes place in the board production process at the scene, provide a kind of and can judge in process of production whether its BGA solder joint that welds in advance a kind of ball grid array welding spot remelting test and the labelling apparatus of remelting take place when welding for the second time.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of ball grid array welding spot remelting test, comprise the steps:
A) the usage flag device accomplish welding, make a mark on the BGA solder joint of appointed area or one side on the circuit board;
B) obtain said marking image and preservation;
C) the BGA welding of other zones or another side on the said circuit board of completion;
D) obtain the image of above-mentioned mark once more, and with step B) in the image comparison that obtains.
In method of the present invention, said steps A) further comprises the steps: in
A1) welding of the BGA solder joint of appointed area or one side on the completion circuit board;
A2) marked region of the said weld pads of selection;
A3) use said labelling apparatus to make a mark at said marked region.
In method of the present invention, steps A 2) marked region comprises that said circuit board is carried out heat distribution analyzes the one or more BGA solder joints of having accomplished in the resulting highest temperature region described in; Said mark comprises the cut that uses said labelling apparatus on said solder joint, to obtain.
In method of the present invention, said step B) comprises the steps: in
B1) use electron microscope to obtain the image of said cut;
B2) image obtained of storage.
In method of the present invention, said step D) further comprise the steps:
D1) use electron microscope to obtain image through the said cut in other zones of said circuit board or another side welding back;
D2) image obtained of demonstration accesses step B simultaneously) in image stored and showing.
The invention still further relates to a kind of device that in said method, uses; Comprise labelling apparatus, this device comprises support, be used on the BGA solder joint, producing the cut mark the cut pen, through rotation axis be installed in said cantilever tip sleeve, be connected the handle of said sleeve one end and be connected the brace table that is used to support said each parts with said frame bottom; Said support and said sleeve are rotationally connected through said rotation axis; Said cut pen is connected with said sleeve through the pilot hole that is provided with on the said sleeve.
In device of the present invention, said sleeve rotates up and down around said rotation axis.
In device of the present invention, said pilot hole is the blind hole that is arranged on said sleeve one end.
In device of the present invention, also comprise be arranged on said blind hole bottom, when said cut pen work, be the spring that said sleeve and said cut pen provide certain elastic force.
In labelling apparatus of the present invention, the terminal end shape of outstanding said sleeve one end of said cut pen is the taper that is suitable on the BGA solder joint, producing the cut mark.
A kind of ball grid array welding spot remelting test of embodiment of the present invention and note device; Has following beneficial effect: make a mark owing to adopt on the BGA solder joint that formerly welds; And after welding for the second time relatively this mark whether different modes is arranged; Whether appropriate or effective, help regulating early production stage if just can judge welding temperature, weld interval or the provision for thermal insulation adopted immediately first good back of circuit board welding, take effective measures; Thereby eliminate the insecure hidden danger of welding, improve the quality of production.
Description of drawings
Fig. 1 is the process flow diagram of method of testing among a kind of ball grid array welding spot remelting test of the present invention and labelling apparatus first embodiment;
Fig. 2 is the structural representation of labelling apparatus among said first embodiment;
Fig. 3 is the process flow diagram of method of testing among a kind of ball grid array welding spot remelting test of the present invention and labelling apparatus second embodiment.
Embodiment
To combine accompanying drawing that the embodiment of the invention is described further below.
As shown in Figure 1, in a kind of ball grid array welding spot remelting test of the present invention and labelling apparatus first embodiment, whether the BGA solder joint of welding for the first time comprises the steps: during remelting when welding for the second time on its test decision circuitry plate
S11 welding is arranged in the BGA solder joint of circuit board one side: first embodiment be that all there is a bga device on a circuit board two sides or one side the bga device another side is arranged is the example of the device (being SMD) of surface encapsulation; Its common ground is; Such circuit board need carry out twice Reflow Soldering in process of production.Like this, after the Reflow Soldering second time, just need to judge whether the formed BGA solder joint of Reflow Soldering for the first time exists the phenomenon of remelting,, need search reason immediately, eliminate the remelting phenomenon if there is the phenomenon of remelting to take place.Otherwise the large-area maintenance of doing over again just possibly appear in the circuit board of producing, and can cause components from being damaged when serious.In this step; Welding is positioned at the BGA solder joint of circuit board one side; Exactly through the brush tin cream, put basic step such as components and parts after, circuit board and device of being arranged on its one side through reflow process, are made it weld together and form the BGA solder joint in the position of setting.Wherein, settings such as Reflow Soldering temperature, time do not have difference with basic regulation of the prior art.
S12 selects BGA solder joint and usage flag device to make a mark: after simultaneously welding through above-mentioned steps S11 completion circuit board, in this step, select a marked region, be used to make a mark.Usually, this marked region should be accepted the maximum position of heat on circuit board, and this can obtain this position by the thermal map when the Reflow Soldering of circuit board.In the present embodiment, above-mentioned marked region be on the circuit board in the heat highest zone near a BGA solder joint of heat-proof device or material.If this solder joint does not have the problem of remelting when getting into Reflow Soldering for the second time, just there is not the problem of remelting in other solder joint equally yet.To also have a principle be will be convenient to observe in the selection of above-mentioned marked region in addition, so the solder joint of a BGA device ragged edge normally.Behind selected above-mentioned solder joint, the position between regulating circuit plate and the labelling apparatus, and use this labelling apparatus to make a mark.In the present embodiment, above-mentioned mark is to use the cut that labelling apparatus is made on above-mentioned selected solder joint.In the present embodiment, this cut is on selected marked region, to be produced and its direction is from the bottom to top or from top to bottom by above-mentioned labelling apparatus, just vertical direction.In other embodiment, the direction of above-mentioned cut also can be from left to right or from right to left, i.e. horizontal direction.
S13 obtains marking image and storage: in this step, use the above-mentioned mark of electron microscope observation that has camera function, obtain the image of this mark, and image is stored.
S14 takes provision for thermal insulation to above-mentioned established BGA solder joint: usually; Need twice during at circuit board through Reflow Soldering; Can it be difficult for by the high temperature melting of Reflow Soldering for the second time to the solder joint that forms for the first time thermal insulation protection in addition, bring short circuit in the welding, open circuit or the like.And in the present embodiment, why want test b GA solder joint whether the remelting phenomenon is arranged, to a certain extent; Whether also detect the above-mentioned provision for thermal insulation of taking just effective; If this measure is effective, just remelting can not take place, can continue to produce and do not worry occurring problems of welded quality; If this measure is invalid or effect is little, then remelting can appear, need to solve immediately, otherwise, be bound to occur problems of welded quality.In the present embodiment, the provision for thermal insulation of taking is to use resistant to elevated temperatures gummed paper to stick on the solder joint that forms above-mentioned for the first time, stops or part stops on the solder joint that heat transferred welded to these.
The S15 welding is arranged in the BGA solder joint of circuit board another side: in this step; Same through the brush tin cream, put basic step such as components and parts after; Circuit board and the device that is arranged on its another side through reflow process, are made it weld together and form the BGA solder joint in the position of setting.Wherein, settings such as Reflow Soldering temperature, time do not have difference with basic regulation of the prior art.
S16 obtains through the marking image of welding once more, and with step S13 in the image obtained relatively: in this step, circuit board through twice Reflow Soldering, needs the components and parts of reflow soldering all to weld.After treating the circuit board cooling, remove in the above-mentioned steps and paste to get on, utilize the electron microscope of band shooting pattern once more as heat insulation high tempreture tape; To the mark shooting of making among the step S12; Obtain its image, and access the image of obtaining among the step S13, contrast above-mentioned two images; If above-mentioned two image differences then are illustrated in the board production process remelting have taken place; If two images are identical, then are illustrated in remelting does not take place in the board production process.In the present embodiment, the display device that is employed in electron microscope progressively makes the method for above-mentioned two doublings of the image judge whether these two images are consistent.During judgement, if the complete remelting of whole solder joint and solidifying is again represented in the cut complete obiteration; The cut occurrence positions changes and alteration of form, as the edge become slick and sly, the cut displaced, partial remelting taken place in expression; Both of these case representes that all remelting has taken place solder joint, and the inner structure of solder joint all can change, and reliability that all can solder joint exerts an influence.
In the present embodiment, also disclosed a kind of labelling apparatus of on the BGA solder joint, making a mark of being used for, as shown in Figure 2; Above-mentioned labelling apparatus comprises brace table 1, support 2, sleeve 3, rotation axis 4, cut pin 5, handle 6, spring 7 and baffle plate 8, and wherein above-mentioned brace table 1 is used to hold the circuit board of placing each part mentioned above and need making a mark to the BGA solder joint on it, and an end of support 2 is fixed on the brace table 1; The other end of support 2 is provided with rotation axis 4; Sleeve 3 is connected on the rotation axis 4, and like this, sleeve 3 just is rotationally connected through rotation axis 4 and support 2; And being set to the position of the center section through sleeve 3, above-mentioned rotation axis 4 is connected with support 2; When sleeve 3 is received external force up or down, will be axle with above-mentioned rotation axis 4, rotation up or down; For more laborsaving or more convenient ground turnbarrel 3, the handle 6 that is fixedly connected with it is set in the rear end of sleeve 3.In first embodiment, cut pin 5 flexibly connects with above-mentioned sleeve 3, and the coupling part is the front end of sleeve 3; Particularly; In first embodiment; The front end of sleeve is provided with along the axial blind hole 31 of sleeve 3, and cut pin 5 parts are put into blind hole 31, and part is stretched out blind hole 31; The cross sectional shape of blind hole 5, size and cut pin 5 insert into the inner the part shape, size suitable, make cut pin 5 can along this blind hole 31 axially move forward and backward and don't meeting about squint; Be provided with spring 7 in above-mentioned blind hole 31 bottoms; When cut pin 5 is mobile backward along blind hole 31, compress the spring 7 between blind hole 31 bottoms and cut pin 5, spring 7 pressurizeds produce certain elastic force; Make cut pin 31 keep certain pressure, be convenient on the BGA solder joint, make cut (mark); In addition, in the present embodiment, above-mentioned cut pin 5 is provided with a convexity in the middle; And sleeve 3 end faces at blind hole 31 place be provided with one with above-mentioned raised position, the suitable groove of size; The degree of depth of this groove is greater than the projection thickness on the cut pin 5, and in the time of in cut pin 5 is assemblied in above-mentioned blind hole 31, above-mentioned convexity is positioned at above-mentioned groove; And be encapsulated in this groove through the baffle plate 8 that is arranged on sleeve 3 end faces, baffle plate is provided with through hole makes the non-bossing on the cut pin 5 stretch out; It is exactly the distance that cut pin 5 can move in blind hole 31 that the degree of depth of above-mentioned groove deducts protruding thickness.In addition; In first embodiment, the part that cut pin 5 contacts with the BGA solder joint (promptly on the BGA solder joint, making the part of cut) is the end points 51 of cut pin 5, and is as shown in Figure 2; Above-mentioned end points 51 be shaped as a taper, this shape is convenient to cut pin 5 and on solder joint, is made cut.
In first embodiment, when the BGA soldered ball is done the cut operation, move left and right pcb board on above-mentioned brace table 1; Cut pin 5 is contacted with the BGA soldered ball, and keep certain contact force, then pcb board is fixed on the brace table 1; Swing handle 6 is made cut on selected BGA solder joint, and with the microscope of professional band image camera function scored area is taken pictures; Take original cut image, and the image of obtaining is stored; Then, carry out corresponding reflow soldering process, treat to take pictures with the cut position of above-mentioned microscope after again after its heating process is accomplished, obtain its image thermal process; The variation of cut position just can judge whether solder joint remelting has taken place before and after the comparative analysis thermal process.In addition, when the BGA soldered ball that connects in butt welding is done cut and handled, get final product about scratch depth 0.3-0.5mm, the cut position, is convenient to microscopic examination and is taken pictures for well with 1/3rd positions, BGA soldered ball centre.In the present embodiment, adopt vertical (vertical direction) cut, in other embodiments, also can adopt laterally (horizontal direction) cut.
Fig. 3 is the process flow diagram in the second embodiment of the present invention; Comprise step S31, S32, S33, S34, S35 and S36 therebetween; These steps are corresponding with step S11, S12, S13, S14, S15 and S16 respectively, and except that step S15 and S35 were slightly different, other steps were roughly the same; And the difference of step S15 and S35 also only is in step S15, when the circuit board secondary is heated, employing be Reflow Soldering, and among the step S35, when the circuit board secondary is heated, employing be wave-soldering.This is the different difference of bringing of components and parts that adopted owing to circuit board itself.During specific to the judgement relevant, do not have too many difference with the present invention.In addition, second embodiment and first embodiment are roughly the same, repeat no more at this.
The above embodiment has only expressed several kinds of embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with accompanying claims.
Claims (3)
1. a ball grid array welding spot remelting test is characterized in that, comprises the steps:
A) the usage flag device accomplish welding, make a mark on the BGA solder joint of appointed area or one side on the circuit board;
B) obtain said marking image and preservation;
C) the BGA welding of other zones or another side on the said circuit board of completion;
D) obtain the image of above-mentioned mark once more, and with step B) in the image comparison that obtains;
Said steps A) further comprises the steps: in
A1) welding of the BGA solder joint of appointed area or one side on the completion circuit board;
A2) marked region of the said weld pads of selection;
A3) use said labelling apparatus to make a mark at said marked region;
Steps A 2) marked region described in comprises that said circuit board is carried out heat distribution analyzes the one or more BGA solder joints of having accomplished in the resulting highest temperature region; The cut that said mark is to use said labelling apparatus on said solder joint, to obtain;
Said labelling apparatus comprises support, be used on the BGA solder joint, producing the cut mark the cut pen, through rotation axis be installed in said cantilever tip sleeve, be connected the handle of said sleeve one end and be connected the brace table that is used to support said each parts with said frame bottom; Said support and said sleeve are rotationally connected through said rotation axis; Said cut pen is connected with said sleeve through the pilot hole that is provided with on the said sleeve; Said sleeve rotates up and down around said rotation axis; Said pilot hole is the blind hole that is arranged on said sleeve one end; Also comprise be arranged on said blind hole bottom, when said cut pen work, be the spring that said sleeve and said cut pen provide certain elastic force; The terminal end shape of outstanding said sleeve one end of said cut pen is the taper that is suitable on the BGA solder joint, producing the cut mark.
2. method according to claim 1 is characterized in that, said step B) in comprise the steps:
B1) use electron microscope to obtain the image of said cut;
B2) image obtained of storage.
3. method according to claim 2 is characterized in that, said step D) further comprise the steps:
D1) use electron microscope to obtain image through the said cut in other zones of said circuit board or another side welding back;
D2) image obtained of demonstration accesses step B simultaneously) in image stored and showing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010147980 CN101799428B (en) | 2010-04-09 | 2010-04-09 | Ball grid array welding spot remelting test method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010147980 CN101799428B (en) | 2010-04-09 | 2010-04-09 | Ball grid array welding spot remelting test method |
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| Publication Number | Publication Date |
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| CN101799428A CN101799428A (en) | 2010-08-11 |
| CN101799428B true CN101799428B (en) | 2012-06-06 |
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| CN 201010147980 Expired - Fee Related CN101799428B (en) | 2010-04-09 | 2010-04-09 | Ball grid array welding spot remelting test method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543151B (en) * | 2013-09-29 | 2017-04-05 | 广东工业大学 | A kind of measuring method of the printed circuit board (PCB) based on microsection bianry image |
| CN111781056B (en) * | 2020-09-07 | 2020-12-04 | 爱德曼氢能源装备有限公司 | Fuel cell stack and circuit board welding spot testing device |
| CN113466660B (en) * | 2021-06-28 | 2022-09-30 | 中国科学技术大学 | Method for detecting reliability of board-level BGA package under fire smoke |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502970A (en) * | 2002-11-21 | 2004-06-09 | ��ʿͨ��ʽ���� | Characteristic value calculation for welding detection |
| CN1590991A (en) * | 2003-09-05 | 2005-03-09 | 英业达股份有限公司 | Method of reducing automatic optical inspection machine misinterpretation rate |
| CN101411252A (en) * | 2006-03-31 | 2009-04-15 | 松下电器产业株式会社 | Circuit board, method for testing circuit board, and method for manufacturing circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170085A (en) * | 1990-11-02 | 1992-06-17 | Matsushita Electric Ind Co Ltd | Reflow soldering method and electronic part |
| KR100586522B1 (en) * | 2004-03-17 | 2006-06-07 | 삼성전자주식회사 | PCB work-system |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1502970A (en) * | 2002-11-21 | 2004-06-09 | ��ʿͨ��ʽ���� | Characteristic value calculation for welding detection |
| CN1590991A (en) * | 2003-09-05 | 2005-03-09 | 英业达股份有限公司 | Method of reducing automatic optical inspection machine misinterpretation rate |
| CN101411252A (en) * | 2006-03-31 | 2009-04-15 | 松下电器产业株式会社 | Circuit board, method for testing circuit board, and method for manufacturing circuit board |
Non-Patent Citations (1)
| Title |
|---|
| JP平4-170085A 1992.06.17 |
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