CN210142754U - Pin header assembly device capable of improving welding quality - Google Patents
Pin header assembly device capable of improving welding quality Download PDFInfo
- Publication number
- CN210142754U CN210142754U CN201921218419.9U CN201921218419U CN210142754U CN 210142754 U CN210142754 U CN 210142754U CN 201921218419 U CN201921218419 U CN 201921218419U CN 210142754 U CN210142754 U CN 210142754U
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- CN
- China
- Prior art keywords
- pin header
- welding quality
- injection molding
- assembly device
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003466 welding Methods 0.000 title claims abstract description 37
- 238000001746 injection moulding Methods 0.000 claims abstract description 26
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 238000004880 explosion Methods 0.000 abstract description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N Acetylene Chemical compound C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses an improve row's needle subassembly device of welding quality, including row's needle, injection molding, PCB board, and arrange the needle and pass injection molding, PCB board simultaneously to be in the same place injection molding, PCB board location, the logical groove that link up with the outside air is seted up to the bottom of injection molding for steam can follow the quick discharge that gives in logical groove among the wave-soldering process, thereby in order to improve welding quality. Change injection molding bottom boss into logical groove by the plane, lead to the groove and use the pin as the center and extend to two external directions and link up, the quick discharge that gives of two directions can be followed to steam among the wave-soldering process, has the gas permeable gap when guaranteeing the welding to improve welding tin liquid mobility and welding heat and effectively transmit to PCB board pad first-class scheme and solve welding gas pocket, tin explosion problem, improve whole welded quality.
Description
Technical Field
The utility model belongs to the technical field of PCB wave-soldering is relevant, especially, relate to an improve welding quality's row needle subassembly device.
Background
The pin header is generally used for connecting a PCB (printed circuit board), is widely applied to the PCB of electronics, electrical appliances and instruments, has the function of a bridge between the blocked part in a circuit or isolated and non-through circuits, plays a role of carrying current or signal transmission, is matched with the pin header for use to form a board-to-board connection or is matched with an electronic wire harness terminal for use, and has the external structure of an injection molding part and a pin for general household electrical appliance products, wherein one end of the pin is riveted in a flat boss of the injection molding part, and the other end of the pin is inserted in the PCB and is welded by wave soldering.
The feedback pin header (code: 42028000013) of the manual production manipulator frequently has air holes and has low welding efficiency, and the analysis and verification mainly cause that one surface of the pin header inserted into the hole of the PCB is of a plane structure and is tightly attached to the PCB after being normally inserted, no gap exists between a device and the PCB, no air flow channel exists on a boss at the bottom of the plastic pin header, and the defects of air holes and tin explosion of a welding point during welding are easily caused. The problem is easy to cause a large amount of tin beads generated during manual welding to remain on a PCB (printed Circuit Board) when the structural abnormality of the device is verified, and the problem that continuous tin short circuit and electromigration failure exist among pins is a core problem of product application failure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an improve welding quality's row needle subassembly device to solve the problem of background art.
In order to achieve the above object, the utility model discloses an improve welding quality's row needle subassembly device's concrete technical scheme as follows:
the utility model provides an improve row's needle subassembly device of welding quality, includes row's needle, injection molding, PCB board, and arranges the needle and pass injection molding, PCB board simultaneously to with injection molding, PCB board location together, the logical groove that link up with the outside air is seted up to the bottom of injection molding for the quick discharge that gives in logical groove can be followed to hot gas among the wave-soldering process, thereby in order to improve welding quality.
Furthermore, the through groove takes the pin of the pin header as the center, and extends along the width of the PCB and towards the two directions of the outside.
Furthermore, each row of pins are coaxially provided with a through groove, and the through grooves are distributed at equal intervals.
Further, the through groove is of a rectangular cavity structure.
Further, the through groove is of a semi-cylindrical cavity structure.
Furthermore, the width of the rectangular cavity structure is 0.4mm larger than the diameter of the pin header, and the height of the rectangular cavity structure is 0.3-0.35 cm.
Furthermore, a heat dissipation and ventilation pore canal which is communicated with each other is also arranged between every two adjacent through grooves, so that the unobstructed performance of hot air is improved.
Furthermore, at least four heat dissipation and ventilation pore passages are communicated between every two adjacent through grooves.
Furthermore, the pins of the pin header are phosphor copper pins which are not easy to heat.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. change injection molding bottom boss into logical groove by the plane, lead to the groove and use the pin as the center and extend to two external directions and link up, the quick discharge that gives of two directions can be followed to steam among the wave-soldering process, has the gas permeable gap when guaranteeing the welding to improve welding tin liquid mobility and welding heat and effectively transmit to PCB board pad first-class scheme and solve welding gas pocket, tin explosion problem.
2. Under the condition that does not change the original performance of row needle, change the stitch material into the phosphorus copper that is difficult for generating heat by brass, red copper that the heat conductivity is good, avoid the quick transmission of high temperature to lead to the injection molding to melt and step on the emergence of needle, the bad problem of length needle for the injection molding.
Drawings
FIG. 1 is a front view of a prior art pin header assembly arrangement;
FIG. 2 is a top view of a prior art pin header assembly arrangement;
FIG. 3 is a side view of a prior art pin header assembly arrangement;
fig. 4 is a front view of the pin header assembly apparatus of the present invention;
fig. 5 is a top view of the pin header assembly arrangement of the present invention;
fig. 6 is a side view of the pin header assembly arrangement of the present invention.
The reference numbers in the figures illustrate: the pin header comprises a pin header 1, an injection molding part 2, a PCB 3 and a through groove 4.
Detailed Description
For a better understanding of the objects, structure and function of the invention, reference should be made to the drawings, which are illustrated in fig. 1-6.
As shown in fig. 1-3, the existing pin header assembly device structure comprises a pin header 1, an injection molding part 2 and a PCB 3, wherein the pin header 1 simultaneously penetrates through the injection molding part 2 and the PCB 3, so that the injection molding part 2 and the PCB 3 are positioned together and welded by wave soldering, generally, one surface of the pin header 1 inserted into a hole of the PCB 3 is of a planar structure and is tightly attached to the PCB 3 after being normally inserted, no gap exists between a device and the PCB 3, no air flow channel exists on a boss at the bottom of plastic of the pin header 1, and the defects of air holes and tin explosion of a welding spot during welding are easily caused.
The utility model relates to a can solve the simple structure improvement of above-mentioned problem, its core innovation point lies in two points, include: the structure of the through groove 4 and the arrangement position of the through groove 4 are novel and outstanding; wherein, the through groove 4 can be a rectangular cavity structure or a semi-cylindrical cavity structure.
As shown in fig. 4-6, it is determined that the modified boss structure of the injection molded part 2 is provided with a through groove 4, which is centered on the pin and extends and is grooved in two directions, the depth of the groove is controlled to be 0.3-0.35cm, and the groove width is controlled to be L ═ needle diameter +0.4 mm. The logical groove 4 structure after the change has established the heat circulation channel, makes the heat can follow the quick outflow of the track of design, and quick the giving discharge of two directions can be followed to steam in the wave-soldering process, has the air gap when guaranteeing the welding, leads to the position that sets up of groove 4 to improve welding tin liquid mobility and welding heat and effectively transmit to the scheme such as 3 pads of PCB board and solve welding gas pocket, tin-frying problem.
Change 1 stitch material to arranging the needle, reduce the quick transmission of high temperature for injection molding 2, lead to the emergence of injection molding 2 melting problems, solve and step on needle, length needle is bad.
Further optimization, the through grooves 4 are provided with mutually communicated heat dissipation and ventilation holes, so that the smooth performance of hot air is improved. At least four heat dissipation and ventilation channels are communicated between every two adjacent through grooves 4, so that hot air can conveniently circulate between every two adjacent through grooves 4, and local overhigh temperature is avoided.
The stitch material of the pin header 1 is changed, the red copper material has good heat conductivity, and the stitch is heated to reach the injection molding part 2 at the temperature, so that the injection molding part 2 is melted. According to the actual use condition, the phosphorus copper which is not easy to generate heat is adopted for replacement under the condition that the original performance of the pin header 1 is not changed, and the risk of high-temperature melting resistance and pin treading of the pin header 1 is improved from the material characteristics. The welding temperature of the wave soldering furnace is recommended to be 265-275 ℃, the welding time is less than 5 seconds as far as possible, and air cooling or extension wire body natural cooling is adopted after welding.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.
Claims (9)
1. The utility model provides an improve needle subassembly device of arranging of welding quality, includes row needle (1), injection molding (2), PCB board (3), and row needle (1) passes injection molding (2), PCB board (3) simultaneously to with injection molding (2), PCB board (3) location together, its characterized in that: the bottom of injection molding (2) is seted up logical groove (4) that link up with the outside air for quick discharge in order to improve welding quality can be followed from leading to groove (4) to steam in the wave-soldering process.
2. The pin header assembly device for improving the welding quality according to claim 1, wherein the through slot (4) is centered on the pin of the pin header (1), extends along the width of the PCB (3) and towards the outside.
3. The needle bar assembly device for improving the welding quality according to claim 1, characterized in that a through groove (4) is coaxially arranged on each row of the needle bars (1), and the through grooves (4) are distributed at equal intervals.
4. The pin header assembly device for improving welding quality according to claim 2, wherein the through slot (4) has a rectangular cavity structure.
5. The pin header assembly device for improving welding quality according to claim 2, wherein the through slot (4) has a semi-cylindrical cavity structure.
6. The pin header assembly device for improving welding quality according to claim 4, wherein the width of the rectangular cavity structure is 0.4mm larger than the diameter of the pin header (1) and the height is 0.3-0.35 cm.
7. The pin header assembly device for improving welding quality according to claim 2, wherein a heat dissipation and ventilation hole channel is further formed between each two adjacent through grooves (4) to improve hot gas circulation performance.
8. The pin header assembly device for improving welding quality according to claim 7, wherein at least four heat dissipation ventilation channels are communicated between each adjacent through groove (4).
9. The pin header assembly device for improving welding quality according to any one of claims 1-8, characterized in that the pins of the pin header (1) are phosphor copper pins which are not easy to generate heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921218419.9U CN210142754U (en) | 2019-07-31 | 2019-07-31 | Pin header assembly device capable of improving welding quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921218419.9U CN210142754U (en) | 2019-07-31 | 2019-07-31 | Pin header assembly device capable of improving welding quality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210142754U true CN210142754U (en) | 2020-03-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921218419.9U Active CN210142754U (en) | 2019-07-31 | 2019-07-31 | Pin header assembly device capable of improving welding quality |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210142754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114759389A (en) * | 2022-03-23 | 2022-07-15 | 北京理工大学重庆创新中心 | On-vehicle ECU90 disconnect-type connector |
-
2019
- 2019-07-31 CN CN201921218419.9U patent/CN210142754U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114759389A (en) * | 2022-03-23 | 2022-07-15 | 北京理工大学重庆创新中心 | On-vehicle ECU90 disconnect-type connector |
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