TWI608889B - Welding equipment and welding method - Google Patents

Description

Welding device and welding method

The present invention relates to a welding device and a welding method, and more particularly to a welding device and a welding method for simultaneously heating and welding components of different volumes.

SMT is Surface Mounting Technology, which is the most popular process technology in the electronics assembly industry. It is a surface-mounted component with no lead or short lead mounted on the surface of a printed circuit board (hereinafter referred to as a PCB board), and then the component and the PCB board are soldered together by a solder paste alloy by reflow soldering; It compresses traditional components into devices of only a few tens of parts, enabling high density, high reliability, miniaturization, low cost, and automation of production for electronic product assembly.

Patent No. JP-A-1998-209630 A discloses a welding device (see Fig. 1 for details), comprising: a printed circuit board 1 and components 6, 7 respectively mounted on the upper and lower surfaces of the printed circuit board 1, through which holes are welded. 9 The heat of the body portion of the component 6 is released to prevent the component 6 from being burned at a high temperature during soldering. However, such a welding device can prevent the loss of heat by preventing the element 6 from being burned at a high temperature.

In the existing welding device, it is found that if the SMT component and the conventional plug-in (wave soldering) component are mounted on the PCB at the same time, since the volume difference between the two is several tens to several thousand times, the bulky component and volume in the process are large. Small components have different heating temperatures. When the temperature satisfies the small component, the bulky component cannot reach the melting temperature and cannot be soldered; When the size of the component is large, the small component is exposed to excessive temperature and burns, so how to balance the temperature of the bulky component and the small component during soldering and improve the heat utilization, which is for SMT The great challenge of the process.

The main technical feature of the present invention is to provide a welding device, comprising: a furnace body, wherein the furnace body is provided with a furnace chamber; a plurality of hot air nozzles are disposed at the bottom of the furnace chamber; at least one welding fixture is detachably mounted on the furnace Above the hot air nozzle, there is a gap between the at least one welding jig and the hot air nozzle, and the at least one welding jig is used for shielding and guiding when the plurality of hot air nozzles heat-weld at least two different volume elements The transfer of heat allows the at least two different volume elements to be welded simultaneously.

In the above welding device, each of the welding jigs of the at least one welding jig includes two vertical portions symmetrically disposed and a connecting portion connected to the two vertical portions, the two vertical portions being mounted on the hot air The gap is present between the lower surface of the connecting portion and the hot air nozzle on both sides of the nozzle.

In the above welding device, the PCB board is disposed above the upper surface of the connecting portion, and the PCB board is provided with the at least two different volume components, and the connecting portion is provided with at least one heat conducting through the connecting portion a slot, the heat conducting slot correspondingly disposed at a bottom of the relatively bulky component of the at least two different volume elements.

In the above welding device, the connecting portion is further provided with two shielding grooves, and the two shielding grooves are respectively located at two sides of the heat conducting groove.

In the above welding device, each of the welding fixtures includes two shielding strips respectively inserted into the two shielding slots, and the two shielding strips and the connecting portion guide heat to be transmitted through the heat conducting slot to the at least two different volumes. The bottom of the relatively bulky component of the component.

In the above welding device, the gap is between 5 mm and 8 mm.

Another technical feature of the present invention is to provide a welding method suitable for the above welding device, the welding method comprising the following steps: Step 1: mounting at least two different volume components on a PCB; Step 2: at least one The welding jig is installed above the plurality of hot air nozzles at the bottom of the furnace cavity of the furnace body of the welding device, and there is a gap between the at least one welding jig and the plurality of hot air nozzles; Step 3: the at least the device is installed The PCB board of the two different volume components is disposed above the at least one welding fixture, and the at least two different volume components are heated and welded by the hot air released by the plurality of hot air nozzles, wherein the at least one welding treatment The transmission for shielding and guiding heat during heating is such that the at least two different volume components simultaneously complete the welding.

In the above welding method, in the step 3, each of the welding fixtures of the at least one welding jig includes two vertical portions symmetrically disposed and a connecting portion connected to the two vertical portions, the two vertical portions Installed on both sides of the hot air nozzle, the gap exists between the lower surface of the connecting portion and the hot air nozzle.

In the above soldering method, in the step 3, the PCB board is disposed above the upper surface of the connecting portion, and the PCB board is provided with the at least two different volume components, and the connecting portion is provided with at least one through a heat conducting slot of the connecting portion, the heat conducting slot correspondingly disposed at a bottom of the relatively bulky component of the at least two different volume elements.

In the above welding method, in the step 3, the connecting portion is further provided with two shielding grooves, and the two shielding grooves are respectively located at two sides of the heat conducting groove.

In the above welding method, in the step 3, each of the welding fixtures comprises two shielding strips respectively inserted into the two shielding slots, and the two shielding strips and the connecting portion guide heat to be transmitted through the heat conducting slot to the The bottom of a relatively bulky element of at least two different volume elements.

The soldering method described above, further comprising the step 0 before the step 1, printing the cream solder onto the PCB.

The welding device and the welding method of the present invention are directed to the prior art, and the effects thereof are as follows: 1. By welding the jig, blocking the heat in the bottom region of the small component, and forcing the portion of the heat to be deflected to the bottom of the bulky component, increasing the volume of the component. The bottom part of the component is hot power; 2. The proper space is maintained between the welding fixture and the hot air nozzle to ensure hot air flow; 3. The welding fixture forces the hot air to flow only from the heat conduction groove designed at the bottom of the bulky component.

1‧‧‧Printed circuit board

11‧‧‧ furnace body

111‧‧‧The cavity

12‧‧‧ hot air nozzle

13‧‧‧ welding fixture

131‧‧‧Vertical

132‧‧‧Connecting Department

1321‧‧‧heat conduction slot

1322‧‧‧ occlusion slot

1323‧‧‧ lower surface

1324‧‧‧ upper surface

133‧‧‧ occlusion strip

14‧‧‧Printed circuit board (or PCB board)

6, 7, 15, 16‧‧‧ components

9‧‧‧ hole

Figure 1 is a schematic view showing the structure of a prior art welding device.

Figure 2 is a top view of the welding fixture of the present case.

Figure 3 is a side view of the welding jig of the present case.

Figure 4 is a schematic view showing the structure of the welding device of the present invention.

Figure 5 is a flow chart of the welding method of the present case.

The detailed description of the present invention and the technical description are further described in a preferred embodiment, but should not be construed as limiting the implementation of the present invention.

Please refer to Fig. 2 to Fig. 4, Fig. 2 is a top view of the welding jig of the present invention; Fig. 3 is a side view of the welding jig of the present invention; Fig. 4 is a structural schematic view of the welding device of the present invention. As shown in FIG. 2 to FIG. 4, the welding device of the present invention comprises a furnace body 11, a plurality of hot air nozzles 12 and at least one welding fixture; a furnace chamber 111 is disposed in the furnace body 11; and a plurality of hot air nozzles 12 are disposed in the furnace. a bottom portion of the cavity 111; at least one welding jig is detachably mounted above the plurality of hot air nozzles 12, a gap exists between the at least one welding jig and the hot air nozzle 12, and at least one welding jig is used for the plurality of hot air nozzles 12 Shielding and guiding heat transfer during heating welding of at least two different volume components, so that at least two different volume components are simultaneously completed welding.

Further, each of the welding fixtures 13 of the at least one welding fixture includes two vertical portions 131 symmetrically disposed, a connecting portion 132 connected to the two vertical portions 131, and two shielding strips 133; the two vertical portions 131 are mounted Provided on both sides of the hot air nozzle 12; a gap exists between the lower surface 1323 of the connecting portion 132 and the hot air nozzle 12, wherein the height of the gap is between 5 mm and 8 mm; and the PCB board 14 is disposed above the upper surface 1324 of the connecting portion 132. The PCB board 14 is provided with two different volume components 15 and 16, wherein the volume of the component 15 is larger than the volume of the component 16; the connecting portion 132 defines a heat conducting slot 1321 extending through the connecting portion 132, and the heat conducting slot 1321 is correspondingly disposed. The shielding portion 132 is further provided with two shielding slots 1322 extending through the connecting portion 132. The two shielding slots 1322 are respectively located at two sides of the heat conducting slot 1321; the two shielding strips 133 are respectively inserted into the two shielding slots. In 1322, the two shielding strips 133 and the connecting portion 132 guide heat to the bottom of the element 15 through the heat conducting groove 1322. The preferred embodiment is that the thickness of the two vertical portions 131 and the connecting portion 132 is 5 mm, but the present invention is not limited thereto.

It should be noted that the number of the welding jig, the heat conducting groove, the shielding groove and the shielding strip has been as described above in the above embodiments, but the present invention is not limited thereto. In other embodiments, the corresponding requirements of the designer may be change.

Please refer to Figure 5, which is a flow chart of the welding method of the present invention. The welding method as shown in Fig. 5 is applied to the welding device shown in Figs. 2 to 4, and the welding method of the present invention comprises the following steps:

Step 0: Printing the cream solder onto the PCB.

Step 1: Install at least two different volume components on the PCB.

Step 2: mounting at least one welding jig above a plurality of hot air nozzles at the bottom of the furnace cavity of the furnace body of the welding device, wherein there is a gap between the at least one welding jig and the plurality of hot air nozzles, wherein The gap system is between 5mm and 8mm, which is a preferred embodiment, but the case Not limited to this.

Step 3: disposing the PCB board with the at least two different volume components above the at least one welding fixture, and heating the at least two different volume components by the hot air released by the plurality of hot air nozzles Welding, wherein the at least one welding jig is used to heat the transmission of shielding and guiding heat during welding, so that the at least two different volume elements simultaneously complete the welding.

In the above welding method, in the step 3, each of the welding fixtures of the at least one welding jig includes two vertical portions symmetrically disposed and a connecting portion connected to the two vertical portions, the two vertical portions Installed on both sides of the hot air nozzle, the gap exists between the lower surface of the connecting portion and the hot air nozzle.

In the above welding method, in the step 3, the upper surface of the connecting portion is used for placing the PCB board with the at least two different volume components, and the connecting portion is provided with at least one penetrating through the connecting portion. a heat conducting slot correspondingly disposed at a bottom of the relatively bulky component of the at least two different volume elements.

In the above welding method, in the step 3, the connecting portion is further provided with two shielding grooves, and the two shielding grooves are respectively located at two sides of the heat conducting groove.

In the above welding method, in the step 3, each of the welding fixtures comprises two shielding strips respectively inserted into the two shielding slots, and the two shielding strips and the connecting portion guide heat to be transmitted through the heat conducting slot to the The bottom of a relatively bulky element of at least two different volume elements.

In the welding device and the welding method of the present invention, the component 15 is a connector RJ45 and the component 16 is a ball grid array (BGA) component. In actual implementation, the soldering temperatures of the two components are different from each other. The 74.55 degree is reduced to within 10 degrees Celsius and is fully compliant with the welding requirements of the SMT process.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the implementation of the present invention. A person skilled in the art can make various changes and modifications in accordance with the present invention without departing from the spirit and scope of the present invention, but such corresponding changes and modifications are intended to fall within the scope of the appended claims.

11‧‧‧ furnace body

111‧‧‧The cavity

12‧‧‧ hot air nozzle

132‧‧‧Connecting Department

1321‧‧‧heat conduction slot

1323‧‧‧ lower surface

1324‧‧‧ upper surface

133‧‧‧ occlusion strip

14‧‧‧Printed circuit board (or PCB board)

15, 16‧‧‧ components

Claims (10)

A welding device comprising: a furnace body, wherein the furnace body is provided with a furnace chamber; a plurality of hot air nozzles are disposed at the bottom of the furnace chamber; and at least one welding fixture is detachably mounted on the plurality of hot air nozzles The at least one welding fixture comprises a connecting portion, at least one heat conducting slot extending through the connecting portion, and two shielding slots. The two shielding slots are formed on the connecting portion and are respectively located at the two heat conducting slots a side; wherein there is a gap between the at least one welding fixture and the hot air nozzle, the at least one welding fixture is configured to shield and guide heat when the plurality of hot air nozzles heat-weld at least two different volume components The transmission is such that the at least two different volume elements are simultaneously welded. The welding device of claim 1, wherein each of the at least one welding fixture comprises two perpendicular portions symmetrically disposed and the connecting portion connected to the two vertical portions, the two The vertical portions are disposed on both sides of the hot air nozzle, and the gap exists between the lower surface of the connecting portion and the hot air nozzle. The soldering device of claim 2, wherein a printed circuit board is disposed above the upper surface of the connecting portion, the printed circuit board is provided with the at least two different volume components, and the heat conducting slot corresponds to The bottom portion of the relatively bulky element is disposed in the at least two different volume elements. The welding device of claim 3, wherein each of the welding fixtures comprises two shielding strips respectively inserted into the two shielding slots, and the two shielding strips and the connecting portion guide heat through the heat conducting slot. Transfer to the bottom of the relatively bulky element of the at least two different volume elements. The welding device of claim 1, wherein the gap is between 5 mm and 8mm. A welding method, which is applied to the welding device according to any one of the above claims, wherein the welding method comprises the steps of: step 1: mounting at least two different volume components on a printed circuit board; 2: mounting at least one welding fixture above a plurality of hot air nozzles at the bottom of a furnace chamber of a furnace body of the welding device, the at least one welding fixture comprising a connecting portion and at least one through the connecting portion a heat-conducting groove and two shielding grooves, the two shielding grooves are formed on the connecting portion and respectively located at two sides of the heat-conducting groove, and a gap exists between the at least one welding fixture and the plurality of hot air nozzles; Step 3: disposing the printed circuit board on which the at least two different volume components are mounted above the at least one welding fixture, and performing hot air released by the plurality of hot air nozzles on the at least two different volume components Heat welding, wherein the at least one welding fixture is used to heat the transmission of shielding and guiding heat during welding, so that the at least two different volume components simultaneously complete the welding. The welding method of claim 6, wherein in the step 3, each of the welding fixtures of the at least one welding fixture comprises two vertical portions symmetrically disposed and connected to the two vertical portions. The connecting portion is disposed on two sides of the hot air nozzle, and the gap exists between a lower surface of the connecting portion and the hot air nozzle. The soldering method according to claim 7, wherein in the step 3, the printed circuit board is disposed above the upper surface of the connecting portion, and the printed circuit board is provided with the at least two different volumes. An element, the heat conducting groove is correspondingly disposed at a bottom of the relatively bulky element of the at least two different volume elements. The welding method of claim 8, wherein in the step 3, each of the welding fixtures comprises two shielding strips, respectively inserted into the two shielding slots, the two shielding strips and the connecting portion Directing heat transfer through the heat transfer slot to the at least two different volume elements The bottom of a bulky component. The soldering method of claim 6, wherein the step 1 is further included before the step 1, and a cream solder is printed onto the printed circuit board.