CN202633555U - Connector for integrated circuit IC - Google Patents
Connector for integrated circuit IC Download PDFInfo
- Publication number
- CN202633555U CN202633555U CN 201120497975 CN201120497975U CN202633555U CN 202633555 U CN202633555 U CN 202633555U CN 201120497975 CN201120497975 CN 201120497975 CN 201120497975 U CN201120497975 U CN 201120497975U CN 202633555 U CN202633555 U CN 202633555U
- Authority
- CN
- China
- Prior art keywords
- connector
- soft
- integrated circuit
- heat conduction
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The utility model provides a connector for an integrated circuit IC, which is used for connecting the integrated circuit IC and a circuit board. A high-density flexible connector and a heat conductive material are combined, the integrated circuit IC, the new connector, and the circuit board are contacted closely by pressing the integrated circuit IC and the circuit board. Therefore, transmission of electric signals and reliability of heat conduction can be ensured. The new connector can not only provide a heat conduction channel at the lower part of the integrated circuit IC, such that the cooling channels are no longer singularized; but also can avoid negative phenomena such as pseudo soldering and bridge connection caused by the soldering technology as soldering is not needed. The integrated circuit IC can be disassembled and replaced freely.
Description
Affiliated technical field
The utility model relates to the IC field, is specifically related to a kind of novel connector and is used for being connected of IC and circuit board.
Background technology
The mode that generally adopts welding that is connected of current IC and circuit board bridge joint occurs but pin welds bad meeting, and bad phenomenon such as rosin joint have a strong impact on the welding quality of conductive channel, and it is unreliable to conduct electricity.And for example the too high meeting of temperature of fruit appearance welding causes damage to chip.In a single day damaging appears in IC in addition, because it is difficult for replacing through being welded to connect.On the other hand, present high-power IC all be on top through radiator heat-dissipation, the passage of bottom heat conduction is not provided, passage of heat is single, in the limited application in space, top heat conduction is difficulty more.Because the cause of IC heating can cause the IC pin to expand with heat and contract with cold, the pin welding point is burst apart, in addition to such an extent as to the IC cisco unity malfunction.
Summary of the invention
Be difficult for after the rosin joint that occurs in the welding process of existing IC and circuit board, bridge joint, the damage changing and the problem of the passage of heat of improvement IC.The utility model provides a kind of novel connector that need not to weld of bulk, and this novel connector not only can provide the passage of IC bottom heat conduction, the bad phenomenon of also having avoided welding procedure to bring.
The utility model solves the technical scheme that its technical problem adopted: use a novel connector, the integral body that this novel connector is combined and obtained by soft connector of high density and soft Heat Conduction Material.The soft connector of its middle-high density is to be used for the circuit of conducting IC, and the part of conduction is wire or the conductive micro-balloons in the soft connector of high density.Soft Heat Conduction Material is to be used for the bottom heat dissipation channel to IC being provided, and the soft Heat Conduction Material of heat process passes to the cooling mechanism of circuit board toward the bottom of IC, dispel the heat.The practical implementation method is that this novel connector is placed between IC and the circuit board; Wherein the soft connector of high density in this novel connector is placed corresponding to the below design of the conductive pin of IC, and the design below the IC encapsulation of soft Heat Conduction Material is placed.Use this novel connector not need welding, only need pressing between IC and circuit board, through the pressing contact this novel connector is closely contacted with IC and circuit board, make the transmission of electric signal and the transmission of heat reach perfect condition.
The beneficial effect of the utility model is: this novel connector not only can substitute welding and carry out the connection of circuit, owing to need not to weld bad phenomenon such as the rosin joint that can also avoid solder technology to cause, bridge joint, has guaranteed the reliability of conduction.When damaging appearred in IC in addition, IC can change with dismantling.Return high-power IC on the other hand the lower guide passage of heat is provided, make the heat dissipation channel of integrated circuit that selectivity is provided.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified
Fig. 1 is the front view that the utility model connector is used to connect integrated circuit and circuit board.
Fig. 2 is the vertical view of the utility model connector.
Fig. 3 is the vertical view and the side cross-sectional view of the soft connector of high density
Fig. 4 is the utility model connector vertical view that is used for double row packaged integrated circuits IC
1. novel connectors among the figure, 2. IC, 3. circuit board, the 4. conductive pin of IC, the 5. soft connector of high density, 6. soft Heat Conduction Material, 7. conductive wire or conductive micro-balloons in the soft connector of high density, 8. soft insulated part.
Embodiment
In Fig. 1, IC 2, novel connector 1, circuit board 3 as figure install.Through pressing integrated circuit 2 and circuit board 3, novel connector 1 is closely contacted with integrated circuit 2 and circuit board 3, realize reliably conduction, heat conduction.Thereby thereby, electric signal exports to the operate as normal that IC 2 forms loop realization IC 2 when getting into the soft connector 5 of high density from circuit board 3.When IC 2 produces heats in addition, can through with novel connector 1 that its IC package casing contact in the transmission of soft Heat Conduction Material 6 realization heats dispel the heat.
Claims (5)
1. IC connector; Be used for being connected of IC and circuit board; It is characterized in that: the soft connector of high density combines the integral body that obtains with soft Heat Conduction Material, in conjunction with electric conductivity and the heat conductivility of Heat Conduction Material of the soft connector of high density.
2. IC connector according to claim 1 is characterized in that: the soft connector design of high density is combined closely around soft Heat Conduction Material.
3. IC connector according to claim 1 is characterized in that: the soft connector of high density combines with soft Heat Conduction Material, realizes that through pressing IC and circuit board IC, novel connector, circuit board closely contact.
4. IC connector according to claim 1; It is characterized in that: the structure of the soft connector of high density is to pass the conductive wire or the metallic microspheres of some in the middle of the block soft insulating material, and conduction is to lean on these wires or the metallic microspheres that contacts with each other is realized.
5. IC connector according to claim 1; It is characterized in that: its shape can be according to the packaged type design of integrated circuit; The soft connector of high density is placed corresponding to the design of IC conductive pin below, and soft Heat Conduction Material is placed corresponding to the below design of IC encapsulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120497975 CN202633555U (en) | 2011-12-05 | 2011-12-05 | Connector for integrated circuit IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120497975 CN202633555U (en) | 2011-12-05 | 2011-12-05 | Connector for integrated circuit IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633555U true CN202633555U (en) | 2012-12-26 |
Family
ID=47386706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120497975 Expired - Fee Related CN202633555U (en) | 2011-12-05 | 2011-12-05 | Connector for integrated circuit IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633555U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311692A (en) * | 2013-06-27 | 2013-09-18 | 刘腾飞 | Connector |
-
2011
- 2011-12-05 CN CN 201120497975 patent/CN202633555U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311692A (en) * | 2013-06-27 | 2013-09-18 | 刘腾飞 | Connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20131205 |