CN1151676A - Device and method for perforating printed circuit board - Google Patents
Device and method for perforating printed circuit board Download PDFInfo
- Publication number
- CN1151676A CN1151676A CN96112343A CN96112343A CN1151676A CN 1151676 A CN1151676 A CN 1151676A CN 96112343 A CN96112343 A CN 96112343A CN 96112343 A CN96112343 A CN 96112343A CN 1151676 A CN1151676 A CN 1151676A
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- circuit board
- printed circuit
- hole
- pcb
- interval
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
- Details Of Cutting Devices (AREA)
- Control Of Cutting Processes (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
The objective of the invention is to accurately punch a printed circuit board despite of a simple constitution. A plurality of holes are provided on a jig board on a working table. A movable side image pickup means and a punching means are made to move by intervals of holes to be punched by the second moving means. X-ray is irradiated from both X-ray irradiation means. Transmission images of holes are picked up by the both image pickup means, and positional deviation between these central positions and the image center is found. The interval between the holes is known so that the interval between both image pickup means can be calculated. Then, a printed circuit board is set and both identification marks are picked up by both image pickup means. The image is processed so as to find the positional deviation between the central position and the image center, and the interval between the discrimination marks is calculated from the interval between both image pickup means. A punching position is set by dividing and correcting the errors of the interval between the discrimination marks from the interval between the holes to be punched so as to be punched by a drill.
Description
The present invention relates to the perforating apparatus of printed circuit board (PCB) and use the method for this perforating apparatus.
Printed circuit board (PCB) is to use following method to make always traditionally, in this method, and the many circuit patterns of printing on a large-area substrate.Each circuit pattern is cut and separates to obtain the polylith circuit board.Form at least one pair of guide hole earlier on substrate, the pilot pin that is provided with on the process equipment is inserted guide hole, make the guide hole location, order is carried out above-mentioned cutting then.Therefore, guide hole provides the basis of decision cutting position, thereby must bore a hole on accurate position.
In the employed perforating apparatus that carries out above-mentioned perforation, when printed circuit pattern, on a pair of punch position, mark in advance; These marks are to carry out imaging by the image device that is arranged on the perforating apparatus as TV camera or X ray gamma camera; Perforation be by with punching machine as drill bit move to imaging handle carry out on the position obtains, as the patent application of Japanese unexamined disclose text H3 (91)-No. 277411 disclosed, perforating apparatus comprises a pair of image device and a pair of a pair of punching machine that can form pair of holes simultaneously.In this device, each image device and punching machine are provided with movably, so that can bore a hole to the printed circuit board (PCB) of various sizes.Knowing in advance at interval between two imaging devices on the initial position.Then, under numerical control, move movably after the image device and punching machine, form their reference mark by image device separately according to the interval between the hole to be bored a hole; Carrying out the imaging processing is in order to obtain the center of two reference marks; On the center, use two punching machines to bore a hole.
In above-mentioned prior art structure, image device and punching machine are mobile under numerical control according to the size of printed circuit board (PCB).Specifically, the interval that equals between the hole to be bored a hole of their amounts of moving deducts the interval between the two imaging devices under initial condition.But if in the interval inaccuracy between the two imaging devices on the initial position, so, the precision of perforation will reduce.Along with the disappearance of time, depend on the employed environment of machine (temperature, humidity etc.), when machine error occurring, the perforation precision also can descend.
Use ball-screw to make image device and punching machine move to the position that preparation is bored a hole in some cases from its initial position.Because the precision of ball-screw is not enough, the error that use linear scale correction to exist is above-mentioned mobile to prove conclusively.Above-mentioned linear scale costs an arm and a leg, and cost is increased.
Therefore, the object of the present invention is to provide a kind of perforating apparatus and method of printed circuit board (PCB), need not that expensive linear scale can tackle long-term use and the error that occurs, thereby guarantee accurate perforation.
To achieve these goals, the perforating apparatus according to the invention provides a kind of printed circuit board (PCB) is characterized in that: it comprises a workbench, and the printed circuit board (PCB) with a pair of reference mark is put thereon; Be arranged on fixation side and active side.Be used for forming respectively the image device of reference mark; Be located on fixation side and the active side, be used for imaging result, the punching machine of on the printed circuit board (PCB) that is placed on the workbench, boring a hole based on reference mark; Be used to be adjusted in first mobile device of the position of the image device of fixation side and punching machine; Be used to make image device and punching machine on the active side integrally to shift to or move apart the image device of fixation side and second mobile device of punching machine; A model that is arranged on the workbench; And a plurality of datum holes that are used for determining to be located at the position of the image device on the model with predetermined space, its feature is that also in described a plurality of datum hole at least one can be faced by the image device of fixation side, and other datum hole then direction of being shifted to or move apart the image device on the fixation side by second mobile device of the image device on the active side is arranged.
Model can be contained on the workbench, also can pull down from it.Model is preferably used with the printed circuit board (PCB) identical materials and is made.
In addition, be characterised in that according to method for punching of the present invention: move by the interval in second mobile device hole to be bored a hole on according to printed circuit board (PCB) at the image device on the active side and punching machine; Each datum hole near two imaging devices a plurality of datum holes is handled imaging to obtain the center of each datum hole in the imaging region of two imaging devices by imaging; Between the two imaging devices is with the basic calculation that is spaced apart between the datum hole of the center of each datum hole and the imaging that obtains in advance at interval; Printed circuit board (PCB) is arranged on the workbench, makes two quasi-marks all in the imaging region of separately image device; Two base standards are handled imaging to detect the center of two reference marks by two imaging devices by imaging; Between two reference marks is to obtain with the center of each reference mark and the basis that is spaced apart between the two imaging devices at interval, error between the interval between interval between two reference marks and the hole to be bored a hole is obtained, and sets by the amount corresponding to above-mentioned error according to the punch position that the center of reference mark is revised; After the punch position that by two mobile devices two punching machines is moved to separately, printed circuit board (PCB) is bored a hole.
Brief Description Of Drawings is as follows:
Fig. 1 is the front cross sectional view according to perforating apparatus of the present invention;
Fig. 2 is the plane graph of the local excision of the part of perforating apparatus under workbench;
Fig. 3 is the end view of the local excision of the part of perforating apparatus under workbench;
Fig. 4 is the plane graph of the workbench of perforating apparatus;
Fig. 5 is the plane and the sectional view of perforating apparatus;
Fig. 6 is used to illustrate the calculating according to the interval between the image device of method of the present invention;
Fig. 7 is used to illustrate the setting according to the punch position of method of the present invention.
Fig. 8 is plane graph and the sectional side view of another embodiment of model.
Fig. 1 represents the general structure according to perforating apparatus of the present invention.A pair of X-radiation device 4 is bearing in the top of workbench 1 with predetermined interval.The structure of X-radiation device 4 is at first described.X-radiation device 4 is connected in protection cylinder 6, and protection cylinder 6 constitutes the path 5 of X-radiation.Protection cylinder 6 comprises that one crosses the optical gate 7 that path 5 is provided with, the open and close path 5 that it is driven by front and back.Form a vertical guide groove 8 on the periphery of protection cylinder 6, be provided with a protecting tube 10 under protection cylinder 6, it has a path 9 that supplies X ray to be communicated with path 5, thereby it can shift to and move apart workbench 1.Protecting tube 10 is fixed on the lower end of a cylindrical part 13, and cylindrical part 13 is contained on the periphery of protection cylinder 6.In the part of cylindrical part 13, be provided with the guider 14 that can in guide groove 8, slide.Can be provided with around protecting tube 10 by cylinder 11 upper and lower mobile shielding parts 12.Shielding part 12 is to be formed by two leaded synthetic resin sheets, and two synthetic resin sheets are arranged in parallel, and are provided with vertical seam in its skirt section with proper spacing, and a metallic bond is located at wherein to improve the shield effectiveness of X ray.When the workpiece on the workbench during by x-ray bombardment, the part in skirt section is against on the workpiece to seal up inside, makes X ray obtain shielding, can not spill.
X-radiation device with said structure comprises an active side X ray spoke device 4b who is located at the fixation side X ray spoke device 4a in Fig. 1 left side and is located at the right side.Active side X-radiation device 4b comprises a nut 15, and it engages with the leading screw 17 that is rotated by motor 16.In addition, also comprise a balladeur train 19 that on track 18, slides at the X-radiation device 4b of active side.Therefore, active side X-radiation device 2b can move to the left and right side of Fig. 1 by motor 16.
A part below Fig. 2 and the 3 expression workbench wherein is provided with a pair of image device 2 that is used for being obtained by X-radiation the radiation image of workpiece, a pair of punching machine 3 and a pair of mobile device 20.Image device 2 and punching machine 3 are at first described.One support plate 39 is erected on the Y-workbench, is fixed on the support plate 39 by clip 40 and the cylindrical part 41 that is clipped in therebetween as the X ray gamma camera 2 of image device.X ray gamma camera 2 is connected in a presentation manager, and central processing unit serves as the similar device of the work of basis control mobile device 20 with being used for the image processing on the radiation image of workpiece, and this point will be described below.Pair of guide rails 42 is installed on the side of support plate 39.One guide rail guider 44a is arranged on the retainer 44 that is used for fixing punching machine 3 and is assemblied on the guide rail 42, can slide thereon.Punching machine 3 comprises an air spindle 43a, a collection chuck 43b and a drill unit such as a drill bit 43c who is fixed by the collection chuck who is fixed on the air spindle upper end.Air spindle drives drill bit 43c and rotates, and bores a hole on printed circuit board (PCB), and smear metal cover 45 is installed in the upper end of punching machine 3.
Now contrasting Fig. 3 is described in vertical (Z to) and goes up the driving mechanism 46 that drives punching machine 3.Be installed in rotation on the support plate 39 at the upwardly extending leading screw 48 of Z, installed part 47 is folded in therebetween.Leading screw 48 engages with a nut 49 that is fixed on the above-mentioned retainer 44, and a nut seat 50 is folded in therebetween.The upper end of leading screw 48 is connected in a belt pulley 51.In addition, a motor 52 is fixing by installed part 47, and the driving shaft of motor 52 is connected in belt pulley 53.Belt 54 is installed around belt pulley 51 and 53.Therefore, when motor 52 drive pulleys 53 rotate, rotate and reach belt pulley 51 so that rotational lead screw 48 by belt.Therefore, nut seat 50 and retainer 44 are upwards whole mobile with nut 49 at Z, so that upper and lower moving by the fixing punching machine 3 of retainer.
The shared pair of guide rails 29 of the first and second mobile device 20a and 20b goes up in the horizontal direction of Fig. 1 and 2 (X to) and is provided with.Balladeur train 22 is installed on the guide rail 29, can upwards slide at X, and X-workbench 23 is installed on the balladeur train 22.One nut 24a engages with one that is connected in motor 2a short leading screw 26a, and is fixed on the X-workbench in fixation side.A pair of nut 24b is by timing belt 35 and a pair of motor 25b that is connected in, and timing belt is T-shaped around roller 33 and belt pulley 34 installings, and nut 24b is fixed on the X-workbench 23b in fixation side.Therefore, when motor 25 drives leading screws 26 and rotates, X-workbench 23 with nut 24 integral body at X to moving.The moving range of the X-workbench 23b of active side is greater than the moving range of the X-workbench 23a of fixation side.
Going up the guide rail 27 that extends at Fig. 2 vertical (Y to) is fixed on the X-workbench 23.One balladeur train 28 is assemblied on the guide rail 27 slidably.A Y-workbench 21 is fixed on the balladeur train 28.One nut 32 is fixed on the downside of Y-workbench 21.In addition, motor 30 is fixed on the X-workbench 23, and a leading screw 31 that is connected on the motor driving shaft is arranged on the X-workbench 23 rotationally.Above-mentioned nut 32 engages with leading screw 31.Therefore, when motor 30 drove leading screw 31 rotations, Y-workbench and nut 32 were upwards whole mobile at Y.
As shown in figs. 1 and 4, on workbench 1, one through hole 60 is arranged, it is located at the image device 2a or the punching machine 3a of two pairs of fixation side, also has one at the upwardly extending groove 63 of X, when the X-of active side workbench 23b moved, groove 63 was into face-to-face relationship with the image device 2b or the punching machine 3b of active side.The model 61 that size is enough to cover through hole 60 and groove 63 is arranged on the workbench 1.Model 61 shown in Figure 5 is by making with printed circuit board (PCB) identical materials to be bored a hole, being assemblied in step part 1a and going up (see figure 1), and fixed by hold-down screw 61a.Model 61 has: a through hole 61, and through hole 61 is in the face of through hole 60, and diameter is less than the diameter of through hole 60; Article one, in the face of groove 63, width is less than the groove 61c of the width of groove 63; One has minor diameter, at each datum hole 62 that forms in the face of the position of the part 61d that is provided with on the through hole 61, down, in the face of position and the datum hole 62 of part 61d is provided with predetermined interval the upper and lower of groove 61c.Pass drill bit 43c so that printed circuit board (PCB) is bored a hole among through hole 61b and the groove 61c.Datum hole 62 is used for determining the position of two imaging devices 2, knowing in advance at interval between the datum hole 62.
Method for punching according to printed circuit board (PCB) of the present invention is described now.
In the present embodiment, printed circuit board (PCB) to be bored a hole is the plate of layering, does not appear circuit pattern and reference mark thereon.Reference mark is symmetrically arranged on printed circuit board (PCB).
The invention is characterized in before perforation, determining at interval between the two imaging devices.The position of two imaging devices 2 also may comprise the position deviation that produces when it because the error when making may be coarse when initial position is shifted to punch position.Then, accurately perforation is undertaken by correction.
Between hole to be formed on the printed circuit board (PCB) (is to be two holes at present embodiment) is to import in advance at interval, mobile at interval according to this by second mobile device 2 at the image device 2b and the punching machine of active side.But, this moment the image device 2b of active side and punching machine 3b may be not with the image device 2a of fixation side and punching machine 3a on the exact position of L, this is because the image device 2b of active side and the initial position deviation of punching machine 3b, the error of the second mobile device 20b, and the alignment error of the image device 2b of active side and punching machine 3b causes.
Then, before printed circuit board (PCB) being placed on the workbench 1, workbench 1 is by the X-radiation from two X-radiation devices 4, near the X-radiation image of the datum hole 62 each X-radiation device 4 obtains by two image devices (X ray gamma camera) 2a and 2b, and handles to obtain the center of each datum hole 62 through imaging.In Fig. 6, label 62a and 62b represent the datum hole by fixation side image device 2a imaging, and label 62c and 62d represent the datum hole by active side image device 2b imaging.For example, difference between the position of the center 2a ' of the center of the datum hole 62a above the groove 61c and fixation side image device 2a is obtained, in addition, the alternate position spike of the center 2b ' of the center of the datum hole 62c above through hole 61 and fixation side image device 2b is also obtained.By knowing in advance at datum hole 62a on the model and the interval L1 between the 62c, thereby two interval L2 between imaging device 2a and the 2b can center 2a ' according to datum hole 62a and image device between, and the position deviation between the center 2b ' of datum hole 62c and image device, and consider at interval L1 and calculate.If the precision height is error free, so, L and L2 equate, need not to revise and can bore a hole to printed circuit board (PCB), and still, the errors table between L and the L2 is shown as and resembles device and be not on the position that needs.
Then, on workbench 1 printed circuit board (PCB) is set, two imaging devices form reference mark M1 and M2, and they bear image processing to obtain center separately.As shown in Figure 7, the difference between the position of the center 2a ' of the center of reference mark M1 and fixation side image device 2a is obtained, and in addition, the difference between the position of the center 2b ' of the center of reference mark M2 and active side image device 2b is also obtained.Because the interval L2 between the two imaging devices obtains in previous step, thereby the interval L3 between reference mark M1 and the M2 can accurately calculate.The formation of reference mark M1 and M2 should make therebetween interval L3 equal interval L between the required hole, still, since the error that printed circuit board manufacturing process causes, factors such as thermal deformation, and L3 also may and be not equal to L.In this case, if accurately bore a hole at the reference mark place, the hole will form incorrect interval, can not be assemblied in problem in all holes thereby be created in alignment pin in the following step, and printed circuit board (PCB) can not be installed on the anchor clamps.Correction of the present invention the position of reference mark, at interval L accurately bores a hole, thereby has solved the problems referred to above.Specifically, the position of reference mark M1 and M2 is moved (L3-L)/2 respectively, and this value is that poor (L3-L) between L3 and the L is divided into left and right two halves, thereby is set to punch position P1 and P2.Obviously, the interval between punch position P1 and the P2 accurately equals L.In the present embodiment, because many datum hole is disposed in the both sides of through hole and groove, so can on vertical, revise.Specifically, if it is not parallel with the vertical axis (Y-axis) of figure to connect the straight line Y1 (and the straight line that is connected datum hole 62c and 62d) of datum hole 62a and 62b, then can think to exist because the error that image device and the low installation accuracy of punching machine on mobile device cause.Then, above-mentioned straight line and between perpendiculars parallelism error can be used as revises storage, and the amount that the image processing on the reference mark and the setting of punch position can correcting said error is to guarantee higher perforation precision.
Thereafter operating moving device 20a and 20b make two drill bit 43c be in punch position P1 and P2, and maneuveringair main shaft 43a bores a hole.At this moment, pass hole 60 and groove 63 respectively, printed circuit board (PCB) is bored a hole at the drill bit 43c of fixed and movable side.
In the present embodiment, when setting punch position, the half point of the error of two reference marks need not distributed to two reference marks, but the method for distributing error is not limited boring a hole.
In addition, at every turn move the operation that need obtain when the image device of active side and the punching machine between the two imaging devices accurately at interval by mobile device.When after model may use for a long time, deforming, can shed model from workbench and come interval between the measuring basis hole, so that always can guarantee accurate calculating.But when model is when making with the printed circuit board (PCB) identical materials, the distortion of model can be ignored in calculating, and this is that they bear similar distortion because because factors such as variations in temperature.
The position of datum hole 62 is provided with and size, should make datum hole 62 image devices move to the there and all always be included in the imaging region of active side image device 2b.
In the present embodiment, printed circuit board (PCB) to be bored a hole is a demixing plate, and uses the X ray gamma camera to form the reference mark that does not appear on the surface as image device.But, if perforation is at overstepping one's bounds laminate, carry out on the printed panel that reference mark reveals, can use the common TV gamma camera so.From cost, it is favourable using the common TV gamma camera, and this is because need not expensive x ray generator and safety devices.In addition, though use drill bit, also can use other device to substitute as drift as punching machine.
Fig. 8 represents another embodiment of model.This model 65 has the datum hole 65b that sets in a row on it is vertical, and is fixed on the workbench 1 with hold-down screw 65a, substitutes the model 61 of previous embodiment with this model.Between the datum hole 65b is known at interval, in previous embodiment, among the datum hole 65b two by image device 2a and 2b imaging and image processing to identify the accurate interval between two imaging device 2a and the 2b.Printed circuit board (PCB) is by the drill bit 43c boring of passing datum hole 65b.In the present embodiment, printed circuit board (PCB) can only bored a hole in the face of on the position of datum hole 65b, but model is simple in structure, is easy to make.
According to the present invention, before the printed circuit board (PCB) perforation, the use model can accurately identify the interval between the two imaging devices, can calculate the accurate spacing between the reference mark on this basis.So just can guarantee accurate perforation, thereby improve the quality of printed circuit board (PCB).The use of detachable model provides a kind of solution to model distortion etc.In addition, if model is by making with the printed circuit board (PCB) identical materials, the error that its distortion causes also can be ignored, and this is because the distortion of model can be accompanied by the similar distortion of printed circuit board (PCB).
Claims (4)
1. printed circuit board (PCB) perforating apparatus is characterized in that it comprises:
A workbench, the printed circuit board (PCB) that is provided with a pair of reference mark is arranged on the workbench;
Be respectively applied for the image device on the fixed and movable side of being arranged on that forms described reference mark;
Be used for imaging result, the punching machine of the enterprising eleven punch 11 of described printed circuit board (PCB) on workbench based on described reference mark;
Be used to be adjusted in first mobile device of the position of described image device on the fixation side and punching machine;
Be used for integrally described image device on fixation side and second mobile device of punching machine are shifted to and moved apart to the described image device on the active side and punching machine;
Be placed on the model on the described workbench; And
A plurality of datum holes that are used to determine the position of the described image device that on described model, is provided at predetermined intervals,
In the described datum hole at least one can be faced by the described image device on fixation side, and other datum hole then is arranged in by described second mobile device and the described image device of active side is shifted to and moved apart on the direction of described image device of fixation side.
2. printed circuit board (PCB) perforating apparatus as claimed in claim 1 is characterized in that: described model can be contained on the described workbench and unload from workbench.
3. printed circuit board (PCB) punching machine as claimed in claim 1 or 2 is characterized in that: described model is by making with described printed circuit board (PCB) identical materials.
4. use method for punching, it is characterized in that it may further comprise the steps as each described printed circuit board (PCB) perforating apparatus in the claim 1,2 and 3:
According to the interval between hole to be bored a hole on the described printed circuit board (PCB), move the described image device and the punching machine of active side by described second mobile device;
Make in each the datum hole imaging that is arranged near the described a plurality of datum holes described two image devices, and in the imaging region of described image device, obtain the center of each described datum hole by image processing;
With the interval between two described image devices of basic calculation of being spaced apart between each center of described datum hole and the described datum hole that obtains in advance;
Described printed circuit board (PCB) is set on described workbench, two described reference marks are in respectively in the imaging region of two image devices;
Make two described reference mark imaging by two described image devices, so that detect the center of two reference marks by image processing;
Obtain two intervals between the described reference mark with the basis that is spaced apart between the center of each described reference mark and two the described image devices, and obtain two between described reference mark the interval and the error between the interval between hole to be bored a hole, thereby revise from the center of described reference mark one corresponding to an amount of described error setting punch position, and
After the described punch position that by two described mobile devices two described punching machines is moved to respectively separately, described printed circuit board (PCB) is bored a hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7244377A JP2873439B2 (en) | 1995-09-22 | 1995-09-22 | Drilling device and method for printed circuit board |
| JP244377/95 | 1995-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1151676A true CN1151676A (en) | 1997-06-11 |
| CN1088320C CN1088320C (en) | 2002-07-24 |
Family
ID=17117784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96112343A Expired - Lifetime CN1088320C (en) | 1995-09-22 | 1996-09-20 | Device and method for perforating printed circuit board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2873439B2 (en) |
| KR (1) | KR100247266B1 (en) |
| CN (1) | CN1088320C (en) |
| SG (1) | SG52844A1 (en) |
| TW (1) | TW386047B (en) |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2561166B2 (en) * | 1990-03-26 | 1996-12-04 | 株式会社精工舎 | Method and device for punching printed circuit board |
| JPH0657381A (en) * | 1992-08-05 | 1994-03-01 | Sumitomo Special Metals Co Ltd | Fe-ni-co low thermal expansion alloy |
-
1995
- 1995-09-22 JP JP7244377A patent/JP2873439B2/en not_active Expired - Lifetime
-
1996
- 1996-08-22 TW TW085110270A patent/TW386047B/en not_active IP Right Cessation
- 1996-09-17 KR KR1019960040305A patent/KR100247266B1/en not_active IP Right Cessation
- 1996-09-20 CN CN96112343A patent/CN1088320C/en not_active Expired - Lifetime
- 1996-09-20 SG SG1996010669A patent/SG52844A1/en unknown
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| CN102699952A (en) * | 2012-06-01 | 2012-10-03 | 深圳市威利特自动化设备有限公司 | Punching method, device and equipment |
| CN104511616A (en) * | 2013-09-26 | 2015-04-15 | 波音公司 | Automated Drilling Through Pilot Holes |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPH0985693A (en) | 1997-03-31 |
| TW386047B (en) | 2000-04-01 |
| SG52844A1 (en) | 1998-09-28 |
| KR970019786A (en) | 1997-04-30 |
| JP2873439B2 (en) | 1999-03-24 |
| CN1088320C (en) | 2002-07-24 |
| KR100247266B1 (en) | 2000-03-15 |
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