CN104260147A - Flexible circuit board drilling method - Google Patents
Flexible circuit board drilling method Download PDFInfo
- Publication number
- CN104260147A CN104260147A CN201410413851.9A CN201410413851A CN104260147A CN 104260147 A CN104260147 A CN 104260147A CN 201410413851 A CN201410413851 A CN 201410413851A CN 104260147 A CN104260147 A CN 104260147A
- Authority
- CN
- China
- Prior art keywords
- drill bit
- boring
- group
- circuit board
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a flexible circuit board drilling method which includes the steps of firstly, parallelly and independently disposing a first drill bit and a second drill bit on a drilling machine; secondly, using the first drill bit to sequentially drill a first group of holes in a circuit board, and using the second drill bit to sequentially drill a second group of holes in the circuit board, wherein the first group of holes and the second group of holes are distributed in the up-down and left-right directions at intervals. The method has the advantages that a cover film is directly used for drilling by improving the drilling procedures, an ink printing procedure is not needed, product yield is increased, manpower and material cost is reduced correspondingly, delivery time is reduced, and probability of drill bit breaking is reduced.
Description
Technical field
The present invention relates to a kind of flexibility circuit board production technology, particularly relate to boring method.
Background technology
Flex circuit application in the fabrication process, needs to get out through hole not of uniform size at substrate surface, makes place mat, or identify for rear operation and locate use for connecting two sides circuit electric conductivity.Along with the development of technology, the aperture of boring reduces to 1.0mm, and hole and pitch of holes are reduced to 1.03mm, the mechanical force produced during boring and heat, and right bore process is had higher requirement.When pitch-row and aperture less time, causing hole limit mechanicals efforts strengthens, the raising of drill point rotating speed and the raising of penetration rate, cause rubbing and produce a large amount of heats, the temperature of drill point improves accordingly, because temperature is too high, cover layer can be made to burn, even the cover layer connecting bridge between holes is blown, cause cover layer product rejection, increase cost and quality hidden danger.Its result can only consider that this region ink printing is to replace cover layer and then protection circuit, then add operation, increases material and cost of labor, extends the friendship phase, and quality qualification rate declines.
Summary of the invention
In order to overcome deficiency of the prior art, the invention provides a kind of boring method avoiding the flex circuit application burning out cover layer because temperature is too high.
The technical scheme that the present invention solves its technical problem is:
A kind of flex circuit application boring method, the steps include:
(1) on drilling machine side by side and be independently provided with the first drill bit and the second drill bit;
(2) first group of boring is got out in the circuit board successively with the first described drill bit, and then getting out second group of boring in the circuit board successively with the second described drill bit, described first group of boring and second group of boring are spaced apart respectively on upper and lower, left and right directions.
As preferably, before step (2), locating hole is formed to drilling holes on circuit board.
Drilling machine arranges the first drill bit arranged side by side and the second drill bit, and the first drill bit and the second drill bit independently control, during boring, first by the first drill bit, first group of boring is formed to drilling holes on circuit board, by the second drill bit, second group of boring is formed to drilling holes on circuit board again, and first group of boring and second group of boring are spaced apart respectively on upper and lower, left and right directions.
In prior art, only have a drill bit sequentially to hole respectively to boring, like this, a upper boring and next spacing of wells only have the spacing between two borings, and heat affected zone is less, easily causes the cover layer connecting bridge between holes to blow, bit also can be caused easily broken.The present invention, on bore position and next bore position are spaced two spacings of wells, heat affected zone increases, good heat dissipation effect, cover layer connecting bridge can not be caused to blow, instantly during drilling round, namely during the second bit bore, heat also leaves part, and the connecting bridge between the boring that can't be adjacent is blown.
Beneficial effect of the present invention is: the present invention, by the improvement to drilling program, directly gets out with cover layer, can not increase printing ink operation, the qualification rate of product is also promoted to some extent, consequently reduce artificial and Material Cost, shorten the friendship phase, decrease the probability that bit breaks.
Accompanying drawing explanation
Fig. 1 is drilling program schematic diagram of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
As shown in Figure 1, a kind of flex circuit application boring method, the steps include:
(1) on drilling machine side by side and be independently provided with the first drill bit and the second drill bit;
(2) first group of boring is got out in the circuit board successively with the first described drill bit, and then getting out second group of boring in the circuit board successively with the second described drill bit, described first group of boring and second group of boring are spaced apart respectively on upper and lower, left and right directions.
In addition, before step (2), locating hole 3 is formed to drilling holes on circuit board.By the pilot pin on the corresponding drilling machine of locating hole, wiring board is positioned, facilitate next step, precise positioning is carried out to first group of boring and second group of boring.
Drilling machine arranges the first drill bit arranged side by side and the second drill bit, and the first drill bit and the second drill bit independently control, during boring, the stroke of the first drill bit and the second drill bit is designed according to IC layout design, first by the first drill bit, first group of boring 1 is formed to drilling holes on circuit board, by the second drill bit, second group of boring 2 is formed to drilling holes on circuit board again, and first group of boring and second group of boring are spaced apart.
In prior art, only have a drill bit sequentially to hole respectively to boring, like this, a upper boring and next spacing of wells only have the spacing between two borings, and heat affected zone is less, easily causes the cover layer connecting bridge between holes to blow, bit also can be caused easily broken.The present invention, on bore position and next bore position are spaced two spacings of wells, heat affected zone increases, good heat dissipation effect, cover layer connecting bridge can not be caused to blow, instantly during drilling round, namely during the second bit bore, heat also leaves part, and the connecting bridge between the boring that can't be adjacent is blown.
The present invention, by the improvement to drilling program, directly gets out with cover layer, can not increase printing ink operation, also promote to some extent the qualification rate of product, consequently reduces artificial and Material Cost, shortens the friendship phase, decreases the probability that bit breaks.
Claims (2)
1. a flex circuit application boring method, is characterized in that, the steps include:
(1) on drilling machine side by side and be independently provided with the first drill bit and the second drill bit;
(2) first group of boring is got out in the circuit board successively with the first described drill bit, and then getting out second group of boring in the circuit board successively with the second described drill bit, described first group of boring and second group of boring are spaced apart respectively on upper and lower, left and right directions.
2. a kind of flex circuit application boring method according to claim 1, is characterized in that: before step (2), form locating hole to drilling holes on circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410413851.9A CN104260147A (en) | 2014-08-21 | 2014-08-21 | Flexible circuit board drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410413851.9A CN104260147A (en) | 2014-08-21 | 2014-08-21 | Flexible circuit board drilling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104260147A true CN104260147A (en) | 2015-01-07 |
Family
ID=52151791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410413851.9A Pending CN104260147A (en) | 2014-08-21 | 2014-08-21 | Flexible circuit board drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104260147A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690769A (en) * | 2015-02-12 | 2015-06-10 | 大连崇达电路有限公司 | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0985693A (en) * | 1995-09-22 | 1997-03-31 | Seiko Precision Kk | Punching device for printed circuit board and punching method |
| EP1784071A1 (en) * | 2005-11-08 | 2007-05-09 | COMET GmbH | Apparatus to prepare a multilayer printed circuit board for contact hole drilling |
| CN201186359Y (en) * | 2008-03-26 | 2009-01-28 | 东台精机股份有限公司 | Printed circuit board drilling machine capable of lifting drilling accuracy |
| CN101370617A (en) * | 2006-01-03 | 2009-02-18 | Lg技术有限公司 | Drilling device |
| CN102107290A (en) * | 2010-12-23 | 2011-06-29 | 北大方正集团有限公司 | Drilling method and drilling equipment |
| CN102497733A (en) * | 2011-11-28 | 2012-06-13 | 东莞市五株电子科技有限公司 | Circuit board drilling method |
| CN202621976U (en) * | 2012-05-30 | 2012-12-26 | 广东成德电路股份有限公司 | Drilling device of ultra-large printed circuit board |
-
2014
- 2014-08-21 CN CN201410413851.9A patent/CN104260147A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0985693A (en) * | 1995-09-22 | 1997-03-31 | Seiko Precision Kk | Punching device for printed circuit board and punching method |
| EP1784071A1 (en) * | 2005-11-08 | 2007-05-09 | COMET GmbH | Apparatus to prepare a multilayer printed circuit board for contact hole drilling |
| CN101370617A (en) * | 2006-01-03 | 2009-02-18 | Lg技术有限公司 | Drilling device |
| CN201186359Y (en) * | 2008-03-26 | 2009-01-28 | 东台精机股份有限公司 | Printed circuit board drilling machine capable of lifting drilling accuracy |
| CN102107290A (en) * | 2010-12-23 | 2011-06-29 | 北大方正集团有限公司 | Drilling method and drilling equipment |
| CN102497733A (en) * | 2011-11-28 | 2012-06-13 | 东莞市五株电子科技有限公司 | Circuit board drilling method |
| CN202621976U (en) * | 2012-05-30 | 2012-12-26 | 广东成德电路股份有限公司 | Drilling device of ultra-large printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690769A (en) * | 2015-02-12 | 2015-06-10 | 大连崇达电路有限公司 | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104427768B (en) | The circuit board that circuit board drilling method and this method make | |
| CN207099441U (en) | A kind of printed circuit board laser drill special backing plate | |
| CN104020031A (en) | Manufacturing method of PCB (Printed Circuit Board) section and microsection sample | |
| CN102612259A (en) | Drilling short slot for printed circuit board | |
| CN104385362B (en) | Opposite angle hole separated jumping drilling method of printed circuit board | |
| CN104260147A (en) | Flexible circuit board drilling method | |
| CN103846557B (en) | A kind of cutting path method to set up of boring piecemeal of pcb board | |
| CN106231821A (en) | A kind of four layers of pcb board processing technology | |
| CN102497733A (en) | Circuit board drilling method | |
| CN106482591A (en) | A kind of impact piece transducing meta structure and preparation method thereof | |
| CN103231171A (en) | Processing method of blind hole of printed circuit board | |
| CN102869191A (en) | Manufacturing method of printed circuit board | |
| CN105009697B (en) | High-speed printed circuit board with uniform via interior diameter | |
| CN110933849A (en) | Method for manufacturing small half-hole circuit board | |
| US20160086879A1 (en) | Package substrate and method of fabricating the same | |
| CN205987555U (en) | PCB plate height precision drilling positioner | |
| CN108064118B (en) | Dislocation-preventing PCB drilling method | |
| CN103917058B (en) | Method for manufacturing pluggable finger type flexible circuit board | |
| CN103692091B (en) | Flat-plate laser stitch welding technique | |
| CN104284519A (en) | Printed circuit board depth control gong device and method | |
| CN106922082A (en) | A kind of localization method of machine drilling | |
| CN110248476A (en) | A kind of circuit board and its preparation process based on the discontinuous mesh of tomography | |
| CN104418495B (en) | Strengthened glass cutting method | |
| CN102218753B (en) | Method for shaping PCB (Printed Circuit Board) by stamping | |
| CN104690769A (en) | Processing method of finished holes of circuit board with inner-layer copper thickness of more than 420 micrometers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |
|
| RJ01 | Rejection of invention patent application after publication |