CN102218753B - Method for shaping PCB (Printed Circuit Board) by stamping - Google Patents
Method for shaping PCB (Printed Circuit Board) by stamping Download PDFInfo
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- CN102218753B CN102218753B CN 201110107331 CN201110107331A CN102218753B CN 102218753 B CN102218753 B CN 102218753B CN 201110107331 CN201110107331 CN 201110107331 CN 201110107331 A CN201110107331 A CN 201110107331A CN 102218753 B CN102218753 B CN 102218753B
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Abstract
The invention relates to the field for manufacturing a PCB (Printed Circuit Board) and in particularly relates to a method for shaping a PCB by stamping. According to the method, a stamping buffer hole or slot is increased during a drilling step of the PCB, thus a buffering action can be obtained during stamping, undesirable phenomena such as fracture of connection and whitened punched holes caused by small distance among some adjacent boards, uneven stress and the like can be avoided as well as shaping speed and production efficiency can be increased.
Description
Technical field
The present invention relates to PCB and make the field, be specifically related to a kind of stamping forming method of pcb board.
Background technology
After pcb board has carried out anti-welding, text printout operation, the monoblock pcb board is carried out moulding cut apart, with the method for the plank that obtains the desired size and dimension of client.In the pcb board manufacturing, the pcb board molding mode mainly is divided into CNC moulding and stamping moulding dual mode.The stamping moulding is because of the higher important way that becomes the pcb board moulding of its production efficiency, but in the stamping process since between some plate to be formed the problem such as little, the stamping unbalance stress of spacing be easy to produce a series of defectives such as break in the pcb board junction, punching is turned white.
Summary of the invention
The problem that the present invention need solve provides a kind of pcb board stamping forming method.
For addressing the above problem, the technical scheme that the present invention takes is: a kind of pcb board stamping forming method is provided, and it is before the stamping operation, reserves edges of boards along the PCB platelet and open auxiliary tank around each PCB platelet, and the method for fluting is as follows:
(1) reserves between the edges of boards apart from a ﹤ 4.0mm when two PCB platelet junctions, reserve between the edges of boards center line apart from d 〉=4.0mm, then reserve edges of boards in this left and right sides, junction along two PCB platelets and leave auxiliary tank c;
(2) reserve between the edges of boards center line apart from d ﹤ 4.0mm when two PCB platelet junctions, and during distance b between the actual edges of boards of two PCB platelets 〉=4.0mm, then leave auxiliary tank c in this left and right sides, junction along two PCB platelet preformed plate edges, and in this junction up and down both sides two reserve edges of boards and open respectively auxiliary tank e up and down along the PCB platelet.
Concrete, the c groove width is whole preformed plate hem width degree, the e groove width is half of c groove width.
Described auxiliary tank is once finished in the pcb board drilling operating by bore process.
Pcb board stamping forming method of the present invention passes through the reservation leaving channel at each PCB platelet of need moulding, a series of defective that this groove can effectively be avoided in the stamping process because break in the pcb board junction that the problem such as little, the stamping unbalance stress of spacing produces between the plate to be formed, punching is turned white etc., and can improve shaping speed, improving production efficiency.
Description of drawings
Fig. 1 is that the pcb board of stamping moulding for the treatment of of the present invention is implemented illustration;
Fig. 2 is fluting schematic diagram of the present invention.
The specific embodiment
For the ease of those skilled in the art's understanding, below in conjunction with accompanying drawing structure of the present invention is further described in detail.
Generally, the work flow of pcb board is: boring-heavy copper-plating-figure transfer-anti-welding processing-text printout-stamping moulding, and the pcb board after having rear operation to moulding carries out quality testing etc.
Such as Fig. 1, on a large substrate, produce a plurality of PCB platelet A by above-mentioned operation, when after integral body has been carried out the text printout operation on the large substrate, need to adopt the stamping mode to be divided into platelet by the size of the pcb board of the required reality of client and the large large plate of young pathbreaker.Have the edges of boards of reservation B around each PCB platelet, by design each junction of large plate is washed out during punching, isolate each platelet.If on the large plate between each platelet to be formed spacing less, unbalance stress during punching may cause some platelet junctions to be broken behind the stamping or punching is turned white.
For this problem, the present invention proposes a kind of pcb board stamping forming method, and it is in advance the reservation edges of boards of PCB platelet to be slotted by the mode of boring in drilling operating, alleviates the dynamics that is connected of each platelet and junction by this groove, makes things convenient for punching.
For the increase production cost of exceeding, need that each platelet edges of boards is had optionally fluting; Be chosen in pcb board and reserve leaving channel, do not need additionally to carry out figure and size design, can conveniently together operation in bore process.
During concrete operations, such as Fig. 2, apart from a ﹤ 4.0mm, reserve between the edges of boards center line apart from d 〉=4.0mm between the two PCB platelet junctions reservation edges of boards, then reserve edges of boards in this left and right sides, junction along two PCB platelets and leave auxiliary tank c, the c groove width is whole preformed plate hem width degree.When two PCB platelet junctions are reserved between the edges of boards center line apart from d ﹤ 4.0mm, and during distance b between the actual edges of boards of two PCB platelets 〉=4.0mm, then leave auxiliary tank c in this left and right sides, junction along two PCB platelet preformed plate edges, and in this junction up and down both sides two reserve edges of boards and open respectively auxiliary tank e up and down along the PCB platelet.This moment, the c groove was of a size of a size of reserving edges of boards of joining with this junction, and of being about to join with this junction reserves edges of boards and all slots, the e groove be respectively with half of the neighbouring preformed plate hem width degree in this junction, length can according to circumstances be determined.The whole edges of boards that join with the junction of PCB platelet all disconnect with the junction like this, and when effectively preventing stamping, production board is reserved the edges of boards fracture and had influence on the production board quality.
Above-described embodiment only is the better embodiment of the method for the invention, and in addition, the present invention can also have other implementations.That is to say that under the prerequisite that does not break away from the present invention's design, any apparent replacement and minor variations all should fall within protection scope of the present invention.
Claims (2)
1. a pcb board stamping forming method before the stamping operation, is reserved edges of boards along the PCB platelet and is opened auxiliary tank around each PCB platelet, and the method for fluting is as follows:
(1) reserve between the edges of boards apart from a ﹤ 4.0mm when two PCB platelet junctions, reserve between the edges of boards center line apart from d 〉=4.0mm, then reserve edges of boards in this left and right sides, junction along two PCB platelets and leave auxiliary tank c, the c groove width is whole preformed plate hem width degree;
(2) reserve between the edges of boards apart from a ﹤ 4.0mm when two PCB platelet junctions, two PCB platelet junctions are reserved between the edges of boards center line apart from d ﹤ 4.0mm, and during distance b between the actual edges of boards of two PCB platelets 〉=4.0mm, then leave auxiliary tank c in this left and right sides, junction along two PCB platelet preformed plate edges, and in this junction up and down both sides two reserve edges of boards and open respectively auxiliary tank e up and down along the PCB platelet; The c groove is of a size of join with this junction one size of reserving edges of boards, and of being about to join with this junction reserves edges of boards and all slots, the e groove be respectively with half of the neighbouring preformed plate hem width degree in this junction, length can according to circumstances be determined.
2. pcb board stamping forming method according to claim 1, it is characterized in that: described auxiliary tank is once finished in the pcb board drilling operating by bore process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110107331 CN102218753B (en) | 2011-04-28 | 2011-04-28 | Method for shaping PCB (Printed Circuit Board) by stamping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110107331 CN102218753B (en) | 2011-04-28 | 2011-04-28 | Method for shaping PCB (Printed Circuit Board) by stamping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102218753A CN102218753A (en) | 2011-10-19 |
| CN102218753B true CN102218753B (en) | 2013-03-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110107331 Expired - Fee Related CN102218753B (en) | 2011-04-28 | 2011-04-28 | Method for shaping PCB (Printed Circuit Board) by stamping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102218753B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647857B (en) * | 2012-04-27 | 2015-04-29 | 惠州中京电子科技股份有限公司 | Manufacture process of printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08197499A (en) * | 1995-01-31 | 1996-08-06 | Matsushita Electric Works Ltd | Printed circuit board punching method |
| JP2000141604A (en) * | 1998-11-12 | 2000-05-23 | Fuji Photo Film Co Ltd | Printing plate-making system and punching apparatus |
| JP2004228534A (en) * | 2003-01-27 | 2004-08-12 | Kyocera Corp | Punching method by laser to mother board for multi-cavity wiring board |
| CN101686604B (en) * | 2008-09-24 | 2011-05-18 | 比亚迪股份有限公司 | Flexible printed circuit whole board punching method |
| CN101790284B (en) * | 2009-01-22 | 2011-06-29 | 深圳国义五金制品有限公司 | PCB (printed circuit board) punch forming method and composite punch die |
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2011
- 2011-04-28 CN CN 201110107331 patent/CN102218753B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN102218753A (en) | 2011-10-19 |
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| C06 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Chengfeng Inventor before: Zhao Zhiping Inventor before: Zhou Gang |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170523 Address after: 516300, Huizhou District, Guangdong City, Huidong Province town of camphor Hill Industrial Zone two Patentee after: Huidong Jian Xiang Electronic Technology Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20200428 |