CN102497733A - Circuit board drilling method - Google Patents
Circuit board drilling method Download PDFInfo
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- CN102497733A CN102497733A CN2011103863930A CN201110386393A CN102497733A CN 102497733 A CN102497733 A CN 102497733A CN 2011103863930 A CN2011103863930 A CN 2011103863930A CN 201110386393 A CN201110386393 A CN 201110386393A CN 102497733 A CN102497733 A CN 102497733A
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Abstract
The invention discloses a circuit board drilling method. The circuit board drilling method comprises the following steps: measuring parameters of a circuit board influenced by the drilling of the circuit board; setting the drilling parameter of the drilling according to the measured parameters; and according to the drilling parameters, drilling the circuit board. The circuit board drilling method has the advantages of high quality and high benefits.
Description
Technical field
The present invention relates to a kind of boring method, particularly a kind of circuit boring method that is used for the circuit board course of processing.
Background technology
At present, most of electronic equipment arrives computer, communication electronic equipment, military armament systems etc. as little greatly to electronic watch, calculator, general-purpose computer, all need adopt printed circuit board (PCB) (Printed Circuit Board, PCB).Printed circuit board (PCB) is mainly used in the mechanical support of the fixing assembling of electronic devices and components such as integrated circuit, and wiring therebetween and being electrically connected.Printed circuit board (PCB) one necessary program in the process of making is boring.Because the wiring of circuit board is more and more closeer, the number of plies is increasingly high, and the aperture and the spacing of via that therefore produces inter-level interconnects is more and more littler; Requirement on machining accuracy is increasingly high; Thereby make circuit board, particularly hole than the circuit board of comparatively dense, difficulty of processing is increasing.
General boring method is pre-designed bore position, then according to from left to right, order from top to bottom holes successively.Yet in boring procedure, the friction of drill bit and circuit board can produce great amount of heat and circuit board is formed certain mechanical pressure.The circuit board temperature of certain limit raise near great amount of heat usually caused holing; Or even circuit board material; Like glass fiber, epoxy resin, filler etc.; The hot melt phenomenon takes place to a certain extent, and since the mechanical pressure of drill bit to the influence of circuit board, the circuit board in this scope also can produce the phenomenon that mechanical strength reduces.If continue the preset bore position that closes on is holed this moment in this scope; Then might cause taking place between the adjacent boring situation of through hole or fracture; The quality and the yield of circuit board have been had a strong impact on like this; Even have the UNICOM between the layer segment boring in the circuit board, reduce the reliability of circuit board, thereby make the quality of circuit board be difficult to guarantee.
Summary of the invention
In order to solve the problems referred to above of prior art, be necessary to provide a kind of boring method of high-quality, high benefit.
A kind of boring method of circuit board comprises step: measure the influence parameter of circuit boring to circuit board; According to location parameter, set the parameter of drilling of boring; According to drilling parameter, circuit board is holed.
According to a preferred embodiment of the invention, the described parameter that influences comprises critical distance L, and critical distance L representes to form in the certain hour of boring back, and the circuit board of borehole circumference is within critical distance L, and boring does not suit to continue.
According to a preferred embodiment of the invention; The described parameter that influences comprises crash time T; After crash time T represented to form boring, the temperature of boring peripheral region circuit board was through after the cooling of crash time T, and boring suits to continue on the circuit board of said borehole circumference.
According to a preferred embodiment of the invention, the boring that neighbor distance is not less than critical distance L is divided into same group and holes.
According to a preferred embodiment of the invention, accomplish said every group boring the time of drilling be not less than crash time T.
According to a preferred embodiment of the invention, the sequence consensus of drilling of each group internal drilling.
According to a preferred embodiment of the invention, each group the taking from left to right of internal drilling, boring are from top to bottom holed in proper order.
According to a preferred embodiment of the invention, each group internal drilling take behind the first both sides in the middle of order hole.
According to a preferred embodiment of the invention, also comprise the dedusting to circuit board, the step of boring polishing.
Compared to prior art, in the boring method of circuit board of the present invention, measure the influence parameter of boring earlier to circuit board; According to the parameter of measuring, set the parameter of drilling of boring, boring is divided into many groups holes; In same group; The space length that makes any adjacent time go up two borings that form should be not less than critical distance L, can guarantee that like this boring that formerly forms can not influence the boring that forms subsequently, guarantees the quality of circuit board; Not on the same group in, the arbitrarily boring of the adjacent formation in space, its drilling time should be not less than crash time T at interval, that is to say, treats the boring zone in a settings, in boring procedure, is to select the non-conterminous bore position of treating to carry out the interval bore process.Same like this two borings that can guarantee that any space is adjacent, formerly forming boring can not influence the boring that forms in the back, guarantees the quality of circuit board.Like this through the great-jump-forward boring method of double design, avoid influencing the zone of follow-up boring from the space on the bank with the time, can improve the reliability of boring circuit board and make efficient.
Description of drawings
Fig. 1 is the sketch map of the employed circuit board of circuit boring method of the present invention.
Fig. 2 is the flow chart of circuit boring method of the present invention.
Fig. 3-Fig. 6 is each step sketch map of circuit boring method one specific embodiment of the present invention.
Embodiment
Please consult Fig. 1 simultaneously, Fig. 1 is the sketch map of circuit board used in the present invention.Being preset with a plurality of borings 11 on the said circuit board 10, among the present invention, is that example describes with said boring 11 for basic arranged.
Please consult Fig. 2 simultaneously, Fig. 2 is the flow chart of circuit boring method of the present invention, and boring method comprises: step S1, measure the influence parameter of boring to the peripheral circuits plate; Step S2 sets the parameter of drilling of holing; Step S3, parameter is holed according to drilling; Step S4 accomplishes circuit boring.Specifically introduce the step of circuit boring method of the present invention below in conjunction with Fig. 3 to Fig. 6.
Step S1 measures the influence parameter of boring to the peripheral circuits plate,
In this step; At first with the testing circuit board of circuit board 10 identical materials (figure does not show) on carry out the experiment of drilling parameter; Detection formation is holed to the influence of the circuit board of boring peripheral region, and its influence comprises the necessarily regional interior circuit board temperature of testing bore holes and the influence of intensity on every side.Concrete, after the formation boring just, after the circuit board of this borehole circumference surpasses a certain critical distance L; It is stable that circuit board temperature and intensity keep; Continuing boring will not influence the quality of circuit board, and in critical distance L, because the circuit board temperature rises and intensity decreases; Suitable continuation boring in this zone, next boring should surpass critical distance L apart from a last boring; After formation is holed owing to drill; The temperature of boring peripheral region circuit board can reduce in time and gradually; Also should test this regional circuit board this moment after the cooling of crash time T at least; It is normal that circuit board temperature and intensity are recovered, and new boring around this boring will not had influence to the quality of circuit board, writes down above-mentioned two parameters: critical distance L, crash time T then.
Step S2 sets the parameter of drilling of adjacent boring;
In this step; According to three parameters that step S1 measures, formulate the circuit boring condition, that is: any adjacent time is gone up two borings that form; The space length of two borings should be not less than critical distance L; Can guarantee that like this boring that formerly forms can not influence the boring that forms subsequently, guarantee the quality of circuit board; Perhaps, the boring of the adjacent formation in space arbitrarily, its drilling time should be not less than crash time T at interval, and just, the drilling time that should set each group boring is not less than crash time T.Same like this two borings that can guarantee that any space is adjacent, the boring and the peripheral circuit plate thereof that formerly form are lowered the temperature, and are unlikely to influence the boring that forms in the back, guarantee the quality of circuit board.
With Fig. 3-circuit board shown in Figure 6 is example; If critical distance L be not less than two neighbours on the space boring 11 distance and less than the distance of three adjacent borings 11; Then choose on the space groupings of holing of distance that distance is not less than two neighbours' borings, for example can all be holed 11 be divided into four groups: the boring group 111 of odd-numbered line odd column, the boring group 112 of odd-numbered line even column; The boring group 113 of even number line odd column; The boring group 114 of even number line even column simultaneously, guarantees that the time span of accomplishing any boring group is not less than crash time T.
Divide into groups to above-mentioned boring; Respectively the boring group of each group is holed; That is, accomplish the boring group 111 (shown in Figure 3) of odd-numbered line odd column earlier, carrying out the boring group 112 (shown in Figure 4) of odd-numbered line even column; Carry out the boring group 113 (shown in Figure 5) of even number line odd column then, carry out the boring group 114 (shown in Figure 6) of even number line even column at last.Because the distance between the boring 11 in arbitrary group of boring group 111,112,113,114 all is not less than critical distance L, then be independent of each other between the boring 11 in arbitrary group of boring group 111,112,113,114; Be not less than crash time T because accomplish the time of boring group arbitrarily 111,112,113,114 again; The temperature of last boring group 111,112,113 reduces; Then can eliminate each boring group 111,112,113, influencing each other between 114, guarantee the quality of circuit board.
Boring 11 in each boring group 111,112,113,114 can according to about up and down order hole successively; Order in the middle of after also can first both sides is holed; And the boring of each boring group 111,112,113,114 order can be consistent; Also can be inconsistent, not do concrete restriction at this.
Certainly, according to the not isostructure and the characteristic of circuit board 10, also can the boring of circuit board 10 be divided into the grouping of other types, but should guarantee the circuit board quality that is independent of each other between the boring 11 adjacent in each boring group, promptly satisfy the relation of critical distance L; Simultaneously, satisfy the circuit board quality that is independent of each other between the boring 11 between any adjacent boring group, that is, satisfy the relation of crash time T.
Step S3, parameter is holed according to drilling;
In this step, according to the good parameters of drilling such as grouping of step S2 planning, one by one circuit board 10 is holed, until accomplishing all borings.
Step S4 accomplishes circuit boring;
In this step, mainly the circuit board 10 of having holed is carried out work such as dedusting, boring polishing, cleaning, repeat no more at this.
Compared to prior art, in the boring method of circuit board of the present invention, measure the influence parameter of boring earlier to circuit board; According to the parameter of measuring, set the parameter of drilling of boring, boring is divided into many groups holes; In same group; The space length that makes any adjacent time go up two borings that form should be not less than critical distance L, can guarantee that like this boring that formerly forms can not influence the boring that forms subsequently, guarantees the quality of circuit board; Not on the same group in, the arbitrarily boring of the adjacent formation in space, its drilling time should be not less than crash time T at interval.Same like this two borings that can guarantee that any space is adjacent, formerly forming boring can not influence the boring that forms in the back, guarantees the quality of circuit board.Like this through the great-jump-forward boring method of double design, avoid influencing the zone of follow-up boring from the space on the bank with the time, can improve the reliability of boring circuit board and make efficient.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (9)
1. the boring method of a circuit board is characterized in that comprising step:
Measure the influence parameter of circuit boring to circuit board;
According to location parameter, set the parameter of drilling of boring;
According to drilling parameter, circuit board is holed.
2. the boring method of circuit board according to claim 1 is characterized in that, the described parameter that influences comprises critical distance L, and critical distance L representes to form in the certain hour of boring back, and the circuit board of borehole circumference is within critical distance L, and boring does not suit to continue.
3. the boring method of circuit board according to claim 2; It is characterized in that; The described parameter that influences comprises crash time T; After crash time T represented to form boring, the temperature of boring peripheral region circuit board was through after the cooling of crash time T, and boring suits to continue on the circuit board of said borehole circumference.
4. the boring method of circuit board according to claim 3 is characterized in that, the boring that neighbor distance is not less than critical distance L is divided into same group and holes.
5. the boring method of circuit board according to claim 4 is characterized in that, the time of drilling of accomplishing said every group of boring is not less than crash time T.
6. the boring method of circuit board according to claim 4 is characterized in that, the sequence consensus of drilling of each group internal drilling.
7. the boring method of circuit board according to claim 4 is characterized in that, the boring in each group is taked from left to right, boring is from top to bottom holed in proper order.
8. the boring method of circuit board according to claim 4 is characterized in that, middle order was holed after first both sides were taked in the boring in each group.
9. the boring method of circuit board according to claim 1 is characterized in that, also comprises the dedusting to circuit board, the step of boring polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103863930A CN102497733A (en) | 2011-11-28 | 2011-11-28 | Circuit board drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103863930A CN102497733A (en) | 2011-11-28 | 2011-11-28 | Circuit board drilling method |
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| CN102497733A true CN102497733A (en) | 2012-06-13 |
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| CN2011103863930A Pending CN102497733A (en) | 2011-11-28 | 2011-11-28 | Circuit board drilling method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN104260147A (en) * | 2014-08-21 | 2015-01-07 | 宁波赛特信息科技发展有限公司 | Flexible circuit board drilling method |
| CN104385362A (en) * | 2014-08-28 | 2015-03-04 | 梅州市志浩电子科技有限公司 | Opposite angle hole separated jumping drilling method of printed circuit board |
| CN103785876B (en) * | 2014-02-21 | 2016-11-30 | 昆山苏杭电路板有限公司 | Printed board high-precision large aperture hole forming method |
| CN107580415A (en) * | 2017-08-14 | 2018-01-12 | 姜鹏 | A kind of pcb board adjacent pores electric leakage ameliorative way |
| CN112845823A (en) * | 2021-01-07 | 2021-05-28 | 辽阳石化机械设计制造有限公司 | Drawing method for short-distance holes of large-diameter collecting pipe device |
| CN113210650A (en) * | 2021-03-31 | 2021-08-06 | 成都飞机工业（集团）有限责任公司 | Aviation metal plate mesh part drilling die and drilling method thereof |
| CN117202515A (en) * | 2023-11-07 | 2023-12-08 | 深圳市中电联科技有限公司 | Automatic punching control method and system for flexible circuit board |
Citations (3)
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| CN101537505A (en) * | 2008-12-30 | 2009-09-23 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| JP2009260100A (en) * | 2008-04-18 | 2009-11-05 | Shimada Phys & Chem Ind Co Ltd | Drilling method of printed circuit board, and creation device of drilling data |
| CN102039432A (en) * | 2010-09-30 | 2011-05-04 | 北大方正集团有限公司 | Printed circuit board (PCB) drilling method and equipment |
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2011
- 2011-11-28 CN CN2011103863930A patent/CN102497733A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260100A (en) * | 2008-04-18 | 2009-11-05 | Shimada Phys & Chem Ind Co Ltd | Drilling method of printed circuit board, and creation device of drilling data |
| CN101537505A (en) * | 2008-12-30 | 2009-09-23 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| CN102039432A (en) * | 2010-09-30 | 2011-05-04 | 北大方正集团有限公司 | Printed circuit board (PCB) drilling method and equipment |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN103785876B (en) * | 2014-02-21 | 2016-11-30 | 昆山苏杭电路板有限公司 | Printed board high-precision large aperture hole forming method |
| CN104260147A (en) * | 2014-08-21 | 2015-01-07 | 宁波赛特信息科技发展有限公司 | Flexible circuit board drilling method |
| CN104385362A (en) * | 2014-08-28 | 2015-03-04 | 梅州市志浩电子科技有限公司 | Opposite angle hole separated jumping drilling method of printed circuit board |
| CN107580415A (en) * | 2017-08-14 | 2018-01-12 | 姜鹏 | A kind of pcb board adjacent pores electric leakage ameliorative way |
| CN112845823A (en) * | 2021-01-07 | 2021-05-28 | 辽阳石化机械设计制造有限公司 | Drawing method for short-distance holes of large-diameter collecting pipe device |
| CN113210650A (en) * | 2021-03-31 | 2021-08-06 | 成都飞机工业（集团）有限责任公司 | Aviation metal plate mesh part drilling die and drilling method thereof |
| CN113210650B (en) * | 2021-03-31 | 2022-06-14 | 成都飞机工业（集团）有限责任公司 | Drilling method for aviation sheet metal mesh part |
| CN117202515A (en) * | 2023-11-07 | 2023-12-08 | 深圳市中电联科技有限公司 | Automatic punching control method and system for flexible circuit board |
| CN117202515B (en) * | 2023-11-07 | 2024-01-19 | 深圳市中电联科技有限公司 | Automatic punching control method and system for flexible circuit board |
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Application publication date: 20120613 |