CN115152013A - 磁性装置 - Google Patents
磁性装置 Download PDFInfo
- Publication number
- CN115152013A CN115152013A CN202180015269.5A CN202180015269A CN115152013A CN 115152013 A CN115152013 A CN 115152013A CN 202180015269 A CN202180015269 A CN 202180015269A CN 115152013 A CN115152013 A CN 115152013A
- Authority
- CN
- China
- Prior art keywords
- magnetic layer
- layer
- magnetic
- opposing
- nonmagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 948
- 230000005415 magnetization Effects 0.000 claims abstract description 170
- 229910052796 boron Inorganic materials 0.000 claims description 18
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 16
- 229910052721 tungsten Inorganic materials 0.000 claims description 13
- 229910052720 vanadium Inorganic materials 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 230000014759 maintenance of location Effects 0.000 description 17
- 238000005259 measurement Methods 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 229910052742 iron Inorganic materials 0.000 description 11
- 230000009471 action Effects 0.000 description 10
- 229910052741 iridium Inorganic materials 0.000 description 10
- 229910052707 ruthenium Inorganic materials 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 229910052735 hafnium Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000005290 antiferromagnetic effect Effects 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000005355 Hall effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910019041 PtMn Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Thin Magnetic Films (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020051703A JP2023062214A (ja) | 2020-03-23 | 2020-03-23 | 磁気装置 |
JP2020-051703 | 2020-03-23 | ||
PCT/JP2021/011589 WO2021193488A1 (ja) | 2020-03-23 | 2021-03-22 | 磁気装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115152013A true CN115152013A (zh) | 2022-10-04 |
Family
ID=77891856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180015269.5A Pending CN115152013A (zh) | 2020-03-23 | 2021-03-22 | 磁性装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2023062214A (ja) |
CN (1) | CN115152013A (ja) |
WO (1) | WO2021193488A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007150265A (ja) * | 2005-10-28 | 2007-06-14 | Toshiba Corp | 磁気抵抗効果素子および磁気記憶装置 |
KR102524352B1 (ko) * | 2015-07-16 | 2023-04-21 | 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 | 자기 저항 효과 소자 및 자기 메모리 |
JP6290487B1 (ja) * | 2017-03-17 | 2018-03-07 | 株式会社東芝 | 磁気メモリ |
JP7024204B2 (ja) * | 2017-04-21 | 2022-02-24 | Tdk株式会社 | スピン流磁化回転素子、磁気抵抗効果素子及び磁気メモリ |
US11610614B2 (en) * | 2018-04-18 | 2023-03-21 | Tohoku University | Magnetoresistive element, magnetic memory device, and writing and reading method for magnetic memory device |
-
2020
- 2020-03-23 JP JP2020051703A patent/JP2023062214A/ja active Pending
-
2021
- 2021-03-22 WO PCT/JP2021/011589 patent/WO2021193488A1/ja active Application Filing
- 2021-03-22 CN CN202180015269.5A patent/CN115152013A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023062214A (ja) | 2023-05-08 |
WO2021193488A1 (ja) | 2021-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240117 Address after: Sheung Wan, Hongkong, China Applicant after: SP AITH Ltd. Address before: Japan Ibaraki Applicant before: Yoda-s Co.,Ltd. |