CN115148419A - High-conductivity antioxidant microalloyed copper alloy bonding wire and preparation method thereof - Google Patents
High-conductivity antioxidant microalloyed copper alloy bonding wire and preparation method thereof Download PDFInfo
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Abstract
The invention provides a high-conductivity antioxidant microalloyed copper alloy bonding wire and a preparation method thereof, wherein the preparation method comprises the following steps: mixing Cu-Ag intermediate alloy, cu-Au intermediate alloy, cu-Pd intermediate alloy and more than 5N high-purity copper, smelting, adding Cu-Mg, cu-Zn and Cu-Al intermediate alloy for refining, casting the melt obtained by refining into a round bar, and sequentially carrying out the processes of large drawing, medium drawing, fine drawing and fine drawing on the round bar to obtain the high-conductivity antioxidant microalloyed copper alloy bonding wire. Ag. The total content of Au, pd, mg, zn and Al in the bonding wire is less than or equal to 0.01wt%. The high-conductivity antioxidant microalloyed copper alloy bonding wire comprises a product prepared by the method. The invention achieves the purposes of obtaining good oxidation resistance, conductivity and ductility and basically keeping the same resistivity and hardness as pure copper by controlling the content of alloy elements in the bonding wire.
Description
Technical Field
The invention relates to the technical field of packaging materials of Integrated Circuits (IC) and light-emitting diode (LED) devices, in particular to a high-conductivity antioxidant microalloyed copper alloy bonding wire and a preparation method thereof.
Background
Wire bonding, also known as wire bonding, is a technique of connecting a bare chip electrode pad and an input/output lead of an electronic package or a metal wiring pad on a substrate with a metal bonding wire by applying pressure, heat, ultrasonic energy, and the like by a bonding method (ball-split, wedge-wedge, or the like).
At present, the wire bonding technology still dominates the inner connection technology. The bonding wires mainly used in the market comprise gold wires, copper wires, silver wires and aluminum wires. Copper bonding wires have been widely used in the fields of IC integrated circuits, LED optoelectronic product circuits, discrete devices, high-power devices, etc., and the market share thereof has already occupied more than 50% in the field of bonding wires. Compared with the traditional gold bonding wire, the copper bonding wire has low material cost and obvious price advantage. The copper bonding wire has better electrical conductivity, thermal conductivity and comprehensive mechanical property than the gold bonding wire, and can realize bonding packaging of the ultra-fine wire diameter bonding wire below 150 mu m and low long arc. In the work, the copper bonding wire is used for transmitting current signals, so that the distortion is not easy, the conduction of the work heat of the chip is facilitated, the growth speed of copper-aluminum intermetallic compounds and the like at the interface is slow, the reliability is high, and the service life of a chip device is long. However, pure copper bonding wires have high hardness, are easily oxidized, have inferior chemical stability than gold bonding wires, and the oxidation of pure copper affects the size and shape of free air balls during the formation of free air balls. Meanwhile, the recrystallization temperature of pure copper is low, the grain size of the formed free air ball is large, and the Heat Affected Zone (HAZ) is long, so that the reliability of the bonding wire is influenced. Although the Pd (palladium) -plated copper wire can solve the oxidation problem of the pure copper bonding wire, the cost is higher than that of the pure copper bonding wire, and the copper exposed part at the heel of the wedge welding point has the problems of failure, weak point and the like. Therefore, the alloying method for improving the oxidation resistance of the copper wire is still an effective method for solving the oxidation problem of the copper bonding wire.
Disclosure of Invention
In view of the deficiencies in the prior art, the present invention is directed to solving one or more of the problems in the prior art set forth above. For example, one of the objects of the present invention is to improve the oxidation resistance of copper wire.
In order to achieve the above object, the present invention provides a method for preparing a high-conductivity antioxidant microalloyed copper alloy bonding wire, which mainly comprises the following steps:
mixing 0.006-0.6 wt% of Cu-Ag intermediate alloy, 0.006-0.6 wt% of Cu-Au intermediate alloy, 0.006-0.6 wt% of Cu-Pd intermediate alloy and the balance of high-purity copper of 5N or more in terms of weight percentage, and then carrying out vacuum melting to obtain a first molten mass;
adding 0.006 to 0.6wt% of a Cu-Mg intermediate alloy, 0.006 to 0.6wt% of a Cu-Zn intermediate alloy and 0.006 to 0.6wt% of a Cu-Al intermediate alloy to the first molten mass under a protective atmosphere, and refining to obtain a second molten mass;
drawing and casting the second molten mass into a round bar, and sequentially carrying out large drawing, medium drawing, fine drawing and fine drawing on the drawn and cast round bar to obtain a high-conductivity antioxidant microalloyed copper alloy bonding wire;
wherein, the contents of Ag, au, pd, mg, zn and Al in the high-conductivity antioxidant microalloyed copper alloy bonding wire are all 0.0001-0.003 wt%, and the total content of Ag, au, pd, mg, zn and Al in the high-conductivity antioxidant microalloyed copper alloy bonding wire is less than or equal to 0.01wt%.
According to an exemplary embodiment of an aspect of the present invention, the Cu-Ag master alloy may be a Cu-0.5 to 1.5wt% Ag alloy, the Cu-Au master alloy may be a Cu-0.5 to 1.5wt% Au alloy, the Cu-Pd master alloy may be a Cu-0.5 to 1.5wt% Pd alloy, the Cu-Mg master alloy may be a Cu-0.5 to 1.5wt% Mg alloy, the Cu-Zn master alloy may be a Cu-0.5 to 1.5wt% Zn alloy, and the Cu-Al master alloy may be a Cu-0.5 to 1.5wt% Al alloy.
According to an exemplary embodiment of an aspect of the present invention, the preparation method may further include a step of preheating the raw material before melting, the preheating temperature may be 150 to 250 ℃, and the preheating time may be 10 to 50min.
According to an exemplary embodiment of an aspect of the present invention, the temperature of the vacuum melting may be 1100 to 1350 ℃, the time may be 10 to 30min, and the degree of vacuum may be 1.1 to 2 × 10 -2 Pa。
According to an exemplary embodiment of an aspect of the present invention, the temperature of the refining may be 1150 to 1250 ℃ and the time may be 5 to 10min; the refining may further include stirring the second molten mass using electromagnetic stirring.
According to an exemplary embodiment of an aspect of the present invention, the preparation method may further include: after the refining is finished, the temperature of the second molten mass is reduced to 1100-1200 ℃, and the second molten mass is kept stand for 5-10 min.
According to an exemplary embodiment of an aspect of the present invention, the speed of the drawing may be 50 to 150mm/min, the diameter of the round bar may be 8 to 10mm, and the diameter of the highly conductive antioxidant microalloyed copper alloy bonding wire may be 15 to 30 μm.
According to an exemplary embodiment of an aspect of the present invention, the preparation method may further include: and annealing the bonding wire subjected to the processes of heavy drawing, medium drawing, fine drawing and fine drawing at 350-450 ℃ in an inert atmosphere.
In another aspect of the invention, a high-conductivity antioxidant microalloyed copper alloy bonding wire is provided, and the high-conductivity antioxidant microalloyed copper alloy bonding wire can comprise a product prepared by the preparation method of the high-conductivity antioxidant microalloyed copper alloy bonding wire.
According to an exemplary embodiment of another aspect of the present invention, the copper alloy bonding wire may include: 0.0001 to 0.003wt% of Ag, 0.0001 to 0.003wt% of Au, 0.0001 to 0.003wt% of Pd, 0.0001 to 0.003wt% of Mg, 0.0001 to 0.003wt% of Zn, 0.0001 to 0.003wt% of Al and the balance of high purity copper of 5N or more, in mass percent. Wherein the total content of Ag, au, pd, mg, zn and Al in the copper alloy bonding wire is less than or equal to 0.01wt%, and the content of copper is more than or equal to 99.99wt%.
Compared with the prior art, the invention has the beneficial effects that at least one of the following contents is included:
(1) The high-conductivity antioxidant microalloyed copper alloy bonding wire has good ductility and the same or similar hardness as pure copper;
(2) The high-conductivity antioxidant microalloyed copper alloy bonding wire has good conductivity;
(3) The high-conductivity antioxidant microalloyed copper alloy bonding wire has high-temperature oxidation resistance, and the melting point of the bonding wire is reduced by adding Mg.
Drawings
The above and other objects and features of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
fig. 1 shows a line graph of the oxidative weight gain of a highly conductive, oxygen resistant microalloyed copper alloy bonding wire prepared according to a specific example of the invention.
Detailed Description
Hereinafter, a highly conductive antioxidant microalloyed copper alloy bonding wire and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings and exemplary embodiments.
It should be noted that "first," "second," and the like are merely for convenience of description and for ease of distinction, and are not to be construed as indicating or implying relative importance.
Fig. 1 shows an oxidation weight gain line graph of a highly conductive oxygen-resistant microalloyed copper alloy bonding wire prepared according to a specific embodiment of the invention.
In a first exemplary embodiment of the present invention, a method for preparing a high-conductivity antioxidant microalloyed copper alloy bonding wire mainly comprises the following steps:
weighing 0.006-0.6 wt% of Cu-Ag intermediate alloy, 0.006-0.6 wt% of Cu-Au intermediate alloy, 0.006-0.6 wt% of Cu-Pd intermediate alloy and the balance of high-purity copper of more than 5N, mixing, and vacuum melting in a melting furnace to obtain the first molten mass. The high purity copper of 5N or more may be 5N copper, 6N copper, 7N copper, or the like. For example, in weight percent, one can refer to a Cu-Ag master alloy of 0.006wt%, 0.06wt%, 0.12wt%, 0.041wt%, 0.55wt%, 0.6wt%; 0.0069wt%, 0.08wt%, 0.19wt%, 0.3wt%, 0.45wt% and 0.6wt% of Cu-Au master alloy can be weighed; cu-Pu master alloy can be weighed as 0.0068wt%, 0.045wt%, 0.088wt%, 0.29wt%, 0.46wt%, 0.59wt%. For example, a Cu-Mg master alloy, a Cu-Zn master alloy and a Cu-Al master alloy can be added by adopting a bowl feeding mode. The Au and Pd alloy elements are added into the copper to play a role in multi-element alloying, the Au and Pd alloy elements can form an infinite mutual solution with the copper, the oxidation resistance and the corrosion resistance of the copper can be obviously improved, and the recrystallization temperature and the creep strength of the copper can be properly improved by adding a trace amount of Ag.
Adding the weighed Cu-Mg intermediate alloy in an amount of 0.006 to 0.6wt%, the weighed Cu-Zn intermediate alloy in an amount of 0.006 to 0.6wt%, and the weighed Cu-Al intermediate alloy in an amount of 0.006 to 0.6wt% to the first molten mass under a protective atmosphere, and refining to obtain a second molten mass. For example, in weight percent, the Cu-Mg master alloy may be referred to as 0.006wt%, 0.009wt%, 0.031wt%, 0.35wt%, 0.41wt%, 0.599wt%; 0.0068wt%, 0.0099wt%, 0.058wt%, 0.11wt%, 0.44wt% and 0.6wt% of Cu-Zn master alloy can be weighed; the Cu-Al master alloy can be weighed as 0.0069wt%, 0.0097wt%, 0.047wt%, 0.19wt%, 0.48wt% and 0.6wt%. Here, the protective atmosphere may be nitrogen, argon, carbon dioxide, or the like. The addition of Mg alloy elements has a deoxidizing effect in the refining process, and the Mg alloy elements remained in copper can further improve the high-temperature oxidation resistance of the copper and reduce the melting point of the copper. Since Al has a limited solid solubility in copper, it is pushed out to the surface during the refining process, thereby further preventing the oxidation of copper. The addition of Zn alloy elements can improve the weldability of the bonding wire material and improve the welding spot reliability. Ag. Most of atoms of Au, pd, mg, zn and Al alloy elements exist in copper in a solid solution mode, which can cause lattice distortion or segregation at grain boundaries, so that free air ball grains are finer, the grain growth stage in the annealing process and the bonding balling process can block the migration of the grain boundaries, the recrystallization temperature is increased, the heat affected zone of the copper in the bonding process is shorter than that of pure copper, and the oxidation resistance of the copper is improved. Here, the elements of Ag, au, pd, mg, zn, and Al are added as an intermediate alloy in order to make the content distribution of the added alloying elements more uniform. In addition, due to the special characteristics of the industry (the number of one furnace for one time of processing is small), the intermediate alloy is adopted for proportioning and is also convenient to weigh. However, the present invention is not limited thereto, and a manner of directly adding Ag, au, pd, mg, zn, al, and the like may be adopted.
And performing drawing casting on the second molten mass to form a round bar, and performing multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like and annealing process procedures on the drawn and cast round bar in sequence to obtain the high-conductivity antioxidant microalloyed copper alloy bonding wire.
Wherein, the contents of Ag, au, pd, mg, zn and Al in the high-conductivity antioxidant microalloyed copper alloy bonding wire are all 0.0001 to 0.003 weight percent. Ag. The total content of Au, pd, mg, zn and Al in the copper alloy bonding wire is less than or equal to 0.01wt%, for example, 0.0009wt%, 0.002wt%, 0.005wt%, 0.01wt%. The trace Ag, au, pd, mg, zn and Al alloy elements can improve the oxidation resistance of the copper, but the resistivity and the hardness of the copper are not obviously improved, so that the bonding wire material still keeps good conductivity and ductility, and the smooth cold working forming is ensured.
In the present exemplary embodiment, the Cu-Ag intermediate alloy may be Cu-0.5 to 1.5wt% Ag alloy, the Cu-Au intermediate alloy may be Cu-0.5 to 1.5wt% Au alloy, the Cu-Pd intermediate alloy may be Cu-0.5 to 1.5wt% Pd alloy, the Cu-Mg intermediate alloy may be Cu-0.5 to 1.5wt% Mg alloy, the Cu-Zn intermediate alloy may be Cu-0.5 to 1.5wt% Zn alloy, the Cu-Al intermediate alloy may be Cu-0.5 to 1.5wt% Al alloy. For example, for Cu-Ag intermediate alloys, cu-0.5wt% Ag alloy, cu-0.8wt% Ag alloy, cu-1.0wt% Ag alloy, cu-1.5wt% Ag alloy, may be selected; for the Cu-Au intermediate alloy, cu-0.5wt% Au alloy, cu-0.9wt% Au alloy, cu-1.0wt% Au alloy, cu-1.4wt% Au alloy can be selected; for the Cu-Pd intermediate alloy, cu-0.6wt% Pd alloy, cu-1.0wt% Pd alloy, cu-1.2wt% Pd alloy, cu-1.5wt% Pd alloy can be selected; for the Cu-Mg intermediate alloy, optionally selecting Cu-0.7wt% Mg alloy, cu-1.0wt% Mg alloy, cu-1.1wt% Mg alloy, cu-1.4wt% Mg alloy; for the Cu-Zn intermediate alloy, cu-0.5wt% of Zn alloy, cu-0.7wt% of Zn alloy, cu-1.0wt% of Zn alloy, cu-1.4wt% of Zn alloy can be selected; for the Cu-Al intermediate alloy, may be selected from Cu-0.5wt% Al alloy, cu-1.0wt% Al alloy, cu-1.3wt% Al alloy, cu-1.5wt% Al alloy.
In the present exemplary embodiment, the method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire may further include a step of preheating the weighed raw materials before melting. The preheating step can be completed in a vacuum oven with protective atmosphere, and the vacuum degree in the oven is 6.0-10.0 × 10 -2 Pa, e.g. 6.0X 10 -2 Pa、6.5×10 -2 Pa、10.0×10 -2 Pa. The temperature of the preheating may be 150 to 250 deg.C, for example, 150 deg.C, 200 deg.C, 250 deg.C. The preheating time can be 10-50 min, such as 10min, 30min, 50min. Here, preheating the raw material can remove moisture in the raw material and ensure the drying of the raw material.
In the present exemplary embodiment, the temperature of vacuum melting may be 1100 to 1350 ℃, e.g., 1112 ℃, 1200 ℃, 1300 ℃, 1349 ℃. The time can be 10-30 min, such as 11min, 20min, 30min. The vacuum degree in the vacuum smelting furnace is 1.1-2 x 10 -2 Pa, e.g. 1.2X 10 -2 Pa、1.6×10 -2 Pa、1.8×10 -2 Pa、2×10 -2 Pa。
In the present exemplary embodiment, the temperature of refining may be 1150 to 1250 ℃, for example, 1150 ℃, 1165 ℃, 1220 ℃, 1250 ℃. The time may be 5 to 10min, for example, 5min, 7min, 10min. And stirring the second molten mass in an electromagnetic stirring mode in the refining process. The electromagnetic stirring mode can strengthen the convection, heat transfer and mass transfer processes of the molten mass and control the flow direction and the shape of the molten mass. The melt may be in rotary, linear or spiral motion. The electromagnetic stirring mode can be used for adjusting parameters according to the quality requirements of finished products of materials to obtain different stirring effects, and has a positive effect of improving the quality of the final products compared with other stirring methods (such as vibration and air blowing).
In the present exemplary embodiment, the preparation method may further include: and after the refining is finished, reducing the temperature of the second molten mass to 1100-1200 ℃, and standing for 5-10 min. For example, the temperature can be reduced to 1150 ℃ and kept still for 5min, the temperature can be reduced to 1170 ℃ and kept still for 9min, and the temperature can be reduced to 1200 ℃ and kept still for 6min. Here, too high temperature of the second molten mass directly performs drawing casting and drawing, which may cause too large supercooling degree and too fast crystallization, which may result in failure to complete drawing work normally, so that cooling treatment is required. And the second molten mass is kept still, so that the temperature of each part of the second molten mass is consistent, and the next step of drawing casting and traction is facilitated.
In the present exemplary embodiment, the speed of the drawing may be 50 to 150mm/min, for example, 50mm/min, 60mm/min, 100mm/min, 150mm/min. The diameter of the formed round bar may be 8 to 10mm, for example 8mm, 9mm, 10mm. The diameter of the high-conductivity antioxidant microalloyed copper alloy bonding wire can be 15-30 μm, such as 15 μm, 18 μm, 22 μm and 30 μm.
In the present exemplary embodiment, the method for preparing the high-conductive antioxidant microalloyed copper alloy bonding wire may further include: and annealing the bonding wire subjected to the multi-pass drawing process such as heavy drawing, medium drawing, fine drawing, micro fine drawing and the like at 350-450 ℃ in a protective atmosphere. Here, the annealing temperature may be 351 deg.C, 400 deg.C, 450 deg.C. The bonding wire is placed in the protective atmosphere, so that oxygen can be isolated, and the protective atmosphere can be used as a heat transfer medium, so that the bonding wire is heated uniformly during annealing. Here, the drawing speed in the drawing process is less than 1000m/min, for example 850m/min, 900m/min, 999m/min. The drawn wire has a diameter of more than 1.5mm, for example 1.6mm, 1.8mm, 2mm. The diameter of the drawn wire may be 0.082mm to 1.5mm, for example 0.083mm, 0.99mm, 1.49mm. The diameter of the fine drawn wire may be 0.036mm to 0.082mm, for example 0.036mm, 0.07mm, 0.082mm. The diameter of the micro-drawn wire is less than 0.036mm, such as 0.019mm, 0.028mm, 0.035mm.
In order that the above-described exemplary embodiments of the invention may be better understood, further description thereof with reference to specific examples is provided below.
Example 1
(1) Weighing the following raw materials: cu-1.0wt% Ag intermediate alloy 4g, cu-1.0wt% Au intermediate alloy 2g, cu-1.0wt% Pd intermediate alloy 4g, cu-1.0wt% Mg intermediate alloy 2g, cu-1.0wt% Zn intermediate alloy 4g, cu-1.0wt% Al intermediate alloy 2g and 6N copper 1982g.
(2) Preheating the weighed raw materials in a vacuum oven under the protection of nitrogen atmosphere, and vacuumizing the oven to 6.5 × 10 -2 Pa, preheating at 200 deg.C for 30min.
(3) Mixing preheated 6N copper, cu-Ag intermediate alloy, cu-Au intermediate alloy and Cu-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6 multiplied by 10 -2 Pa, heating a vacuum smelting furnace, and smelting at 1200 ℃ for 30min to obtain a first molten mass.
(4) Injecting nitrogen for protection, and then adding the preheated Cu-Mg master alloy, the preheated Cu-Zn master alloy and the preheated Cu-Al master alloy into the first molten mass in a bowl feeding mode. And refining for 5min at 1200 ℃ by adopting an electromagnetic stirring mode in the refining process to obtain a second molten mass.
(5) After completion of refining, the temperature of the second melt was lowered to 1150 ℃ and left to stand for 5min.
(6) The second melt was cast at a casting speed of 60mm/min into round bars having a diameter of 8 mm.
(7) And (3) carrying out multi-pass drawing processes such as heavy drawing, medium drawing, fine drawing, micro-fine drawing and the like on the round bar formed by drawing and casting, and then carrying out annealing treatment at 400 ℃ in the protection of nitrogen atmosphere to obtain the high-conductivity antioxidant microalloyed copper alloy bonding wire with the diameter of 18 microns.
Example 2
(1) Weighing the following raw materials: cu-1.0wt% of Ag intermediate alloy 4g, cu-1.0wt% of Au intermediate alloy 2g, cu-1.0wt% of Pd intermediate alloy 2g, cu-1.0wt% of Mg intermediate alloy 2g, cu-1.0wt% of Zn intermediate alloy 4g, cu-1.0wt% of Al intermediate alloy 2g and 6N copper 1984g.
(2) Preheating the weighed raw materials in a vacuum oven under the protection of nitrogen atmosphere, and vacuumizing the oven to 6.5 × 10 -2 Pa, preheating at 200 deg.C for 30min.
(3) Mixing preheated 6N copper, cu-Ag intermediate alloy, cu-Au intermediate alloy and Cu-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6 multiplied by 10 -2 Pa, heating a vacuum smelting furnace, and smelting at 1200 ℃ for 30min to obtain a first molten mass.
(4) Injecting nitrogen for protection, and then adding the preheated Cu-Mg master alloy, the Cu-Zn master alloy and the Cu-Al master alloy into the first molten mass in a bowl feeding mode. Refining at 1200 deg.C for 5min by electromagnetic stirring to obtain second molten mass.
(5) After completion of refining, the temperature of the second molten mass was lowered to 1150 ℃ and left to stand for 5min.
(6) The second melt was cast at a casting speed of 60mm/min into round bars having a diameter of 8 mm.
(7) And (3) carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing, micro fine drawing and the like on the round bar formed by drawing and casting, and then carrying out annealing treatment in the protection of nitrogen at 400 ℃ to obtain the high-conductivity antioxidant microalloyed copper alloy bonding wire with the diameter of 18 microns.
Example 3
(1) Weighing the following raw materials: cu-1.0wt% of Ag intermediate alloy 4g, cu-1.0wt% of Au intermediate alloy 2g, cu-1.0wt% of Pd intermediate alloy 2g, cu-1.0wt% of Mg intermediate alloy 2g, cu-1.0wt% of Zn intermediate alloy 2g, cu-1.0wt% of Al intermediate alloy 2g and 6N copper 1986g.
(2) Preheating the weighed raw materials in a vacuum oven under the protection of nitrogen atmosphere, and vacuumizing the oven to 6.5 × 10 -2 Pa, preheating at 200 deg.C for 30min.
(3) Intermediate bonding the preheated 6N copper and Cu-AgMixing gold, cu-Au intermediate alloy and Cu-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6 multiplied by 10 -2 Pa, heating a vacuum smelting furnace, and smelting at 1200 ℃ for 30min to obtain a first molten mass.
(4) Injecting nitrogen for protection, and then adding the preheated Cu-Mg master alloy, the Cu-Zn master alloy and the Cu-Al master alloy into the first molten mass in a bowl feeding mode. Refining at 1200 deg.C for 5min by electromagnetic stirring to obtain second molten mass.
(5) After completion of refining, the temperature of the second molten mass was lowered to 1150 ℃ and left to stand for 5min.
(6) The second melt was cast at a casting speed of 60mm/min into round bars having a diameter of 8 mm.
(7) And (3) carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing, micro fine drawing and the like on the round bar formed by drawing and casting, and then carrying out annealing treatment in the protection of nitrogen at 400 ℃ to obtain the high-conductivity antioxidant microalloyed copper alloy bonding wire with the diameter of 18 microns.
Comparative example
(1) Weighing the following raw materials: cu-1.0wt% Ag master alloy 4g and the balance 6N copper 1996g.
(2) Preheating the weighed raw materials in a vacuum oven under the protection of nitrogen atmosphere, and vacuumizing the oven to 6.5 × 10 -2 Pa, preheating at 200 deg.C for 30min.
(3) Mixing preheated 6N copper and Cu-Ag intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6 multiplied by 10 -2 Pa, heating the vacuum smelting furnace, and smelting at 1200 ℃ for 30min to obtain a first molten mass.
(4) Injecting nitrogen for protection, and refining the first molten mass at 1200 ℃ for 5min by adopting an electromagnetic stirring mode to obtain a second molten mass.
(5) After completion of refining, the temperature of the second melt was lowered to 1150 ℃ and left to stand for 5min.
(6) The second melt was cast at a casting speed of 60mm/min into round bars having a diameter of 8 mm.
(7) And (3) carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing, micro fine drawing and the like on the round bar formed by drawing and casting, and then carrying out annealing treatment in the protection of nitrogen at 400 ℃ to obtain the copper alloy bonding wire with the diameter of 18 mu m.
The first example, the second example, the third example and the comparative example all adopt the same bonding wire preparation steps and adopt different weight percentages of alloy raw materials. Some performance parameters of the bonding wires made in examples one, two, three and comparative examples were compared. The performance parameters may include oxidation weight gain, mechanical properties, and resistivity.
As shown in fig. 1, the oxidation weight gain (g) was measured at 1 to 9 hours for the copper alloy bonding wires manufactured in example one, example two, example three, and comparative example, respectively. As can be seen from fig. 1, the oxidation resistance of the high-conductivity antioxidant microalloyed copper alloy bonding wire made of the Cu-Ag master alloy, the Cu-Au master alloy, the Cu-Pd master alloy, the Cu-Mg master alloy, the Cu-Zn master alloy, the Cu-Al master alloy and the balance of 6N copper is stronger than that of the copper alloy bonding wire made of only the Cu-Ag master alloy and the balance of 6N copper through the same steps. Ag. Au, pd, mg, zn and Al alloy elements can improve the oxidation resistance of the copper.
Mechanical properties (breaking force and elongation) of the copper alloy bonding wires manufactured in example one, example two, example three and comparative example were measured at 400 deg.c and 160 rpm. As can be seen from table 1, the bond wires prepared in examples 1, 2 and 3 exhibited a slight increase in breaking force and a slight decrease in elongation compared to the comparative ratio, indicating that the bond wires still maintained good ductility.
Table 1: mechanical Properties (breaking force and elongation) of Each bonding wire at 400 ℃ and 160rpm
| Categories | Example 1 | Example 2 | Example 3 | Comparative example |
| Breaking force (g) | 5.56 | 5.24 | 5.06 | 4.65 |
| Elongation (%) | 12.35 | 12.77 | 12.95 | 13.37 |
The resistivity of the copper alloy bonding wires made in example one, example two, example three and comparative example was measured. As shown in Table 2, the copper alloy bonding wire with higher total content of Ag, au, pd, mg, zn and Al has higher resistivity, but the resistivity is not obviously improved, and the bonding wire still keeps good conductivity.
Table 2: resistivity of each bonding wire
| Categories | Example 1 | Example 2 | Example 3 | Comparative example |
| Specific resistance (mu omega cm) | 1.81 | 1.77 | 1.74 | 1.72 |
In a second exemplary embodiment of the present invention, the high-conductivity antioxidant micro-alloyed copper alloy bonding wire may include a product manufactured by the method for manufacturing the high-conductivity antioxidant micro-alloyed copper alloy bonding wire according to the first exemplary embodiment.
In the present exemplary embodiment, the copper alloy bonding wire may include: 0.0001 to 0.003wt% of Ag, 0.0001 to 0.003wt% of Au, 0.0001 to 0.003wt% of Pd, 0.0001 to 0.003wt% of Mg, 0.0001 to 0.003wt% of Zn, 0.0001 to 0.003wt% of Al and the balance of high-purity copper of 5N or more, in terms of mass percentage. For example, a copper alloy bonding wire may comprise 0.0001wt% ag, 0.003wt% au, 0.0019wt% pd, 0.0027wt% mg, 0.003wt% zn, 0.0011wt% al and the balance 6N copper. The copper alloy bonding wire may comprise 0.0021wt% Ag, 0.0009wt% Au, 0.003wt% Pd, 0.0018wt% Mg, 0.0021wt% Zn, 0.0017wt% Al and the balance 5N copper. The copper alloy bonding wire may comprise 0.0007wt% ag, 0.0013wt% au, 0.0015wt% pd, 0.0025wt% mg, 0.0017wt% zn, 0.003wt% al and the balance 7N copper.
Wherein the total content of Ag, au, pd, mg, zn and Al in the copper alloy bonding wire is less than or equal to 0.01wt%, such as 0.0009wt%, 0.006wt% and 0.01wt%. The copper content is 99.99 wt.% or more, for example 99.995 wt.%, 99.999 wt.%, 99.9999 wt.%.
In summary, the beneficial effects of the present invention may include at least one of the following:
(1) The preparation method of the high-conductivity antioxidant microalloyed copper alloy bonding wire is simple and convenient in process and easy to operate;
(2) The preparation method of the high-conductivity antioxidant microalloyed copper alloy bonding wire can improve the oxidation resistance and corrosion resistance of copper;
(3) The preparation method of the high-conductivity antioxidant microalloyed copper alloy bonding wire can improve the weldability of alloy materials and the reliability of welding spots.
Although a highly conductive oxygen resistant micro-alloyed copper alloy bonding wire and a method of manufacturing the same according to the present invention have been described above with reference to exemplary embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope defined in the appended claims.
Claims (10)
1. A preparation method of a high-conductivity antioxidant microalloyed copper alloy bonding wire is characterized by comprising the following steps:
mixing 0.006-0.6 wt% of Cu-Ag intermediate alloy, 0.006-0.6 wt% of Cu-Au intermediate alloy, 0.006-0.6 wt% of Cu-Pd intermediate alloy and the balance of high-purity copper of 5N or more in terms of weight percentage, and then carrying out vacuum melting to obtain a first molten mass;
adding 0.006 to 0.6wt% of a Cu-Mg intermediate alloy, 0.006 to 0.6wt% of a Cu-Zn intermediate alloy and 0.006 to 0.6wt% of a Cu-Al intermediate alloy to the first molten mass under a protective atmosphere, and refining to obtain a second molten mass;
drawing and casting the second molten mass into a round bar, and sequentially carrying out large drawing, medium drawing, fine drawing and fine drawing on the drawn and cast round bar to obtain a high-conductivity antioxidant microalloyed copper alloy bonding wire;
wherein, the contents of Ag, au, pd, mg, zn and Al in the high-conductivity antioxidant microalloyed copper alloy bonding wire are all 0.0001-0.003 wt%, and the total content of Ag, au, pd, mg, zn and Al in the high-conductivity antioxidant microalloyed copper alloy bonding wire is less than or equal to 0.01wt%.
2. The method for preparing a highly conductive antioxidant microalloyed copper alloy bonding wire according to claim 1, wherein the Cu-Ag intermediate alloy is Cu-0.5 to 1.5wt% Ag alloy, the Cu-Au intermediate alloy is Cu-0.5 to 1.5wt% Au alloy, the Cu-Pd intermediate alloy is Cu-0.5 to 1.5wt% Pd alloy, the Cu-Mg intermediate alloy is Cu-0.5 to 1.5wt% Mg alloy, the Cu-Zn intermediate alloy is Cu-0.5 to 1.5wt% Zn alloy, and the Cu-Al intermediate alloy is Cu-0.5 to 1.5wt% Al alloy.
3. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 1, wherein the preparation method further comprises the step of preheating raw materials before smelting, wherein the preheating temperature is 150-250 ℃, and the preheating time is 10-50 min.
4. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 1, wherein the vacuum melting temperature is 1100-1350 ℃, the time is 10-30 min, and the vacuum degree is 1.1-2 x 10 -2 Pa。
5. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 1, wherein the refining temperature is 1150-1250 ℃ and the refining time is 5-10 min;
and the refining also comprises stirring the second molten mass in an electromagnetic stirring mode.
6. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 5, wherein the preparation method further comprises the following steps:
and after refining is finished, reducing the temperature of the second molten mass to 1100-1200 ℃, and standing for 5-10 min.
7. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 1, wherein the speed of the drawing casting is 50 to 150mm/min;
the diameter of the round bar is 8-10 mm;
the diameter of the high-conductivity antioxidant microalloyed copper alloy bonding wire is 15-30 mu m.
8. The method for preparing the high-conductivity antioxidant microalloyed copper alloy bonding wire according to claim 7, wherein the method further comprises the following steps:
and annealing the bonding wire subjected to the processes of heavy drawing, medium drawing, fine drawing and fine drawing at 350-450 ℃ in an inert atmosphere.
9. A highly conductive and antioxidant microalloyed copper alloy bonding wire, characterized in that the highly conductive and antioxidant microalloyed copper alloy bonding wire is prepared by the preparation method of the highly conductive and antioxidant microalloyed copper alloy bonding wire according to any one of claims 1 to 8.
10. The highly conductive antioxidant microalloyed copper alloy bonding wire as claimed in claim 9, wherein the copper alloy bonding wire comprises:
0.0001 to 0.003wt% of Ag, 0.0001 to 0.003wt% of Au, 0.0001 to 0.003wt% of Pd, 0.0001 to 0.003wt% of Mg, 0.0001 to 0.003wt% of Zn, 0.0001 to 0.003wt% of Al and the balance of high-purity copper of 5N or more, in terms of mass percentage, wherein,
the total content of Ag, au, pd, mg, zn and Al in the copper alloy bonding wire is less than or equal to 0.01wt%, and the content of copper is more than or equal to 99.99wt%.
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| CN116013793A (en) * | 2023-01-09 | 2023-04-25 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026475A (en) * | 2011-07-21 | 2013-02-04 | Hitachi Cable Ltd | Copper bonding wire |
| WO2015037876A1 (en) * | 2013-09-12 | 2015-03-19 | 엠케이전자 주식회사 | Silver alloy boding wire and semiconductor device using same |
| JP2017048431A (en) * | 2015-09-02 | 2017-03-09 | 田中電子工業株式会社 | Copper alloy fine wire for ball bonding |
| CN108598058A (en) * | 2017-12-21 | 2018-09-28 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
| CN110284023A (en) * | 2019-07-22 | 2019-09-27 | 安徽广宇电子材料有限公司 | One Albatra metal bonding wire and its preparation method and application |
-
2022
- 2022-07-14 CN CN202210825157.2A patent/CN115148419B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026475A (en) * | 2011-07-21 | 2013-02-04 | Hitachi Cable Ltd | Copper bonding wire |
| WO2015037876A1 (en) * | 2013-09-12 | 2015-03-19 | 엠케이전자 주식회사 | Silver alloy boding wire and semiconductor device using same |
| JP2017048431A (en) * | 2015-09-02 | 2017-03-09 | 田中電子工業株式会社 | Copper alloy fine wire for ball bonding |
| CN108598058A (en) * | 2017-12-21 | 2018-09-28 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
| CN110284023A (en) * | 2019-07-22 | 2019-09-27 | 安徽广宇电子材料有限公司 | One Albatra metal bonding wire and its preparation method and application |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116013793A (en) * | 2023-01-09 | 2023-04-25 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
| CN116013793B (en) * | 2023-01-09 | 2024-03-19 | 四川威纳尔特种电子材料有限公司 | Multi-element microalloyed bond alloy wire and preparation method and application thereof |
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