CN115128902A - 电子部件制造用成套材料和其应用 - Google Patents

电子部件制造用成套材料和其应用 Download PDF

Info

Publication number
CN115128902A
CN115128902A CN202210305888.4A CN202210305888A CN115128902A CN 115128902 A CN115128902 A CN 115128902A CN 202210305888 A CN202210305888 A CN 202210305888A CN 115128902 A CN115128902 A CN 115128902A
Authority
CN
China
Prior art keywords
glass
photosensitive
paste
mass
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210305888.4A
Other languages
English (en)
Chinese (zh)
Inventor
佐合佑一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Publication of CN115128902A publication Critical patent/CN115128902A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Non-Insulated Conductors (AREA)
CN202210305888.4A 2021-03-25 2022-03-25 电子部件制造用成套材料和其应用 Pending CN115128902A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-051086 2021-03-25
JP2021051086A JP7232280B2 (ja) 2021-03-25 2021-03-25 電子部品製造用キットとその利用

Publications (1)

Publication Number Publication Date
CN115128902A true CN115128902A (zh) 2022-09-30

Family

ID=83376055

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210305888.4A Pending CN115128902A (zh) 2021-03-25 2022-03-25 电子部件制造用成套材料和其应用

Country Status (4)

Country Link
JP (2) JP7232280B2 (enExample)
KR (1) KR102972060B1 (enExample)
CN (1) CN115128902A (enExample)
TW (1) TWI922632B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102940935B1 (ko) 2024-02-15 2026-03-17 이화여자대학교 산학협력단 고인지예비능 생체표지자로서의 snp 및 이의 이용

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159322A (en) * 1996-06-17 2000-12-12 Toray Industries, Inc. Photosensitive ceramic green sheet, ceramic package, and process for producing the same
TW342578B (en) * 1996-09-26 1998-10-11 Toray Industries Photosensitive ceramic blank sheet, ceramic package and process for producing the same
JP2000165048A (ja) 1998-11-26 2000-06-16 Kyocera Corp 積層回路基板及びその製造方法
JP3674501B2 (ja) 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
JP3985493B2 (ja) * 2001-10-19 2007-10-03 株式会社村田製作所 感光性ペースト、それを用いた回路基板およびセラミック多層基板の製造方法
JP2006285226A (ja) * 2005-03-10 2006-10-19 Toray Ind Inc 感光性セラミックス組成物
CN101595071B (zh) 2007-01-30 2012-07-04 株式会社村田制作所 感光性玻璃浆料和多层布线片部件
JP6694099B1 (ja) 2019-07-10 2020-05-13 株式会社ノリタケカンパニーリミテド 感光性組成物の製造方法、ペースト状の感光性組成物、電子部品の製造方法および電子部品、ならびに感光性組成物中の有機成分の配合比決定装置、コンピュータプログラム

Also Published As

Publication number Publication date
TW202239727A (zh) 2022-10-16
JP2022186715A (ja) 2022-12-15
JP7627250B2 (ja) 2025-02-05
TWI922632B (zh) 2026-04-21
JP7232280B2 (ja) 2023-03-02
KR20220133808A (ko) 2022-10-05
JP2022149102A (ja) 2022-10-06
KR102972060B1 (ko) 2026-06-02

Similar Documents

Publication Publication Date Title
US20170236611A1 (en) Photosensitive conductive paste, method of producing multilayer electronic component using the same, and multilayer electronic component
CN110297397A (zh) 感光性组合物、复合体、电子部件和电子部件的制造方法
JP7627250B2 (ja) 電子部品製造用キットとその利用
WO2017056793A1 (ja) 感光性ガラスペースト及び電子部品
TWI799547B (zh) 感光性組成物、複合體、電子零件及電子零件的製造方法
JP7668668B2 (ja) 電子部品製造用キットとその利用
TWI780277B (zh) 感光性組成物、複合體、電子零件及電子零件的製造方法
JP7446355B2 (ja) 感光性組成物とその利用
TW202102940A (zh) 感光性組成物、複合體、電子零件及電子零件的製造方法
JP7806563B2 (ja) 感光性導電ペースト、導電パターン付き基材の製造方法、硬化膜、焼成体の製造方法、焼成体および電子部品
JP2001092118A (ja) 感光性ペーストおよび電子部品
KR102862850B1 (ko) 감광성 조성물의 제조 방법, 페이스트상의 감광성 조성물, 전자 부품의 제조 방법 및 전자 부품, 및 감광성 조성물 중의 유기 성분의 배합비 결정 장치, 컴퓨터 프로그램
JP7108778B1 (ja) 感光性組成物とその利用
CN116893572A (zh) 感光性玻璃组合物、电子部件和电子部件的制造方法
WO2023032536A1 (ja) 感光性導電ペースト、導電パターン付き基材の製造方法、電子部品の製造方法、硬化膜、焼成体および電子部品
WO2022191054A1 (ja) 感光性組成物とその利用
CN118642325A (zh) 感光性组合物、导体膜和电子材料
WO2022030382A1 (ja) 感光性導電ペースト、硬化物、焼成体、電子部品、回路パターン付き絶縁性セラミックス層の製造方法、電子部品の製造方法、回路パターン付き基板の製造方法およびインダクターの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Country or region after: Japan

Address after: Aichi Prefecture, Japan

Applicant after: Seibu Corp.

Address before: Aichi Prefecture, Japan

Applicant before: NORITAKE Co.,Ltd.

Country or region before: Japan

CB02 Change of applicant information