CN115101430B - Detection method for multi-size wafer compatible box opener - Google Patents
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
The invention belongs to the technology of a wafer box switch box and wafer state scanning equipment, and particularly relates to a detection method of a multi-size wafer compatible box opener. The method comprises the following steps: fixing the wafer box on a box opener machine table; separating the outer cover from the wafer box, scanning in real time by a mapping sensor during the upward movement of a box opener machine table, recording the code disc value of a machine table motor during the movement of the box opener machine table in real time by a control end of the box opener, and judging the size of the current jam box after the movement is finished; calculating the wafer state information according to the code wheel value of the machine motor obtained by the real-time scanning result of the mapping sensor, and judging the current wafer state in the cassette; completing the detection of the wafer, namely the jam box; the invention realizes a method for realizing 6/8-inch wafer switch box and state scanning in an atmosphere transmission system, and simultaneously is compatible with 6-inch and 8-inch wafers on the basis of not changing a mechanical structure, thereby increasing the application range.
Description
Technical Field
The invention belongs to the technology of a wafer box switch box and wafer state scanning equipment, and particularly relates to a detection method of a multi-size wafer compatible box opener.
Background
In the existing IC process, the equipment and process cost can be greatly reduced under the atmospheric environment, meanwhile, an atmospheric transmission system has more external interfaces and stronger compatibility, and most of the existing 6/8 inch wafers use a vacuum transmission system and lack a wafer switch box and state scanning equipment under the atmospheric environment, so that the defects of high cost and low automation degree exist in the 6/8 inch wafer process flow. As the small size of 6/8 inches is generally used for vacuum, the box opener with 6 inches is not available according to our knowledge in China, the mechanical design of vacuum equipment is complicated, and the sealing and the door opening and closing are required to be considered for inflation and deflation. Therefore, it is very important to design a detection method for a multi-size wafer compatible cassette opener capable of being in an atmospheric environment.
Disclosure of Invention
The invention aims to provide a detection method for a multi-size wafer compatible box opener, which is used for realizing a 6/8-inch wafer switch box and state scanning device in an atmospheric transmission system and is compatible with 6-inch and 8-inch wafers on the basis of not changing a mechanical structure.
The technical scheme adopted by the invention for realizing the purpose is as follows: a detection method for a multi-size wafer compatible box opener is characterized by comprising the following steps:
1) Placing the wafer box on a box opener machine table, sending a control command to a box opener through an upper computer, controlling a LOCK shaft driving motor, and driving a metal sheet connected with a LOCK shaft of the box opener to be lapped on the wafer box so as to fix the wafer box on the box opener machine table;
2) Setting the position of a mapping sensor, sending an instruction to a box opener through an upper computer, controlling a latch shaft driving motor by the box opener, controlling two metal rods at the bottom of a machine table of the box opener to extend out and be inserted into a wafer box, driving the two metal rods to open a lock tongue by the latch shaft, providing a lifting mechanism for controlling the box opener to drive an outer cover of the wafer box to move upwards, separating the outer cover of the wafer box from the wafer box, and leaving a blocking box and a base on the machine table;
3) During the upward movement of the box opener machine table, the mapping sensor scans in real time, the control end of the box opener records the code disc value of the machine table motor during the movement of the box opener machine table in real time, and after the movement is finished, the size of the current jam box is judged;
4) Calculating the state information of the wafer according to the code wheel value of the machine motor obtained according to the real-time scanning result of the mapping sensor, and judging the state of the wafer in the current cassette;
5) After the operation in the wafer box is finished, the motor drives the box opener to drive the outer cover to move downwards, the latch shaft drives the lock tongue in the wafer box to close the latch shaft, and the two lock shafts enable the metal sheet to leave the wafer box to take away the wafer box.
The mapping sensor is a correlation photoelectric sensor.
The mapping sensor is arranged on the lifting mechanism, the direction of a light path of the mapping sensor is always parallel to the plane of the wafer, the wafer is placed in the chuck box, and the plane of the wafer is parallel to the horizontal plane.
An adapter is further arranged at the bottom of the 6-inch jam box to distinguish the 6-inch jam box from the 8-inch jam box;
the physical height dimension of the adapter is larger than the dimension of the 8-inch jam box.
In step 3), the upper computer records the code wheel value of the machine table motor in the movement process of the box opener machine table in real time, and judges the size of the current jam box, specifically:
setting the size of a to-be-detected clamping and plugging box for placing the wafer;
recording mapping sensor scan from first occlusion to first non-occlusion, i.e.: the signal of the mapping sensor jumps for the first time to generate interruption;
the method comprises the steps that a coded disc value when a mapping sensor signal is subjected to first jumping to generate interruption is judged whether an adapter exists or not according to the range of the coded disc value, if yes, the size of a card plug box is 6 inches, and otherwise, the size of the card plug box is 8 inches;
comparing the size of the wafer to be detected with the size of a clamping and plugging box for placing the wafer, and if the sizes are consistent, continuing to perform detection; otherwise, the box opener reports the error to the upper computer.
In the step 4), according to the real-time scanning result of the mapping sensor, the obtained code wheel value of the machine motor is specifically as follows:
in the upward movement process of the box opener machine table, the light path of the mapping sensor is shielded by the wafer, each time the light path is triggered to be interrupted in the jumping mode of switching between the states of being shielded by the wafer and not being shielded by the wafer, namely 2 jumps generated by one wafer are generated, and the upper edge code disc value of each wafer is selected according to the jumps
And lower edge code disc value
And (6) recording.
The calculating of the wafer state information specifically comprises the following steps:
(1) According to the upper edge code disc value of each wafer
And lower edge code disc value
Obtaining the center distance of the wafers, calculating the position Si of the theoretical center of each wafer according to the wafer center distance in advance, and storing the position Si;
(2) According to the upper edge code disc value of each wafer
And lower edge code disc value
Acquiring the central value of the ith wafer;
(3) And judging the wafer state to be a wafer state, an empty wafer state or a wafer-crossing state according to the position Si of the theoretical center of each wafer and the center value of the ith wafer.
The sheet-present state is as follows: the two ends of the ith wafer are respectively clamped in an ith groove on the left side and an ith groove on the right side in the clamping and plugging box;
the cross-slice state is as follows: the two ends of the ith wafer are respectively clamped in the ith-1 at the left side or the (i + 1) th groove at the right side of the groove in the blocking box.
The theoretical center position of the ith wafer is as follows:
Si＝S1+(i-1)×Delta Slot
wherein Delta Slot is the wafer theoretical center distance, and the center position of the 1 st wafer in S1;
the wafer center spacing Delta Slot is as follows:
according to the upper edge code disc value of each wafer
And lower edge code disc value
The ith wafer center value Sloti is:
the step (3) specifically comprises the following steps:
the ith wafer center value Sloti is in the range of Si +/-bias, and the bias is a threshold value for setting whether the wafer exists or not, and then the ith groove is considered to have a wafer state;
otherwise, judging that the ith wafer center value Sloti is in S i + bias to S i+1 Within the range of-bias, the ith slot and the (i + 1) th slot are considered to be in a sheet spanning state.
The invention has the following beneficial effects and advantages:
1. the invention realizes a method for realizing 6/8-inch wafer switch box and state scanning in an atmosphere transmission system, and simultaneously is compatible with 6-inch and 8-inch wafers on the basis of not changing a mechanical structure, thereby increasing the application range.
2. According to the invention, the state information of the wafer can be acquired only through the mapping sensor;
3. the invention can simply and quickly judge whether the wafer is a 6-inch wafer or an 8-inch wafer by the installation of the adapter.
Drawings
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic structural diagram of a conventional box opener and a diagram of positions of newly added waist holes;
FIG. 3 is a schematic diagram of mapping data collection route according to the present invention;
FIG. 4 is a diagram of the location of the added adapter of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples.
Fig. 1 and 2 are a flow chart of the method of the present invention and a schematic structural diagram of a conventional box opener; the invention comprises the following steps:
1) Placing the wafer box on a box opener machine table, sending a control command to a box opener through an upper computer, controlling a LOCK shaft driving motor, and driving a metal sheet connected with a LOCK shaft of the box opener to be lapped on the wafer box so as to fix the wafer box on the box opener machine table;
the pod is placed manually or robotically on a LoadPort stage, which has a protruding pressure sensor for detecting whether the pod is in place. An indicator lamp is arranged on a main panel of the LoadPort and used for indicating whether the pod is in place or not, system software can control the pod in-place indicator lamp according to information of the pod in-place sensor, the sensor is triggered to be on, and the sensor is not triggered to be off.
2) Setting the position of a mapping sensor, sending an instruction to a box opener through an upper computer, controlling a latch shaft driving motor by the box opener, controlling two metal rods at the bottom of a machine table of the box opener to extend out and be inserted into a wafer box, driving the two metal rods to open a lock tongue by the latch shaft, providing a lifting mechanism for controlling the box opener to drive an outer cover of the wafer box to move upwards, separating the outer cover of the wafer box from the wafer box, and leaving a blocking box and a base on the machine table;
3) During the upward movement of the box opener machine table, the mapping sensor scans in real time, the control end of the box opener records the code disc value of the machine table motor during the movement of the box opener machine table in real time, and after the movement is finished, the size of the current jam box is judged;
4) Calculating the state information of the wafer according to the code wheel value of the machine motor obtained according to the real-time scanning result of the mapping sensor, and judging the state of the wafer in the current cassette;
5) After the operation in the wafer box is finished, the motor drives the box opener to drive the outer cover to move downwards, the latch shaft drives the spring bolt in the wafer box to close the spring bolt, and the two lock shafts enable the metal sheet to leave the wafer box to take away the wafer box.
In this embodiment, the additional waist hole is to place the jam dislocation sensor because the 6 inches jam box is shorter.
FIG. 3 is a schematic diagram of mapping data collection route according to the present invention; wherein, mapping sensor is correlation formula photoelectric sensor. The mapping sensor is arranged on the lifting mechanism, the light path direction of the mapping sensor is always parallel to the plane where the wafer is located, the wafer is placed in the chuck box, and the plane where the wafer is located is parallel to the horizontal plane.
The box opener control end records the code wheel value of a machine table motor in the movement process of a machine table of the box opener in real time, and judges the size of the current jam box, wherein the size is as follows:
setting the size of a to-be-detected clamping and plugging box for placing the wafer; the size of the card plug box supports a user to manually set the size of the card plug box, and can be configured by writing instructions through an RS232 serial port, wherein 150 represents a 6-inch card plug box, and 200 represents an 8-inch card plug box.
Recording mapping sensor scan from first occlusion to first non-occlusion, i.e.: the signal of the mapping sensor jumps for the first time to generate interruption;
the method comprises the steps that a coded disc value when a mapping sensor signal is subjected to first jumping to generate interruption is judged whether an adapter exists or not according to the range of the coded disc value, if yes, the size of a card plug box is 6 inches, and otherwise, the size of the card plug box is 8 inches;
comparing the size of the wafer to be detected with the size of a clamping and plugging box for placing the wafer, and if the sizes are consistent, continuing to perform detection; otherwise, the box opener reports an error to the upper computer.
In the step 4), according to the real-time scanning result of the mapping sensor, the obtained code wheel value of the machine motor is specifically as follows:
in the upward movement process of the box opener machine table, the light path of the mapping sensor is shielded by the wafer, each time the light path is triggered to be interrupted in the jumping mode of switching between the states of being shielded by the wafer and not being shielded by the wafer, namely 2 jumps generated by one wafer are generated, and the upper edge code disc value of each wafer is selected according to the jumps
And lower edge code disc value
And (6) recording.
As shown in fig. 4, which is a new adapter position diagram of the present invention, an adapter is further installed at the bottom of the 6-inch jam box to distinguish the 6-inch jam box from the 8-inch jam box; the adapter has a physical height dimension greater than the 8 "card plug box dimension. The adapter is because the 6 "jam box is lower in height and needs to be lifted.
As shown in fig. 1, in the detection method of the present invention, wafer state information is calculated, specifically:
(1) According to the upper edge code disc value of each wafer
And lower edge code disc value
Obtaining the center distance of the wafers, calculating the position Si of the theoretical center of each wafer according to the wafer center distance in advance, and storing the position Si;
(2) According to the upper edge code disc value of each wafer
And lower edge code disc value
Acquiring a central value of an ith wafer;
(3) And judging whether the wafer state is a wafer state, an empty wafer state or a wafer-crossing state according to the position Si of the theoretical center of each wafer and the center value of the ith wafer.
The sheet-existing state is as follows: the two ends of the ith wafer are respectively clamped in an ith groove on the left side and an ith groove on the right side in the clamping and plugging box;
the cross-slice state is: the two ends of the ith wafer are respectively clamped in the ith-1 at the left side or the (i + 1) th groove at the right side of the groove in the blocking box.
In this embodiment, a set of mapping data is actually acquired, and the acquired values 60000 and 66000, and the mean value 63000 represents a filmed state; the collected values are 100000, 106000, the mean value is 103000, which represents the cross-slice state, where: there are theoretical values of: 60000 +/-6000 and 120000 +/-6000;
calculating according to mapping algorithm: and calculating the theoretical range of the region where the theoretical wafer should be located (the calculation result is the region where the horizontal center of the wafer is located) according to the set parameters and the scanning result of the Mapping sensor during teaching, and then judging whether the actual center of the wafer is in the set range according to the actual scanning result.
The theoretical center position of the ith wafer is as follows:
Si＝S1+(i-1)×Delta Slot
wherein Delta Slot is the wafer theoretical center distance, and the center position of the 1 st wafer in S1;
the wafer center spacing Delta Slot is as follows:
according to the upper edge code disc value of each wafer
And lower edge code disc value
The ith wafer center value Sloti is:
step (3), specifically:
the ith wafer center value Sloti is in the range of Si +/-bias, and the bias is a threshold value for setting whether the wafer exists or not, and then the ith groove is considered to have a wafer state;
otherwise, judging that the central value Sloti of the ith wafer is in S i + bias to S i+1 Within the range of-bias, the ith slot and the (i + 1) th slot are considered to be in a sheet spanning state.
In the invention, the Mapping sensor only selects the code disc value in a specified range as the basis of the state of the wafer in the scanning process, and the jumping of the sensor from shielding to shielding must occur in the Mapping action process, and the wafer box with which size is placed is judged according to the code disc value with the jumping.
According to the invention, by designing the detection method of the multi-size wafer compatible box opener, 6-inch and 8-inch wafers are compatible on the basis of not changing the mechanical structure, and the application range is enlarged.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, extension, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (9)
1. A detection method for a multi-size wafer compatible box opener is characterized by comprising the following steps:
1) Placing the wafer box on a box opener machine table, sending a control command to a box opener through an upper computer, controlling a LOCK shaft driving motor, and driving a metal sheet connected with a LOCK shaft of the box opener to be in lap joint with the wafer box so as to fix the wafer box on the box opener machine table;
2) Setting the position of a mapping sensor, sending an instruction to a box opener through an upper computer, controlling a latch shaft driving motor by the box opener, controlling two metal rods at the bottom of a machine table of the box opener to extend out and be inserted into a wafer box, driving the two metal rods to open a lock tongue by the latch shaft, providing a lifting mechanism for controlling the box opener to drive an outer cover of the wafer box to move upwards, separating the outer cover of the wafer box from the wafer box, and leaving a blocking box and a base on the machine table of the box opener;
3) During the upward movement of the box opener machine table, the mapping sensor scans in real time, the control end of the box opener records the code disc value of a machine table motor during the movement of the box opener machine table in real time, and after the movement is finished, the size of the current jam box is judged;
an adapter is further arranged at the bottom of the 6-inch jam box to distinguish the 6-inch jam box from the 8-inch jam box;
the physical height size of the adapter is larger than the size of the 8-inch jam box;
4) Calculating the wafer state information according to the code wheel value of the machine motor obtained by the real-time scanning result of the mapping sensor, and judging the current wafer state in the cassette;
5) After the operation in the wafer box is finished, the motor drives the box opener to drive the outer cover to move downwards, the latch shaft drives the spring bolt in the wafer box to close the latch shaft, and the two LOCK shafts enable the metal sheets to leave the wafer box so as to take away the wafer box.
2. The method as claimed in claim 1, wherein the mapping sensor is a correlation photoelectric sensor.
3. The method as claimed in claim 1, wherein the mapping sensor is mounted on the lifting mechanism, and the optical path direction of the mapping sensor is set to be always parallel to the plane of the wafer, the wafer is placed in the cassette, and the plane of the wafer is parallel to the horizontal plane.
4. The method as claimed in claim 1, wherein the step 3) is specifically as follows:
setting the size of a to-be-detected clamping plug box for placing the wafer;
recording mapping sensor scan from first occlusion to first non-occlusion, i.e.: the signal of the mapping sensor jumps for the first time to generate interruption;
the method comprises the steps that a coded disc value when a mapping sensor signal is subjected to first jumping to generate interruption is judged whether an adapter exists or not according to the range of the coded disc value, if so, the size of a jam box is 6 inches, otherwise, the size of the jam box is 8 inches;
comparing the size of the wafer to be detected with the size of a clamping and plugging box for placing the wafer, and if the sizes are consistent, continuing to perform detection; otherwise, the box opener reports an error to the upper computer.
5. The method as claimed in claim 1, wherein the step 4) comprises:
in the upward movement process of the box opener machine table, the light path of the mapping sensor can be shielded by the wafer, and the shape of the light path which is shielded by the wafer and is not shielded by the wafer every timeThe jump of switching between states triggers interruption, namely 2 jumps generated by the ith wafer, and the upper edge code disc value of each wafer is selected according to the jumps
And lower edge code disc value
And (6) recording.
6. The method as claimed in claim 1, wherein the calculating wafer state information specifically comprises:
(1) According to the upper edge code disc value of the ith wafer
And lower edge code disc value
Obtaining the center distance of the wafers, and calculating the theoretical center position S of the ith wafer according to the wafer center distance in advance i And storing;
(2) According to the upper edge code disc value of the ith wafer
And lower edge code disc value
Acquiring a central value of an ith wafer;
(3) According to the position S of the theoretical center of the ith wafer i And judging whether the wafer state is a wafer-present state, a wafer-empty state or a wafer-crossing state according to the center value of the ith wafer.
7. The method as claimed in claim 6, wherein the wafer-on-chip status is: the two ends of the ith wafer are respectively clamped in the ith groove on the left side and the ith groove on the right side in the clamping and plugging box;
the cross-slice state is: the two ends of the ith wafer are respectively clamped in the ith-1 st groove or the (i + 1) th groove on the left side in the blocking box.
8. The method as claimed in claim 6, wherein the theoretical center of the ith wafer is located at a position as follows:
S i ＝S 1 +(i-1)×Delta Slot，
wherein Delta Slot is the wafer theoretical center distance, S 1 The position of the center of the 1 st wafer;
the wafer theoretical center spacing Delta Slot is as follows:
according to the upper edge code disc value of the ith wafer
And lower edge code disc value
The central value Slot of the ith wafer i Comprises the following steps:
9. the method as claimed in claim 6, wherein the step (3) is specifically as follows:
center value Slot of ith wafer i At S i Within the range of +/-bias, if bias is a threshold value for setting whether the measurement has a chip, the ith slot is considered to have a chip state;
otherwise, judging the Slot of the central value of the ith wafer i At S i + bias to S i+1 Within the range of-bias, the ith slot and the (i + 1) th slot are considered to be in a sheet spanning state.
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| JP2002170864A (en) * | 2000-11-29 | 2002-06-14 | Yaskawa Electric Corp | Substrate detector |
| TW570291U (en) * | 2003-05-02 | 2004-01-01 | Fortrend Taiwan Scient Corp | Dual-track wafer box opening mechanism |
| CN113053773A (en) * | 2019-12-26 | 2021-06-29 | 沈阳新松机器人自动化股份有限公司 | Wafer state online identification detection method, device and system |
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