CN218414515U - Wafer correcting device - Google Patents

Abstract

The utility model provides a wafer correcting unit, include: the device comprises a driving module, a pushing module and a detecting module; the detection module is arranged at least one end of the wafer transmission box and used for detecting a target wafer deviating from a preset position; the driving module is connected with the pushing module and used for driving the pushing module to move; the pushing module is arranged at the side of the wafer transmission box and used for contacting the circumferential edge of the wafer under the driving of the driving module and pushing the target wafer to the preset position, and the device is used for automatically correcting the position of the wafer in the wafer transmission box.

Description

Wafer correcting device

Technical Field

The utility model relates to a semiconductor equipment makes the field, especially relates to a wafer correcting unit.

Background

When a Front-Opening Unified Pod (FOUP) reaches an upper Opening door of a Front-Opening Interface Mechanical Standard (frames) system to scan a wafer, due to jolt in a carrying process and difference of internal and external air pressures during Opening the door, a wafer position in the FOUP may be abnormal, a whole process flow needs to be stopped, and an equipment engineer needs to intervene for processing.

In the prior art, the equipment engineer needs to open the back door of the load area (LoadingArea) of the pod, check the actual state of the wafer, and if the wafer protrudes, return the wafer to the original position by means of a tool. In the process of manually returning the wafer, the microenvironment of the loading area of the wafer transfer box is changed, which may cause the problem that the wafer contacts particles; in addition, the manual use of the tool to contact the wafer may cause damage or the wafer may contact particles, especially the tool needs to pass through the wafer boat to return the wafer, and the small space may also touch the wafer boat to cause damage. Therefore, a new wafer calibration apparatus is needed to improve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer correcting unit, the device are used for the wafer position in the automatic correction wafer transfer box.

The utility model provides a wafer correcting unit, include: the device comprises a driving module, a pushing module and a detecting module; the detection module is arranged at least one end of the wafer transmission box and used for detecting a target wafer deviating from a preset position; the driving module is connected with the pushing module and used for driving the pushing module to move; the pushing module is arranged at the side of the wafer transmission box and used for contacting the circumferential edge of the wafer under the driving of the driving module so as to push the target wafer to the preset position.

The utility model discloses a device beneficial effect does: the utility model discloses a target wafer deviating from the preset position is detected by the arranged detection module; when the wafer deviates from the preset position, the driving module drives the pushing module to push the wafer deviating from the preset position to the preset position. The wafer position is automatically detected and the wafer is automatically reset, manual operation is not needed, time and labor are saved, and the problem that damage is possibly caused when a tool is manually used to contact the wafer or the wafer contacts particles is avoided; the utility model discloses a set up the drive module drive bulldoze the module contact the circumferential edge reason of wafer will the target wafer is pushed to preset the position, do not need artifical handheld instrument to pass the wafer boat and return to the throne the wafer, avoid because the space is narrow and small, the damage that manual operation unstability touched the wafer boat and caused is favorable to promoting the yield of wafer.

Optionally, the driving module is a motor; the pushing module is a link arm, and a main shaft of the motor is connected with the link arm so that the motor can drive the link arm to rotate along the main shaft of the motor.

Optionally, the driving module is a sliding block arranged on the guide rail; the pushing module is a push plate, and the sliding block is connected with the push plate, so that the sliding block can drive the push plate to move back and forth along the guide rail.

Optionally, the detection modules are two optical sensors symmetrically arranged at two ends of the wafer transfer box; the optical sensor is used for detecting whether a target wafer deviating from a preset position exists in the wafer conveying box.

Optionally, the apparatus further comprises a control module; the detection module and the driving module are electrically connected with the control module; the control module is used for controlling the working state of the driving module.

Optionally, the device further comprises a limiting module; the limiting module is connected with the wafer transmission box and used for limiting the position of the pushing module relative to the wafer.

Optionally, the hardness of the pushing module is greater than or equal to that of the limiting module and less than or equal to that of the wafer.

Optionally, the limiting module is a limiter, a cushion pad or a spring.

Optionally, the apparatus further comprises a scanning module; the scanning module is connected with the wafer transmission box; the control module is used for controlling the scanning module to measure the distance between the scanning module and at least one wafer, and generating a wafer number signal and a wafer position signal.

Optionally, the scanning module is a distance meter; the distance measuring instrument is fixedly arranged at the top end of the wafer transmission box and used for vertically and downwards measuring the distance from the distance measuring instrument to the uppermost wafer in the wafer transmission box; or the distance measuring instrument is connected with the wafer conveying box in a sliding mode through a sliding rail and slides in the vertical direction along the sliding rail, and the distance of the distance measuring instrument relative to each wafer is measured sequentially.

Drawings

FIG. 1 is a schematic diagram of a wafer boat and a wafer pod in the prior art;

fig. 2 is a schematic structural view of a wafer alignment device according to the present invention, in which a pushing module rotates along a vertical axis;

fig. 3 is a schematic structural view of a wafer alignment apparatus with a pushing module rotating along a horizontal axis according to the present invention;

fig. 4 is a schematic structural view of a wafer correcting device according to the present invention, in which a pushing module is horizontally moved;

fig. 5 is a schematic structural diagram of a wafer calibrating apparatus having a control module according to the present invention;

fig. 6 is a schematic structural diagram of a wafer calibrating apparatus having a scanning module according to the present invention;

fig. 7 is a schematic cross-sectional structural view of a wafer calibration device with a scanning module disposed on a slide rail according to the present invention;

fig. 8 is a schematic structural diagram of a wafer calibrating apparatus having two pressing modules according to the present invention.

The reference numbers in the figures:

1. a drive module; 2. a pushing module; 3. a detection module; 4. a limiting module; 5. a control module; 6. a wafer transfer box; 61. a bracket set; 7. a wafer; 8. a scanning module; 81. a slide rail; 9. alarm module, 10, boat.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but not the exclusion of other elements or items.

Fig. 1 is a schematic diagram of a wafer boat and a wafer pod in the prior art.

As shown in fig. 1, the boat 10 of the prior art is located at the rear side of the loading area of the foup 6, and when the rear door of the loading area of the foup 6 is opened, the wafers loaded on the foup 6 are pushed to the rear side by the air pressure, and the equipment engineer needs to hold the tool to push the wafers forward to the home position, during which the microenvironment of the loading area of the foup 6 is changed, which may cause the problem that the wafers contact particles. Furthermore, manual contact of the wafer with the tool may cause damage or contact of the wafer with particles, especially if the hand-held tool needs to pass through the wafer boat 10 to return the wafer, the tool may contact the wafer boat 10 to cause damage due to the narrow space.

Fig. 2 is a schematic structural diagram of a wafer correcting device according to the present invention, in which the pushing module rotates along a vertical axis.

To the problem that prior art exists, as shown in fig. 2, the utility model provides a wafer correcting unit, include: the device comprises a driving module 1, a pushing module 2 and a detecting module 3. The detection module 3 is arranged at least at one end of the wafer transfer box 6 and is used for detecting a target wafer 7 deviating from a preset position. The driving module 1 is connected with the pushing module 2 and is used for driving the pushing module 2 to move. The pushing module 2 is disposed beside the foup 6, and is configured to contact a circumferential edge of the wafer 7 under the driving of the driving module 1, so as to push the target wafer 7 to the preset position.

It is worth explaining that the utility model discloses a detection module 3 that sets up detects target wafer 7 of skew preset position. When the wafer 7 deviates from the preset position, the driving module 1 drives the pushing module 2 to push the wafer 7 deviating from the preset position to the preset position. Realize 7 positions of automated inspection wafer and automatic homing wafer 7, need not manual operation, labour saving and time saving avoids artifical use of tool contact wafer 7 probably to cause the problem of damage or wafer 7 contact particulate matter. The utility model discloses a set up drive module 1 drive bulldoze module 2 contacts the circumferential edge reason of wafer 7 will target wafer 7 is pushed to predetermine the position, do not need artifical handheld tool to pass the wafer boat and return to the throne with wafer 7, avoid because the space is narrow and small, manual operation unstability touching wafer boat and the damage that causes.

Specifically, the detection modules 3 are two optical sensors symmetrically disposed at two ends of the wafer transfer box 6. When the two photo sensors are in an operating state, one photo sensor emits light to the other photo sensor. When the light is blocked by the target wafer 7, a detection signal is output to the driving module 1, and the detection signal is used for electrifying the driving module 1. The driving module 1 drives the pushing module 2 to push the wafer 7 deviated from the preset position to the preset position. The preset position is the central position in the wafer transmission box 6; and when the optical sensor detects that the target wafer 7 deviates from the preset position, the optical sensor is used for outputting a detection signal.

In other embodiments, the detection module 3 may also be configured as a distance meter for measuring a distance at a fixed position; the fixed position is set as the inner wall of the wafer transmission box 6; when the change of the distance measurement reading of the distance measuring instrument exceeds a preset change interval, a detection signal is output to the driving module 1, and the detection signal is used for enabling the driving module 1 to be powered on. The driving module 1 drives the pushing module 2 to push the wafer 7 deviated from the preset position to the preset position.

It should be noted that the number of the detection modules 3 may be N, N being any positive integer. The orientation of the detection module 3 is perpendicular to the surface of the wafer in the foup 6. The predetermined position may be any position within the foup 6.

In some embodiments, the drive module 1 is an electric motor. The pushing module 2 is a link arm, and a main shaft of the motor is connected with the link arm so that the motor can drive the link arm to rotate along the main shaft of the motor.

Specifically, the link arm is arranged in an L shape. The main shaft direction of the motor is vertical. The detection signal output by the optical sensor is used for controlling the motor to enter a working state, the link arm is driven to rotate clockwise, and the mass center of the link arm is close to the wafer 7 along a horizontal circular path. After the link arm contacts the circumferential edge of the wafer 7, the wafer 7 is pushed back into the foup 6.

Fig. 3 is a schematic structural diagram of a wafer calibration apparatus according to the present invention, in which a pushing module rotates along a horizontal axis.

In other embodiments, the link arms are plate-like in configuration, as shown in fig. 3. The main shaft direction of the motor is the horizontal direction. The detection signal output by the optical sensor is used for controlling the motor to enter a working state, the linkage arm is driven to rotate around a horizontal shaft, and the center of mass of the linkage arm approaches the wafer 7 along a vertical circular path. After the link arm contacts the circumferential edge of the wafer 7, the wafer 7 is pushed back into the wafer transfer box 6.

It should be noted that the main shaft of the motor is fixedly connected or detachably connected with the link arm. The link arm may be configured in any shape as long as the link arm can return the wafers 7 in the wafer transport box 6 to the predetermined positions.

Fig. 4 is a schematic structural view of the wafer correcting device according to the present invention, wherein the pushing module is horizontally moved.

In other embodiments, as shown in fig. 4, the driving module 1 is a slider disposed on a guide rail. The pushing module 2 is a push plate, and the sliding block is connected with the push plate so that the sliding block can drive the push plate to move back and forth along the guide rail.

Specifically, the guide rail is horizontally disposed at the bottom side of the wafer transfer box 6. The guide rail is arranged in a linear manner. The push plate is perpendicular to the guide rail. The detection signal output by the optical sensor is used for controlling the sliding block to enter a working state and driving the push plate to be close to the wafer 7 along a horizontal path. And after the push plate contacts the circumferential edge of the wafer 7, pushing the wafer 7 back into the wafer transmission box 6.

It is worth mentioning that the sliding block and the push plate can be integrally arranged or fixedly connected or detachably connected. The push plate may be formed in any shape as long as the push plate can make the wafers 7 in the wafer transfer box 6 all return to the preset positions.

Fig. 5 is a schematic structural diagram of a wafer calibrating apparatus having a control module according to the present invention.

As shown in fig. 5, in some embodiments, the apparatus further comprises a control module 5. The detection module 3 and the driving module 1 are electrically connected with the control module 5. The control module 5 is used for controlling the working state of the driving module 1.

Specifically, the control module 5 is disposed outside the wafer transfer box 6. When the control module 5 acquires the detection signal, the driving module 1 is controlled to drive the pushing module 2 to move towards the wafer 7. When the wafer 7 returns to the preset position, the control module 5 drives the pushing module 2 to move away from the wafer 7 by the driving module 1.

It should be noted that the control module 5 may also be disposed inside the foup 6. The driving module 1 may be a reset motor, and automatically drives the pressing module 2 to move away from the wafer 7.

In some embodiments, the apparatus further comprises a spacing module 4. The limiting module 4 is connected with the wafer transfer box 6 and used for limiting the position of the pushing module 2 relative to the wafer 7.

Specifically, the limiting module 4 is a limiter.

In other embodiments, the position limiting module 4 is a cushion pad.

In still other embodiments, the limiting module 4 is a spring.

It should be noted that the hardness of the pushing module 2 is greater than or equal to the hardness of the limiting module 4 and less than or equal to the hardness of the wafer 7. This arrangement prevents damage to the wafer 7 and damage to the push module 2.

Fig. 6 is a schematic structural diagram of a wafer calibration apparatus with a scan module according to the present invention.

As shown in fig. 6, in some embodiments, the device further comprises an alarm module 9. The alarm module 9 is connected with the control module 5 and is used for giving an alarm under the control of the control module 5.

Specifically, when the control module 5 obtains the detection signal, the driving module 1 is controlled to enter a working state, so that the pushing module 2 is close to the wafer 7. Meanwhile, the control module 5 controls the alarm module 9 to give an alarm for prompting an equipment engineer so as to prevent accidental injury caused by movement of the pushing module 2. When the pushing module 2 pushes the wafer 7 back to the preset position, the control module 5 controls the alarm module 9 to alarm.

In other embodiments, when the pushing module 2 fails to push the wafer 7 back to the preset position, the control module 5 controls the alarm module 9 to continuously alarm. The wafer 7 deviation prevention device is used for prompting an equipment engineer to check in time and preventing the wafer 7 from deviating from the preset position, and is beneficial to safety production.

In some embodiments, the apparatus further comprises a scanning module 8. The scanning module 8 is connected to the foup 6 and configured to obtain a wafer number signal of the wafer 7 in the foup 6.

Specifically, the processing unit is further configured to obtain the wafer number signal, and control the power down of the driving module 1 when the number of the wafers 7 in the wafer transfer box 6 is 0.

In other embodiments, the scanning module 8 is a distance meter, and is fixed to the top end of the foup 6, and is configured to measure a distance a from the distance meter to an uppermost wafer among the wafers stacked in the foup 6 vertically and downwardly, where a total thickness b of all the wafers in the foup 6 satisfies:

b＝c-a

wherein c is the distance between the distance measuring instrument and the inner bottom surface of the wafer transmission box 6. It should be noted that the thickness h of each wafer in the foup 6 is the same, and the number N of all wafers in the foup 6 satisfies:

the control module 5 generates a wafer number signal according to the number N, and obtains the height hp of the wafer in the wafer transmission box 6 according to the thickness h and the sequence p of the wafer from bottom to top in the wafer transmission box 6; and generating a position signal of the wafer according to the height hp.

Specifically, the processing unit is further configured to obtain the wafer position signal, and update the wafer position signal corresponding to the wafer 7 when the wafer 7 enters the wafer transfer box 6, so as to position the wafer 7, and save time for finding the wafer 7.

It should be noted that the control module 5 is configured to send the wafer number signal and the wafer position signal to a Manufacturing Execution System (MES), so as to facilitate an engineer to query wafer information.

Fig. 7 is a schematic cross-sectional view of a wafer calibration apparatus with a scanning module disposed on a slide rail according to the present invention.

In still other embodiments, as shown in fig. 6 and 7, the wafers are horizontally disposed in parallel in the foup 6, and the wafers are supported by the support sets 61 in the foup 6 without contacting each other; the scanning module 8 is a distance measuring instrument which is connected with the wafer conveying box 6 in a sliding manner through a sliding rail 81; when the distance measuring instrument is in a working state, the distance of the wafer is measured in the horizontal direction, and meanwhile, the distance measuring instrument slides in the vertical direction along the sliding rail 81, and the distance of the distance measuring instrument relative to each wafer is measured according to the sequence from bottom to top. When the distance is within a preset interval, judging that the wafer exists at the top end of the support; when the distance exceeds a preset interval, the control module 5 judges that no wafer exists at the top end of the support set 61; the control module 5 counts the number of the wafers and generates a wafer number signal; according to the distance i between the upper bracket group 61 and the lower bracket group 61 which are adjacent to each other and the sequence q of the bracket groups 61 for supporting the wafer, the height qi of the wafer in the wafer transmission box 6 can be obtained; and generating a position signal of the wafer according to the height qi.

Fig. 8 is a schematic structural diagram of a wafer calibrating apparatus having two pressing modules according to the present invention.

As shown in fig. 8, the foup 6 is initially provided with front and rear doors. And the top end and the bottom end of the front door and the top end and the bottom end of the rear door are respectively provided with a detection module 3. The number of the driving modules 1 and the number of the pressing modules 2 are both set to 2. The two pushing modules 2 are respectively used for contacting the wafers 7 positioned on the front door side and the rear door side so as to move the wafers 7 to the preset position. This arrangement is advantageous in preventing the wafer 7 from being out of the predetermined position by the action of the pushing module 2.

Specifically, the two pressing modules 2 simultaneously contact the wafers 7 on the front door side and the rear door side.

In other embodiments, two of the pushing modules 2 contact the wafer 7 on the front door side and the rear door side sequentially.

It should be noted that the number of side doors that the foup 6 can open, the number of the detection modules 3, the driving module 1, and the pushing module 2 may be any positive integer.

Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (10)

1. A wafer correcting apparatus, comprising: the device comprises a driving module, a pushing module and a detecting module;

the detection module is arranged at least one end of the wafer transmission box and used for detecting a target wafer deviating from a preset position;

the driving module is connected with the pushing module and used for driving the pushing module to move;

the pushing module is arranged at the side of the wafer transmission box and used for contacting the circumferential edge of the wafer under the driving of the driving module and pushing the target wafer to the preset position.

2. The device of claim 1, wherein the drive module is a motor; the pushing module is a link arm, and a main shaft of the motor is connected with the link arm so that the motor can drive the link arm to rotate along the main shaft of the motor.

3. The device of claim 1, wherein the driving module is a slider disposed on the guide rail; the pushing module is a push plate, and the sliding block is connected with the push plate, so that the sliding block can drive the push plate to move back and forth along the guide rail.

4. The apparatus of claim 1, wherein the detecting module is two optical sensors symmetrically disposed at two ends of the foup; the optical sensor is used for detecting whether a target wafer deviating from a preset position exists in the wafer conveying box.

5. The apparatus of claim 1, further comprising a control module; the detection module and the driving module are electrically connected with the control module; the control module is used for controlling the working state of the driving module.

6. The device of claim 1, further comprising a spacing module;

the limiting module is connected with the wafer transmission box and used for limiting the position of the pushing module relative to the wafer.

7. The apparatus of claim 6, wherein the pushing module has a hardness greater than or equal to a hardness of the limiting module and less than or equal to a hardness of the wafer.

8. The device of claim 6, wherein the spacing module is a spacer, cushion or spring.

9. The apparatus of claim 5, further comprising a scanning module;

the scanning module is connected with the wafer transmission box; the control module is used for controlling the scanning module to measure the distance between the scanning module and at least one wafer, and generating a wafer number signal and a wafer position signal.

10. The apparatus of claim 9, wherein the scanning module is a range finder; the distance measuring instrument is fixedly arranged at the top end of the wafer transmission box and used for vertically and downwards measuring the distance from the distance measuring instrument to the uppermost wafer in the wafer transmission box; or the distance measuring instrument is connected with the wafer conveying box in a sliding mode through a sliding rail and slides in the vertical direction along the sliding rail, and the distance of the distance measuring instrument relative to each wafer is measured in sequence.

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