CN115078400A - Ceramic substrate defect detection device and defect detection method - Google Patents
Ceramic substrate defect detection device and defect detection method Download PDFInfo
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- CN115078400A CN115078400A CN202210653616.3A CN202210653616A CN115078400A CN 115078400 A CN115078400 A CN 115078400A CN 202210653616 A CN202210653616 A CN 202210653616A CN 115078400 A CN115078400 A CN 115078400A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 99
- 239000000758 substrate Substances 0.000 title claims abstract description 86
- 230000007547 defect Effects 0.000 title claims abstract description 35
- 238000001514 detection method Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000012545 processing Methods 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 230000002950 deficient Effects 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- 239000011435 rock Substances 0.000 claims abstract description 3
- 238000006073 displacement reaction Methods 0.000 claims abstract 2
- 239000010409 thin film Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 8
- 241000220317 Rosa Species 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000011895 specific detection Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 abstract description 3
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- 239000010408 film Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 238000009659 non-destructive testing Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009658 destructive testing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
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- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
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- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a ceramic substrate defect detection device and a defect detection method, which comprise a shell, wherein the inner wall of the shell is provided with a processing table and a support frame, the processing table is positioned at the inner side of the support frame, the inner wall of the processing table is provided with a fixing mechanism, the outer wall of the support frame is provided with a detection assembly, and the inner wall of the support frame is provided with an adjusting assembly. Can carry out nondestructive test to ceramic substrate, and pinpoint the defective position, the degree of accuracy that detects is higher, can adjust the open scope of gasbag, support ceramic substrate's side, can fix ceramic substrate of equidimension not, avoid ceramic substrate to take place the displacement at the in-process that detects, improve the precision that detects, can avoid infrared camera to take place to rock, stability when guaranteeing infrared camera use, can test the ceramic substrate of different thickness, can adjust the position of metal plate electrode and transparent film plate electrode, thereby improve the compactness of device.
Description
Technical Field
The invention relates to the technical field of ceramic substrate defect detection, in particular to a ceramic substrate defect detection device and a defect detection method.
Background
The copper-clad ceramic substrate has the characteristics of high thermal conductivity, good heat resistance, low thermal expansion coefficient, high mechanical strength, good insulativity, corrosion resistance, radiation resistance and the like, is widely applied to electronic device packaging, and can be divided into a thick-film printed ceramic substrate, a directly-bonded copper ceramic substrate, an active metal welded ceramic substrate and the like according to different preparation principles and processes.
The ceramic substrate is one of the main materials for preparing the copper-clad ceramic substrate, and the product quality of the ceramic substrate directly determines the product quality of the copper-clad ceramic substrate. In the process of preparing ceramic substrates (such as aluminum oxide, aluminum nitride, silicon nitride, and silicon carbide substrates), defects occur to different degrees, and not only exist on the surface of the material, but also occur inside the material. The common defects comprise fine impurities and internal air holes inside, the voltage resistance of the ceramic wafer can be seriously influenced by the defects sometimes, and the problems of product insulation failure and the like can occur when the copper-clad substrate is used in a high-voltage high-power module after being prepared by using the ceramic wafer.
At present, the existing detection device has the defects that one or even a plurality of impurities and one or even a plurality of air holes are occasionally generated in the ceramic chip, the product defects cannot be judged through mechanical property detection, voltage resistance or partial discharge performance testing needs sampling and destructive testing, the detection accuracy is low, a small quantity of unqualified products still can be caused to flow out of a downstream automobile part process, nondestructive testing and defect positioning cannot be achieved, and the stability of the detection device is poor.
Disclosure of Invention
The present invention is directed to a defect detecting apparatus and a defect detecting method for a ceramic substrate, which solve the problems of the background art mentioned above.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a ceramic substrate defect detecting device, includes the casing, shells inner wall is equipped with processing platform and support frame, the processing platform is located the support frame is inboard, processing platform inner wall is equipped with fixed establishment, the support frame outer wall is equipped with the determine module, the support frame inner wall is equipped with adjusting part.
Further, the adjusting part includes the adjustment tank, the adjustment tank is located support frame inner wall, the adjustment tank inner wall slides and is equipped with the back shaft, the back shaft bottom is equipped with automatic telescopic link two, two bottoms of automatic telescopic link are equipped with infrared camera, the infrared camera outer wall is equipped with the light filter, the support frame top is equipped with the computer, the back shaft inner wall is equipped with the through-hole, the adjustment tank inner wall rotates and is equipped with the lead screw, the lead screw run through in the through-hole.
Furthermore, the inner wall of the through hole is provided with a lead screw nut matched with the lead screw, the outer wall of the support shaft is symmetrically provided with a spring, the spring is sleeved outside the lead screw, the outer wall of the spring is far away from one end of the support shaft and connected with the adjusting groove, the inner wall of the support frame is provided with a motor, and an output shaft of the motor is connected with the outer wall of the lead screw to provide power for the lead screw.
Further, the detection subassembly includes a plurality of automatic telescopic link one, and is a plurality of a symmetry of automatic telescopic link is located the support frame bottom, a bottom of automatic telescopic link is equipped with transparent film plate electrode, and is a plurality of an automatic telescopic link evenly sets up four angles of transparent film plate electrode for transparent film plate electrode obtains stable support.
Furthermore, an electroluminescent layer is arranged at the bottom end of the transparent thin-film electrode plate, a metal electrode plate is arranged at the bottom end of the support frame, a plurality of automatic telescopic rods are symmetrically arranged on the inner wall of the shell, and the automatic telescopic rods are matched with the metal electrode plate.
Furthermore, the metal electrode plate is movably connected with the support frame, a voltage-stabilized power supply is arranged on the outer wall of the shell, and the electroluminescent layer is a fluorescent light-emitting layer.
Further, fixed establishment includes a plurality of standing grooves, the standing groove is located the processing platform inner wall, the standing groove inner wall is equipped with gasbag and lug, the lug is located the standing groove bottom, the gasbag cover is located the standing groove inner wall, the gasbag outer wall is close to lug one side is equipped with the protective layer.
Furthermore, one side of the outer wall of the air bag is movably connected with the bump, a plurality of branch pipes are arranged on the outer wall of the air bag and connected through ventilation pipes, and air pumps are arranged on the outer wall of the ventilation pipes and on the outer wall of the processing table to realize movement of air in the ventilation pipes.
Further, the inner wall of the shell is provided with a filter box, the inner wall of the filter box is provided with adsorption carbon, one end of the filter box is connected with the air pump through a first pipeline, the other end of the filter box is provided with a second pipeline, and the second pipeline extends to the outer side of the shell.
A detection method of a ceramic substrate defect detection device comprises the following specific detection methods:
the method comprises the following steps: fix ceramic substrate, ceramic substrate has different thickness, different size, open a body, the ceramic substrate who will wait to detect is placed on the lug, the air pump operation, external air passes through in pipeline two gets into the rose box, reach pipeline one after adsorbing the carbon filtration, then carry to the ventilation pipe in, carry to the gasbag that corresponds through a plurality of branch pipes, the gasbag is by the back expansion of air packing, the gasbag drives the protective layer and is close to ceramic substrate, according to the size of waiting to detect ceramic substrate, until protective layer and ceramic substrate contact, make the gasbag support ceramic substrate's side, accomplish the fixing to ceramic substrate, avoid ceramic substrate at the in-process that detects, improve the precision that detects.
Step two: the device is adjusted, the transparent film electrode plate is driven by the first extension of the automatic telescopic rod, the electroluminescent layer is close to the ceramic substrate, the metal electrode plate is driven by the third extension of the automatic telescopic rod to be close to the ceramic substrate, so that the compactness of the device is improved, the transparent film electrode plate, the metal electrode plate and a stabilized voltage power supply are connected, the output shaft of the motor drives the lead screw to rotate, the lead screw drives the support shaft through a lead screw nut, the support shaft is limited through an adjusting groove on the outer wall of the support shaft, so that the support shaft horizontally moves along the lead screw until the support shaft drives the second automatic telescopic rod, the infrared camera moves to the position above the ceramic substrate to be detected, in the process that the support shaft moves from the position to the position where the infrared camera stops moving, the support shaft is subjected to moving impact force due to inertia, springs on the two sides buffer the support shaft, so that the impact force on the infrared camera is reduced, and the infrared camera is prevented from shaking, the stability when guaranteeing infrared camera and using, two extensions of automatic telescopic link or shrink adjust infrared camera's height.
Step three: the method comprises the steps of detecting a ceramic substrate, closing a door body, detecting in a dark environment, switching on a stabilized voltage power supply, taking a picture by matching an infrared camera and an optical filter, processing a luminous photo by a computer, judging whether the photo is defective or not, accurately positioning the defective position of a ceramic chip, enabling the defective position of the ceramic chip to have bright spots, if the photo is not defective, determining whether the ceramic chip is defective or not, enabling the ceramic chip to have the defects, and processing the photo by the computer to position the defective position of the ceramic chip.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the infrared camera and the optical filter can be matched for photographing by arranging the infrared camera, the optical filter, the insert block, the transparent thin film electrode plate, the metal electrode plate and the stabilized voltage power supply, the computer can process a luminous photo and judge whether the photo has defects, so that the ceramic substrate can be subjected to nondestructive testing, the defect positions can be accurately positioned, the detection accuracy is higher, the air bag can be expanded after being filled with air through the air bag, the first pipeline, the protective layer, the ventilation pipe, the filter box and the branch pipe, the air bag drives the protective layer to be close to the ceramic substrate, so that the expansion range of the air bag is adjusted, the side surface of the ceramic substrate is supported, the ceramic substrates with different sizes can be fixed, the ceramic substrate is prevented from being displaced in the detection process, and the detection accuracy is improved.
2. According to the invention, the supporting shaft can be buffered by the springs on two sides by arranging the supporting shaft, the springs, the adjusting groove, the motor, the lead screw and the automatic telescopic rod II, so that the impact force on the infrared camera is reduced, the infrared camera is prevented from shaking, the stability of the infrared camera during use is ensured, the automatic telescopic rod II extends or contracts to drive the infrared camera to move, ceramic substrates with different thicknesses can be tested, the automatic telescopic rod III, the supporting frame and the automatic telescopic rod I are arranged, the automatic telescopic rod I can extend to drive the transparent thin film electrode plate and the electroluminescent layer to approach the ceramic substrate, and the automatic telescopic rod III extends to drive the metal electrode plate to approach the ceramic substrate, so that the compactness of the device is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic side view of the interior of the present invention;
FIG. 2 is a bottom view of the interior of the present invention;
FIG. 3 is a top view of an adjustment slot of the present invention;
FIG. 4 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 5 is an enlarged view of a portion of the invention at B in FIG. 3;
FIG. 6 is a schematic view of the fixing mechanism of the present invention;
FIG. 7 is a schematic structural view of the present invention as a whole;
in the figure: 1. a housing; 2. a processing table; 3. a support frame; 4. a fixing mechanism; 5. an adjustment groove; 6. a support shaft; 7. automatically telescoping a rod II; 8. an infrared camera; 9. an optical filter; 10. a computer; 11. a screw rod; 12. a spring; 13. a motor; 14. Automatically telescoping a rod I; 15. a transparent thin film electrode plate; 16. an electroluminescent layer; 17. a metal electrode plate; 18. automatically telescoping a rod III; 19. a placement groove; 20. an air bag; 21. a bump; 22. a regulated power supply; 23. a branch pipe; 24. a vent pipe; 25. an air pump; 26. a filter box; 27. a first pipeline; 28. and a second pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 7, the present invention provides a technical solution: a ceramic substrate defect detection device and a defect detection method comprise a shell 1, wherein a processing table 2 and a support frame 3 are arranged on the inner wall of the shell 1, the processing table 2 is positioned on the inner side of the support frame 3, a fixing mechanism 4 is arranged on the inner wall of the processing table 2, a detection assembly is arranged on the outer wall of the support frame 3, an adjusting assembly is arranged on the inner wall of the support frame 3, the adjusting assembly comprises an adjusting groove 5, the adjusting groove 5 is arranged on the inner wall of the support frame 3, a support shaft 6 is slidably arranged on the inner wall of the adjusting groove 5, an automatic telescopic rod II 7 is arranged at the bottom end of the support shaft 6, an infrared camera 8 is arranged at the bottom end of the automatic telescopic rod II 7, an optical filter 9 is arranged on the outer wall of the infrared camera 8, a computer 10 is arranged at the top end of the support frame 3, a through hole is arranged on the inner wall of the support shaft 6, a lead screw 11 is rotatably arranged on the inner wall of the adjusting groove 5, and the lead screw 11 penetrates through the through hole, the inner wall of the through hole is provided with a screw nut matched with the screw rod 11, the outer wall of the supporting shaft 6 is symmetrically provided with a spring 12, the spring 12 is sleeved outside the screw rod 11, the outer wall of the spring 12 is far away from one end of the supporting shaft 6 and connected with the adjusting groove 5, the inner wall of the supporting frame 3 is provided with a motor 13, an output shaft of the motor 13 is connected with the outer wall of the screw rod 11 to provide power for the screw rod 11, the detection assembly comprises a plurality of automatic telescopic rods I14, the automatic telescopic rods I14 are symmetrically arranged at the bottom end of the supporting frame 3, the bottom end of the automatic telescopic rods I14 is provided with a transparent thin film electrode plate 15, the automatic telescopic rods I14 are uniformly arranged at four corners of the transparent thin film electrode plate 15, so that the transparent thin film electrode plate 15 is stably supported, the bottom end of the transparent thin film electrode plate 15 is provided with a field emission layer 16, the bottom end of the support frame 3 is provided with a metal electrode plate 17, the inner wall of the shell 1 is symmetrically provided with a plurality of automatic telescopic rods three 18, the automatic telescopic rods three 18 are matched with the metal electrode plate 17, the metal electrode plate 17 is movably connected with the support frame 3, the outer wall of the shell 1 is provided with a stabilized voltage power supply 22, the electroluminescent layer 16 is a fluorescent luminescent layer, the fixing mechanism 4 comprises a plurality of placing grooves 19, the placing grooves 19 are arranged on the inner wall of the processing table 2, the inner wall of the placing grooves 19 is provided with air bags 20 and convex blocks 21, the convex blocks 21 are arranged at the bottoms of the placing grooves 19, the air bags 20 are sleeved on the inner wall of the placing grooves 19, a protective layer is arranged on one side, close to the convex blocks 21, of the outer wall of the air bags 20, one side of the outer wall of the air bags 20 is movably connected with the convex blocks 21, the outer wall of the air bags 20 is provided with branch pipes 23, and a plurality of the branch pipes 23 are connected through ventilation pipes 24, an air pump 25 is arranged on the outer wall of the ventilation pipe 24 and on the outer wall of the processing table 2, so that air movement in the ventilation pipe 24 is achieved, a filter box 26 is arranged on the inner wall of the shell 1, adsorption carbon is arranged on the inner wall of the filter box 26, one end of the filter box 26 is connected with the air pump 25 through a first pipeline 27, a second pipeline 28 is arranged at the other end of the filter box 26, and the second pipeline 28 extends to the outer side of the shell 1.
A detection method of a ceramic substrate defect detection device comprises the following specific detection methods:
the method comprises the following steps: fix ceramic substrate, ceramic substrate has different thickness, different size, open the door body, the ceramic substrate who will wait to detect is placed on lug 21, air pump 25 moves, external air passes through in pipeline two 28 gets into rose box 26, reach pipeline one 27 after adsorbing carbon filtration, then carry to in the ventilation pipe 24, carry to the gasbag 20 that corresponds through a plurality of branch pipes 23 in, gasbag 20 is expanded after being filled by the air, gasbag 20 drives the protective layer and is close to ceramic substrate, according to the size of the ceramic substrate who waits to detect, until protective layer and ceramic substrate contact, make gasbag 20 support ceramic substrate's side, accomplish the fixing to ceramic substrate, avoid ceramic substrate at the in-process that detects, improve the precision that detects.
Step two: the device is adjusted, the first automatic telescopic rod 14 extends to drive the transparent thin film electrode plate 15, the electroluminescent layer 16 approaches to the ceramic substrate, the third automatic telescopic rod 18 extends to drive the metal electrode plate 17 to approach to the ceramic substrate, thereby improving the tightness of the device, the transparent thin film electrode plate 15, the metal electrode plate 17 and the stabilized voltage power supply 22 are connected, the output shaft of the motor 13 drives the lead screw 11 to rotate, the lead screw 11 drives the support shaft 6 through a lead screw nut, the support shaft 6 is limited through the adjusting groove 5 on the outer wall of the support shaft 6, so that the support shaft 6 horizontally moves along the lead screw 11 until the support shaft 6 drives the second automatic telescopic rod 7, the infrared camera 8 moves above the ceramic substrate to be detected, in the process that the support shaft 6 stops moving, the support shaft 6 can be impacted by moving due to inertia, the springs 12 on two sides buffer the support shaft 6, thereby the reduction is to infrared camera 8's impact force, avoids infrared camera 8 to take place to rock, and stability when guaranteeing infrared camera 8 and use, automatic two 7 extensions of telescopic link or shrink are adjusted infrared camera 8's height.
Step three: the method comprises the steps of detecting a ceramic substrate, closing a door body, detecting in a dark environment, switching on a voltage-stabilized power supply 22, taking a picture by matching an infrared camera 8 and an optical filter 9, processing a luminous photo by a computer 10, judging whether the photo is defect-free, accurately positioning the defect position of a ceramic chip, enabling the defect position of the ceramic chip to have bright spots, if the photo is not the bright spot, enabling the ceramic chip to be defect-free and have bright spots, processing the photo by the computer 10, and positioning the defect position of the ceramic chip.
The working principle of the invention is as follows:
referring to the attached drawings 1-7 of the specification, the invention arranges an infrared camera 8, a filter 9, an insert block, a transparent thin film electrode plate 15, a metal electrode plate 17 and a stabilized voltage power supply 22, the infrared camera 8 and the optical filter 9 can be matched for taking a picture, the computer 10 can process the luminous picture and judge whether the picture has defects, thereby carrying out nondestructive testing on the ceramic substrate, accurately positioning the defect position, having higher detection accuracy, by means of the air bag 20, the first pipe 27, the protective layer, the ventilation pipe 24, the filter tank 26 and the branch pipe 23, the air bag 20 can be expanded after being filled with air, the air bag 20 drives the protective layer to approach the ceramic substrate, thereby adjusting the expansion range of the air bag 20, the side of the ceramic substrate is supported, the ceramic substrates with different sizes can be fixed, the ceramic substrate is prevented from displacing in the detection process, and the detection accuracy is improved.
Further, referring to the attached drawings 1-5 of the specification, the supporting shaft 6, the springs 12, the adjusting groove 5, the motor 13, the lead screw 11 and the automatic telescopic rod two 7 are arranged, the springs 12 on two sides can buffer the supporting shaft 6, impact force on the infrared camera 8 is reduced, shaking of the infrared camera 8 is avoided, stability of the infrared camera 8 in use is guaranteed, the automatic telescopic rod two 7 extends or contracts to drive the infrared camera 8 to move, ceramic substrates with different thicknesses can be tested, the automatic telescopic rod three 18, the supporting frame 3 and the automatic telescopic rod one 14 are arranged, the automatic telescopic rod one 14 extends to drive the transparent thin film electrode plate 15 and the electroluminescent layer 16 to approach to the ceramic substrates, and the automatic telescopic rod three 18 extends to drive the metal electrode plate 17 to approach to the ceramic substrates, so that compactness of devices is improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A ceramic substrate defect detecting device includes a case (1), characterized in that: casing (1) inner wall is equipped with processing platform (2) and support frame (3), processing platform (2) are located support frame (3) are inboard, processing platform (2) inner wall is equipped with fixed establishment (4), support frame (3) outer wall is equipped with determine module, support frame (3) inner wall is equipped with adjusting part.
2. The apparatus for detecting defects of a ceramic substrate as claimed in claim 1, wherein: the adjusting part includes adjustment tank (5), adjustment tank (5) are located support frame (3) inner wall, adjustment tank (5) inner wall slides and is equipped with back shaft (6), back shaft (6) bottom is equipped with automatic telescopic link two (7), automatic telescopic link two (7) bottom is equipped with infrared camera (8), infrared camera (8) outer wall is equipped with light filter (9), support frame (3) top is equipped with computer (10), back shaft (6) inner wall is equipped with the through-hole, adjustment tank (5) inner wall rotates and is equipped with lead screw (11), lead screw (11) run through in the through-hole.
3. The apparatus for detecting defects of a ceramic substrate according to claim 2, wherein: the through-hole inner wall be equipped with lead screw (11) assorted screw-nut, back shaft (6) outer wall symmetry is equipped with spring (12), spring (12) cover is located lead screw (11) outside, spring (12) outer wall is kept away from back shaft (6) one end with adjustment tank (5) are connected, support frame (3) inner wall is equipped with motor (13), the output shaft of motor (13) with lead screw (11) outer wall connection.
4. The apparatus for detecting defects of a ceramic substrate according to claim 1, wherein: the detection assembly comprises a plurality of automatic telescopic rods (14) and a plurality of automatic telescopic rods (14) which are symmetrically arranged at the bottom end of the support frame (3), a transparent thin film electrode plate (15) is arranged at the bottom end of the automatic telescopic rods (14), and the automatic telescopic rods (14) are uniformly arranged at four corners of the transparent thin film electrode plate (15).
5. The apparatus of claim 4, wherein: the bottom end of the transparent thin film electrode plate (15) is provided with an electroluminescent layer (16), the bottom end of the support frame (3) is provided with a metal electrode plate (17), and the inner wall of the shell (1) is symmetrically provided with a plurality of automatic telescopic rods III (18).
6. The apparatus of claim 5, wherein: the metal electrode plate (17) is movably connected with the support frame (3), a voltage-stabilized power supply (22) is arranged on the outer wall of the shell (1), and the electroluminescent layer (16) is a fluorescent light-emitting layer.
7. The apparatus for detecting defects of a ceramic substrate according to claim 1, wherein: the fixing mechanism (4) comprises a plurality of placing grooves (19), the placing grooves (19) are arranged on the inner wall of the processing table (2), air bags (20) and bumps (21) are arranged on the inner wall of the placing grooves (19), the bumps (21) are arranged at the bottom of the placing grooves (19), the air bags (20) are sleeved on the inner wall of the placing grooves (19), and a protective layer is arranged on one side, close to the bumps (21), of the outer wall of each air bag (20).
8. The apparatus of claim 7, wherein: one side of the outer wall of the air bag (20) is movably connected with the bump (21), a branch pipe (23) is arranged on the outer wall of the air bag (20), the branch pipes (23) are connected through a ventilation pipe (24), and an air pump (25) is arranged on the outer wall of the processing table (2) on the outer wall of the ventilation pipe (24).
9. The apparatus of claim 8, wherein: casing (1) inner wall is equipped with rose box (26), rose box (26) inner wall is equipped with the adsorption carbon, rose box (26) one end pass through pipeline one (27) with air pump (25) are connected, rose box (26) other end is equipped with pipeline two (28), pipeline two (28) extend to the casing (1) outside.
10. The method of claim 9, wherein the method comprises: the specific detection method comprises the following steps:
the method comprises the following steps: fix ceramic substrate, ceramic substrate has different thickness, different size, open the door body, the ceramic substrate who will wait to detect places on lug (21), air pump (25) operation, external air passes through in pipeline two (28) gets into rose box (26), it reaches pipeline one (27) after adsorbing carbon filtration, then carry to in ventilation pipe (24), carry to corresponding gasbag (20) through a plurality of branch pipes (23) in, gasbag (20) are by the air filling back expansion, gasbag (20) drive the protective layer and are close to ceramic substrate, according to the size of the ceramic substrate who waits to detect, until protective layer and ceramic substrate contact, make gasbag (20) support the side of ceramic substrate, accomplish the fixing to ceramic substrate, avoid ceramic substrate to take place the displacement at the in-process that detects, improve the precision of detecting.
Step two: the device is adjusted, the first automatic telescopic rod (14) is extended to drive the transparent thin film electrode plate (15), the electroluminescent layer (16) is close to the ceramic substrate, the third automatic telescopic rod (18) is extended to drive the metal electrode plate (17) to be close to the ceramic substrate, thereby improving the tightness of the device, the transparent thin film electrode plate (15), the metal electrode plate (17) and the stabilized voltage power supply (22) are connected, the output shaft of the motor (13) drives the lead screw (11) to rotate, the lead screw (11) drives the supporting shaft (6) through a lead screw nut, the supporting shaft (6) is limited through the adjusting groove (5) on the outer wall of the supporting shaft (6), so that the supporting shaft (6) horizontally moves along the lead screw (11) until the supporting shaft (6) drives the second automatic telescopic rod (7), the infrared camera (8) moves to the position above the ceramic substrate to be detected, and in the process that the supporting shaft (6) moves to stop moving, back shaft (6) can receive the impact force of removal because inertia, and spring (12) of both sides cushion back shaft (6) to reduce the impact force to infrared camera (8), avoid infrared camera (8) to take place to rock, guarantee the stability when infrared camera (8) use, automatic telescopic link two (7) extension or shrink are adjusted the height of infrared camera (8).
Step three: the method comprises the steps of detecting a ceramic substrate, closing a door body, detecting in a dark environment, switching on a voltage-stabilizing power supply (22), matching an infrared camera (8) and an optical filter (9) to take a picture, processing a luminous photo by a computer (10), judging whether the photo is defective or not, accurately positioning the defective position of a ceramic chip, enabling the defective position of the ceramic chip to have bright spots, processing the photo by the computer (10) if the photo is not defective or the bright spots are generated, and positioning the defective position of the ceramic chip.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116008295A (en) * | 2023-02-21 | 2023-04-25 | 苏州精创光学仪器有限公司 | Copper-clad ceramic substrate detection equipment |
| CN117571611A (en) * | 2024-01-12 | 2024-02-20 | 山西泓韵达陶瓷股份有限公司 | Ceramic substrate outward appearance detection device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1576825A (en) * | 2003-07-25 | 2005-02-09 | 株式会社丰田自动织机 | Gas detection method, gas sensor, method for storing the gas sensor, and storage vessel |
| CN101400300A (en) * | 2006-03-10 | 2009-04-01 | 松下电器产业株式会社 | Instrument for measuring concentration of living body ingredient |
| JP2011138969A (en) * | 2009-12-28 | 2011-07-14 | Mitsubishi Heavy Ind Ltd | Inspecting method for thin-film solar cell module, and method for manufacturing thin-film solar cell module |
| JP2013011522A (en) * | 2011-06-29 | 2013-01-17 | Nippon Electric Glass Co Ltd | Inspection method and inspection device for glass substrate |
| WO2015165244A1 (en) * | 2014-04-29 | 2015-11-05 | 京东方科技集团股份有限公司 | Flexible substrate, oled device, and defect detection method thereof |
| CN110823910A (en) * | 2019-12-02 | 2020-02-21 | 广东汇博机器人技术有限公司 | Appearance detection device for ceramic substrate |
| CN213558492U (en) * | 2020-11-04 | 2021-06-29 | 盐城宇欣陶瓷科技有限公司 | 3D cell-phone ceramic defect automatic checkout device |
| CN113640305A (en) * | 2021-08-11 | 2021-11-12 | 佛山市龙生光启科技有限公司 | Intelligent detection system suitable for new material ceramic utensil |
-
2022
- 2022-06-10 CN CN202210653616.3A patent/CN115078400A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1576825A (en) * | 2003-07-25 | 2005-02-09 | 株式会社丰田自动织机 | Gas detection method, gas sensor, method for storing the gas sensor, and storage vessel |
| CN101400300A (en) * | 2006-03-10 | 2009-04-01 | 松下电器产业株式会社 | Instrument for measuring concentration of living body ingredient |
| JP2011138969A (en) * | 2009-12-28 | 2011-07-14 | Mitsubishi Heavy Ind Ltd | Inspecting method for thin-film solar cell module, and method for manufacturing thin-film solar cell module |
| JP2013011522A (en) * | 2011-06-29 | 2013-01-17 | Nippon Electric Glass Co Ltd | Inspection method and inspection device for glass substrate |
| WO2015165244A1 (en) * | 2014-04-29 | 2015-11-05 | 京东方科技集团股份有限公司 | Flexible substrate, oled device, and defect detection method thereof |
| CN110823910A (en) * | 2019-12-02 | 2020-02-21 | 广东汇博机器人技术有限公司 | Appearance detection device for ceramic substrate |
| CN213558492U (en) * | 2020-11-04 | 2021-06-29 | 盐城宇欣陶瓷科技有限公司 | 3D cell-phone ceramic defect automatic checkout device |
| CN113640305A (en) * | 2021-08-11 | 2021-11-12 | 佛山市龙生光启科技有限公司 | Intelligent detection system suitable for new material ceramic utensil |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116008295A (en) * | 2023-02-21 | 2023-04-25 | 苏州精创光学仪器有限公司 | Copper-clad ceramic substrate detection equipment |
| CN116008295B (en) * | 2023-02-21 | 2023-07-04 | 苏州精创光学仪器有限公司 | Copper-clad ceramic substrate detection equipment |
| CN117571611A (en) * | 2024-01-12 | 2024-02-20 | 山西泓韵达陶瓷股份有限公司 | Ceramic substrate outward appearance detection device |
| CN117571611B (en) * | 2024-01-12 | 2024-03-26 | 山西泓韵达陶瓷股份有限公司 | Ceramic substrate outward appearance detection device |
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Application publication date: 20220920 |