CN111092035B - System for be used for chemical passivation - Google Patents
System for be used for chemical passivation Download PDFInfo
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- CN111092035B CN111092035B CN201911357714.7A CN201911357714A CN111092035B CN 111092035 B CN111092035 B CN 111092035B CN 201911357714 A CN201911357714 A CN 201911357714A CN 111092035 B CN111092035 B CN 111092035B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The invention discloses a system for chemical passivation, which comprises a bubble removing device, a sample carrying platform and a sealing mechanism, wherein the bubble removing device is positioned above the sample carrying platform; the bubble removing device is used for uniformly dispersing the passivation liquid on the sample to be sealed and removing bubbles and redundant passivation liquid in the sealing film loaded with the sample to be sealed; the sealing mechanism is used for sealing the sealing film in the sealing area. The system for chemical passivation provided by the invention does not need to artificially remove bubbles in the sealing film, can precisely carry out plastic package on the sealing film, improves the chemical passivation effect and efficiency, and reduces the difference between passivation effects caused by the level problem of operators.
Description
Technical Field
The invention belongs to the technical field of passivation, and particularly relates to a system for chemical passivation.
Background
With the increasing integration of integrated circuits, the quality requirement for the required substrate monocrystalline silicon wafer is higher and higher, and people often use the non-equilibrium state minority carrier lifetime (minority carrier lifetime) to reflect the quality of the silicon wafer. The minority carrier lifetime of the silicon wafer refers to: the mean time for excited hole-electron pairs to recombine minority carriers under excitation with energy (1.12eV) greater than the semiconductor forbidden bandwidth. And metal and defects can become effective recombination centers, and when more metal and defects exist in the silicon wafer, the minority carrier lifetime can be greatly reduced, so that the length of the minority carrier lifetime can reflect the quality of the silicon wafer.
At present, the method for detecting the minority carrier lifetime of the silicon wafer is mainly a Microwave photoconductive Decay method (micro Photo-semiconductor Decay, mu-PCD). The microwave photoconduction decay method is characterized in that pulse laser with the band gap width larger than that of silicon is used for irradiating the surface of a silicon wafer, the generated hole-electron can increase the photoconductivity of the silicon wafer, the photoconductivity is decayed exponentially along with the removal of the laser, and the change of the photoconductivity is detected by the change of the reflection intensity of the microwave, so that the service life of minority carriers is obtained. However, the dangling bonds existing on the surface of the silicon wafer can become effective recombination centers, so that the measured minority carrier lifetime is not the real minority carrier lifetime of the silicon wafer. In order to eliminate the influence of surface recombination, the surface of the silicon wafer needs to be passivated. Common passivation methods are oxidation passivation, charge deposition passivation, chemical passivation. The oxidation passivation is to carry out thermal oxidation treatment in an oxidation furnace, and an oxide layer grows on the surface of the silicon wafer; the charge deposition passivation is to deposit charges with the same electrical property as that of minority carriers on the surface of the silicon wafer by a corona discharge technology to saturate dangling bonds and reduce the diffusion of the minority carriers to the surface; the chemical passivation is to passivate the surface of the silicon wafer with iodine in a plastic package bag (i.e. a sealing film) made of special materials, and the test is carried out after the plastic package. The oxidation passivation is easy to introduce new pollution in the oxidation process, the charge deposition passivation speed is slow, the compactness is not high, and the chemical passivation can better eliminate the influence of surface load and becomes a main silicon wafer surface passivation method.
However, in the chemical passivation process, bubbles and redundant iodine solution in the plastic package bag need to be manually removed, and then the rectangular plastic bag wrapping the silicon wafer is changed into a round shape wrapping the silicon wafer after being subjected to multiple plastic packages, so that the problems of long processing time and low efficiency are caused, and the chemical passivation result is different due to different levels of operators, so that a large error is caused.
Disclosure of Invention
To solve the above-mentioned problems in the prior art, the present invention provides a system for chemical passivation. The technical problem to be solved by the invention is realized by the following technical scheme:
a system for chemical passivation, comprising: the device comprises a rotatable bubble removing device, a rotatable sample carrying platform and a sealing mechanism which can move up and down;
the bubble removing device is positioned above the sample carrying platform, the sealing mechanism is positioned above the bubble removing device, the bubble removing device and the sample placing area of the sample carrying platform are arranged oppositely, the sealing part of the sealing mechanism and the sealing area of the sample carrying platform are arranged oppositely, wherein,
the sample carrying platform is used for placing a sample to be sealed in the sample placing area;
The bubble removing device is used for uniformly spreading passivation liquid on the sample to be sealed when the distance between the sample placing area and the bubble removing device is a preset distance, and removing bubbles in the sealing film loaded with the sample to be sealed and redundant passivation liquid;
the sealing mechanism is used for sealing the sealing film in the sealing area.
In an embodiment of the present invention, the apparatus further includes a first moving mechanism, and the first moving mechanism is connected to the sample stage to drive the sample stage to move up and down.
In an embodiment of the present invention, the first moving mechanism includes a first telescopic member, the first telescopic member is located below the sample stage, and one end of the first telescopic member is connected to a lower end surface of the sample stage so as to perform telescopic motion to drive the sample stage to move up and down.
In an embodiment of the present invention, the sample stage further includes a first bearing and a base, the first bearing is sleeved on the first telescopic member, an upper end surface of the first bearing is fixedly connected to a lower end surface of the sample stage, and the base is located at a lower end of the first telescopic member and is connected to the first telescopic member.
In one embodiment of the invention, the sealing device further comprises a second moving mechanism, and the second moving mechanism is connected with the sealing mechanism to drive the sealing mechanism to move up and down.
In an embodiment of the present invention, the second moving mechanism includes a second telescopic member, the second telescopic member is located above the sealing mechanism, and one end of the second telescopic member is connected to the upper end surface of the sealing mechanism to perform telescopic motion to drive the sealing mechanism to move up and down.
In one embodiment of the invention, the bubble removal device further comprises a connecting piece, the second telescopic piece has a hollow structure, one end of the connecting piece is connected with the upper end face of the bubble removal device, and the connecting piece penetrates through the hollow structure of the second telescopic piece.
In one embodiment of the invention, the connecting piece comprises a third moving mechanism, and the third moving mechanism is connected with the upper end surface of the bubble removing device so as to drive the bubble removing device to move up and down.
In an embodiment of the present invention, the third moving mechanism includes a third telescopic member, the third telescopic member is located above the bubble removing device, one end of the third telescopic member is connected to the upper end surface of the bubble removing device, and the third telescopic member passes through the hollow structure of the second telescopic member to perform telescopic motion to drive the bubble removing device to move up and down.
In an embodiment of the present invention, the bubble removing device further includes a second bearing, the second bearing is sleeved on the connecting member, and a lower end surface of the second bearing is fixedly connected to an upper end surface of the bubble removing device.
The invention has the beneficial effects that:
the sample carrying platform provided by the invention can rotate, so that after a sample to be sealed is placed in the sample placing area, the sample carrying platform can rotate, the passivation liquid in the sealing film can be uniformly dispersed on the sample to be sealed, then the distance between the sample carrying platform and the bubble removing device is adjusted to reach a preset distance, the bubble removing device can be contacted with the sample to be sealed, and at the moment, the bubble removing device can rotate in a direction opposite to the direction of the sample carrying platform, so that the passivation liquid can be further uniformly dispersed on the sample to be sealed, and bubbles in the sealing film and redundant passivation liquid can be removed. After the process is finished, the sealing film loaded with the sample to be sealed can be sealed by the sealing mechanism, air bubbles in the sealing film do not need to be removed artificially in the whole process, the sealing film can be subjected to plastic packaging accurately, the chemical passivation effect and efficiency are improved, and the difference between passivation effects caused by the horizontal problem of operators is reduced.
The present invention will be described in further detail with reference to the drawings and examples.
Drawings
FIG. 1 is a schematic diagram of a system for chemical passivation according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another system for chemical passivation according to an embodiment of the present invention.
Description of the reference numerals:
bubble removal means-10; a sample stage-20; a sealing mechanism-30; sample to be sealed-40; sealing film-50; a first telescoping member-60; a first bearing-70; a base-80; a second telescoping member-90; a third telescoping member-100; a second bearing-110; sample placement area-201; a seal area-202; seal portion-301.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a system for chemical passivation according to an embodiment of the present invention, and fig. 2 is a schematic structural diagram of another system for chemical passivation according to an embodiment of the present invention. An embodiment of the present invention provides a system for chemical passivation, including: a rotatable bubble removing device 10, a rotatable sample stage 20, and a sealing mechanism 30 capable of moving up and down, wherein the bubble removing device 10 is located above the sample stage 20, the sealing mechanism 30 is located above the bubble removing device 10, the bubble removing device 10 and a sample placing area 201 of the sample stage 20 are arranged oppositely, a sealing part 301 of the sealing mechanism 30 is arranged oppositely to a sealing area 202 of the sample stage 20, wherein,
The sample stage 20 is used for placing a sample 40 to be sealed in the sample placing area 201;
the bubble removing device 10 is used for uniformly spreading the passivation liquid on the sample 40 to be sealed when the distance between the sample placing area 201 and the bubble removing device 10 is a preset distance, and removing bubbles and redundant passivation liquid in the sealing film 50 loaded with the sample 40 to be sealed;
the sealing mechanism 30 is used to seal the sealing film 50 in the sealing region 202.
Specifically, the sample to be sealed 40 of the present embodiment may be any sample that needs to be chemically passivated and sealed, for example, a silicon wafer, and for the convenience of understanding of the scheme, the sample to be sealed 40 is taken as an example for description.
Generally, before chemical passivation is performed on a silicon wafer, the silicon wafer needs to be placed in the sealing film 50 with an opening, a passivation liquid (e.g., iodine solution) needs to be dropped on the surface of the silicon wafer to passivate the silicon wafer, and then the silicon wafer in the sealing film 50 can be placed in the sample placement area 201 on the sample placement table 20, because the sample placement table 20 can rotate, the sample placement table 20 can rotate at this time to drive the silicon wafer in the sample placement area 201 to rotate, and the passivation liquid on the silicon wafer can diffuse around the silicon wafer under the acting force generated by rotation, so that the passivation liquid can be primarily uniformly dispersed on the silicon wafer. Of course, whether to perform the operation may be selected according to actual conditions in the process, which is not specifically limited in this embodiment. The sample placement area 201 of the present embodiment may be, for example, a groove provided on the upper surface of the sample stage 20, or may be configured to accommodate a silicon wafer, and the size of the sample placement area 201 may be set according to the size of the silicon wafer so as to accommodate the silicon wafer without causing mechanical damage to the silicon wafer.
After placing the silicon chip in sample placing area 201, the distance between sample placing area 201 and bubble removing device 10 can be adjusted, the distance is adjusted to a preset distance, the preset distance is a distance that can make bubble removing device 10 contact with the silicon chip, and the silicon chip is not damaged, the distance between sample placing area 201 and bubble removing device 10 can be realized by making sample carrier 20 move up and down, or can be realized by adjusting bubble removing device 10 to move up and down, or can be realized by making sample carrier 20 and bubble removing device 10 move up and down at the same time, this embodiment is not specifically limited. After the distance between the sample placement area 201 and the bubble removal device 10 is adjusted to be a preset distance, the bubble removal device 10 and the sample carrier 20 can rotate in the opposite directions, so that the passivation liquid on the silicon wafer can be more uniformly distributed on the silicon wafer under the action force applied by the bubble removal device 10, and meanwhile, the bubble removal device 10 can also remove bubbles and redundant passivation liquid in the sealing film 50, so that the redundant passivation liquid is discharged from the opening of the sealing film 50, and the final test result is more accurate. The size of the bubble removal device 10 is not particularly limited in this embodiment, and should be sufficient to contact the silicon wafer without interfering with other structures, and preferably, the size of the bubble removal device 10 is the same as that of the sample placement area 201, so that the bubble removal device 10 completely covers the silicon wafer. It should be noted that, in this embodiment, the rotation manner of the bubble removal device 10 and the sample stage 20 is not specifically limited, and a person skilled in the art may select a suitable driving mechanism to drive the bubble removal device 10 and the sample stage 20 to rotate according to specific requirements.
After the passivation liquid is uniformly spread on the silicon wafer and bubbles are removed, the sealing mechanism 30 can be used to seal the sealing film 50, because the sealing position of the sealing film 50 covers the sealing area 202 of the sample carrier 20, the sealing portion 301 of the sealing mechanism 30 is opposite to the sealing area 202, wherein the sealing portion 301 is a structure for performing sealing operation on the sealing mechanism 30. When sealing is needed, the sealing mechanism 30 is moved toward the sealing area 202, and after the sealing mechanism 30 reaches the sealing area 202, the sealing film 50 can be sealed by the sealing mechanism 30, thereby completing the sealing of the silicon wafer. The sealing area 202 of the present embodiment may be, for example, a concave groove formed on the upper surface of the sample stage 20, or may be another structure capable of accommodating the sealing portion 301 of the sealing mechanism 30, and the size of the sealing area 202 should be set according to the size of the sealing portion 301 so as to accommodate the sealing portion 301, and the sealing area 202 should correspond to the portion of the sealing film 50 that needs to be sealed, for example, the sealing film 50 needs to be sealed in a circular state, and then both the sealing area 202 and the sealing portion 301 of the sealing mechanism 30 should be circular. The outer diameter of the sealing portion 301 of the sealing mechanism 30 of the present embodiment may be 304mm and the inner diameter may be 302mm, for example.
The sample stage 20 provided in this embodiment can rotate, so that after a silicon wafer is placed in the sample placement area 201, the sample stage 20 can rotate, so that the passivation liquid in the sealing film 50 can be uniformly spread on the silicon wafer, and then the distance between the sample stage 20 and the bubble removal device 10 is adjusted to reach a preset distance, so that the bubble removal device 10 can be in contact with the silicon wafer, at this time, the bubble removal device 10 can rotate in a direction opposite to the direction of the sample stage 20, so that the passivation liquid can be further uniformly spread on the silicon wafer, and bubbles and redundant passivation liquid in the sealing film 50 can also be removed. After this process, alright in order to utilize sealing mechanism 30 to seal the sealing film 50 that loads the silicon chip, whole process not only need not artificially go the bubble in the sealing film 50, and can also make the even dispersion of passivation liquid on the silicon chip, can also carry out the plastic envelope to sealing film 50 accurately in addition, has improved the effect and the efficiency of chemical passivation, has reduced the problem that the passivation effect differs because the operating personnel level causes.
Further, the material of the bubble removing device 10 may be a soft material, so as not to cause mechanical damage to the silicon wafer, for example, the material of the bubble removing device 10 includes PP (Polypropylene) or PFA (polytetrafluoroethylene).
Furthermore, the rotating speed of the bubble removing device 10 and the sample carrying platform 20 is 1-100rpm, and the rotating time is 0.5-5 min.
In a specific embodiment, the system for chemical passivation of the present embodiment may further include a first moving mechanism connected to the sample stage 20 to drive the sample stage 20 to move up and down.
That is to say, when the sample stage 20 needs to be close to the bubble removal device 10 or far away from the bubble removal device 10, the first moving mechanism may be used to drive the sample stage 20 to move, and the first moving mechanism may be, for example, an air cylinder or a hydraulic structure that can drive the sample stage 20 to move, or may be a telescopic mechanism that drives the sample stage 20 to move by using telescopic motion.
Further, the first moving mechanism may include, for example, a first telescopic member 60, the first telescopic member 60 is located below the sample stage 20, and one end of the first telescopic member 60 is connected to the lower end surface of the sample stage 20, so as to perform telescopic motion to drive the sample stage 20 to move up and down.
That is to say, first extensible member 60 is a mechanism that can stretch out and draw back, and the one end of first extensible member 60 is connected with the lower terminal surface of sample microscope carrier 20, therefore, when needing sample microscope carrier 20 upward movement, then can make first extensible member 60 upwards extend to drive sample microscope carrier 20 upward movement, when needing sample microscope carrier 20 downward movement, then can make first extensible member 60 shrink downwards, thereby drive sample microscope carrier 20 downward movement, with this reciprocating that realizes sample microscope carrier 20. The first expansion element 60 may be any expansion mechanism that can drive the sample stage 20 to move up and down, and this embodiment is not limited in particular, and the first expansion element 60 may be driven by a first driving mechanism to perform an expansion and contraction motion, and the first driving mechanism may be, for example, a motor.
In an embodiment, the system for chemical passivation of the present embodiment may further include a first bearing 70 and a base 80, the first bearing 70 is sleeved on the first telescopic member 60, an upper end surface of the first bearing 70 is fixedly connected with a lower end surface of the sample stage 20, and the base 80 is located at a lower end of the first telescopic member 60 and is connected with the first telescopic member 60.
That is to say, in the present embodiment, the first bearing 70 is disposed on the lower end surface of the sample stage 20, and the first extensible member 60 passes through the first bearing 70, when the first bearing 70 performs a rotation motion, because the first bearing 70 and the sample stage 20 are fixedly connected, the sample stage 20 can be driven to rotate together, the first bearing 70 can be driven to rotate by a second driving mechanism, for example, a motor. In addition, a base 80 is disposed at the lower end of the first extensible member 60, and the base 80 can support the first extensible member 60 and the sample stage 20.
The up-down movement and rotation of the sample stage 20 are realized in a simple manner, the implementation is easy, the space is saved, and the accuracy of the movement and rotation of the sample stage 20 is ensured.
In a specific embodiment, the system for chemical passivation of the present embodiment may further include a second moving mechanism connected to the sealing mechanism 30 to drive the sealing mechanism 30 to move up and down.
That is to say, when the sealing mechanism 30 needs to face the sample stage 20 or be far away from the sample stage 20, the sealing mechanism 30 can be driven to move by using a second moving mechanism, for example, the second moving mechanism is an air cylinder or a hydraulic structure that can drive the sealing mechanism 30 to move, and also can be a telescopic mechanism that drives the sealing mechanism 30 to move by using telescopic motion.
Further, the second moving mechanism may include, for example, a second telescopic member 90, the second telescopic member 90 is located above the sealing mechanism 30, and one end of the second telescopic member 90 is connected to the upper end surface of the sealing mechanism 30, so as to perform telescopic motion to drive the sealing mechanism 30 to move up and down.
That is to say, second extensible member 90 is a mechanism that can stretch out and draw back, and the one end of second extensible member 90 is connected with the up end that seals mechanism 30, consequently, when mechanism 30 upward movement is sealed to needs, then can make second extensible member 90 upwards contract to the drive seals mechanism 30 upward movement, when mechanism 30 downward movement is sealed to needs, then can make second extensible member 90 downwardly extending, thereby the drive seals mechanism 30 downward movement, with this realization seal the reciprocating of mechanism 30. The second telescopic member 90 may be any telescopic mechanism capable of driving the sealing mechanism 30 to move up and down, and this embodiment is not limited in particular, and the second telescopic member 90 may be driven by a third driving mechanism to perform telescopic movement, and the third driving mechanism may be, for example, a motor.
In a specific embodiment, the system for chemical passivation of this embodiment may further include a connecting member, and the second telescopic member 90 has a hollow structure, one end of the connecting member is connected to the upper end surface of the bubble removal device 10, and the connecting member passes through the hollow structure of the second telescopic member 90.
In this embodiment, a connecting member penetrating through the sealing mechanism 30 and the second telescopic member 90 is provided, and the connecting member and one end of the second telescopic member 90 far away from the sealing mechanism 30 can be connected to a fixing device, such as a bracket, so as to fix the sealing mechanism 30 and the bubble removing device 10 in the transverse position. The connecting member should be secured to pass through the sealing mechanism 30 so that it does not interfere with the movement of the sealing mechanism 30. This way, it can be ensured that the sealing mechanism 30 and the bubble removing device 10 are coaxial, so as to save the installation space, and at the same time, it can ensure the normal movement of the bubble removing device 10 and the sealing mechanism 30.
The link of the present embodiment may be configured to be movable up and down, or may be configured not to be movable up and down.
Further, in order to improve the use effect and function of the system for chemical passivation of the present embodiment, the connection part of the system may further include a third moving mechanism, which is connected to the upper end surface of the bubble removing device 10 to drive the bubble removing device 10 to move up and down.
That is to say, when the bubble removal device 10 needs to be close to the sample stage 20 or far away from the sample stage 20, the third moving mechanism may be used to drive the bubble removal device 10 to move, and the third moving mechanism may be, for example, an air cylinder or a hydraulic structure that can drive the bubble removal device 10 to move, or may be a telescopic mechanism that drives the bubble removal device 10 to move by using telescopic motion.
Further, the third moving mechanism may include, for example, a third telescopic member 100, the third telescopic member 100 is located above the bubble removing device 10, one end of the third telescopic member 100 is connected to the upper end surface of the bubble removing device 10, and the third telescopic member 100 passes through the hollow structure of the second telescopic member 90 to perform telescopic motion to drive the bubble removing device 10 to move up and down.
That is to say, the third extensible member 100 is a mechanism capable of extending and retracting, and one end of the third extensible member 100 is connected to the upper end face of the bubble removal device 10, so that when the bubble removal device 10 needs to move upwards, the third extensible member 100 can be contracted upwards to drive the bubble removal device 10 to move upwards, and when the bubble removal device 10 needs to move downwards, the third extensible member 100 can be extended downwards to drive the bubble removal device 10 to move downwards, so as to achieve the up-and-down movement of the bubble removal device 10. The third telescopic member 100 may be any telescopic mechanism capable of driving the bubble removing device 10 to move up and down, and this embodiment is not limited in particular, the third telescopic member 100 may be driven by a fourth driving mechanism to perform telescopic motion, and the fourth driving mechanism may be, for example, a motor.
In an embodiment, the system for chemical passivation of the present embodiment may further include a second bearing 110, the second bearing 110 is sleeved on the connecting member, and a lower end surface of the second bearing 110 is fixedly connected to an upper end surface of the bubble removing device 10.
When the connecting piece is the structure that can not reciprocate, second bearing 110 directly overlaps on the connecting piece, and the lower terminal surface of second bearing 110 and bubble remove device 10's up end fixed connection, when second bearing 110 carries out rotary motion, because of second bearing 110 and bubble remove device 10 fixed connection, then can drive bubble remove device 10 and rotate jointly, second bearing 110 can for example drive it through fifth actuating mechanism and rotate, fifth actuating mechanism can be the motor for example.
When the connecting piece is the structure that can reciprocate, the connecting piece can be third extensible member 100, then second bearing 110 directly overlaps on third extensible member 100, and the lower terminal surface of second bearing 110 and bubble remove device 10's up end fixed connection, and on the same way, can drive the rotary motion of bubble remove device 10 through the rotary motion of second bearing 110. Thereby, both the rotational movement of the bubble removing device 10 and the up-and-down movement of the bubble removing device 10 can be realized.
The system for chemical passivation of the embodiment can initially uniformly disperse passivation liquid on a silicon wafer through the rotation motion of the sample carrier 20, and then the bubble removing device 10 and the sample carrier 20 can also rotate in the opposite directions, so that the passivation liquid can be further uniformly dispersed on the silicon wafer between the bubble removing device 10 and the sample carrier 20 under the action of the bubble removing device 10, and meanwhile, bubbles and redundant passivation liquid in the sealing film 50 can be removed, and finally, the sealing film 50 loaded with the silicon wafer is sealed through the sealing mechanism 30 capable of moving up and down, thereby finally realizing the chemical passivation process of the silicon wafer.
The system for chemical passivation can enable an operator to continuously operate, so that the chemical passivation of the surface of the silicon wafer is fully and uniformly realized, the silicon wafer can be directly sealed, and the chemical passivation time is shortened. Especially, in the process of rotating the sample carrier 20, rotating the bubble removing device 10 and sealing the opening of the sealing mechanism 30, the original manual processing mode is changed, and the processing efficiency of chemical passivation is greatly improved. And in the passivation process, the passivation liquid can be uniformly dispersed on the silicon wafer and bubbles on the silicon wafer can be removed, so that the accuracy of the measurement result is improved.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art. The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A system for chemical passivation, comprising: the device comprises a rotatable bubble removing device, a rotatable sample carrying platform and a sealing mechanism which can move up and down;
the bubble removing device is positioned above the sample carrying platform, the sealing mechanism is positioned above the bubble removing device, the bubble removing device and the sample placing area of the sample carrying platform are arranged oppositely, the sealing part of the sealing mechanism and the sealing area of the sample carrying platform are arranged oppositely, wherein,
the sample carrying platform is used for placing a sample to be sealed in the sample placing area;
the bubble removing device is used for uniformly spreading passivation liquid on the sample to be sealed when the distance between the sample placing area and the bubble removing device is a preset distance, and removing bubbles in the sealing film loaded with the sample to be sealed and redundant passivation liquid;
the sealing mechanism is used for sealing the sealing film in the sealing area.
2. The system of claim 1, further comprising a first movement mechanism coupled to the sample stage to move the sample stage up and down.
3. The system for chemical passivation according to claim 2, wherein the first moving mechanism comprises a first telescopic member, the first telescopic member is located below the sample stage, and one end of the first telescopic member is connected with the lower end face of the sample stage so as to perform telescopic motion to drive the sample stage to move up and down.
4. The system of claim 3, further comprising a first bearing and a base, wherein the first bearing is sleeved on the first telescopic member, an upper end surface of the first bearing is fixedly connected with a lower end surface of the sample stage, and the base is located at a lower end of the first telescopic member and connected with the first telescopic member.
5. The system for chemical passivation according to claim 1, further comprising a second moving mechanism connected to the sealing mechanism to drive the sealing mechanism to move up and down.
6. The system for chemical passivation according to claim 5, wherein the second moving mechanism comprises a second telescopic member, the second telescopic member is located above the sealing mechanism, and one end of the second telescopic member is connected with the upper end face of the sealing mechanism so as to perform telescopic motion to drive the sealing mechanism to move up and down.
7. The system for chemical passivation of claim 6, further comprising a connecting member, wherein the second telescopic member has a hollow structure, one end of the connecting member is connected to the upper end surface of the bubble removal device, and the connecting member passes through the hollow structure of the second telescopic member.
8. The system for chemical passivation according to claim 7, characterized in that the connecting member comprises a third moving mechanism, and the third moving mechanism is connected with the upper end surface of the bubble removing device to drive the bubble removing device to move up and down.
9. The system for chemical passivation according to claim 8, wherein the third moving mechanism comprises a third telescopic member, the third telescopic member is located above the bubble removing device, one end of the third telescopic member is connected with the upper end face of the bubble removing device, and the third telescopic member penetrates through the hollow structure of the second telescopic member to perform telescopic motion to drive the bubble removing device to move up and down.
10. The system for chemical passivation according to any one of claims 7 to 9, characterized by further comprising a second bearing, wherein the second bearing is sleeved on the connecting piece, and a lower end face of the second bearing is fixedly connected with an upper end face of the bubble removing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |