CN217637243U - Automatic detection system for surface roughness of wafer - Google Patents
Automatic detection system for surface roughness of wafer Download PDFInfo
- Publication number
- CN217637243U CN217637243U CN202221469959.6U CN202221469959U CN217637243U CN 217637243 U CN217637243 U CN 217637243U CN 202221469959 U CN202221469959 U CN 202221469959U CN 217637243 U CN217637243 U CN 217637243U
- Authority
- CN
- China
- Prior art keywords
- wafer
- microscope
- fixing
- wafers
- vacuum suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 title claims description 31
- 230000003746 surface roughness Effects 0.000 title claims description 21
- 235000012431 wafers Nutrition 0.000 claims abstract description 220
- 239000000919 ceramic Substances 0.000 claims description 18
- 230000001174 ascending effect Effects 0.000 claims description 2
- 230000035939 shock Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000013522 software testing Methods 0.000 abstract description 2
- 239000000523 sample Substances 0.000 description 29
- 238000012360 testing method Methods 0.000 description 19
- 238000013016 damping Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to the field of semiconductor technology, a wafer roughness automatic check out system is disclosed, include: a microscope, a robotic arm, and a wafer device; the wafer device is used for storing a plurality of wafers, the microscope is used for detecting the roughness of the surface of the wafer placed on the sample platform, and the mechanical arm is used for sequentially taking out the wafers stored in the wafer device, moving the wafers to the sample platform of the microscope and then moving and storing the wafers which are detected into the wafer device. Through using the utility model provides high efficiency of software testing has reduced the contaminated risk of wafer in the transfer process.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a wafer roughness automatic check out system.
Background
As is well known, semiconductor materials are the most critical materials in the chip fabrication process, can be used for fabricating various semiconductor devices, and are widely used in the field of power electronics; with the development of science and technology, higher requirements are put on various performances of semiconductor devices, and the semiconductor device manufacturing is based on materials, so that high requirements are put on the quality of semiconductor materials; at present, semiconductor materials in the industry mainly include silicon wafers, silicon carbide wafers, gallium oxide wafers and the like, the characterization test performance includes surface roughness, wafer size, thickness, primary and secondary positioning edge length, surface warping degree and the like, and the adopted equipment includes a wafer geometric parameter tester, an atomic force microscope, a wafer defect detector and the like.
The surface roughness of the wafer is generally tested by an atomic force microscope, namely, a surface topography of the wafer is obtained firstly, and then the surface roughness of the wafer is obtained by analysis software; during the testing process, in order to obtain a clear topographic map, parameters related to the testing need to be manually adjusted, and the parameters are affected by a plurality of factors such as: the number of particles on the surface of the wafer, the curvature of the probe tip and the like. In the actual wafer production process, in order to ensure stable quality of the delivered products and control the test parameters of the detection equipment to be consistent, it is also critical that the batch test is standardized and streamlined. At present, the conventional method is still adopted for detecting the surface roughness of the semiconductor wafer, namely, the manual test is carried out by an operator, and the test is repeated in turn according to the wafer number; the semiconductor wafer is mainly delivered in a sampling inspection mode, the test result is greatly influenced by the operation method of an operator and the test environment, and the test result is unstable and violates the rigor of the test; the main expression is as follows: in the testing process, each time a wafer is tested, a new wafer needs to be replaced for retesting, the whole process needs more time, and in addition, the wafer has a pollution risk in the process of replacing the wafer; the manual adjustment of the wafer position cannot make the testing positions of the front and rear wafers the same, so how to test the wafers in a large scale with high efficiency is an urgent problem to be solved in the current semiconductor wafer production process.
Disclosure of Invention
The utility model aims to overcome the problem that wafer roughness detection efficiency is not high, a wafer roughness automatic check out system is provided.
In order to achieve the above object, the utility model provides a wafer roughness automatic detection system, include: a microscope, a robotic arm, and a wafer device; the wafer device is used for storing a plurality of wafers, the microscope is used for detecting the roughness of the surface of the wafer placed on the sample platform, and the mechanical arm is used for sequentially taking out the wafers stored in the wafer device, moving the wafers to the sample platform of the microscope, and moving the wafers which are detected to be stored in the wafer device from the sample platform of the microscope.
As an implementation manner, the robot arm includes a robot arm base, a rotating part disposed above the robot arm base, and a robot arm disposed above the rotating part, wherein the rotating part drives the robot arm to rotate, so that the robot arm can move to the wafer device and the sample stage of the microscope respectively.
As an implementation manner, the mechanical arm includes a fixed portion and a suction portion, the fixed portion is mounted above the rotating portion, and the suction portion is movably connected with the fixed portion and used for entering the wafer device to pick and place the wafer; the suction part is provided with a vacuum suction port and is used for taking out the wafer stored in the wafer device in a vacuum suction mode through the vacuum suction port and moving and placing the wafer on a sample table of the microscope after the suction part enters the wafer device, and then the wafer which is detected is moved and stored in the wafer device from the sample table of the microscope in a vacuum suction mode through the vacuum suction port of the suction part.
As an implementation mode, the sample stage is provided with a vacuum suction hole, and the vacuum suction hole is used for performing vacuum adsorption on the wafer when the wafer is placed on the surface of the sample stage, so as to prevent the wafer from sliding down.
As an implementation mode, the sample table is further provided with ceramic pins, and the ceramic pins are located around the vacuum suction holes; the ceramic pins are used for ascending and keeping at a preset height when not contacting the wafer, and descending when contacting the wafer, so that the wafer is attached to the surface of the sample stage.
As an implementation manner, the wafer device includes a fixing base and a wafer storage device, the fixing base is used for fixing the wafer storage device, and the wafer storage device is used for storing a plurality of wafers.
As an implementation manner, the fixing base includes a fixing base and a fixing projection, and the fixing projection is disposed above the fixing base; the wafer storage device comprises a wafer frame, fixing grooves arranged at the bottom of the wafer frame and a plurality of vertically-arranged clamping grooves arranged in the wafer frame, wherein each clamping groove is used for storing a wafer, the fixing grooves correspond to the fixing lugs, and the fixing base is fixed with the wafer storage device by embedding the fixing lugs into the fixing grooves.
As an implementation manner, the fixing base further includes a fixing support, the fixing support is disposed above the fixing base and is an enclosing structure enclosing the fixing protrusion, and the fixing support is used for accommodating the wafer storage device.
As an implementation mode, the device also comprises a damping device, and the microscope, the mechanical arm and the wafer device are placed in the damping device to operate.
As one possible embodiment, the microscope is an atomic force microscope.
The utility model has the advantages that: the utility model provides a wafer roughness automatic check out system, include: a microscope, a robotic arm, and a wafer device; the wafer device is used for storing a plurality of wafers, the microscope is used for detecting the roughness of the surface of the wafer placed on the sample platform, and the mechanical arm is used for sequentially taking out the wafers stored in the wafer device, moving the wafers to the sample platform of the microscope and then moving and storing the wafers which are detected into the wafer device. Through using the utility model discloses an automatic detection system has improved wafer roughness's detection efficiency, has also reduced the contaminated risk of wafer in the transfer process during use.
Drawings
Fig. 1 is a schematic diagram illustrating positions of a microscope, a robot arm, and a wafer device in an automatic detection system for wafer surface roughness according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a sample stage in an automatic detection system for wafer surface roughness according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of positions of ceramic pins and vacuum suction holes in an automatic detection system for wafer surface roughness according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a robot arm in an automatic detection system for wafer surface roughness according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a fixing base in the automatic detection system for wafer surface roughness according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a wafer storage device in an automatic detection system for wafer surface roughness according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment provides a technical scheme: an automatic wafer surface roughness detection system, comprising: a microscope, a robotic arm, and a wafer device; the wafer device is used for storing a plurality of wafers, the microscope is used for detecting the roughness of the surface of the wafer placed on the sample platform, and the mechanical arm is used for sequentially taking out the wafers stored in the wafer device, moving the wafers to the sample platform of the microscope, and moving the wafers which are detected to be stored in the wafer device from the sample platform of the microscope.
The microscope is specifically an atomic force microscope, the automatic detection system for the surface roughness of the wafer of the embodiment further comprises a damping device, and the microscope, the mechanical arm and the wafer device are all placed in the damping device for operation, so that the risk of pollution in the detection process is further reduced, and the stability in the detection process is improved; fig. 1 is a schematic diagram showing a position of the microscope 200, the robot 300, and the wafer apparatus 100 in the damping device 1.
Fig. 4 shows a robot arm, wherein (a) in fig. 4 is a front view of the robot arm, (b) in fig. 4 is a side view of the robot arm, and (c) in fig. 4 is a top view of the robot arm, the robot arm includes a robot base 350, a rotating part 310 disposed above the robot base 350, and a robot 340 disposed above the rotating part 310, the rotating part 310 drives the robot 340 to rotate, so that the robot 340 can move to the wafer device and the sample stage of the microscope, respectively.
The mechanical arm comprises a fixed part 341 and a suction part 342, the fixed part 341 is installed above the rotating part, and the suction part 342 is movably connected with the fixed part 341 and used for entering the wafer device to pick and place the wafer; the suction part 342 is provided with a vacuum suction port 330, and is used for taking out the wafer stored in the wafer device through the vacuum suction port 330 in a vacuum suction manner and moving the wafer to the sample stage of the microscope after the suction part 342 enters the wafer device, and then moving the detected wafer from the sample stage of the microscope to the wafer device through the vacuum suction port 330 of the suction part 342 in a vacuum suction manner.
Fig. 2 shows a sample stage 10 of a microscope, a scanning probe 30 of the microscope is arranged above a surface 20 of the sample stage, the sample stage is provided with a vacuum suction hole 21, and the vacuum suction hole 21 is used for performing vacuum adsorption on a wafer when the wafer is placed in a wafer placing area 22 of the surface 20 of the sample stage, so as to prevent the wafer from sliding down.
As shown in fig. 3, the sample stage is further provided with ceramic pins 24, and the ceramic pins 24 are located around the vacuum suction hole 21; the ceramic pins are used for automatically rising and keeping at a preset height when not contacting the wafer, and automatically descending when contacting the wafer, so that the wafer is attached to the surface 20 of the sample stage.
Specifically, when the detection is started, the ceramic pins 24 ascend, the robot arm takes out the wafer stored in the wafer device and moves and places the wafer on the ceramic pins 24, the ceramic pins 24 descend after contacting the wafer, so that the wafer is attached to the surface 20 of the sample stage, meanwhile, the vacuum suction holes start vacuum suction on the wafer, after the microscope finishes the detection, the ceramic pins 24 ascend, and the robot arm moves and stores the wafer placed on the ceramic pins 24 in the wafer device; and repeating the steps, and taking out other wafers stored in the wafer device in sequence by the mechanical arm for detection.
The wafer device comprises a fixing base and a wafer storage device, wherein the fixing base is used for fixing the wafer storage device, and the wafer storage device is used for storing a plurality of wafers.
Fig. 5 showsbase:Sub>A fixed base, wherein fig. 5 (base:Sub>A) isbase:Sub>A front view of the fixed base, fig. 5 (b) isbase:Sub>A side view of the fixed base, and fig. 5 (c) isbase:Sub>A cross-sectional view of the planebase:Sub>A-base:Sub>A of fig. 5 (base:Sub>A), the fixed base includesbase:Sub>A fixed base 110,base:Sub>A fixed bracket 120 andbase:Sub>A fixed protrusion 140, the fixed protrusion 140 is disposed at the upper middle portion of the fixed base 110, the fixed bracket 120 is disposed above the fixed base 110 and is an enclosing structure enclosing the fixed protrusion, and the fixed bracket 120 is configured to accommodate the wafer storage device therein.
Fig. 6 shows a wafer storage device, wherein (a) in fig. 6 is a front view of the wafer storage device, (b) in fig. 6 is a side view of the wafer storage device, and (c) in fig. 6 is a top view of the wafer storage device, the wafer storage device includes a wafer rack 230, a fixing groove 210 formed at the bottom of the wafer rack 230, and a plurality of vertically-arranged slots 220 formed inside the wafer rack 230, wherein each slot 220 is used for storing one wafer, i.e., when the wafer is placed in the slot, the wafer is vertically placed therein, the fixing groove 210 corresponds to the fixing bump 140, and the fixing base is fixed to the wafer storage device by inserting the fixing bump 140 into the fixing groove 210.
It should be noted that, in order to conveniently pick and place the wafer, as shown in fig. 6, the clamping slot 220 provided in this embodiment is vertically arranged, and the plurality of wafers placed in the clamping slot are opposite to each other, so that the suction portion of the robot arm needs to enter the wafer device to reach the surface of the wafer so as to suck the surface of the wafer to take out the wafer, and after the detection is completed, the wafer is placed in the clamping slot, and then other wafers are sequentially taken out for detection.
The specific operation method using the embodiment is as follows: firstly, opening an atomic force microscope, and lifting ceramic pins on the atomic force microscope; then, the wafer to be tested is sequentially placed into a clamping groove of the wafer device, then the wafer device is fixed on a fixed base, a fixed groove and a fixed bump are matched and embedded with each other, a cover of a damping device is closed, the testing environment is sealed, a suction part of a mechanical arm sequentially obtains the wafer in the wafer device and accurately places the wafer on a ceramic needle head on a sample platform of an atomic force microscope, the ceramic needle head automatically falls down after contacting the wafer, a vacuum suction port starts a vacuum adsorption function, then automatic detection and analysis are carried out by the atomic force microscope, after the detection is finished, the vacuum suction port closes the vacuum adsorption function, a ceramic pin ascends again, the suction part of the mechanical arm puts the tested wafer back to the wafer device, the next wafer is taken out for testing, and the testing process is consistent with that of the previous wafer.
The utility model discloses a roughness of wafer roughness automatic check out system can the wafer of the simultaneous test more quantity, and wherein, concrete quantity is decided according to the quantity of draw-in groove, can trade the wafer automatically simultaneously, has improved efficiency of software testing, has reduced the contaminated risk of wafer in the transfer process to make the test procedure ization, guarantee the unanimity of shipment wafer test parameter.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can use the above-described method and technical contents to make possible changes and modifications to the technical solution of the present invention without departing from the spirit and scope of the present invention, and therefore, any simple modifications, equivalent changes and modifications made to the above embodiments by the technical substance of the present invention do not depart from the technical solution of the present invention, and all belong to the protection scope of the technical solution of the present invention.
Claims (10)
1. An automatic wafer surface roughness detection system, comprising: a microscope, a robotic arm, and a wafer device; the wafer device is used for storing a plurality of wafers, the microscope is used for detecting the roughness of the surface of the wafer placed on the sample platform, the mechanical arm is used for sequentially taking out the wafers stored in the wafer device and moving and placing the wafers on the sample platform of the microscope, and then the wafers which are detected are moved and stored in the wafer device from the sample platform of the microscope.
2. The system of claim 1, wherein the robot arm comprises a robot base, a rotating part disposed above the robot base, and a robot arm disposed above the rotating part, and the rotating part drives the robot arm to rotate, so that the robot arm can move to the wafer device and the sample stage of the microscope, respectively.
3. The automatic wafer surface roughness detection system of claim 2, wherein the robot arm comprises a fixed portion and a suction portion, the fixed portion is mounted above the rotating portion, and the suction portion is movably connected with the fixed portion and used for entering the wafer device to pick and place the wafer; the suction part is provided with a vacuum suction port and is used for taking out the wafer stored in the wafer device in a vacuum suction mode through the vacuum suction port and moving and placing the wafer on a sample table of the microscope after the suction part enters the wafer device, and then the wafer which is detected is moved and stored in the wafer device from the sample table of the microscope in a vacuum suction mode through the vacuum suction port of the suction part.
4. The automatic detection system for the surface roughness of the wafer as claimed in claim 1, wherein the sample stage is provided with a vacuum suction hole, and the vacuum suction hole is used for performing vacuum suction on the wafer when the wafer is placed on the surface of the sample stage, so as to prevent the wafer from sliding down.
5. The automatic detection system for the surface roughness of the wafer as claimed in claim 4, wherein the sample stage is further provided with ceramic pins, the ceramic pins are used for ascending and keeping at a predetermined height when not contacting the wafer, and descending when contacting the wafer, so that the wafer is attached to the surface of the sample stage.
6. The system as claimed in claim 1, wherein the wafer installation includes a fixing base and a wafer storage device, the fixing base is used for fixing the wafer storage device, and the wafer storage device is used for storing a plurality of wafers.
7. The automatic detection system for wafer surface roughness as claimed in claim 6, wherein the fixing base comprises a fixing base and a fixing bump, the fixing bump is disposed above the fixing base; the wafer storage device comprises a wafer rack, fixing grooves formed in the bottom of the wafer rack and a plurality of vertically-arranged clamping grooves formed in the wafer rack, wherein each clamping groove is used for storing a wafer, the fixing grooves correspond to the fixing bumps, and the fixing base is fixed with the wafer storage device by embedding the fixing bumps into the fixing grooves.
8. The system as claimed in claim 7, wherein the mounting base further includes a mounting bracket, the mounting bracket is disposed above the mounting base and is an enclosure surrounding the mounting bumps, and the mounting bracket is configured to receive the wafer storage device therein.
9. The automatic detection system for wafer surface roughness as claimed in claim 1, further comprising a shock absorbing device, wherein the microscope, the robot arm and the wafer device are all placed in the shock absorbing device for operation.
10. The automatic wafer surface roughness detection system of claim 1, wherein the microscope is an atomic force microscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221469959.6U CN217637243U (en) | 2022-06-13 | 2022-06-13 | Automatic detection system for surface roughness of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221469959.6U CN217637243U (en) | 2022-06-13 | 2022-06-13 | Automatic detection system for surface roughness of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217637243U true CN217637243U (en) | 2022-10-21 |
Family
ID=83624191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221469959.6U Active CN217637243U (en) | 2022-06-13 | 2022-06-13 | Automatic detection system for surface roughness of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217637243U (en) |
-
2022
- 2022-06-13 CN CN202221469959.6U patent/CN217637243U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7135883B2 (en) | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | |
| JP6515007B2 (en) | Wafer inspection method and wafer inspection apparatus | |
| US6164894A (en) | Method and apparatus for integrated wafer handling and testing | |
| US4818169A (en) | Automated wafer inspection system | |
| US6249342B1 (en) | Method and apparatus for handling and testing wafers | |
| CN113658898A (en) | Automatic wafer feeding device and feeding detection method | |
| TW200935535A (en) | Probe device and probe method | |
| KR100878211B1 (en) | Probe station, and testing method of wafer using the same | |
| CN217637243U (en) | Automatic detection system for surface roughness of wafer | |
| CN115274483A (en) | Wafer electrical property detection equipment | |
| CN115274484A (en) | Wafer detection device and detection method thereof | |
| JP3344545B2 (en) | Structure of rotary arm device chuck part of handler | |
| CN216487998U (en) | Bonding strength detection device and detection platform | |
| CN115372672A (en) | Workbench of probe device, control method and probe testing method | |
| CN115632016A (en) | Wafer detection system and method | |
| CN205067532U (en) | Probe station | |
| US20030154002A1 (en) | Method and apparatus for aligning a cassette handler | |
| US20050105351A1 (en) | Ic transfer device | |
| JP2652711B2 (en) | Semiconductor inspection apparatus and inspection method | |
| CN219142615U (en) | Wafer inspection apparatus | |
| CN220323158U (en) | Automatic tester for flip-chip bonding of camera chip | |
| JPH05343500A (en) | Wafer transferring apparatus and probe device | |
| CN221078509U (en) | Wafer surface detection device and wafer detection equipment thereof | |
| CN220323467U (en) | Wafer defect detection equipment | |
| CN216646581U (en) | Manual probe test workbench |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |