CN115011953A - 一种复杂结构自适应的可焊接柔性金属垫片及其制备方法 - Google Patents
一种复杂结构自适应的可焊接柔性金属垫片及其制备方法 Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 95
- 239000002184 metal Substances 0.000 title claims abstract description 95
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000004964 aerogel Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000872 buffer Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 16
- 230000003044 adaptive effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000006722 reduction reaction Methods 0.000 claims description 9
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
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- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 108010010803 Gelatin Proteins 0.000 claims description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- JBQDKODJUQXMPD-UHFFFAOYSA-N [Au+3].[O-]Cl.[O-]Cl.[O-]Cl Chemical compound [Au+3].[O-]Cl.[O-]Cl.[O-]Cl JBQDKODJUQXMPD-UHFFFAOYSA-N 0.000 claims description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 230000005674 electromagnetic induction Effects 0.000 claims description 3
- 230000005284 excitation Effects 0.000 claims description 3
- 239000011790 ferrous sulphate Substances 0.000 claims description 3
- 235000003891 ferrous sulphate Nutrition 0.000 claims description 3
- 229920000159 gelatin Polymers 0.000 claims description 3
- 239000008273 gelatin Substances 0.000 claims description 3
- 235000019322 gelatine Nutrition 0.000 claims description 3
- 235000011852 gelatine desserts Nutrition 0.000 claims description 3
- 239000000411 inducer Substances 0.000 claims description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 3
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims description 3
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims 1
- 230000006978 adaptation Effects 0.000 claims 1
- 235000010338 boric acid Nutrition 0.000 claims 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 18
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 9
- 239000002131 composite material Substances 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 3
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- LXAHHHIGZXPRKQ-UHFFFAOYSA-N 5-fluoro-2-methylpyridine Chemical compound CC1=CC=C(F)C=N1 LXAHHHIGZXPRKQ-UHFFFAOYSA-N 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B1/00—Devices for securing together, or preventing relative movement between, constructional elements or machine parts
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Abstract
本发明提供了一种复杂结构自适应的可焊接柔性金属垫片,包括两层结构,第一层为金属垫片结构,作为缓冲层材料或提供可焊接界面,第二层为金属气凝胶结构,作为焊料层。本发明还提供了一种复杂结构自适应的可焊接柔性金属垫片的制备方法。本发明的有益效果是:一方面,可以对表面起伏结构进行有效的自适应变形,保证焊接接头的紧密接触与连接;另一方面,可以作为异种材料连接的界面缓冲材料,降低接头的机械应力,有效提高服役可靠性。
Description
技术领域
本发明涉及可焊接柔性金属垫片,尤其涉及一种复杂结构自适应的可焊接柔性金属垫片及其制备方法。
背景技术
在新能源、航空航天、国防军工、微电子领域,存在大量应用于复杂结构表面的焊接或连接需求。复杂结构体现在两方面,一是不规则形状尺寸,如应用于导弹头、航天器外壳、电池极耳方面,被焊接面为曲面、凹面或复杂立体结构。这为焊接或连接带来了极大的困难,传统的固相连接方法难以对起伏表面进行有效填充,而液相的钎料连接又难以满足焊接接头的导热、机械性能需求。另一方面是异种材料连接,如铜-铝、铜-硅、铝-硅等,由于材料性能各异,导致连接接头存在较大的热机械应力,对长期服役造成较大的风险。
发明内容
为了解决现有技术中的问题,本发明提供了一种复杂结构自适应的可焊接柔性金属垫片及其制备方法。
本发明提供了一种复杂结构自适应的可焊接柔性金属垫片,包括两层结构,第一层为金属垫片结构,作为缓冲层材料或提供可焊接界面,第二层为金属气凝胶结构,作为焊料层。
作为本发明的进一步改进,所述金属气凝胶结构为由不规则孔洞构成的蜂窝状结构。
本发明还提供了一种复杂结构自适应的可焊接柔性金属垫片的制备方法,用于制备所述的复杂结构自适应的可焊接柔性金属垫片。
作为本发明的进一步改进,所述制备方法包括以下步骤:
S1、在金属垫片的表面制作模板或晶种;
S2、在金属垫片的表面的模板或晶种上进行金属气凝胶的制备;
S3、对附着金属气凝胶的金属垫片进行后处理,获得可焊接柔性金属垫片。
作为本发明的进一步改进,所述步骤S1中金属垫片为铜、银、镍、钼、铝、金、锌、钴、钽、钯、钛中的任意一种或其中任意组合所组成的合金。
作为本发明的进一步改进,所述步骤S1中金属垫片的厚度为20μm -200μm。
作为本发明的进一步改进,所述步骤S1中金属垫片表面的模板为氧化铝AAO模板、碳模板或金属模板;模板的孔径为50 nm -500 nm,孔间距为60nm-500nm,孔深为20μm-200μm。
作为本发明的进一步改进,所述步骤S1中金属垫片表面的晶种通过磁控溅射或化学镀的方式进行制备;晶种的元素包括银、铜、镍、金中的任意一种或其任意组合所组成的合金;晶种的粒径为20nm-100nm。
作为本发明的进一步改进,所述步骤S2中金属气凝胶的制备方法为化学液相还原法。
作为本发明的进一步改进,所述化学液相还原法的金属盐前驱体为硝酸银,硫酸铜,氯化镍,次氯酸金中的一种或几种,还原溶剂为乙二醇、二甘醇、丙二醇、丙三醇、聚乙二醇中的一种,还原剂为硼氢化钠、硫酸亚铁、次亚磷酸钠、柠檬酸钠其中的一种,定向生长诱导剂为氯化铁、氯化钠、氯化钾中的一种,缓冲剂为EDTA二钠、硼酸、明胶中的一种;还原反应的温度为80℃-150 ℃,反应时间为10min-60min。
作为本发明的进一步改进,所述步骤S3中的后处理工艺为超声激励、白光照射、UV照射、鼓风加热、热压成形、电磁感应加热其中的一种。
本发明的有益效果是:通过上述方案,一方面,可以对表面起伏结构进行有效的自适应变形,保证焊接接头的紧密接触与连接;另一方面,可以作为异种材料连接的界面缓冲材料,降低接头的机械应力,有效提高服役可靠性。
附图说明
为了更清楚地说明本发明实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的方案。
图1是本发明一种复杂结构自适应的可焊接柔性金属垫片的示意图。
图2是本发明一种复杂结构自适应的可焊接柔性金属垫片用于异种材料焊接示意图。
图3是本发明一种复杂结构自适应的可焊接柔性金属垫片用于复杂形状焊接示意图。
图4是本发明一种复杂结构自适应的可焊接柔性金属垫片切片的扫描电子显微镜图。
图5是本发明一种复杂结构自适应的可焊接柔性金属垫片的制作流程图。
具体实施方式
需要说明的是,在不冲突的情况下,本发明中的实施例及实施例中的特征可以相互组合。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明保护范围的限制。此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以通过具体情况理解上述术语在本发明中的具体含义。
下面结合附图说明及具体实施方式对本发明作进一步说明。
术语说明如下:
复杂结构自适应:意为垫片可以根据被焊接基板/芯片等对象的高度起伏结构进行变形并匹配相关结构,完成紧密的贴合与焊接。
可焊接:意为通过熔化钎焊、固相扩散、固相烧结等方式完成垫片与被焊接基板/芯片表面的冶金连接和紧固接合。
如图1所示,一种复杂结构自适应的可焊接柔性金属垫片,包含金属垫片结构1和金属气凝胶结构2两层结构,金属垫片结构1作为缓冲层材料或提供可焊接界面;金属气凝胶结构2作为焊料层。金属垫片结构1和金属气凝胶结构2均具备可自适应变形的能力。
如图2所示,可焊接柔性金属垫片可以通过金属气凝胶结构2与物体5形成连接,构成焊接接头,金属垫片结构1可以与物体4进行连接,完成物体4和物体5的异质材料间的焊接或连接。
如图3所示,金属垫片结构1和金属气凝胶结构2所形成的复合结构,可以通过自适应变形有效填充复杂形状结构物体3的起伏表面,完成对复杂形状结构物体3的焊接或连接。
本发明提供了一种柔性金属垫片与金属气凝胶的复合结构,其中金属垫片结构1可以作为缓冲层缓解焊点的机械应力,亦可作为焊接界面进行与其他异种材料的连接,如图2。
如图5所示,一种复杂结构自适应的可焊接柔性金属垫片的制备方法,包括以下步骤:
S1:在金属垫片的表面制作模板或晶种;
S2: 在金属垫片表面模板或晶种上进行金属气凝胶的制备;
S3: 对附着金属气凝胶的金属垫片进行后处理,获得可焊接金属垫片结构。
所述步骤S1中金属垫片可以为铜、银、镍、钼、铝、金、锌、钴、钽、钯、钛或其中元素组成的合金,如铜铝合金、银铜合金、铜锌合金等。
所述步骤S1中金属垫片的厚度为20-200μm。
所述步骤S1中金属垫片表面的模板可以为氧化铝AAO模板、碳模板或金属模板,包括但不限于镁、铝、锌等金属;模板的孔径为50-500nm,孔间距为60-500nm,孔深为20-200μm。
所述步骤S1中金属垫片表面的晶种可以通过磁控溅射、化学镀的方式进行制备;晶种的元素包括银、铜、镍、金或其组成的合金;晶种的粒径为20-100nm。
所述步骤S2中金属气凝胶的制备方法为化学液相还原法;进一步的,化学液相还原的金属盐前驱体为硝酸银,硫酸铜,氯化镍,次氯酸金中的一种或几种,还原溶剂为乙二醇、二甘醇、丙二醇、丙三醇、聚乙二醇中的一种,还原剂为硼氢化钠、硫酸亚铁、次亚磷酸钠、柠檬酸钠其中的一种,定向生长诱导剂为氯化铁、氯化钠、氯化钾中的一种,缓冲剂为EDTA二钠、硼酸、明胶中的一种;还原反应的温度80-150℃,反应时间为10-60 min。
所述步骤S3中的后处理工艺为超声激励、白光照射、UV照射、鼓风加热、热压成形、电磁感应加热其中的一种。以鼓风加热为例,优选的加热温度是80-150 ℃,时间为20-100min。
本发明提供的制备方法,以金属垫片为衬底,使用模板法或晶种法进行气凝胶生长制备,提供了气凝胶的反应原料和反应条件,可以形成由不规则孔洞构成的蜂窝状结构的金属气凝胶结构2,见图4,可以较好的实现结构自适应焊接,以及,以金属垫片作为缓冲结构,构建双层复合结构的柔性垫片,降低焊接接头的机械应力,并提供新的焊接界面。
本发明提供的一种复杂结构自适应的可焊接柔性金属垫片及其制备方法,具有以下优点:
1、可焊接柔性金属垫片中的垫片与金属气凝胶结构均具有自适应变形的特点,可以适配复杂形状结构的焊接与连接;
2、气凝胶结构经低温成形的后处理,保留焊接活性;
3、金属垫片-气凝胶的复合结构可以作为异质材料连接的中间层,保持良好焊接性能的同时可提供缓冲异质材料间机械应力的作用。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。
Claims (10)
1.一种复杂结构自适应的可焊接柔性金属垫片,其特征在于:包括两层结构,第一层为金属垫片结构,作为缓冲层材料或提供可焊接界面,第二层为金属气凝胶结构,作为焊料层。
2.根据权利要求1所述的复杂结构自适应的可焊接柔性金属垫片,其特征在于:所述金属气凝胶结构为由不规则孔洞构成的蜂窝状结构。
3.一种复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:用于制备如权利要求1或2所述的复杂结构自适应的可焊接柔性金属垫片。
4.根据权利要求3所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述制备方法包括以下步骤:
S1、在金属垫片的表面制作模板或晶种;
S2、在金属垫片的表面的模板或晶种上进行金属气凝胶的制备;
S3、对附着金属气凝胶的金属垫片进行后处理,获得可焊接柔性金属垫片。
5.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S1中金属垫片为铜、银、镍、钼、铝、金、锌、钴、钽、钯、钛中的任意一种或其中任意组合所组成的合金。
6.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S1中金属垫片的厚度为20μm-200μm。
7.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S1中金属垫片表面的模板为氧化铝AAO模板、碳模板或金属模板;模板的孔径为50nm-500nm,孔间距为60nm-500nm,孔深为20μm-200μm。
8.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S1中金属垫片表面的晶种通过磁控溅射或化学镀的方式进行制备;晶种的元素包括银、铜、镍、金中的任意一种或其任意组合所组成的合金;晶种的粒径为20nm-100nm。
9.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S2中金属气凝胶的制备方法为化学液相还原法,所述化学液相还原法的金属盐前驱体为硝酸银,硫酸铜,氯化镍,次氯酸金中的一种或几种,还原溶剂为乙二醇、二甘醇、丙二醇、丙三醇、聚乙二醇中的一种,还原剂为硼氢化钠、硫酸亚铁、次亚磷酸钠、柠檬酸钠其中的一种,定向生长诱导剂为氯化铁、氯化钠、氯化钾中的一种,缓冲剂为EDTA二钠、硼酸、明胶中的一种;还原反应的温度为80℃-150 ℃,反应时间为10min-60min。
10.根据权利要求4所述的复杂结构自适应的可焊接柔性金属垫片的制备方法,其特征在于:所述步骤S3中的后处理工艺为超声激励、白光照射、UV照射、鼓风加热、热压成形、电磁感应加热其中的一种。
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Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES278463A1 (es) * | 1961-06-21 | 1962-08-16 | Philips Nv | Método para unir localmente partes metálicas entre sí |
DE3315062A1 (de) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | Verfahren zur abscheidung von lot auf aluminiummetallmaterial |
JPS59185771A (ja) * | 1983-04-07 | 1984-10-22 | Satoosen:Kk | めつき方法 |
DE4326206A1 (de) * | 1992-08-05 | 1994-02-10 | Murata Manufacturing Co | Stromloses Lötmittel-Metallisierungsbad |
EP0930647A1 (en) * | 1998-01-20 | 1999-07-21 | International Business Machines Corporation | Method to selectively fill recesses with conductive metal |
US6117784A (en) * | 1997-11-12 | 2000-09-12 | International Business Machines Corporation | Process for integrated circuit wiring |
US6436816B1 (en) * | 1998-07-31 | 2002-08-20 | Industrial Technology Research Institute | Method of electroless plating copper on nitride barrier |
US20030194494A1 (en) * | 2002-04-12 | 2003-10-16 | Ritek Corporation | Method for forming soldering layer of fiber arrays |
CN1928156A (zh) * | 2005-09-05 | 2007-03-14 | 李克清 | 镁及其合金的化学镀方法 |
CN101082126A (zh) * | 2007-07-10 | 2007-12-05 | 东莞市通旺达五金制品有限公司 | 一种铝散热器内孔局部化学镀工艺 |
CN102605359A (zh) * | 2011-01-25 | 2012-07-25 | 台湾上村股份有限公司 | 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺 |
CN103732793A (zh) * | 2011-08-08 | 2014-04-16 | 泰科电子Amp有限责任公司 | 改善两接触元件间电连接的过渡阻抗的方法和两接触元件间具有电连接的部件 |
US20150287898A1 (en) * | 2012-12-05 | 2015-10-08 | Atotech Deutschland Gmbh | Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes |
CN105551956A (zh) * | 2015-12-29 | 2016-05-04 | 中国电子科技集团公司第五十五研究所 | 用于半导体背面通孔金属化种子层的化学镀钯方法 |
CN105593404A (zh) * | 2011-11-22 | 2016-05-18 | 麦克德米德尖端有限公司 | 处理金属表面的方法 |
CN106894003A (zh) * | 2016-12-30 | 2017-06-27 | 广东致卓环保科技有限公司 | 镍基材上无氰化学镀厚金方法及镀液配制方法 |
-
2022
- 2022-06-21 CN CN202210704251.2A patent/CN115011953A/zh active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES278463A1 (es) * | 1961-06-21 | 1962-08-16 | Philips Nv | Método para unir localmente partes metálicas entre sí |
DE3315062A1 (de) * | 1982-04-26 | 1983-10-27 | Mitsubishi Denki K.K., Tokyo | Verfahren zur abscheidung von lot auf aluminiummetallmaterial |
JPS59185771A (ja) * | 1983-04-07 | 1984-10-22 | Satoosen:Kk | めつき方法 |
DE4326206A1 (de) * | 1992-08-05 | 1994-02-10 | Murata Manufacturing Co | Stromloses Lötmittel-Metallisierungsbad |
US6117784A (en) * | 1997-11-12 | 2000-09-12 | International Business Machines Corporation | Process for integrated circuit wiring |
EP0930647A1 (en) * | 1998-01-20 | 1999-07-21 | International Business Machines Corporation | Method to selectively fill recesses with conductive metal |
US6436816B1 (en) * | 1998-07-31 | 2002-08-20 | Industrial Technology Research Institute | Method of electroless plating copper on nitride barrier |
US20030194494A1 (en) * | 2002-04-12 | 2003-10-16 | Ritek Corporation | Method for forming soldering layer of fiber arrays |
CN1928156A (zh) * | 2005-09-05 | 2007-03-14 | 李克清 | 镁及其合金的化学镀方法 |
CN101082126A (zh) * | 2007-07-10 | 2007-12-05 | 东莞市通旺达五金制品有限公司 | 一种铝散热器内孔局部化学镀工艺 |
CN102605359A (zh) * | 2011-01-25 | 2012-07-25 | 台湾上村股份有限公司 | 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺 |
CN103732793A (zh) * | 2011-08-08 | 2014-04-16 | 泰科电子Amp有限责任公司 | 改善两接触元件间电连接的过渡阻抗的方法和两接触元件间具有电连接的部件 |
CN105593404A (zh) * | 2011-11-22 | 2016-05-18 | 麦克德米德尖端有限公司 | 处理金属表面的方法 |
US20150287898A1 (en) * | 2012-12-05 | 2015-10-08 | Atotech Deutschland Gmbh | Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes |
CN105551956A (zh) * | 2015-12-29 | 2016-05-04 | 中国电子科技集团公司第五十五研究所 | 用于半导体背面通孔金属化种子层的化学镀钯方法 |
CN106894003A (zh) * | 2016-12-30 | 2017-06-27 | 广东致卓环保科技有限公司 | 镍基材上无氰化学镀厚金方法及镀液配制方法 |
Non-Patent Citations (2)
Title |
---|
XIAOWEI ZHOU等: "Electroless Ni–P alloys on nanoporous ATO surface of Ti substrate", 《J. MATER. SCI.》, vol. 53, pages 2812 - 2829, XP036380290, DOI: 10.1007/s10853-017-1686-1 * |
ZILIANG HAO等: "Preparation of direct plated copper ceramic spreader using electroless copper as seed layer", 《2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY》, pages 292 - 295 * |
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