CN115007855A - 一种银包镍铝粉复合物及其制备方法和应用 - Google Patents
一种银包镍铝粉复合物及其制备方法和应用 Download PDFInfo
- Publication number
- CN115007855A CN115007855A CN202210615324.0A CN202210615324A CN115007855A CN 115007855 A CN115007855 A CN 115007855A CN 202210615324 A CN202210615324 A CN 202210615324A CN 115007855 A CN115007855 A CN 115007855A
- Authority
- CN
- China
- Prior art keywords
- nickel
- silver
- aluminum powder
- solution
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 104
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 239000004332 silver Substances 0.000 title claims abstract description 100
- 239000000843 powder Substances 0.000 title claims abstract description 74
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 150000001875 compounds Chemical class 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 164
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 81
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000002131 composite material Substances 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 75
- 239000000243 solution Substances 0.000 claims description 74
- 238000003756 stirring Methods 0.000 claims description 57
- 238000007747 plating Methods 0.000 claims description 51
- 239000007864 aqueous solution Substances 0.000 claims description 44
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 35
- 230000009467 reduction Effects 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 28
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 24
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 22
- 238000001035 drying Methods 0.000 claims description 21
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 14
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 13
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 13
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 12
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 12
- 235000002906 tartaric acid Nutrition 0.000 claims description 12
- 239000011975 tartaric acid Substances 0.000 claims description 12
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 11
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 11
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 11
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 11
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical group N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 claims description 11
- 239000008103 glucose Substances 0.000 claims description 11
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 8
- 239000004094 surface-active agent Substances 0.000 claims description 8
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical group S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000001509 sodium citrate Substances 0.000 claims description 7
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 6
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 4
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 claims description 3
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- 150000004673 fluoride salts Chemical group 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- 239000011775 sodium fluoride Substances 0.000 claims description 2
- 235000013024 sodium fluoride Nutrition 0.000 claims description 2
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000005260 corrosion Methods 0.000 abstract description 14
- 230000007797 corrosion Effects 0.000 abstract description 14
- 150000003839 salts Chemical class 0.000 abstract description 10
- 239000007921 spray Substances 0.000 abstract description 10
- 238000012360 testing method Methods 0.000 abstract description 7
- 238000002474 experimental method Methods 0.000 abstract description 5
- 241001089723 Metaphycus omega Species 0.000 abstract description 4
- 239000008367 deionised water Substances 0.000 description 38
- 229910021641 deionized water Inorganic materials 0.000 description 38
- 238000006722 reduction reaction Methods 0.000 description 19
- 238000004090 dissolution Methods 0.000 description 16
- 238000005406 washing Methods 0.000 description 11
- 239000011259 mixed solution Substances 0.000 description 10
- 238000005303 weighing Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000006228 supernatant Substances 0.000 description 8
- 238000002604 ultrasonography Methods 0.000 description 8
- 238000012512 characterization method Methods 0.000 description 6
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010907 mechanical stirring Methods 0.000 description 4
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 4
- 229940074439 potassium sodium tartrate Drugs 0.000 description 4
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- -1 aluminum silver Chemical compound 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
本申请公开了一种银包镍铝粉复合物及其制备方法和应用,包括铝粉、包覆于铝粉表面的纳米镍层和包覆于纳米镍层表面的银层;粒度为0.1~300μm;铝、镍、银物质的量之比为1:0.1~0.4:0.1~0.2。该复合材料兼具银的导电性、镍的耐腐蚀性和铝密度小、塑性好等优势,具有优异的导电性和耐腐蚀性。电阻率为1.58mΩ·cm,盐雾试验后电阻率为1.68mΩ·cm。盐雾实验前后电阻率相差不大,证明该银包镍铝粉具有优异的导电性和耐腐蚀性;制备方法制备简单、操作方便。
Description
技术领域
本申请涉及一种银包镍铝粉复合物及其制备方法和应用,属于导电填料技术领域。
背景技术
金属银具有导电性好、抗氧化性强等优点,在电磁屏蔽领域、光学领域、催化领域、电子器件领域都具有广泛的应用。但银也具有价格昂贵,易迁移,密度较大等缺点。因此,为了使其他材料兼具银的优点,科研人员通常采用银包覆的方法,使材料具有银的性能并且降低成本。目前研究较多的主要有银包铜粉、银包镍、银包铝、银包玻璃微珠、银包石墨等。其中,金属铝具有密度小、塑性好以及价格低廉等优点被广泛地应用在电子、航空及电磁屏蔽等领域。但铝粉表面活性大,不稳定,容易在空气中发生氧化还原反应,以致于失去其本身的优点。
发明内容
金属镍具有很强的钝化能力,在表面能迅速生成一层极薄的钝化膜,能抵抗大气、碱和某些酸的腐蚀。为了使所制备的材料具有价格低廉、耐腐蚀、导电性能优异的优点,所以我们先对铝粉化学镀镍再进行镀银。所制备的银包铝镍粉电阻率为1.58mΩ·cm,盐雾试验后电阻率为1.68mΩ·cm。盐雾实验前后电阻率相差不大,证明该银包镍铝粉具有优异的导电性和耐腐蚀性。
本申请提供了一种银包镍铝粉复合物,所述银包镍铝粉复合物最内层为铝粉,中间层是镍,最外层是银。
根据本申请的一个方面,提供一种银包镍铝粉复合物,所述银包镍铝粉复合物包括铝粉、包覆于铝粉表面的纳米镍层和包覆于纳米镍层表面的银层;
所述银包镍铝粉复合物的粒度为0.1~300μm;所述银包镍铝粉复合物的粒度上限为300μm、250μm、200μm、150μm、100μm、50μm、25μm、10μm、1μm;下限为0.1μm、1μm、10μm、25μm、50μm、100μm、150μm、200μm、250μm;
所述银包镍铝粉复合物中,铝、镍、银物质的量之比为1:0.1~0.4:0.1~0.2。
可选地,所述银包镍铝粉复合物中,铝、镍、银物质的量之比为1:0.4:0.1~0.2
可选地,所述银包镍铝粉复合物中,铝、镍、银物质的量之比为1:0.4:0.15。
所述铝粉为球形;
所述铝粉的粒度是0.1~200μm;所述铝粉的粒度上限为200μm、150μm、100μm、50μm、25μm、10μm、1μm;下限为0.1μm、1μm、10μm、25μm、50μm、100μm、150μm。
根据本申请的另一个方面,提供一种上所述的银包镍铝粉复合物的制备方法,包括以下步骤:
将含有铝粉的原料依次经过置换镀镍、还原镀镍和还原镀银,得到所述银包镍铝粉复合物。
将含有铝粉的原料置换镀镍、还原镀镍后再进行还原镀银,得到所述银包镍铝粉复合物。
所述置换镀镍的过程包括:
将含有铝粉的原料与镍源水溶液I、酒石酸水溶液I和加速剂水溶液混合,得到混合物料;
所述还原镀镍的过程包括:
将所述混合物料与镍源水溶液II、柠檬酸钠水溶液、次磷酸钠水溶液、表面活性剂水溶液和硫酸铵水溶液混合,加入氨水调节pH为9~12,烘干I,得到镍铝粉;
所述还原镀银的过程包括:
将所述镍铝粉与葡萄糖水溶液、酒石酸水溶液II混合,滴加银源溶液,烘干II,得到所述银包镍铝粉复合物。
所述镍源水溶液I或镍源水溶液II中的镍源选自硝酸镍、氯化镍或硫酸镍中的至少一种;
所述加速剂选自氟化物;
可选地,所述加速剂选自氟化铵和/或氟化钠;
在所述置换镀镍的过程中,以1g铝粉为基准,各物质的用量为:
浓度为10~30g/L的镍源水溶液I20~80ml;以镍元素的质量计;镍源水溶液I浓度上限为30g/L、25g/L、20g/L、15g/L;下限为10g/L、15g/L、20g/L、25g/L;镍源水溶液I体积上限为80ml、75ml、70ml、65ml、60ml、55ml、50ml、45ml、40ml、35ml、30ml、25ml;下限为20ml、25ml、30ml、35ml、40ml、45ml、50ml、55ml、60ml、65ml、70ml、75ml;
浓度为5~20g/L的酒石酸水溶液I30~70ml;酒石酸水溶液I浓度上限为20g/L、15g/L、10g/L;下限为5g/L、10g/L、15g/L;酒石酸水溶液I体积上限为70ml、65ml、60ml、55ml、50ml、45ml、40ml、35ml;下限为30ml、35ml、40ml、45ml、50ml、55ml、60ml、65ml;
浓度为10~30g/L的加速剂水溶液20~50ml;加速剂水溶液浓度上限为30g/L、25g/L、20g/L、15g/L;下限为10g/L、15g/L、20g/L、25g/L;加速剂水溶液体积上限为50ml、45ml、40ml、35ml、30ml、25ml;下限为20ml、25ml、30ml、35ml、40ml、45ml;
所述置换镀镍的温度为30~60℃;置换镀镍的温度上限为60℃、50℃、40℃;下限为30℃、40℃、50℃;
所述置换镀镍的时间为1~30min;
可选地,所述置换镀镍的时间为10~20min;置换镀镍的时间上限为20min、15min;下限为10min、15min;
可选地,所述铝粉在进行置换镀镍前经过碱处理;
所述碱处理采用氢氧化钠水溶液;
所述氢氧化钠水溶液的浓度为1~10g/L;氢氧化钠水溶液的浓度上限为10g/L、9g/L、8g/L、7g/L、6g/L、5g/L、4g/L、3g/L、2g/L;下限为1g/L、2g/L、3g/L、4g/L、5g/L、6g/L、7g/L、8g/L、9g/L;
所述碱处理的时间为3~6min;所述碱处理的时间上限为6min、5min、4min;下限为3min、4min、5min;。
所述表面活性剂选自十二烷基磺酸钠、十二烷基苯磺酸钠或十六烷基三甲基溴化铵中的至少一种;
在所述还原镀镍的过程中,以1g铝粉为基准,各物质的用量为:
浓度为100~200g/L的镍源水溶液II5~40ml;以镍元素的质量计;镍源水溶液II浓度上限为200g/L、190g/L、180g/L、170g/L、160g/L、150g/L、140g/L、130g/L、120g/L、110g/L;下限为100g/L、110g/L、120g/L、130g/L、140g/L、150g/L、160g/L、170g/L、180g/L、190g/L;镍源水溶液II体积上限为40ml、35ml、30ml、25ml、20ml、15ml、10ml;下限为5ml、10ml、15ml、20ml、25ml、30ml、35ml;
浓度为200~500g/L的柠檬酸钠水溶液10~30ml;柠檬酸钠水溶液浓度上限为500g/L、450g/L、400g/L、350g/L、300g/L、250g/L;下限为200g/L、250g/L、300g/L、350g/L、400g/L、450g/L;柠檬酸钠水溶液体积上限为30ml、25ml、20ml、15ml;下限为10ml、15ml、20ml、25ml;
浓度为160~200g/L的次磷酸钠水溶液10~20ml;次磷酸钠水溶液浓度上限为200g/L、190g/L、180g/L、170g/L;次磷酸钠水溶液下限为160g/L、170g/L、180g/L、190g/L;体积上限为20ml、15ml;下限为10ml、15ml;
浓度为5~10g/L的表面活性剂水溶液5~20ml;表面活性剂水溶液浓度上限为10g/L、9g/L、8g/L、7g/L、6g/L;下限为5g/L、6g/L、7g/L、8g/L、9g/L;表面活性剂水溶液体积上限为50ml、15ml、10ml;下限为5ml、10ml、15ml;
浓度为100~300g/L的硫酸铵水溶液10~20ml;硫酸铵水溶液浓度上限为300g/L、250g/L、200g/L、150g/L;下限为100g/L、150g/L、200g/L、250g/L;硫酸铵水溶液体积上限为20ml、15ml;下限为10ml、15ml;
所述氨水的浓度为1~28g/L;所述氨水的浓度上限为28g/L、25g/L、20g/L、15g/L、10g/L、5g/L;下限为1g/L、5g/L、10g/L、15g/L、20g/L、25g/L;
所述还原镀镍的温度为30~60℃;所述还原镀镍的温度上限为60℃、55℃、50℃、45℃、40℃、35℃;下限为30℃、35℃、40℃、45℃、50℃、55℃;
所述还原镀镍的时间为1~8h;
可选地,所述还原镀镍的时间为4~6h;所述还原镀镍的时间上限为6h、5h;下限为4h、5h;
所述烘干I的温度为40~80℃;烘干I的温度上限为80℃、70℃、60℃、50℃;下限为40℃、50℃、60℃、70℃;
所述烘干I的时间为4~8h;所述烘干I的时间上限为8h、7h、6h、5h;下限为4h、5h、6h、7h;
所述银源选自银氨溶液或/和硝酸银;
在所述还原镀银的过程中,以1g铝粉为基准,各物质的用量为:
浓度为10~30g/L的葡萄糖水溶液10~40ml;葡萄糖水溶液浓度上限为为30g/L、25g/L、20g/L、15g/L;下限为10g/L、15g/L、20g/L、25g/L;葡萄糖水溶液体积上限为40ml、35ml、30ml、25ml、20ml、15ml;下限为10ml、15ml、20ml、25ml、30ml、35ml;
浓度为5~30g/L的酒石酸水溶液II10~40ml;酒石酸水溶液浓度上限为30g/L、25g/L、20g/L、15g/L、10g/L;下限为5g/L、10g/L、15g/L、20g/L、25g/L;酒石酸水溶液体积上限为40ml、30ml、20ml;下限为10ml、20ml、30ml;
浓度为5~20g/L的银源溶液5~20ml;以银元素的质量计;银源溶液浓度上限为为20g/L、15g/L、10g/L;下限为5g/L、10g/L、15g/L;银源溶液体积上限为20ml、15ml、10ml;下限为5ml、10ml、15ml;
所述还原镀银的温度为30~60℃;所述还原镀银的温度上限为60℃、50℃、40℃;下限为30℃、40℃、50℃;
所述还原镀银的时间为0.5~2h;
可选地,所述还原镀银的时间为1~2h;所述还原镀银的时间上限为2h、1.5h;下限为1h、1.5h;。
所述烘干II的温度为40~80℃;所述烘干II的温度上限为80℃、70℃、60℃、50℃;下限为40℃、50℃、60℃、70℃;
所述烘干II的时间为4~8h。所述烘干II的时间上限为8h、7h、6h、5h;下限为4h、5h、6h、7h;
所述置换镀镍和还原镀镍的混合过程始终搅拌I;
所述搅拌I的温度为30~60℃;
可选地,所述搅拌I的温度为40℃;
所述搅拌I的时间为1~30min;
可选地,所述搅拌I的时间为10min;
所述还原镀银的混合过程始终搅拌II;
所述搅拌II的温度为30~60℃;
可选地,所述搅拌II的温度为40℃;
所述搅拌II的时间为1~6h;
可选地,所述搅拌II的时间为2h。
本申请的一个方面,采用化学镀法,先在铝粉表面还原镀镍再还原镀银,该方法得到的银包镍铝粉导电性和耐腐蚀性优良,在导电填料领域,比铝镀银粉更具有实际应用的前途。
所述方法包括:
步骤一,铝粉先放入1g/L的氢氧化钠溶液中,搅拌5min,有大量气泡产生,加大量水稀释,洗涤过滤至中性。再将20g/L硫酸镍和10g/L酒石酸混合溶液加入铝粉中,再加入20g/L氟化铵溶液,40℃加热搅拌10min。步骤二,待上述溶液反应10min后,溶液无色,加入180g/L的硫酸镍、300g/L的柠檬酸钠、180g/L的次磷酸钠、6g/L的十二烷基磺酸钠,250g/L的硫酸铵和适量的氨水,40℃加热搅拌4h,去离子水洗涤,60℃真空烘箱烘干。步骤三,取上述银镍粉放置于27g/L葡萄糖和30g/L酒石酸混合溶液中,40℃加热搅拌,搅拌中缓慢滴加银氨溶液40℃加热搅拌2h,去离子水洗涤3次,60℃真空烘箱烘干。
根据本申请的另一个方面,提供一种上述的银包镍铝粉复合物或上述的制备方法制备的银包镍铝粉复合物的应用,用于导电填料。
本申请能产生的有益效果包括:
(1)本发明提供了一种银包镍铝粉,将银镍和铝粉相复合,形成一种银包镍包铝粉的复合结构。该复合材料兼具银的导电性、镍的耐腐蚀性和铝密度小、塑性好等优势,具有优异的导电性和耐腐蚀性。
(2)本申请的制备方法备简单、操作方便。
附图说明
图1是实施例1制备的银包镍铝粉复合物(Ag@Ni-Al)的扫描电镜图。
图2是实施例1制备的银包镍铝粉复合物(Ag@Ni-Al)、镍包铝粉(Ni-Al)以及铝粉的X射线衍射图。
图3是实施例1制备的银包镍铝粉复合物(Ag@Ni-Al)和盐雾实验后的(Ag@Ni-Al)的电阻率图。
具体实施方式
下面结合实施例详述本申请,但本申请并不局限于这些实施例。
如无特别说明,本申请的实施例中的原料均通过商业途径购买
本申请的实施例中分析方法如下:
利用扫描电子显微镜蔡司sigma500进行SEM形貌分析。
利用X射线粉末衍射仪Rigaku miniflex600(铜靶Ka波长为0.154nm)进行XRD结构分析。
利用半导体粉末电阻率测试仪ST2722进行电阻率分析。
实施例1
(1)Ni-Al粉的制备(40wt%Ni):称量1g 150目的铝粉于烧杯中,先加入1g/L的氢氧化钠溶液中,搅拌5min,有大量气泡产生,加大量水稀释,洗涤过滤至中性。再称量1.2g硫酸镍和1.04g酒石酸,加入50ml去离子水超声溶解形成混合溶液A,称量0.36g氟化铵,加入10ml去离子水,超声溶解形成溶液B。将溶液A加入盛有铝粉的烧杯中,40℃水浴,机械搅拌,搅拌的过程中缓慢滴加溶液B。搅拌过程中,称量1.8g硫酸镍和2.14g酒石酸钾钠,加入10ml去离子水,超声溶解形成溶液C,称量1.8g次磷酸钠加入10ml去离子水,超声溶解形成溶液D,称量0.15g十二烷基磺酸钠加入10ml去离子水,超声溶解形成溶液E,称量5g硫酸铵加10ml去离子水,超声溶解形成溶液F。待搅拌10min,上清液变为无色后,依次加入溶液C、D、E、F,再加入适量氨水调节pH>9,继续40℃水浴,机械搅拌。反应4h后,上清液变为无色,使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
(2)Ag@Ni-Al粉的制备(15wt%Ag):称量1g步骤一所得到的Ni-Al粉于烧杯中,加入20g/L葡萄糖和10g/L酒石酸混合溶液于Ni-Al粉中;称量0.28g硝酸银加入20ml去离子水,超声溶解,搅拌的过程中滴加1g/L的氢氧化钠溶液,有大量褐色沉淀产生,滴加稀氨水,至褐色沉淀全部溶解,形成银氨溶液,40℃机械搅拌过程中缓慢滴加银氨溶液,滴加完毕后继续搅拌2h,反应完全后使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
实施例2
(1)Ni-Al粉的制备(40wt%Ni):称量1g 150目的铝粉于烧杯中,先加入1g/L的氢氧化钠溶液中,搅拌5min,有大量气泡产生,加大量水稀释,洗涤过滤至中性。再称量1.2g硫酸镍和1.04g酒石酸,加入50ml去离子水超声溶解形成混合溶液A,称量0.36g氟化铵,加入10ml去离子水,超声溶解形成溶液B。将溶液A加入盛有铝粉的烧杯中,40℃水浴,机械搅拌,搅拌的过程中缓慢滴加溶液B。搅拌过程中,称量1.8g硫酸镍和2.14g酒石酸钾钠,加入10ml去离子水,超声溶解形成溶液C,称量1.8g次磷酸钠加入10ml去离子水,超声溶解形成溶液D,称量0.15g十二烷基磺酸钠加入10ml去离子水,超声溶解形成溶液E,称量5g硫酸铵加10ml去离子水,超声溶解形成溶液F。待搅拌10min,上清液变为无色后,依次加入溶液C、D、E、F,再加入适量氨水调节pH>9,继续40℃水浴,机械搅拌。反应4h后,上清液变为无色,使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
(2)Ag@Ni-Al粉的制备(10wt%Ag):称量1g步骤一所得到的Ni-Al粉于烧杯中,加入20g/L葡萄糖和10g/L酒石酸混合溶液于Ni-Al粉中;称量0.11g硝酸银加入20ml去离子水,超声溶解,搅拌的过程中滴加1g/L的氢氧化钠溶液,有大量褐色沉淀产生,滴加稀氨水,至褐色沉淀全部溶解,形成银氨溶液,40℃机械搅拌过程中缓慢滴加银氨溶液,滴加完毕后继续搅拌2h,反应完全后使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
实施例3
(1)Ni-Al粉的制备(40wt%Ni):称量1g 100目的铝粉于烧杯中,先加入1g/L的氢氧化钠溶液中,搅拌5min,有大量气泡产生,加大量水稀释,洗涤过滤至中性。再称量0.9g硫酸镍和0.77g酒石酸,加入50ml去离子水超声溶解形成混合溶液A,称量0.36g氟化铵,加入10ml去离子水,超声溶解形成溶液B。将溶液A加入盛有铝粉的烧杯中,40℃水浴,机械搅拌,搅拌的过程中缓慢滴加溶液B。搅拌过程中,称量2.1g硫酸镍和2.52g酒石酸钾钠,加入10ml去离子水,超声溶解形成溶液C,称量2.1g次磷酸钠加入10ml去离子水,超声溶解形成溶液D,称量0.15g十二烷基磺酸钠加入10ml去离子水,超声溶解形成溶液E,称量5g硫酸铵加10ml去离子水,超声溶解形成溶液F。待搅拌10min,上清液变为无色后,依次加入溶液C、D、E、F,再加入适量氨水调节pH>9,继续40℃水浴,机械搅拌。反应4h后,上清液变为无色,使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
(2)Ag@Ni-Al粉的制备(15wt%Ag):称量1g步骤一所得到的Ni-Al粉于烧杯中,加入20g/L葡萄糖和10g/L酒石酸混合溶液于Ni-Al粉中;称量0.28g硝酸银加入20ml去离子水,超声溶解,搅拌的过程中滴加1g/L的氢氧化钠溶液,有大量褐色沉淀产生,滴加稀氨水,至褐色沉淀全部溶解,形成银氨溶液,40℃机械搅拌过程中缓慢滴加银氨溶液,滴加完毕后继续搅拌2h,反应完全后使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
实施例4
(1)Ni-Al粉的制备(40wt%Ni):称量1g 100目的铝粉于烧杯中,先加入1g/L的氢氧化钠溶液中,搅拌5min,有大量气泡产生,加大量水稀释,洗涤过滤至中性。再称量0.9g硫酸镍和0.77g酒石酸,加入50ml去离子水超声溶解形成混合溶液A,称量0.36g氟化铵,加入10ml去离子水,超声溶解形成溶液B。将溶液A加入盛有铝粉的烧杯中,40℃水浴,机械搅拌,搅拌的过程中缓慢滴加溶液B。搅拌过程中,称量2.1g硫酸镍和2.52g酒石酸钾钠,加入10ml去离子水,超声溶解形成溶液C,称量2.1g次磷酸钠加入10ml去离子水,超声溶解形成溶液D,称量0.15g十二烷基磺酸钠加入10ml去离子水,超声溶解形成溶液E,称量5g硫酸铵加10ml去离子水,超声溶解形成溶液F。待搅拌10min,上清液变为无色后,依次加入溶液C、D、E、F,再加入适量氨水调节pH>9,继续40℃水浴,机械搅拌。反应4h后,上清液变为无色,使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
(2)Ag@Ni-Al粉的制备(10wt%Ag):称量1g步骤一所得到的Ni-Al粉于烧杯中,加入20g/L葡萄糖和10g/L酒石酸混合溶液于Ni-Al粉中;称量0.11g硝酸银加入20ml去离子水,超声溶解,搅拌的过程中滴加1g/L的氢氧化钠溶液,有大量褐色沉淀产生,滴加稀氨水,至褐色沉淀全部溶解,形成银氨溶液,40℃机械搅拌过程中缓慢滴加银氨溶液,滴加完毕后继续搅拌2h,反应完全后使用去离子水洗涤产物六次以上洗至pH=7,60℃真空条件下干燥6h。
表征例1
对实施例1~4中制备得到的银包镍铝粉进行SEM形貌表征,典型的如图1所示。图1为实施例1中制备得到的银包镍铝粉(MZF@CNT20)的扫描电镜图,从图中可以看出铝粉表面均匀的包覆了一层纳米银颗粒。
结构表征例2
对实施例1~4中制备得到的银包镍铝粉进行XRD结构表征,典型的如图2所示。图2为铝粉,镍包铝粉和银包镍铝粉以及盐雾试验后银包镍铝粉的X射线衍射图,制备得到的银包镍铝粉进行XRD结构表征,铝粉在38.5°、44.7°、65.1°、78.2°、82.4°对应于铝的(111)、(200)、(220)、(311)、(222)晶面,还原镀镍后,样品在44.5°、51.8°、76.4°出现的新的XRD衍射峰分别对应于镍的(111)、(200)、(220)晶面;进一步还原镀银后,样品在38.1°、44.3°、64.4°、77.4°、81.5°、对应于银的(111)、(200)、(220)、(311)、(222)晶面,盐雾实验前后样品的XRD谱图没有发生任何变化,说明该样品具有优异的耐腐蚀性能。
耐腐蚀性能表征例3
对实施例1~4中制备得到的银包镍铝粉进行耐腐蚀性能测试,耐腐蚀性能是通过盐雾实验测得,盐雾试验参照国标GB/T 35858-2018进行,典型的如图3所示。图3为实施例1制备银包镍铝粉的电阻率图,从图中可以看出银包镍铝粉电阻率为1.58mΩ·cm,盐雾试验后电阻率为1.68mΩ·cm。实验前后电阻率相差不大,说明该银包镍铝粉具有优异的耐腐蚀性能。
以上所述,仅是本申请的几个实施例,并非对本申请做任何形式的限制,虽然本申请以较佳实施例揭示如上,然而并非用以限制本申请,任何熟悉本专业的技术人员,在不脱离本申请技术方案的范围内,利用上述揭示的技术内容做出些许的变动或修饰均等同于等效实施案例,均属于技术方案范围内。
Claims (10)
1.一种银包镍铝粉复合物,其特征在于,
所述银包镍铝粉复合物包括铝粉、包覆于铝粉表面的纳米镍层和包覆于纳米镍层表面的银层;
所述银包镍铝粉复合物的粒度为0.1~300μm;
所述银包镍铝粉复合物中,铝、镍、银物质的量之比为1:0.1~0.4:0.1~0.2。
2.根据权利要求1所述的银包镍铝粉,其特征在于,
所述银包镍铝粉复合物中,铝、镍、银物质的量之比为1:0.4:0.1~0.2。
3.根据权利要求1所述的银包镍铝粉复合物,其特征在于,
所述铝粉为球形;
优选地,所述铝粉的粒度是0.1~200μm。
4.权利要求1~3任一项所述的银包镍铝粉复合物的制备方法,其特征在于,
包括以下步骤:
将含有铝粉的原料依次经过置换镀镍、还原镀镍和还原镀银,得到所述银包镍铝粉复合物。
5.根据权利要求4所述的制备方法,其特征在于,
所述置换镀镍的过程包括:
将含有铝粉的原料与镍源水溶液I、酒石酸水溶液I和加速剂水溶液混合,得到混合物料;
所述还原镀镍的过程包括:
将所述混合物料与镍源水溶液II、柠檬酸钠水溶液、次磷酸钠水溶液、表面活性剂水溶液和硫酸铵水溶液混合,加入氨水调节pH为9~11,烘干I,得到镍铝粉;
所述还原镀银的过程包括:
将所述镍铝粉与葡萄糖水溶液、酒石酸水溶液II混合,滴加银源溶液,烘干II,得到所述银包镍铝粉复合物。
6.根据权利要求5所述的制备方法,其特征在于,
所述镍源水溶液I中的镍源选自硝酸镍、氯化镍或硫酸镍中的至少一种;
优选地,所述加速剂选自氟化物;
优选地,所述加速剂选自氟化铵和/或氟化钠;
优选地,在所述置换镀镍的过程中,以1g铝粉为基准,各物质的用量为:
浓度为10~30g/L的镍源水溶液I20~80ml;以镍元素的质量计;
浓度为5~20g/L的酒石酸水溶液I30~70ml;
浓度为10~30g/L的加速剂水溶液20~50ml;
优选地,所述置换镀镍的温度为30~60℃;
优选地,所述置换镀镍的时间为1~30min;
优选地,所述置换镀镍的时间为10~20min;
优选地,所述铝粉在进行置换镀镍前经过碱处理;
优选地,所述碱处理采用氢氧化钠水溶液;
优选地,所述氢氧化钠水溶液的浓度为1~10g/L;
优选地,所述碱处理的时间为3~6min。
7.根据权利要求5所述的制备方法,其特征在于,
所述镍源水溶液II中的镍源选自硝酸镍、氯化镍或硫酸镍中的至少一种;
优选地,所述表面活性剂选自十二烷基磺酸钠、十二烷基苯磺酸钠或十六烷基三甲基溴化铵中的至少一种;
优选地,在所述还原镀镍的过程中,以1g铝粉为基准,各物质的用量为:
浓度为100~200g/L的镍源水溶液II5~40ml;以镍元素的质量计;
浓度为200~500g/L的柠檬酸钠水溶液10~30ml;
浓度为160~200g/L的次磷酸钠水溶液10~20ml;
浓度为5~10g/L的表面活性剂水溶液5~20ml;
浓度为100~300g/L的硫酸铵水溶液10~20ml;
优选地,所述氨水的浓度为1~28g/L;
优选地,所述还原镀镍的温度为30~60℃;
优选地,所述还原镀镍的时间为1~8h;
优选地,所述还原镀镍的时间为4~6h;
优选地,所述烘干I的温度为40~80℃;
优选地,所述烘干I的时间为4~8h。
8.根据权利要求5所述的制备方法,其特征在于,
所述银源选自银氨溶液或/和硝酸银;
优选地,在所述还原镀银的过程中,以1g铝粉为基准,各物质的用量为:
浓度为10~30g/L的葡萄糖水溶液10~40ml;
浓度为5~30g/L的酒石酸水溶液II10~40ml;
浓度为5~20g/L的银源溶液5~20ml;以银元素的质量计;
优选地,所述还原镀银的温度为30~60℃;
优选地,所述还原镀银的时间为0.5~2h;
优选地,所述还原镀银的时间为1~2h;
优选地,所述烘干II的温度为40~80℃;
优选地,所述烘干II的时间为4~8h。
9.根据权利要求5所述的制备方法,其特征在于,
所述置换镀镍和还原镀镍的混合过程始终搅拌I;
优选地,所述搅拌I的温度为30~60℃;
优选地,所述搅拌I的时间为1~30min;
优选地,所述还原镀银的混合过程始终搅拌II;
优选地,所述搅拌II的温度为30~60℃;
优选地,所述搅拌II的时间为1~6h。
10.一种权利要求1~3任一项所述的银包镍铝粉复合物或权利要求4~9任一项所述的制备方法制备的银包镍铝粉复合物的应用,其特征在于,
用于导电填料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210615324.0A CN115007855B (zh) | 2022-06-01 | 2022-06-01 | 一种银包镍铝粉复合物及其制备方法和应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210615324.0A CN115007855B (zh) | 2022-06-01 | 2022-06-01 | 一种银包镍铝粉复合物及其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115007855A true CN115007855A (zh) | 2022-09-06 |
CN115007855B CN115007855B (zh) | 2024-01-02 |
Family
ID=83071757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210615324.0A Active CN115007855B (zh) | 2022-06-01 | 2022-06-01 | 一种银包镍铝粉复合物及其制备方法和应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115007855B (zh) |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1161424A (ja) * | 1997-08-12 | 1999-03-05 | Nippon Chem Ind Co Ltd | 無電解銀めっき粉体およびその製造方法 |
US5945158A (en) * | 1996-01-16 | 1999-08-31 | N.V. Union Miniere S.A. | Process for the production of silver coated particles |
CN101927342A (zh) * | 2010-08-09 | 2010-12-29 | 山东天诺光电材料有限公司 | 镀银铝粉及其制备方法和用途 |
CN102248159A (zh) * | 2011-07-26 | 2011-11-23 | 北京工业大学 | 一种银包铝粉的制备方法 |
CN102528026A (zh) * | 2012-02-24 | 2012-07-04 | 四川大学 | 一种纳米银包铝的复合粉及制备方法 |
CN104005010A (zh) * | 2014-04-14 | 2014-08-27 | 北京工业大学 | 一种导电填料用银包铝合金粉末的制备方法 |
CN104325137A (zh) * | 2014-10-11 | 2015-02-04 | 中北大学 | 一种镀银铝粉的制备方法 |
US20160049531A1 (en) * | 2013-04-02 | 2016-02-18 | Heraeus Deutschland GmbH & Co. KG | Particles comprising al and ag in electro-conductive pastes and solar cell preparation |
US20160055931A1 (en) * | 2013-03-28 | 2016-02-25 | Toyo Aluminium Kabushiki Kaisha | Conductive particles, method of manufacturing the same, conductive resin composition containing the same, and conductive coated object |
CN105598467A (zh) * | 2016-01-20 | 2016-05-25 | 哈尔滨工业大学深圳研究生院 | 一种具有核壳结构的耐高温银包镍包铜导电粉体及其制备方法 |
KR101737515B1 (ko) * | 2016-03-25 | 2017-05-29 | 나노씨엠에스(주) | 신뢰성이 향상된 나노 금속성 은의 비전해 침착방법 및 이에 따라 나노 금속성 은이 침착된 기판 |
CN109909496A (zh) * | 2019-01-26 | 2019-06-21 | 北京工业大学 | 一种环保型银电化学包覆铝粉的方法 |
CN111531168A (zh) * | 2020-04-08 | 2020-08-14 | 西安工程大学 | 一种用于电磁屏蔽的银包铝材料的制备方法 |
CN112207276A (zh) * | 2020-10-16 | 2021-01-12 | 西安工程大学 | 一种微米镀镍铝粉的制备方法 |
CN114425616A (zh) * | 2022-03-31 | 2022-05-03 | 南通领跑者新材料科技有限公司 | 具有核壳结构的银包铜复合粉体及其制备方法 |
-
2022
- 2022-06-01 CN CN202210615324.0A patent/CN115007855B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5945158A (en) * | 1996-01-16 | 1999-08-31 | N.V. Union Miniere S.A. | Process for the production of silver coated particles |
JPH1161424A (ja) * | 1997-08-12 | 1999-03-05 | Nippon Chem Ind Co Ltd | 無電解銀めっき粉体およびその製造方法 |
CN101927342A (zh) * | 2010-08-09 | 2010-12-29 | 山东天诺光电材料有限公司 | 镀银铝粉及其制备方法和用途 |
CN102248159A (zh) * | 2011-07-26 | 2011-11-23 | 北京工业大学 | 一种银包铝粉的制备方法 |
CN102528026A (zh) * | 2012-02-24 | 2012-07-04 | 四川大学 | 一种纳米银包铝的复合粉及制备方法 |
US20160055931A1 (en) * | 2013-03-28 | 2016-02-25 | Toyo Aluminium Kabushiki Kaisha | Conductive particles, method of manufacturing the same, conductive resin composition containing the same, and conductive coated object |
US20160049531A1 (en) * | 2013-04-02 | 2016-02-18 | Heraeus Deutschland GmbH & Co. KG | Particles comprising al and ag in electro-conductive pastes and solar cell preparation |
CN104005010A (zh) * | 2014-04-14 | 2014-08-27 | 北京工业大学 | 一种导电填料用银包铝合金粉末的制备方法 |
CN104325137A (zh) * | 2014-10-11 | 2015-02-04 | 中北大学 | 一种镀银铝粉的制备方法 |
CN105598467A (zh) * | 2016-01-20 | 2016-05-25 | 哈尔滨工业大学深圳研究生院 | 一种具有核壳结构的耐高温银包镍包铜导电粉体及其制备方法 |
KR101737515B1 (ko) * | 2016-03-25 | 2017-05-29 | 나노씨엠에스(주) | 신뢰성이 향상된 나노 금속성 은의 비전해 침착방법 및 이에 따라 나노 금속성 은이 침착된 기판 |
CN109909496A (zh) * | 2019-01-26 | 2019-06-21 | 北京工业大学 | 一种环保型银电化学包覆铝粉的方法 |
CN111531168A (zh) * | 2020-04-08 | 2020-08-14 | 西安工程大学 | 一种用于电磁屏蔽的银包铝材料的制备方法 |
CN112207276A (zh) * | 2020-10-16 | 2021-01-12 | 西安工程大学 | 一种微米镀镍铝粉的制备方法 |
CN114425616A (zh) * | 2022-03-31 | 2022-05-03 | 南通领跑者新材料科技有限公司 | 具有核壳结构的银包铜复合粉体及其制备方法 |
Non-Patent Citations (2)
Title |
---|
张振华;郭忠诚;肖红亮;: "银包铝粉工艺研究", 电镀与涂饰, no. 01, pages 23 - 25 * |
程志鹏;徐继明;朱玉兰;李栋;杨毅;李凤生;: "化学镀法制备纳米Ni-B包覆Al复合粉末", 材料工程, no. 01, pages 19 - 22 * |
Also Published As
Publication number | Publication date |
---|---|
CN115007855B (zh) | 2024-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109414764A (zh) | 使用化学还原方法制造具有核壳结构的银涂覆的铜纳米线的方法 | |
EP3159078B1 (en) | Method of preparing a silver-coated copper nanowire | |
CN110272035B (zh) | 一种以金属离子催化有机配体制备碳纳米笼的方法及其制备的碳纳米笼和应用 | |
KR101078253B1 (ko) | 구리분말의 은 코팅층 형성방법 | |
CN103433485B (zh) | 一种镍包铝粉及制备方法 | |
CN106119818B (zh) | 一种无机粉体表面化学镀的方法及其薄膜 | |
CN1776014A (zh) | 镍或镍合金粉末表面包覆蜂窝状金属钴或钴合金的方法 | |
CN112225220B (zh) | 一种MXene/Ni复合材料及其制备方法和应用 | |
CN107498064A (zh) | 一种中高温电子浆料用超细铜‑银核壳复合粉的制备方法 | |
CN113818043B (zh) | 一种钒酸铋-金属有机配合物复合光电极及其制备方法和应用 | |
JP6210723B2 (ja) | 銀コートニッケル粒子及びその製造方法 | |
CN113020587B (zh) | 银包铜粉的制备方法 | |
CN109423636A (zh) | 一种二次镀银高导电填料的制备方法 | |
Pei et al. | Integrating host design and tailored electronic effects of yolk–shell Zn− Mn diatomic sites for efficient CO2 electroreduction | |
Huang et al. | Fabrication of fully covered Cu–Ag core–shell nanoparticles by compound method and anti-oxidation performance | |
WO2021024729A1 (ja) | クロムめっき製品およびその製造方法 | |
CN104514141A (zh) | 一种微波电磁屏蔽织物及其制造方法 | |
CN108356264B (zh) | 一种银包覆铜粉的制备方法 | |
CN109112508B (zh) | 一种钴包覆氧化铝复合粉体的制备方法 | |
CN115007855B (zh) | 一种银包镍铝粉复合物及其制备方法和应用 | |
Leopold et al. | Spontaneous potential oscillations in the Cu (II)/tartrate and lactate systems, aspects of mechanisms and film deposition | |
US3440181A (en) | Metal coated vermicular expanded graphite and polymer composition containing same | |
CN112207276B (zh) | 一种微米镀镍铝粉的制备方法 | |
KR102391743B1 (ko) | 이종금속 나노입자의 합성방법 | |
Eltoum | Electroless and corrosion of nickel, phosphorus, tungsten alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |