CN115004353A - 陶瓷构造体的制造方法 - Google Patents

陶瓷构造体的制造方法 Download PDF

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Publication number
CN115004353A
CN115004353A CN202180011161.9A CN202180011161A CN115004353A CN 115004353 A CN115004353 A CN 115004353A CN 202180011161 A CN202180011161 A CN 202180011161A CN 115004353 A CN115004353 A CN 115004353A
Authority
CN
China
Prior art keywords
molded body
support member
ceramic structure
manufacturing
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180011161.9A
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English (en)
Chinese (zh)
Inventor
荒井丈幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN115004353A publication Critical patent/CN115004353A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638—Removal thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202180011161.9A 2020-01-31 2021-01-07 陶瓷构造体的制造方法 Pending CN115004353A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020014571 2020-01-31
JP2020-014571 2020-01-31
PCT/JP2021/000309 WO2021153180A1 (ja) 2020-01-31 2021-01-07 セラミック構造体の製造方法

Publications (1)

Publication Number Publication Date
CN115004353A true CN115004353A (zh) 2022-09-02

Family

ID=77079337

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180011161.9A Pending CN115004353A (zh) 2020-01-31 2021-01-07 陶瓷构造体的制造方法

Country Status (4)

Country Link
JP (1) JP7447154B2 (ko)
KR (1) KR20220120656A (ko)
CN (1) CN115004353A (ko)
WO (1) WO2021153180A1 (ko)

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1156706A (zh) * 1995-11-08 1997-08-13 松下电器产业株式会社 陶瓷压型体的脱脂方法和脱脂装置
JP2001110879A (ja) * 1999-06-09 2001-04-20 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2004018325A (ja) * 2002-06-18 2004-01-22 Ngk Insulators Ltd 焼結体の製造方法、焼結体、焼結用部材、セラミック多層基板の製造方法およびセラミック多層基板
EP1407842A2 (en) * 2002-09-30 2004-04-14 Dowa Mining Co., Ltd. Mold and method for manufacturing metal-ceramic composite member
JP2005340441A (ja) * 2004-05-26 2005-12-08 Kyocera Corp ウェハ支持部材
JP2007232352A (ja) * 2005-12-27 2007-09-13 Ibiden Co Ltd 脱脂用治具、セラミック成形体の脱脂方法、及び、ハニカム構造体の製造方法
JP2009090623A (ja) * 2007-10-12 2009-04-30 Tokuyama Corp セラミック成形体の保持具
CN101960245A (zh) * 2008-03-05 2011-01-26 日本碍子株式会社 陶瓷烧成用窑工具板
US20110121493A1 (en) * 2009-11-25 2011-05-26 Ibiden Co., Ltd. Method for manufacturing ceramic fired body and method for manufacturing honeycomb structured body
CN102741998A (zh) * 2010-01-29 2012-10-17 住友大阪水泥股份有限公司 静电卡盘装置
JP2013226497A (ja) * 2012-04-25 2013-11-07 Panasonic Corp マイクロ流体デバイス
US20140355169A1 (en) * 2013-05-31 2014-12-04 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP2016088831A (ja) * 2014-10-29 2016-05-23 住友金属鉱山株式会社 円筒形セラミックス焼結体およびその製造方法
CN107958837A (zh) * 2016-10-14 2018-04-24 日本碍子株式会社 半导体制造装置用部件及其制法
CN108987229A (zh) * 2017-05-30 2018-12-11 朗姆研究公司 高温衬底基座模块及其组件
TW201922676A (zh) * 2017-11-02 2019-06-16 日商日本碍子股份有限公司 半導體製造裝置用構件、其製法及成形模具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089248A (ja) * 1999-09-22 2001-04-03 Ngk Spark Plug Co Ltd セラミック基板の製造方法及びそれに使用する冶具
JP2004214690A (ja) * 2000-02-07 2004-07-29 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP4646461B2 (ja) * 2001-08-10 2011-03-09 京セラ株式会社 電極内蔵セラミック部材及びその製造方法
JP2003128470A (ja) * 2001-10-23 2003-05-08 Mitsubishi Materials Corp セラミックス基板の製造方法及び多孔質セラミックス板
JP2008120653A (ja) 2006-11-15 2008-05-29 Denso Corp セラミックハニカム成形体の焼成用載置台
JP6215668B2 (ja) * 2012-11-30 2017-10-18 京セラ株式会社 セラミック焼結体、これを用いた流路部材ならびに半導体検査装置および半導体製造装置
US10068783B2 (en) 2013-08-26 2018-09-04 Kyocera Corporation Sample holder
JP2016038194A (ja) * 2014-08-12 2016-03-22 東北セラミック株式会社 脱脂・焼成用セッター
JP6410758B1 (ja) * 2016-05-24 2018-10-24 三井金属鉱業株式会社 セラミックス格子体

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1156706A (zh) * 1995-11-08 1997-08-13 松下电器产业株式会社 陶瓷压型体的脱脂方法和脱脂装置
JP2001110879A (ja) * 1999-06-09 2001-04-20 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2004018325A (ja) * 2002-06-18 2004-01-22 Ngk Insulators Ltd 焼結体の製造方法、焼結体、焼結用部材、セラミック多層基板の製造方法およびセラミック多層基板
EP1407842A2 (en) * 2002-09-30 2004-04-14 Dowa Mining Co., Ltd. Mold and method for manufacturing metal-ceramic composite member
JP2005340441A (ja) * 2004-05-26 2005-12-08 Kyocera Corp ウェハ支持部材
JP2007232352A (ja) * 2005-12-27 2007-09-13 Ibiden Co Ltd 脱脂用治具、セラミック成形体の脱脂方法、及び、ハニカム構造体の製造方法
JP2009090623A (ja) * 2007-10-12 2009-04-30 Tokuyama Corp セラミック成形体の保持具
CN101960245A (zh) * 2008-03-05 2011-01-26 日本碍子株式会社 陶瓷烧成用窑工具板
US20110121493A1 (en) * 2009-11-25 2011-05-26 Ibiden Co., Ltd. Method for manufacturing ceramic fired body and method for manufacturing honeycomb structured body
CN102741998A (zh) * 2010-01-29 2012-10-17 住友大阪水泥股份有限公司 静电卡盘装置
JP2013226497A (ja) * 2012-04-25 2013-11-07 Panasonic Corp マイクロ流体デバイス
US20140355169A1 (en) * 2013-05-31 2014-12-04 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP2016088831A (ja) * 2014-10-29 2016-05-23 住友金属鉱山株式会社 円筒形セラミックス焼結体およびその製造方法
CN107958837A (zh) * 2016-10-14 2018-04-24 日本碍子株式会社 半导体制造装置用部件及其制法
CN108987229A (zh) * 2017-05-30 2018-12-11 朗姆研究公司 高温衬底基座模块及其组件
TW201922676A (zh) * 2017-11-02 2019-06-16 日商日本碍子股份有限公司 半導體製造裝置用構件、其製法及成形模具

Also Published As

Publication number Publication date
WO2021153180A1 (ja) 2021-08-05
JPWO2021153180A1 (ko) 2021-08-05
JP7447154B2 (ja) 2024-03-11
KR20220120656A (ko) 2022-08-30

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