CN114999971A

CN114999971A - Chip carrying platform, chip testing module and chip carrying module

Info

Publication number: CN114999971A
Application number: CN202110228136.8A
Authority: CN
Inventors: 王胜弘; 张博翔; 廖哲民
Original assignee: Chroma ATE Suzhou Co Ltd
Current assignee: Chroma ATE Suzhou Co Ltd
Priority date: 2021-03-02
Filing date: 2021-03-02
Publication date: 2022-09-02

Abstract

The application provides a chip microscope carrier, a chip testing module and a chip carrying module. The chip carrier is used for carrying a plurality of chips and comprises a body part, and the body part is defined with an upper surface and a lower surface. The body part is provided with a plurality of air guide holes, and two ends of each air guide hole are respectively exposed out of the upper surface and the lower surface. Wherein part of the air holes are defined as a first group, the air holes defined as the first group are communicated, and the main body is made of conductive material.

Description

Chip carrying platform, chip testing module and chip carrying module

Technical Field

The present disclosure relates to a chip carrier, a chip testing module, and a chip handling module, and more particularly, to a chip carrier capable of carrying a plurality of chips, a chip testing module capable of testing a plurality of chips, and a chip handling module capable of transporting a plurality of chips.

Background

After the chip is manufactured, a series of tests are often performed to ensure the quality of the manufacturing. Since different test items need to be performed in different test stations, chips need to be handled between the test stations. For example, the suction nozzle is used to pick up the chip, and then the picked-up chip is moved to the next testing station, and the suction nozzle is moved to the correct position to release the chip. However, as one of ordinary skill in the art will appreciate, moving the chips one by one can make the entire testing process very time-consuming as more test items are required. In particular, as the size of the chip becomes smaller, repeated picking up and releasing of the chip increases the chance of damaging the chip.

Accordingly, there is a need for a new chip carrier that can simultaneously carry a plurality of chips, thereby improving the efficiency of chip handling and reducing the chance of direct contact between chips. In addition, there is a need for a new chip testing module and a new chip handling module, which can test and handle multiple chips on a chip carrier.

Disclosure of Invention

The technical problem to be solved in the present application is to provide a chip carrier, which can be directly carried by a chip carrying module in addition to simultaneously placing a plurality of chips, thereby achieving the purpose of carrying chips in batches, and reducing the possibility of damage caused by repeated suction and release of individual chips. In addition, during testing, because the chip carrier has conductivity, whether power is supplied to a plurality of chips can be directly controlled, and the situation that the chips are moved or contacted again can be reduced.

The application provides a chip carrying platform which is used for carrying a plurality of chips. The chip carrier includes a body portion defining an upper surface and a lower surface. The body part is provided with a plurality of air guide holes, and two ends of each air guide hole are respectively exposed out of the upper surface and the lower surface. Wherein part of the air holes are defined as a first group, the air holes defined as the first group are communicated, and the main body is made of conductive material.

In some embodiments, the main body may have a first groove for communicating with the first group of air vents. The first groove may be exposed from the lower surface, the body may be provided with a first positioning hole and a second positioning hole, the first positioning hole and the second positioning hole are exposed from the lower surface, and the first groove is located between the first positioning hole and the second positioning hole. In addition, the upper surface can be defined with a plurality of accommodating positions, each accommodating position is provided with one of the plurality of air guide holes, and each accommodating position is used for corresponding to one of the plurality of chips. When the chip is arranged at the corresponding accommodating position, the chip covers the air guide hole in the accommodating position. In addition, the main body may be provided with a first upper guide groove and a second upper guide groove, the first upper guide groove and the second upper guide groove are exposed out of the upper surface, and the plurality of accommodating positions are between the first upper guide groove and the second upper guide groove.

The application provides a chip test module, can adsorb fixed chip microscope carrier to whether can control adsorb the chip in the specific holding position on the chip microscope carrier. In addition, the chip testing module can also be electrically connected with a chip on the chip carrier, and the heat energy of the chip carrier is led out by using the heat conducting block.

The application provides a chip test module, contains heat conduction piece and heat dissipation pedestal. The heat conduction block is provided with a plurality of air extraction pipelines. The heat dissipation base body is arranged on the heat conduction block and is adjacent to the edge of the heat conduction block, the upper surface of the heat dissipation base body is provided with a first positioning column, a second positioning column, a first air exhaust hole and a second air exhaust hole, and the first air exhaust hole and the second air exhaust hole are located between the first positioning column and the second positioning column. The second pumping hole is positioned in the vacuum guide groove, and the vacuum guide groove is exposed out of the upper surface. The first air exhaust hole and the second air exhaust hole are respectively communicated with one of the plurality of air exhaust pipelines, and the first air exhaust hole and the second air exhaust hole are not coplanar.

In some embodiments, when the chip carrier is disposed on the heat dissipation base, the first positioning column and the second positioning column respectively correspond to the first positioning hole and the second positioning hole of the chip carrier. When the chip carrier is arranged on the heat dissipation base, the first air exhaust hole is used for communicating with at least one air guide hole of the chip carrier, and the second air exhaust hole is used for adsorbing the chip carrier.

The application provides a chip carrying module, which can adsorb and carry a chip carrying platform and reduce the number of times that individual chips are moved. In addition, when the chip carrying platform is carried, the chip carrying module can fix a plurality of chips on the chip carrying platform by using the ejector pins, so that the chips can be prevented from sliding or falling off.

The application provides a chip carrying module, which comprises a suction nozzle base body. The suction nozzle base body is provided with a first lug boss, a second lug boss and a plurality of ejector pins on the bottom surface. The ejector pins are located between the first protruding portion and the second protruding portion, the first protruding portion is provided with a third air extracting hole, the second protruding portion is provided with a fourth air extracting hole, and the top surfaces of the first protruding portion and the second protruding portion form a coplanar surface. When the suction nozzle base body is used for adsorbing the chip carrier, the first bulge part and the second bulge part respectively cover the first upper guide groove and the second upper guide groove of the chip carrier, and each thimble corresponds to one of a plurality of accommodating positions of the chip carrier.

In some embodiments, the third air-extracting hole and the fourth air-extracting hole are used for absorbing the chip carrier, and when the suction nozzle base is absorbing the chip carrier, each of the ejector pins is used for abutting against the chip to fix the chip at the corresponding accommodating position.

To sum up, the chip microscope carrier that this application provided can bear a plurality of chips simultaneously, and the chip can utilize the chip microscope carrier to remove between each test station to can improve the efficiency of transport chip and reduce the chance that the chip is by direct contact. In addition, the chip testing module can fix the chip carrier and independently control whether to absorb a specific chip on the chip carrier. And the chip testing module can also be electrically connected with a chip on the chip carrier, and the heat energy of the chip carrier is led out by utilizing the heat conducting block. In addition, the chip carrying module can adsorb and carry the chip carrier, so that the number of times that individual chips are moved is reduced, and when the chip carrier is carried, the chip carrying module can fix a plurality of chips on the chip carrier by using the ejector pins, so that the chips can be prevented from sliding or falling.

Other features and embodiments of the present application will be described in detail below with reference to the drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic perspective view of a chip carrier according to an embodiment of the present application;

fig. 2 is another perspective view of a chip carrier according to an embodiment of the present application;

FIG. 3 is a bottom view of a chip carrier according to an embodiment of the present application;

FIG. 4 is a schematic perspective view of a chip carrier and a chip test module according to an embodiment of the application;

fig. 5 is a perspective view of a chip carrier and a chip handling module according to an embodiment of the present application;

FIG. 6 is a perspective view of a chip handling module according to an embodiment of the present application;

fig. 7 is a schematic perspective view of a chip carrier according to another embodiment of the present application;

fig. 8 is a perspective view of a chip handling module according to another embodiment of the present application.

Description of the symbols

1: chip carrier 10: body part

10 a: upper surface of body portion 10 b: lower surface of main body portion 10 c: inclined plane of body part

100a, 100 b:

air vents

102a, 102 b: accommodating position 104 a: first upper guide groove

104 b: second upper guide grooves 106a to 106 d: groove 108 a: a first positioning hole

108 b: second positioning hole 2: chip test module 20: heat conducting block

200: edge 22 of heat-conductive block: heat radiation seat

22 a: upper surface of heat radiation seat

220 a: first positioning column 220 b: second positioning posts 222a to 222 d: air exhaust hole

224a to 224 b: the air extraction holes 226a to 226 b: vacuum guide groove 24: air tap

3: chip transfer module 30: nozzle holder 30 a: bottom surface of suction nozzle base

300 a: first boss 300 b:

second bosses

302a, 302 b: air exhaust hole

304: the thimble 32: the mobile device 34: air tap

4: chip carrier 40: body part

40 a: upper surface of body portion 40 b: inclined surface 400a of body portion: air guide hole

402 a: the housing position 402:

platforms

404a, 404 b: plane surface

5: chip handling module 50: suction nozzle base

50 a: bottom surface 500a of nozzle holder: first boss portion 500 b: second convex part

504 a: first adsorption groove 504 b: second adsorption groove

Detailed Description

The positional relationship described in the following embodiments includes: top, bottom, left and right, unless otherwise indicated, are based on the direction in which elements in the drawings are depicted.

Referring to fig. 1, fig. 2, and fig. 3 together, fig. 1 is a schematic perspective view of a chip carrier according to an embodiment of the present application, fig. 2 is another schematic perspective view of the chip carrier according to the embodiment of the present application, and fig. 3 is a schematic bottom view of the chip carrier according to the embodiment of the present application. As shown in the figure, the chip carrier 1 includes a main body 10, and the main body 10 may define an upper surface 10a and a lower surface 10 b. The upper surface 10a can be used to carry a plurality of chips (not shown), and it can be seen that the upper surface 10a is provided with a plurality of air hole openings, such as

adjacent air holes

100a and 100 b. In practice, a certain area around each air hole can be defined as a receiving position, for example, the periphery of the air hole 100a can be defined as a receiving position 102a, and the periphery of the air hole 100b can be defined as a receiving position 102 b. In one example, the size of the receiving location corresponds exactly to the size of the chip, i.e. the chip is planned to be placed in the receiving location. As shown in fig. 1, 10 air holes are illustrated in the upper surface 10a, which means that there are 10 accommodating positions for correspondingly placing 10 chips. Of course, the present embodiment is not limited to the number of the air holes, the accommodating positions or the chips, and the person skilled in the art can design the air holes or the accommodating positions freely. In addition, the chip may be a chip for generating laser light, and the present embodiment does not limit the kind of the chip.

Structurally, the area of the upper surface 10a of the body portion 10 is slightly smaller than that of the lower surface 10b because the body portion 10 is provided with a slope 10c, and the slope 10c makes the body portion 10 have an appearance that the upper (upper surface 10a) is narrow and the lower (lower surface 10b) is wide in the central region. In one example, the inclined surface 10c is only on the middle area of the main body 10, and the upper surface 10a forming the middle area of the main body 10 only leaves a plurality of accommodating positions for accommodating the chip. One reason for this is that the design of the inclined surface 10c can reduce the volume and mass of the main body 10, thereby increasing the heat conduction efficiency of the main body 10 (or reducing the heat storage of the main body 10), and the appearance of narrow top and wide bottom can also be used for the step-by-step perforation (for example, opening the air guide hole 100a), taking into account the structural strength of the main body 10. The step-by-step drilling means that a shallow hole can be drilled into the air guide hole 100a from one end of the narrow (poor structural strength) upper surface 10a, and a deep hole can be drilled into the wide (good structural strength) lower surface 10b, and the air guide hole 100a is formed after the two holes are communicated. In addition, after the chips are respectively placed in the corresponding accommodating positions, taking the accommodating position 102a as an example, because the size of the chip is larger than the opening of the air vent 100a on the upper surface 10a, the chip should be able to completely cover the opening of the air vent 100a on the upper surface 10 a. As long as the chip and the upper surface 10a are flat enough, the chip and the upper surface 10a should be closely attached to form a hermetic seal.

In addition, the upper surface 10a of the main body 10 may be provided with a first upper guide groove 104a and a second upper guide groove 104b in addition to the air vent. In one example, the first upper guide groove 104a and the second upper guide groove 104b do not penetrate through the main body 10, but are recessed structures with openings exposed on the upper surface 10 a. As shown in fig. 1, the plurality of accommodating positions of the main body 10 on the upper surface 10a and the openings of the plurality of air holes are located between the first upper guiding groove 104a and the second upper guiding groove 104 b. On the other hand, a plurality of air holes penetrate the main body 10, so that each air hole is also opened on the lower surface 10 b. Taking the

air vents

100a and 100b as examples, fig. 2 also shows that the lower surface 10b has openings of the

adjacent air vents

100a and 100 b. Here, the lower surface 10b may be further provided with a plurality of grooves (first grooves) which function to communicate with the air-guide holes.

In one example, the air holes in the main body 10 may be divided into more than two groups, for example, 10 air holes shown in fig. 1, from left to right, the leftmost four air holes may be a group, the next three air holes may be a group, the next two air holes (i.e., the air holes 100a and the air holes 100b) may be a group, and the rightmost air hole may be a group. The air holes in each group may be communicated by a groove, for example, there may be a groove 106a to a groove 106d from left to right, which correspond to the different air hole groups. As shown in the present embodiment, the

air holes

100a and 100b are connected by the groove 106 c. In an example, the groove does not necessarily need to be exposed from the lower surface 10b, and may also be designed in the body 10, for example, the groove 106c may communicate the air vent 100a and the air vent 100b in the body 10, and the embodiment is not limited thereto.

To illustrate the function of the trench, assume that two chips to be tested are placed at the receiving

positions

102a and 102b, respectively. At this time, the two chips should cover the openings of the

air holes

100a and 100b on the upper surface 10a, and the openings of the

air holes

100a and 100b on the lower surface 10b may be connected to external air extraction holes (not shown in fig. 1-3). When the external air-extracting hole starts to extract air, because the groove 106c communicates with the air-guiding hole 100a and the air-guiding hole 100b, the air-guiding hole 100a and the air-guiding hole 100b are simultaneously extracted with negative pressure (or vacuum), so that the two chips are tightly absorbed at the accommodating position 102a and the accommodating position 102 b. For the example shown in FIG. 2, the trench may be a structure recessed from the lower surface 10b, and one of the functions of the trench, in addition to communicating with the air holes in the respective groups, may be to align with external pumping holes. As shown in fig. 3, the groove 106c may have a recess of an unfixed shape extending from the linear recess in addition to the linear recess communicating the air-guide hole 100a and the air-guide hole 100b, and may correspond to the position of the external air-extracting hole. The above example also illustrates the reason that the trench can be configured even though only one air hole in the group is provided, for example, the rightmost air hole in FIG. 3 can be connected to the trench 106d, and the trench 106d can be used to align with the external air hole, so that the external air hole can pump air through the trench 106d to the rightmost air hole.

The main body 10 may further have a first positioning hole 108a and a second positioning hole 108b on the lower surface 10b, and the first positioning hole 108a and the second positioning hole 108b may be recessed from the lower surface 10b and are respectively located at two ends of the lower surface 10 b. In one example, the opening of the air hole and the groove exposed from the lower surface 10b may be located between the first positioning hole 108a and the second positioning hole 108 b. For explaining the structure and function of the bottom surface 10b, please refer to fig. 3 and fig. 4 together, and fig. 4 is a schematic perspective view of a chip carrier and a chip testing module according to an embodiment of the present application. As shown in the figure, the chip carrier 1 can be tightly sucked and fixed on the chip testing module 2, and the chip testing module 2 can include a heat conducting block 20 and a heat dissipation base 22, wherein the heat dissipation base 22 is installed at an edge 200 of the heat conducting block 20. The upper surface 22a of the heat dissipation base 22 can be provided with a first positioning post 220a and a second positioning post 220b, and the first positioning post 220a and the second positioning post 220b can be used for aligning the first positioning hole 108a and the second positioning hole 108 b.

For example, the first positioning pillar 220a and the second positioning pillar 220b may be cylinders, and the first positioning hole 108a and the second positioning hole 108b may be circular or oval recesses with corresponding shapes, respectively. The present embodiment does not limit the shapes of the first positioning post 220a, the second positioning post 220b, the first positioning hole 108a and the second positioning hole 108b, and functions to guide the chip carrier 1 to align with the heat dissipation base 22. In other words, as long as the first positioning posts 220a (or the second positioning posts 220b) of the chip testing module 2 can be inserted into the first positioning holes 108a (or the second positioning holes 108b) of the chip carrier 1, the scope of the positioning posts and positioning holes disclosed in the present embodiment should be covered. In addition, the shapes of the first positioning hole 108a and the second positioning hole 108b may be different, and the shapes of the first positioning column 220a and the second positioning column 220b may also be different, which is not limited in this embodiment.

First pumping holes (e.g., pumping holes 222 a-222 d) and second pumping holes (e.g., pumping holes 224 a-224 b) may be formed between the first positioning pillar 220a and the second positioning pillar 220 b. The pumping holes 222 a-222 d may be external pumping holes as exemplified in the previous embodiments and may be located corresponding to the trenches 106 a-106 d, respectively, e.g., the pumping hole 222c corresponds to the trench 106c and may be connected to the gas guide hole 100a and the gas guide hole 100 b. In one example, a plurality of air suction pipes (not shown) may be disposed inside the heat conductive block 20 and connected to the plurality of air nozzles 24, and each of the air suction holes 222a to 222d may correspond to one of the air suction pipes. In practical terms, when the air nozzles 24 corresponding to the air pumping holes 222c are used for pumping air, the

air guide holes

100a and 100b communicating with the groove 106c can simultaneously exhibit negative pressure, so that the chips placed in the

accommodating positions

102a and 102b can be tightly sucked. In other words, when the main body 10 of the chip carrier 1 is placed on the heat dissipation base 22 of the chip testing module 2, the air suction holes 222a to 222d function to suck the chips in a plurality of accommodating positions.

Of course, whether each air nozzle 24 is used for air suction can be controlled, that is, a user can determine which group of air guide holes in the chip carrier 1 is used for air suction by controlling the respective air nozzle 24, so that the chip at the corresponding position is tightly sucked. Since different numbers of air vents may be associated with the groups of air vents, controlling different air nozzles 24 may also mean controlling the tightening or releasing of different groups and different numbers of chips. In a practical example, the user may pre-design the placement positions of the chips, for example, knowing that three chips are to be removed during the testing process, the three chips may be arranged in the corresponding placement positions of the grooves 106 b. Then, as long as the air nozzle 24 corresponding to the groove 106b is controlled to stop the air suction, the air suction to the three air vents communicated with the groove 106b can be stopped simultaneously, so that the three chips in the corresponding three containing positions can be released.

In addition, a portion of the air nozzles 24 may correspond to the second suction holes (for example, the suction holes 224a to 224b), and the openings of the suction holes 224a and the suction holes 224b may be respectively located in the vacuum guide 226a and the vacuum guide 226 b. Here, the vacuum guide 226a and the vacuum guide 226b may be a structure recessed from the upper surface 22a, so that openings of the first suction holes (e.g., the suction holes 222a to 222d) and the second suction holes (e.g., the suction holes 224a to 224b) may not be on the same plane. In practice, the openings of the pumping holes 222 a-222 d are located on the upper surface 22a, and the openings of the pumping holes 224 a-224 b are located in the

vacuum grooves

226a and 226b recessed from the upper surface 22a, and thus are slightly lower than the opening heights of the pumping holes 222 a-222 d. In an actual example, when the chip carrier 1 is placed on the chip testing module 2, the lower surface 10b of the main body 10 contacts the upper surface 22a of the heat sink 22, and the lower surface 10b covers the vacuum guiding groove 226a and the vacuum guiding groove 226 b. At this time, when the air nozzles 24 corresponding to the air suction holes 224a to 224b start to suck air, the vacuum guide 226a and the vacuum guide 226b should be airtight as long as the lower surface 10b and the upper surface 22a are flat enough. The lower surface 10b is tightly sealed with the

vacuum channels

226a and 226b under negative pressure, so that the main body 10 is tightly absorbed to the heat dissipation base 22. As can be seen from the above description, when the main body 10 of the chip carrier 1 is placed on the heat dissipation base 22 of the chip testing module 2, the air-extracting holes 224a to 224b have the function of fixing the chip carrier 1 and the chip testing module 2, and are different from the function of fixing the chip by the air-extracting holes 222a to 222 d.

In one example, the main body 10 and the heat dissipation base 22 of the chip carrier 1 may be made of conductive materials, for example, aluminum extrusion may be used to produce an integrally formed structure. Therefore, after the main body 10 and the heat dissipation base 22 are fixed (the chip carrier 1 is fixed to the chip testing module 2), the plurality of chips carried by the main body 10 are already electrically connected to the chip testing module 2 through the heat dissipation base 22, so that the testing can be directly started without moving the chips. In addition, the heat conducting block 20 can be a temperature control platform, which can freely adjust the temperature and transmit the temperature to the upper heat dissipating base 22, and it can be understood by those skilled in the art that the heat conducting block 20 and the heat dissipating base 22 should have good heat conducting efficiency. In practice, the main body 10 has good heat conduction efficiency, so that the heat conduction block 20 can control the operation temperature of the chip carried by the main body 10. It should be noted that, taking the plurality of chips as examples of the chips capable of generating laser light, the heat dissipation base 22 is mounted on the edge 200 of the heat conduction block 20 to facilitate the measurement of the light pattern. For example, a plurality of chips carried by the main body 10 may all emit light toward one side of the edge 200 (e.g., along the planar direction of the upper surface 22 a), and since there is no structural obstruction of the thermal block 20 outside the edge 200, the light pattern of the emitted chips may be measured outside the thermal block 20.

After the chip testing is completed, the chip carrier 1 can remove the chip testing module 2 through the chip handling module. Referring to fig. 1, fig. 5 and fig. 6 together, fig. 5 is a perspective view of a chip carrier and a chip handling module according to an embodiment of the present application, and fig. 6 is a perspective view of a chip handling module according to an embodiment of the present application. As shown, the chip handling module 3 includes a nozzle housing 30, and the nozzle housing 30 may define a bottom surface 30 a. The bottom surface 30a is provided with a first protruding portion 300a and a second protruding portion 300b, the first protruding portion 300a is provided with an air hole 302a (third air hole), and the second protruding portion 300b is provided with an air hole 302b (fourth air hole). In one example, an air suction pipe (not shown) may be disposed inside the nozzle housing 30, and the air suction pipe may communicate with the air nozzle 34 and the air suction holes 302 a-302 b. In practice, whether the air nozzle 34 draws air or not can be controlled, and the user can control the air nozzle 34 to start the air drawing through the air drawing holes 302 a-302 b. In addition, the nozzle holder 30 may be locked to a moving device 32, and the moving device 32 may be used to connect to or be a part of a robot arm that is used to move among the plurality of chip testing modules 2.

In practical terms, the nozzle holder 30 can be used for sucking the main body 10 of the chip carrier 1, and the first protrusion 300a and the second protrusion 300b can cover the first upper guiding groove 104a and the second upper guiding groove 104b of the upper surface 10a of the main body 10. Since the upper surface 10a is substantially flat, the top surfaces of the first and

second protrusions

300a and 300b are flush with the upper surface 10a to form a coplanar surface. In practice, an air chamber (first air chamber) may be formed between the first upper guide groove 104a and the first protrusion 300a, and an air chamber (second air chamber) may be formed between the second upper guide groove 104b and the second protrusion 300 b. When the air suction holes 302a are used for sucking air between the first protruding portion 300a and the first upper guide groove 104a, and the air suction holes 302b are used for sucking air between the second protruding portion 300b and the second upper guide groove 104b, the first air chamber and the second air chamber are under negative pressure and have internal and external pressure difference. The nozzle holders 30 can tightly suck both ends of the main body 10, and the suction force of the nozzle holders 30 to the main body 10 is relatively even. In addition, a plurality of pins 304 may be disposed on the bottom surface 30a, and the plurality of pins 304 are located between the first protrusion 300a and the second protrusion 300 b. As can be seen, the plurality of pins 304 are distributed, and in practice, the number and arrangement of the plurality of pins 304 are related to the number and arrangement of the receiving positions of the upper surface 10 a.

In one example, after the testing of a plurality of chips is completed, the air suction holes 224a to 224b stop sucking air, so as to release the chip carrier 1 and the chip testing module 2, and then the nozzle base 30 aligns the body 10 of the chip carrier 1, and the air suction holes 302a to 302b suck air to suck the body 10. This embodiment can fix the chip carrier 1 and the chip handling module 3 to each other. At this time, since chips may be placed in a plurality of accommodating positions in the main body 10, and since the suction holes 222a to 222d no longer have the ability to suck a plurality of chips after the chip carrier 1 is separated from the chip testing module 2, the chips need to be supported by the plurality of ejector pins 304. For example, each chip is pressed between the thimble 304 and the upper surface 10a of the main body 10, and can be fixed at a default housing position. In practice, in order to avoid the chip being damaged by being excessively pressed by the pins 304, the height of the pins 304 protruding from the bottom surface 30a may be slightly smaller than the height of the first protruding portion 300a and the second protruding portion 300b, or the pins 304 may be made of an elastic material, which is not limited in this embodiment. However, although the present embodiment exemplifies the chip carrying module having the plurality of ejector pins, the plurality of ejector pins are not essential components, and the chip carrying module can carry the chip carrier without the ejector pins, which will be described later in the embodiments.

It should be noted that when the pumping holes (222a to 222d, 224a to 224b, and 302a to 302b) are pumping air, a certain space is reserved around the opening of the pumping hole to help the object to be sucked tightly. In one example, the first upper guide groove 104a and the second upper guide groove 104b are illustrated as having a significantly larger size than the

vacuum guide grooves

226a and 226 b. One reason for this is that the first upper guide groove 104a and the second upper guide groove 104b are large in size for the sake of reducing the volume and mass of the body portion 10 and increasing the heat conduction efficiency, which is similar to the reason for designing the inclined surface 10 c.

In another embodiment, please refer to fig. 1 and fig. 7 together, and fig. 7 is a perspective view of a chip carrier according to another embodiment of the present application. As shown, the present embodiment demonstrates a chip carrier 4 with a structure different from that of fig. 1. As in fig. 1, the chip carrier 4 also includes a main body 40, and the main body 40 may define an upper surface 40a and a lower surface (not shown in fig. 7). The lower surface structure of the main body 40 is the same as that of the embodiment of fig. 1, and the description of the lower surface structure of the main body 40 is omitted here. The structure of the upper surface 40a is the same as that of fig. 1, the upper surface 40a can also see the openings of a plurality of air holes (e.g. one of the air holes 400a), and a certain area around the air hole 400a can be defined as a receiving position 402 a. However, the receiving position 102a of fig. 1 is directly opened on the upper surface 10a, and the receiving position 402a is a groove, in which the air hole 400a is disposed. In one example, the air hole 400a is disposed at a position substantially at a center point of the groove, which is not limited in this embodiment.

The chip can be placed in the receiving position 402a, but the receiving position 402a is only used to roughly distinguish the position where the chip can be placed, and can be regarded as a very shallow imprint mark. In practice, in order to prevent the groove of the accommodating position 402a from shielding the light emitted laterally by the chip, the chip is not completely trapped in the accommodating position 402a, and at least a portion of the chip is exposed from the accommodating position 402 a. In other words, the depth of depression of receiving location 402a from upper surface 40a should be less than the thickness of the die, for example, the depth of depression of receiving location 402a from upper surface 40a may be less than 1/2 the thickness of the die. In addition, the shape of the accommodating position 402a is not limited in this embodiment, and the accommodating position 402a may be an X-shape, a rectangle or other shapes capable of accommodating chips when viewed from the top surface 40 a.

In addition, unlike fig. 1, the slope 40b of the chip stage 4 is also greater than the slope 10c shown in fig. 1, and the slope 40b is connected to a platform 402. In practice, one function of platform 402 is to provide efficiency for chip testing module 2 to control the temperature of chip carrier 4. As will be appreciated by those skilled in the art, platform 402 increases the area of chip carrier 4 that contacts chip test module 2, which is positively related to the rate of heat transfer. That is, when the temperature of the chip testing module 2 is set for testing, the temperature of the chip carrier 4 placed on the chip testing module 2 can be raised (or lowered) to a predetermined temperature through the platform 402 more quickly. On the other hand, in order to increase the speed of the chip carrier 4 reaching the specified temperature, the volume (mass) of the chip carrier 4 is further reduced in the present embodiment, originally, the body portion 10 of the first upper guide groove 104a and the second upper guide groove 104b arranged in fig. 1 is thinned, and the first upper guide groove 104a and the second upper guide groove 104b are removed. As shown in fig. 4, the two ends of the main body 40 are thinner than the main body 10 of fig. 1, that is, the two ends of the main body 40 may have no upper guiding groove and have only a plane 404a and a plane 404b at the corresponding positions.

In one example, plane 404a and plane 404b may be coplanar, and plane 404a and plane 404b may be lower than upper surface 40a, i.e., plane 404a (or plane 404b) and upper surface 40a are not coplanar. Of course, in order to suck the chip carrier 4, the chip transfer module needs to be designed differently from fig. 6. Referring to fig. 6, 7 and 8, fig. 8 is a perspective view of a chip handling module according to another embodiment of the present disclosure. As shown in fig. 6, the chip handling module 5 also includes a nozzle housing 50, and the nozzle housing 50 may define a bottom surface 50 a. The bottom surface 50a is provided with a first protrusion 500a and a second protrusion 500b, the first protrusion 500a is provided with an air hole 502a (third air hole), and the second protrusion 500b is provided with an air hole 502b (fourth air hole). In addition, the chip carrying module 5 may also have a mobile device and an air faucet, but the mobile device and the air faucet are not the key points of this embodiment, and therefore are not described in detail.

Since the structure of the chip carrier 4 to be carried is different from that of the chip carrier 1, the chip carrying module 5 is slightly different from that shown in fig. 6, and for example, the chip carrying module 5 may not have a thimble. In practice, since the receiving position 402a is slightly recessed from the upper surface 40a, the chip placed in the receiving position 402a may be fixed slightly, and the chip itself may have residual glue enough to be substantially fixed in the receiving position 402a without displacement during transportation. In other words, the chip carrying module 5 does not abut against the chip by the ejector pin at the corresponding position, and does not affect carrying the chip carrier 4 and the plurality of chips carried by the chip carrier 4. Further, the chip carrying module 5 is different from fig. 6 in that, since the two ends (the plane 404a and the plane 404b) of the main body 40 of the chip carrier 4 are lower than the upper surface 40a, the first protruding portion 500a and the second protruding portion 500b should protrude further from the bottom surface 50a than that of fig. 6, and can be attached to the positions of the plane 404a and the plane 404b, respectively. In addition, since the flat surface 404a and the flat surface 404b do not have the upper guide groove, the first protrusion 500a and the second protrusion 500b may have the first suction groove 504a and the second suction groove 504b, respectively, in order to improve the vacuum suction effect.

In the example shown in fig. 8, the

suction holes

502a and 502b are respectively formed in the first adsorption groove 504a and the second adsorption groove 504 b. When the first protrusion 500a and the second protrusion 500b are attached to the plane 404a and the plane 404b, respectively, the first adsorption groove 504a and the plane 404a may form an air chamber (first air chamber), and the second adsorption groove 504b and the plane 404b may form an air chamber (second air chamber), so that a certain space may be reserved as well, which should help to suck the object tightly.

The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementations of the technology of the present application in any way, and those skilled in the art can make modifications or changes to other equivalent embodiments without departing from the scope of the technology disclosed in the present application, but should be construed as technology or implementations substantially the same as the present application.

Claims

1. A chip carrier for carrying a plurality of chips, the chip carrier comprising:

the body part is defined with an upper surface and a lower surface and is provided with a plurality of air guide holes, and two ends of each air guide hole are respectively exposed out of the upper surface and the lower surface;

wherein some of the air holes are defined as a first group, and the air holes defined as the first group are communicated with each other;

wherein the body portion is made of an electrically conductive material.

2. The carrier as claimed in claim 1, wherein the body has a first groove for communicating the air holes of the first group.

3. The chip carrier as claimed in claim 2, wherein the first trench is exposed at the bottom surface.

4. The carrier as claimed in claim 3, wherein the body portion has a first positioning hole and a second positioning hole exposed at the lower surface, and the first groove is between the first positioning hole and the second positioning hole.

5. The chip carrier as claimed in claim 1, wherein the top surface defines a plurality of receiving locations, each of the receiving locations having one of the air vents therein, and each of the receiving locations being configured to correspond to one of the chips.

6. The carrier as claimed in claim 5, wherein the chip covers the air holes in the accommodating position when the chip is disposed at the corresponding accommodating position.

7. The chip carrier as claimed in claim 5, wherein the body has a first upper guide groove and a second upper guide groove, the first upper guide groove and the second upper guide groove are exposed out of the upper surface, and the receiving positions are between the first upper guide groove and the second upper guide groove.

8. The carrier as claimed in claim 5, wherein each of the receiving locations is a cavity having one of the air holes therein.

9. A chip test module, comprising:

the heat conducting block is provided with a plurality of air pumping pipelines; and

the heat dissipation seat body is arranged on the heat conduction block and is adjacent to one edge of the heat conduction block, a first positioning column, a second positioning column, a first air exhaust hole and a second air exhaust hole are arranged on the upper surface of the heat dissipation seat body, and the first air exhaust hole and the second air exhaust hole are positioned between the first positioning column and the second positioning column;

the second air exhaust hole is positioned in a vacuum guide groove, the vacuum guide groove is exposed out of the upper surface, the first air exhaust hole and the second air exhaust hole are respectively communicated with one of the air exhaust pipelines, and the first air exhaust hole and the second air exhaust hole are not coplanar.

10. The chip testing module of claim 9, wherein when a chip carrier is disposed on the heat sink base, the first positioning pillar and the second positioning pillar respectively correspond to the first positioning hole and the second positioning hole of the chip carrier.

11. The chip testing module of claim 9, wherein when a chip carrier is disposed on the heat sink base, the first air-extracting hole is used to communicate with at least one air-guide hole of the chip carrier, and the second air-extracting hole is used to absorb the chip carrier.

12. A chip handling module, comprising:

the suction nozzle base is provided with a first bulge and a second bulge on the bottom surface, the first bulge is provided with a third air suction hole, the second bulge is provided with a fourth air suction hole, and the top surfaces of the first bulge and the second bulge form a coplanar surface;

when the suction nozzle base body adsorbs a chip carrying platform, a first air chamber and a second air chamber are respectively formed between the first bulge part and the second bulge part and the chip carrying platform, and the air pressure in the first air chamber and the second air chamber is smaller than the ambient air pressure.

13. The chip handling module of claim 12, further comprising a plurality of pins disposed between the first and second bumps, each pin corresponding to one of a plurality of receiving locations of the chip carrier.

14. The chip handling module of claim 13, wherein the third suction hole and the fourth suction hole are configured to absorb the chip carrier, and each of the pins is configured to abut against a chip to fix the chip at the corresponding receiving position when the nozzle body absorbs the chip carrier.

15. The chip handling module of claim 12, wherein the first and second protrusions have first and second suction grooves on top surfaces thereof, respectively, and the first and second suction grooves form the first and second air chambers with the chip carrier when the nozzle body is sucking the chip carrier.