CN115084343A - Optical module routing and bonding system and routing method - Google Patents
Optical module routing and bonding system and routing method Download PDFInfo
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- CN115084343A CN115084343A CN202210498445.1A CN202210498445A CN115084343A CN 115084343 A CN115084343 A CN 115084343A CN 202210498445 A CN202210498445 A CN 202210498445A CN 115084343 A CN115084343 A CN 115084343A
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- 238000003825 pressing Methods 0.000 claims abstract description 78
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- 238000001179 sorption measurement Methods 0.000 claims description 39
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- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
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Abstract
The invention relates to the technical field of packaging, in particular to an optical module routing and bonding system and a routing method, which comprise a workbench, a material strip, a pressing plate, a routing device and a material strip conveying mechanism; the pressing plate and the workbench can move up and down and are respectively arranged above and below the material strips; the routing device is arranged above the pressing plate; a plurality of accommodating grooves for accommodating optical transceiver modules to be wire-bonded are arranged on the material strip side by side, and a transmitting end wire bonding area and a receiving end wire bonding area are arranged on the workbench and respectively correspond to two adjacent accommodating grooves on the material strip; the workbench is matched with the accommodating groove and is used for fixing the transmitting end substrate of the optical transceiver module in the transmitting end routing area; the pressing plate is matched with the accommodating groove and used for fixing a receiving end substrate of the optical transceiver module in the receiving end wiring area. The invention can wire the optical module with the height difference between the transmitting end substrate and the receiving end substrate on the same wire bonding equipment and material strip, has simple operation, high efficiency and good wire bonding yield, and is convenient to realize production automation.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to an optical module routing and bonding system and a routing method.
Background
In the field of optical communications, in order to meet the requirement of high speed of an optical transceiver module, a COB (chip on Board) packaging form is often adopted to package optical Chips with multiple groups of speeds together in a combined manner, that is, the optical Chips and related elements are directly attached to a substrate, and then electrical connection is achieved through wire bonding and other modes. The packaging mode has the advantages of space saving, packaging operation simplification, good heat dissipation, low cost and the like.
As shown in fig. 1, the optical transceiver module 1 includes two parts, namely, an optical receiving module and an optical transmitting module, in some COB packaged optical transceiver modules, since the optical transmitting module is sensitive to temperature, it is disposed on a high thermal conductive substrate (heat sink) which is used as a transmitting end substrate 11; the light receiving component is only required to be arranged on a common substrate (PCB), and the common substrate (PCB) is used as a receiving end substrate 12; the transmitting end substrate 11 of the light emitting module and the receiving end substrate 12 of the light receiving module are assembled and fixed together by glue or other methods, and usually adopt a form of splicing up and down. Because there are many elements distributed on the lower surface of the receiving end substrate 12 of the light receiving assembly, and the light emitting assembly is disposed on the transmitting end substrate 11, and there is no element distributed on the lower surface of the corresponding transmitting end substrate 11, usually, one end of the transmitting end substrate 11 of the light emitting assembly is fixedly connected below the receiving end substrate 12 of the light receiving assembly, which is convenient for packaging. During packaging, the light receiving module is required to be wire-bonded to the receiving end substrate 12, and the light emitting module is also wire-bonded to the receiving end substrate 12 of the light receiving module, so as to realize electrical connection.
For the light emitting assembly, on the transmitting end substrate 11 with limited size, a plurality of paths of high-speed optical chips need to be integrated, so that the components on the light emitting assembly are distributed densely, and spare space is not easily provided for pressing and fixing a pressing plate; the chip or the component is easy to touch in the operation of fixing the light emitting component by the pressing plate, so that the damage is caused.
And the transmitting end substrate 11 of the light emitting module and the receiving end substrate 12 of the light receiving module are easy to generate unstable height difference during splicing and assembling, which may cause that the pre-designed pressing plate cannot simultaneously match the transmitting end substrate 11 of the light emitting module and the receiving end substrate 12 of the light receiving module, resulting in failure to simultaneously press the transmitting end substrate 11 of the light emitting module and the receiving end substrate 12 of the light receiving module on a material strip or a fixing clamp, thereby causing poor routing of the light emitting module or the light receiving module. For this reason, for this type of optical module, the conventional wire bonding method generally includes that different material strips and fixing fixtures are respectively used for the transmitting assembly and the receiving assembly, for example, after wire bonding of the transmitting assembly is completed, the material strips and the optical module are manually removed, the optical module is switched to the receiving terminal wire bonding material strip and fixed by the corresponding fixture, and then the fixed optical module is placed in wire bonding equipment for wire bonding of the receiving terminal. This kind of mode needs to design two kinds of material strips and anchor clamps, and optical module emission subassembly end and receiving element end moreover can not accomplish the routing operation in same material strip and routing equipment, need switch back and forth, probably because of artifical mistake bumps and leads to damaging chip or circuit in the switching process, complex operation, production efficiency are low moreover.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide an optical module wire bonding system and a wire bonding method, wherein optical transceiver modules corresponding to a transmitting terminal wire bonding area and a receiving terminal wire bonding area are fixed in different fixing modes, so that the wire bonding of the transmitting terminal and the receiving terminal of the optical transceiver module with uncertain height difference between a transmitting terminal substrate and a receiving terminal substrate can be realized on the same wire bonding equipment and material strips, the need of switching different material strips or clamps back and forth can be avoided, the operation is simple, the efficiency is high, the wire bonding yield is good, and the production automation is convenient to realize.
In order to achieve the purpose, the technical scheme of the invention is an optical module wire bonding system which comprises a workbench, a material strip, a pressing plate, a wire bonding device and a material strip conveying mechanism for conveying the material strip; the pressing plate and the workbench can move up and down and are respectively arranged above and below the material strip; the routing device is arranged above the pressing plate; a plurality of accommodating grooves for accommodating optical transceiver modules to be wire-bonded are arranged on the material strip side by side, and a transmitting end wire bonding area and a receiving end wire bonding area are arranged on the workbench and respectively correspond to two adjacent accommodating grooves on the material strip; the workbench is matched with the accommodating groove and is used for fixing an emitting end substrate of the optical transceiver module in the emitting end routing area; the pressing plate is matched with the accommodating groove and used for fixing a receiving end substrate of the optical transceiver module in the receiving end wiring area.
Further, be provided with the through-hole that supplies the transmitting terminal base plate of optical transceiver module to pass on the bottom surface of holding tank, the transmitting terminal of workstation is provided with the vacuum adsorption piece that is used for adsorbing fixed transmitting terminal base plate on the line area of beating, the vacuum adsorption piece with the through-hole phase-match.
Furthermore, a plurality of vent holes are formed in the top surface of the vacuum adsorption block, air exhaust holes communicated with an air exhaust device are formed in the workbench, and each vent hole is communicated with the air exhaust hole.
Furthermore, the sum of the depth of the emission end substrate extending into the through hole and the height of the vacuum adsorption block is greater than the depth of the through hole.
Furthermore, a full opening is arranged at the position, corresponding to the wire bonding area of the transmitting end, on the pressing plate, and is used for a wire bonding head of the wire bonding device to penetrate through so as to wire bond the transmitting end of the optical transceiver module; and an avoiding opening is arranged at the position, corresponding to the receiving end routing area, on the pressing plate and used for enabling a routing head of the routing device to penetrate through so as to route the receiving end of the optical transceiver module.
Furthermore, a receiving end golden finger limiting boss is arranged in the accommodating groove, a receiving end golden finger pressing table is arranged at the position, corresponding to the receiving end wire bonding area, of the bottom surface of the pressing plate, and is matched with the receiving end golden finger pressing table to press and fix a receiving end substrate near a receiving end golden finger of the optical transceiver module.
Furthermore, a wave splitting and combining component back limiting boss is arranged in the accommodating groove, a receiving end wave splitting and combining component pressing table is arranged at the position, corresponding to the wave splitting and combining component back limiting boss of the receiving end wire bonding area, on the bottom surface of the pressing plate, and the wave splitting and combining component back limiting boss and the receiving end wave splitting and combining component pressing table are matched to press and fix a receiving end substrate near the receiving end wave splitting and combining component of the optical transceiver module.
The invention also provides an optical module routing method, which comprises the following steps:
s1, placing the material strip on the material strip conveying mechanism, wherein from one end far away from the routing area of the transmitting end, the first accommodating groove is empty, and the other accommodating grooves are sequentially provided with the optical transceiver modules;
s2, the material strip conveying mechanism drives the material strips to move, so that the first accommodating groove and the second accommodating groove are respectively arranged in the receiving end wire bonding area and the transmitting end wire bonding area;
s3, preheating and moving the workbench upwards, and fixing the transmitting end substrate of the optical transceiver module therein by matching the workbench with the second accommodating groove;
s4, routing the transmitting end of the optical transceiver module above the second accommodating groove by the routing head of the routing device; after the routing of the transmitting end is finished, the workbench is moved downwards, so that the optical transceiver module falls back and is horizontally placed in a second accommodating groove;
s5, the material strip conveying mechanism drives the material strips to move, so that the second accommodating groove and the third accommodating groove are respectively arranged in the receiving end wire bonding area and the transmitting end wire bonding area;
s6, preheating and moving the workbench upwards, and fixing the transmitting end substrate of the optical transceiver module therein by matching the workbench with the third accommodating groove; the pressing plate is moved downwards, and the receiving end substrate of the optical transceiver module is fixed through the cooperation of the pressing plate and the second accommodating groove;
s7, routing the receiving end of the optical transceiver module above the second accommodating groove by the routing head of the routing device; after the receiving end finishes routing, a routing head of the routing device moves and routes a transmitting end of the optical transceiver module above the third accommodating groove; after the routing of the transmitting end is finished, the workbench is moved downwards, the optical transceiver module falls back and is horizontally placed in a third accommodating groove, and the pressing plate is moved upwards;
s8, the steps S5-S7 are repeated until all the optical transceiver modules in the material strip finish wire bonding.
Further, in step S3 and step S6, when the worktable is preheated and moved upward, the vacuum adsorption is started, so that the vacuum adsorption blocks on the worktable extend into the through holes on the corresponding accommodating grooves and adsorb and fix the transmitting end substrates of the optical transceiver modules in the accommodating grooves; then, continuously moving the workbench upwards until the workbench is contacted with the bottom surface of the corresponding accommodating groove, so that the optical transceiver module is suspended and fixed above the corresponding accommodating groove; in steps S4 and S7, after the wire bonding of the transmitting terminal is finished, the vacuum adsorption is turned off, the worktable is moved down to make the optical transceiver module fall back and flatly placed in the corresponding accommodating groove, and the worktable is continuously moved down to make the vacuum adsorption block withdraw and leave the through hole on the corresponding accommodating groove.
Further, in step S6, the pressing plate is moved downward, so that the receiving-end golden finger pressing stage and the receiving-end integrated and combined wave module pressing stage on the bottom surface of the pressing plate are respectively pressed on the receiving-end golden finger limiting boss and the integrated and combined wave module back limiting boss in the second accommodating groove, and the receiving-end substrate of the optical transceiver module in the second accommodating groove is fixed on the material strip.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the transmitting terminal wiring area and the receiving terminal wiring area are respectively arranged on the workbench, and the optical receiving and transmitting modules corresponding to the transmitting terminal wiring area and the receiving terminal wiring area are respectively in different fixing structures, so that the transmitting terminal on the optical receiving and transmitting module of the transmitting terminal wiring area on the material strip and the receiving terminal on the optical receiving and transmitting module of the receiving terminal wiring area are respectively wired, so that the optical receiving and transmitting modules corresponding to the wiring areas can be well fixed when the transmitting terminal and the receiving terminal are respectively wired, and the problem that the wiring yield is influenced due to poor fixing caused by the uncertainty of the height difference of the transmitting terminal substrate and the receiving terminal substrate on the optical module is solved;
(2) the invention can wire the transmitting terminal and the receiving terminal of the optical transceiver module with uncertain height difference between the transmitting terminal substrate and the receiving terminal substrate on the same wire bonding device and material strip, effectively solves the problem of wire bonding fixation of two ends with different height difference, avoids the need of switching different material strips or clamps back and forth to respectively realize wire bonding of the receiving terminal and wire bonding of the transmitting terminal, has simple operation and high efficiency, and is convenient for realizing production automation;
(3) according to the invention, the routing operation of the transmitting terminal and the receiving terminal of one optical transceiver module is staggered, routing is divided into two times, and the routing is fixed in different fixing modes, so that the influence of uncertainty of height difference is avoided; meanwhile, the routing is realized through a routing system, and after routing of the receiving end of the previous module is finished, routing of the transmitting end of the next adjacent module can be directly carried out without extra operation; after routing is finished, moving the material strip, and repeating routing of the receiving end of the next module and the transmitting end of the lower module; the problem of tedious operations such as material strip switching and fixing devices when the transmitting terminal routing and the receiving terminal routing are carried out is avoided, the equipment is simple, clamp material strips do not need to be additionally designed, efficiency is high, and routing yield is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a simplified schematic diagram of a conventional optical transceiver module;
fig. 2 is a schematic structural diagram of an optical module wire bonding system according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a workbench according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a backside of a workbench according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a bar according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a platen according to an embodiment of the present invention;
FIG. 7 is a schematic perspective view of the back side of a platen according to an embodiment of the present invention;
in the figure: 1. an optical transceiver module; 11. an emitter substrate; 12. a receiving end substrate; 2. a work table; 21. a transmitting terminal wiring area; 211. a vacuum adsorption block; 212. a vent hole; 213. an air exhaust hole; 22. a receiving end wiring area; 3. material strips; 31. a through hole; 32. a gold finger limiting boss at the receiving end; 33. the back side limiting boss of the wave splitting and combining component; 34. a bearing platform; 4. pressing a plate; 41. fully opening; 42. a golden finger pressing table at the receiving end; 43. the receiving end divides the wave combination component and presses the platform; 44. avoiding the opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Example one
As shown in fig. 2, the present embodiment provides an optical module wire bonding system, which includes a worktable 2, a material bar 3, a pressing plate 4, a wire bonding device, and a material bar conveying mechanism for conveying the material bar 3; the pressing plate 4 and the workbench 2 can move up and down and are respectively arranged above and below the material strip 3; the routing device is arranged above the pressing plate 4; a plurality of accommodating grooves for accommodating the optical transceiver modules 1 to be wire-bonded are arranged on the material strip 3 side by side, and a transmitting end wire bonding area 21 and a receiving end wire bonding area 22 are arranged on the workbench 2 and respectively correspond to two adjacent accommodating grooves on the material strip 3; the workbench 2 is matched with the accommodating groove and is used for fixing the transmitting end substrate 11 of the optical transceiver module 1 of the transmitting end wiring area 21; the pressing plate 4 is matched with the accommodating groove and used for fixing the receiving end substrate 12 of the optical transceiver module 1 in the receiving end wiring area 22. In the embodiment, the transmitting end wiring area 21 and the receiving end wiring area 22 are respectively arranged on the workbench 2, and the optical transceiver modules corresponding to the transmitting end wiring area 21 and the receiving end wiring area 22 respectively adopt different fixing structures, so that the transmitting end on the optical transceiver module 1 of the transmitting end wiring area 21 on the material strip 3 and the receiving end on the optical transceiver module 1 of the receiving end wiring area 22 are respectively wired, and the substrates of the optical transceiver modules 1 corresponding to the wiring areas can be well fixed when the transmitting end and the receiving end are wired respectively, thereby avoiding the problem that the wiring yield is influenced due to poor fixation caused by uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12 on the optical module; and can realize that the transmitting terminal and the receiving terminal of the optical transceiver module 1 with uncertain height difference between the transmitting terminal substrate 11 and the receiving terminal substrate 12 are wire-bonded on the same wire-bonding device and the material strip 3, effectively solving the problem of wire-bonding fixation at two ends with different height difference, avoiding the need of switching different material strips or clamps back and forth to respectively realize wire-bonding at the receiving terminal and wire-bonding at the transmitting terminal, and having simple operation, high efficiency and convenient realization of production automation.
Wherein, workstation 2 is heating platform, can set up heating device in workstation 2 and heat workstation 2 for preheat the routing region. The workbench 2 is at least provided with a group of transmitting terminal cabling area 21 and a group of receiving terminal cabling area 22, and a plurality of groups of transmitting terminal cabling areas 21 and receiving terminal cabling areas 22 respectively corresponding to a plurality of adjacent accommodating grooves on the material strip 3 can also be arranged.
The pressing plate 4 is fixed above the material strip 3 through a pressing plate moving mechanism, and the pressing plate moving mechanism can drive the pressing plate 4 to move up and down; when the receiving end of the optical transceiver module 1 is wire-bonded, the pressing plate moving mechanism drives the pressing plate 4 to move downwards and to be matched with the accommodating groove to fix the receiving end substrate 12 of the optical transceiver module 1 on the material strip 3; after the routing is finished at the receiving end, the pressing plate moving mechanism drives the pressing plate 4 to move upwards to be away from the material strip 3, so that the material strip 3 moves to route the optical transceiver module 1 in the next accommodating tank.
The workbench 2 is fixed below the material strips 3 through a workbench movement mechanism, and the workbench movement mechanism can drive the workbench 2 to move up and down; when the transmitting end of the optical transceiver module 1 is wire-bonded, the workbench moving mechanism drives the workbench 2 to move upwards and cooperate with the accommodating groove to fix the transmitting end substrate 11 of the optical transceiver module 1 and jack up the suspended material strip, so that the influence of uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12 is avoided; after the routing is finished at the transmitting end, the workbench moving mechanism drives the workbench 2 to move downwards and drop the optical transceiver module 1 back and flatly put into the accommodating tank, so that the material strip 3 moves to route the optical transceiver module 1 in the next accommodating tank.
The material strips 3 are arranged on the material strip conveying mechanism, and the material strip conveying mechanism drives the material strips 3 to move in the horizontal direction; specifically, material strip 3 all is provided with the gear and cooperates with the material strip guide rail on the material strip transport mechanism along direction of transfer's both sides, realizes shifting the switching to material strip 3.
Further, be provided with the through-hole 31 that supplies the transmitting terminal base plate 11 of optical transceiver module 1 to pass on the bottom surface of holding tank, be provided with the vacuum adsorption piece 211 that is used for adsorbing fixed transmitting terminal base plate 11 on the transmitting terminal wiring district 21 of workstation 2, vacuum adsorption piece 211 with through-hole 31 phase-match. As shown in fig. 3, the vacuum absorption block 211 is protruded on the upper surface of the worktable 2, so that the vacuum absorption block 211 can penetrate through the through hole 31 correspondingly formed on the material strip 3 to absorb and fix the transmitting terminal substrate 11, thereby realizing the fixing of the transmitting terminal and the preheating during the routing of the transmitting terminal. The size of the vacuum adsorption block 211 can be matched and set according to the size of the transmitting end substrate 11 of the actual optical transceiver module 1, so that the vacuum adsorption block 211 can at least cover the overlapping area of the transmitting end substrate 11 and the receiving end substrate 12, namely, the area to be wire-bonded, in which the transmitting end substrate 11 is wire-bonded to the receiving end substrate 12, is covered; the through hole 31 can accommodate the emitter substrate 11 and also accommodate the vacuum absorption block 211 protruded from the table 2.
Furthermore, a plurality of vent holes 212 are formed on the top surface of the vacuum suction block 211, a suction hole 213 communicated with a suction device is formed on the worktable 2, and each vent hole 212 is communicated with the suction hole 213. As shown in fig. 3 and 4, the vent hole 212 of the vacuum suction block 211 is connected to an air suction device through an air suction hole 213 of the table 2, and the vacuum suction block 211 sucks and fixes the emitter substrate 11 by vacuum suction by the air suction device. Wherein, the air extracting device can adopt a vacuum pump. Optimally, the air extractor is further provided with a vacuum gauge for monitoring whether the vacuum adsorption block 211 reaches the expected index of vacuum adsorption when fixing the transmitting end substrate 11, so that the reliability of vacuum adsorption fixation is ensured.
Furthermore, the sum of the depth of the transmitting end substrate 11 extending into the through hole 31 and the height of the vacuum adsorption block 211 is greater than the depth of the through hole 31, so that when the vacuum adsorption block 211 adsorbs and jacks up the transmitting end substrate 11 to the top surface of the workbench 2 to be contacted with the bottom surface of the material strip 3, the transmitting end of the optical transceiver module 1 is suspended away from the material strip, and the influence of uncertainty of height difference between the transmitting end and the receiving end is avoided during routing.
Furthermore, a full opening 41 is arranged at a position, corresponding to the transmitting end routing area 21, on the pressing plate 4, and is used for a routing head of a routing device to pass through so as to route the transmitting end of the optical transceiver module 1; an avoiding opening 44 is formed at a position of the pressing plate 4 corresponding to the receiving end routing area 22, and is used for a routing head of a routing device to pass through so as to route the receiving end of the optical transceiver module 1, as shown in fig. 6.
Further, a receiving end golden finger limiting boss 32 is arranged in the accommodating groove, a receiving end golden finger pressing table 42 is arranged at a position, corresponding to the receiving end golden finger limiting boss 32 of the receiving end wiring area 22, on the bottom surface of the pressing plate 4, and the receiving end golden finger limiting boss 32 and the receiving end golden finger pressing table 42 are in up-and-down correspondence and are mutually matched to press and fix the receiving end substrate 12 near the receiving end golden finger of the optical transceiver module 1, as shown in fig. 5 and 7.
Furthermore, a bearing platform 34 is disposed at an edge of an end of the accommodating groove opposite to the receiving end golden finger limiting boss 32, as shown in fig. 5.
Further, a wave splitting and combining component back limiting boss 33 is arranged in the accommodating groove, a receiving end wave splitting and combining component pressing table 43 is arranged on the bottom surface of the pressing plate 4 corresponding to the receiving end wire bonding area 22 at the position of the wave splitting and combining component back limiting boss 33, the wave splitting and combining component back limiting boss 33 and the receiving end wave splitting and combining component pressing table 43 are vertically corresponding in position and are matched with each other to press and fix the receiving end substrate 12 near the receiving end wave splitting and combining component of the optical transceiver module 1, as shown in fig. 5-7.
Example two
The embodiment also provides an optical module routing method, and the system provided by the first embodiment comprises the following steps:
s1, placing the material strip 3 on the material strip conveying mechanism, wherein a first accommodating groove is empty from one end far away from the transmitting end wire bonding area 21, and the light receiving and transmitting modules 1 are sequentially placed in the rest accommodating grooves;
s2, the material strip conveying mechanism drives the material strip 3 to move, so that the first accommodating groove and the second accommodating groove are respectively arranged in the receiving end wire bonding area 22 and the transmitting end wire bonding area 21;
s3, starting vacuum adsorption, and when preheating and moving the worktable 2 upwards, extending the vacuum adsorption block 211 on the worktable 2 into the through hole 31 on the second accommodation groove and adsorbing and fixing the transmitting terminal substrate 11 of the optical transceiver module 1 in the second accommodation groove, and preheating the routing area of the transmitting terminal of the optical transceiver module 1; then, the workbench 2 is moved upwards continuously until the workbench 2 contacts the bottom surface of the material strip 3, so that the optical transceiver module 1 leaves the second accommodating groove and is suspended and fixed above the second accommodating groove through the vacuum adsorption block 211, and the influence of uncertainty of the height difference between the transmitting end substrate 11 and the receiving end substrate 12 is avoided; in the process, the optical transceiver modules 1 in the rest of the accommodating grooves are still naturally placed on the corresponding accommodating grooves, and the material strips 3 are naturally and flatly attached to the workbench 2;
s4, a routing head of the routing device can directly pass through the full opening 41 on the pressing plate 4 to route the transmitting end of the optical transceiver module 1 above the second accommodating groove; after the routing of the transmitting end is finished, the vacuum adsorption is closed, the workbench 2 is moved downwards, the optical transceiver module 1 falls back and is horizontally placed in a second accommodating groove, the workbench 2 is continuously moved downwards, the vacuum adsorption block 211 is retreated and leaves the through hole 31 on the second accommodating groove, the transmitting end substrate 11 is moved downwards into the through hole 31, the bottom surface of the transmitting end substrate 11 cannot protrude out of the lower surface of the through hole 31 of the material strip 3, and therefore the influence of uncertainty of the height difference of the two substrates is avoided;
s5, the material strip conveying mechanism drives the material strips 3 to move, so that the second accommodating groove and the third accommodating groove are respectively arranged in the receiving end wire bonding area 22 and the transmitting end wire bonding area 21;
s6, starting vacuum adsorption, and when preheating and moving the worktable 2 upward, extending the vacuum adsorption block 211 on the worktable 2 into the through hole 31 on the third accommodation groove and adsorbing and fixing the transmitting terminal substrate 11 of the optical transceiver module 1 in the third accommodation groove, and preheating the routing area of the transmitting terminal of the optical transceiver module 1; then, the workbench 2 is continuously moved upwards until the workbench 2 is contacted with the bottom surface of the material strip 3, so that the optical transceiver module 1 leaves the third accommodating groove and is suspended and fixed above the third accommodating groove through the vacuum adsorption block 211;
moving down the pressing plate 4 to press the receiving end golden finger pressing table 42 and the receiving end wave splitting and combining assembly pressing table 43 on the bottom surface of the pressing plate 4 on the receiving end golden finger limiting boss 32 and the wave splitting and combining assembly back limiting boss 33 in the second accommodating groove respectively, pressing the receiving end substrate 12 of the optical transceiver module 1 in the second accommodating groove on the material strip 3, pressing the material strip 3 on the receiving end wiring area 22 of the workbench 2, and preheating the wiring area of the receiving end of the optical transceiver module 1 by the workbench 2 through the material strip 3 and the limiting bosses on the material strip 3;
s7, a routing head of the routing device passes through the avoiding opening 44 on the pressing plate 4 to route the receiving end of the optical transceiver module 1 above the second accommodating groove; after the routing of the receiving end is finished, a routing head of the routing device moves and passes through the full opening 41 on the pressing plate 4 to route the transmitting end of the optical transceiver module 1 above the third accommodating groove;
after the routing of the transmitting end is finished, the vacuum adsorption is closed, the workbench 2 is moved downwards, the optical transceiver module 1 falls back and is horizontally placed in a third accommodating groove, the workbench 2 is continuously moved downwards, the vacuum adsorption block 211 is retreated and leaves a through hole 31 in the third accommodating groove, the transmitting end substrate 11 moves downwards into the through hole 31, the bottom surface of the transmitting end substrate 11 cannot protrude out of the lower surface of the through hole 31 of the material strip 3, and the pressing plate 4 is moved upwards;
s8, the steps S5-S7 are repeated until all the optical transceiver modules 1 in the material strip 3 complete wire bonding.
In the embodiment, the routing operation of the transmitting terminal and the receiving terminal of one optical transceiver module 1 is staggered, routing is divided into two times, and the routing is fixed in different fixing modes, so that the influence of uncertainty of height difference is avoided; in the routing process, after routing of the receiving end of the previous optical module is finished, routing of the transmitting end of the next adjacent optical module can be directly carried out without extra operation; after routing is finished, moving the material strip 3, and repeating routing of the receiving end of the next optical module and the transmitting end of the next optical module; the problem of tedious operations such as material strip switching and fixing devices when the transmitting terminal routing and the receiving terminal routing are carried out is avoided, the equipment is simple, clamp material strips do not need to be additionally designed, efficiency is high, and routing yield is good.
When the transmitting terminal is wire-bonded, the transmitting terminal substrate 11 of the optical transceiver module 1 is only adsorbed and fixed by the vacuum adsorption block 211, because the vacuum adsorption block 211 basically covers the transmitting terminal substrate 11, and the transmitting terminal substrate 11 covers the transmitting terminal chip and the corresponding bonding region on the receiving terminal substrate 12, the whole transmitting terminal substrate 11 can be adsorbed and fixed by the vacuum adsorption block 211, and further the transmitting terminal chip and the bonding region can be supported and fixed; when the transmitting terminal is routing, the transmitting terminal of the optical transceiver module 1 is suspended from the material strip 3, so that the influence of uncertainty of height difference between the transmitting terminal and the receiving terminal is avoided, and the transmitting terminal chip can be well routed to the bonding area on the receiving terminal substrate 12.
Optimally, in steps S3 and S6, when the vacuum suction block 211 is used to suck the emitter substrate 11, when the air pressure measured by the vacuum gauge on the air extractor connected to the vacuum suction block 211 meets the vacuum suction index, it indicates that the vacuum suction block 211 of the emitter wiring region 21 on the table 2 is in end-face contact with and is sucked and fixed with the emitter substrate 11.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An optical module wire bonding system is characterized in that: the device comprises a workbench, a material strip, a pressing plate, a routing device and a material strip conveying mechanism for conveying the material strip; the pressing plate and the workbench can move up and down and are respectively arranged above and below the material strip; the routing device is arranged above the pressing plate; a plurality of accommodating grooves for accommodating optical transceiver modules to be wire-bonded are arranged on the material strip side by side, and a transmitting end wire bonding area and a receiving end wire bonding area are arranged on the workbench and respectively correspond to two adjacent accommodating grooves on the material strip; the workbench is matched with the accommodating groove and is used for fixing an emitting end substrate of the optical transceiver module in the emitting end routing area; the pressing plate is matched with the accommodating groove and used for fixing a receiving end substrate of the optical transceiver module in the receiving end wiring area.
2. The optical module wire bonding system of claim 1, wherein: the bottom surface of holding tank is provided with the through-hole that supplies the transmitting terminal base plate of light transceiver module to pass, the transmitting terminal of workstation is provided with the vacuum adsorption piece that is used for adsorbing fixed transmitting terminal base plate on the line area of beating, the vacuum adsorption piece with the through-hole phase-match.
3. The optical module wire bonding system of claim 2, wherein: the top surface of the vacuum adsorption block is provided with a plurality of vent holes, the workbench is provided with air exhaust holes communicated with an air exhaust device, and each vent hole is communicated with the air exhaust holes.
4. The optical module wire bonding system of claim 2, wherein: the sum of the depth of the transmitting end substrate extending into the through hole and the height of the vacuum adsorption block is greater than the depth of the through hole.
5. The optical module wire bonding system of claim 1, wherein: a full opening is formed in the position, corresponding to the wire bonding area of the transmitting end, of the pressing plate, and is used for a wire bonding head of a wire bonding device to penetrate through so as to wire bond the transmitting end of the optical transceiver module; and an avoiding opening is arranged at the position, corresponding to the receiving end routing area, on the pressing plate and used for enabling a routing head of the routing device to penetrate through so as to route the receiving end of the optical transceiver module.
6. The optical module wire bonding system of claim 1, wherein: the receiving end golden finger limiting boss is arranged in the containing groove, a receiving end golden finger pressing table is arranged at the position, corresponding to the receiving end wire bonding area, of the bottom surface of the pressing plate, and the receiving end golden finger limiting boss and the receiving end golden finger pressing table are matched to press and fix a receiving end substrate near a receiving end golden finger of the light receiving and transmitting module.
7. The optical module wire bonding system of claim 1, wherein: the receiving groove is internally provided with a wave splitting and combining component back limiting boss, a receiving end wave splitting and combining component pressing table is arranged at the position, corresponding to the receiving end wire bonding area, of the wave splitting and combining component back limiting boss on the bottom surface of the pressing plate, and the wave splitting and combining component back limiting boss and the receiving end wave splitting and combining component pressing table are matched to press and fix a receiving end substrate near a receiving end wave splitting and combining component of the optical transceiver module.
8. An optical module routing method is characterized by comprising the following steps:
s1, placing the material strip on the material strip conveying mechanism, wherein from one end far away from the routing area of the transmitting end, the first accommodating groove is empty, and the other accommodating grooves are sequentially provided with the optical transceiver modules;
s2, the material strip conveying mechanism drives the material strips to move, so that the first accommodating groove and the second accommodating groove are respectively arranged in the receiving end wire bonding area and the transmitting end wire bonding area;
s3, preheating and moving the workbench upwards, and fixing the transmitting end substrate of the optical transceiver module therein by matching the workbench with the second accommodating groove;
s4, routing the transmitting end of the optical transceiver module above the second accommodating groove by the routing head of the routing device; after the routing of the transmitting end is finished, the workbench is moved downwards, so that the optical transceiver module falls back and is horizontally placed in a second accommodating groove;
s5, the material strip conveying mechanism drives the material strips to move, so that the second accommodating groove and the third accommodating groove are respectively arranged in the receiving end wire bonding area and the transmitting end wire bonding area;
s6, preheating and moving the workbench upwards, and fixing the transmitting end substrate of the optical transceiver module therein by matching the workbench with the third accommodating groove; the pressing plate moves downwards, and the receiving end substrate of the optical transceiver module is fixed through the cooperation of the pressing plate and the second accommodating groove;
s7, routing the receiving end of the optical transceiver module above the second accommodating groove by the routing head of the routing device; after the receiving end finishes routing, a routing head of the routing device moves and routes a transmitting end of the optical transceiver module above the third accommodating groove; after the routing of the transmitting end is finished, the workbench is moved downwards, the optical transceiver module falls back and is horizontally placed in a third accommodating groove, and the pressing plate is moved upwards;
s8, the steps S5-S7 are repeated until all the optical transceiver modules in the material strip finish wire bonding.
9. The optical module wire bonding method of claim 8, wherein: in the steps S3 and S6, when the worktable is preheated and moved upward, vacuum adsorption is started, so that the vacuum adsorption blocks on the worktable extend into the through holes on the corresponding accommodating grooves and adsorb and fix the transmitting end substrates of the optical transceiver modules in the accommodating grooves; then, continuously moving the workbench upwards until the workbench is contacted with the bottom surface of the corresponding accommodating groove, so that the optical transceiver module is suspended and fixed above the corresponding accommodating groove; in steps S4 and S7, after the wire bonding of the transmitting terminal is finished, the vacuum adsorption is turned off, the worktable is moved down to make the optical transceiver module fall back and flatly placed in the corresponding accommodating groove, and the worktable is continuously moved down to make the vacuum adsorption block withdraw and leave the through hole on the corresponding accommodating groove.
10. The optical module wire bonding method of claim 8, wherein: in step S6, the pressing plate is moved down to press the receiving-end golden finger pressing stage and the receiving-end splitting and combining component pressing stage on the bottom surface of the pressing plate on the receiving-end golden finger limiting boss and the splitting and combining component back-side limiting boss in the second receiving groove, respectively, and the receiving-end substrate of the optical transceiver module in the second receiving groove is fixed on the material strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210498445.1A CN115084343A (en) | 2022-05-09 | 2022-05-09 | Optical module routing and bonding system and routing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210498445.1A CN115084343A (en) | 2022-05-09 | 2022-05-09 | Optical module routing and bonding system and routing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115084343A true CN115084343A (en) | 2022-09-20 |
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ID=83246756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210498445.1A Pending CN115084343A (en) | 2022-05-09 | 2022-05-09 | Optical module routing and bonding system and routing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115084343A (en) |
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2022
- 2022-05-09 CN CN202210498445.1A patent/CN115084343A/en active Pending
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