CN114959851A

CN114959851A - Carrier with offset angle

Info

Publication number: CN114959851A
Application number: CN202110192866.7A
Authority: CN
Inventors: 李齐良
Original assignee: Baicheng Technology Co ltd
Current assignee: Baicheng Technology Co ltd
Priority date: 2021-02-20
Filing date: 2021-02-20
Publication date: 2022-08-30

Abstract

The invention provides a carrier with an offset angle, comprising: the sliding table is provided with a sliding path; the top end of the vertical frame is combined with the bottom end of the sliding table, and the vertical frame is provided with a vertical surface which slightly deviates from the sliding path, so that the vertical surface of the vertical frame and the sliding path of the sliding table form a deviation angle; and a plurality of clamping elements, each clamping element being disposed at a predetermined position on the vertical frame such that each clamping element is slightly offset with respect to the vertical frame.

Description

Carrier with offset angle

Technical Field

The present invention relates to a carrier with an offset angle, and more particularly, to a carrier with an offset angle between a vertical surface of a vertical frame and a sliding path of a sliding platform.

Background

Printed circuit boards are essential in the information, communication, and consumer electronics industries, and the manufacturing process of printed circuit boards requires developing, plating, stripping, and etching processes to form fine wiring as a base for supporting electronic components and the interconnection of the components. The electroplating process is carried out by clamping the PCB in the rack, driving the rack to move in the engineering equipment by the driver, immersing the PCB in the electroplating bath, and generating electrochemical action with the anode to make the copper ion in the bath be plated on the PCB.

The electroplating rack plays a role of conducting and fixing the printed circuit board in the electroplating process, the area of the printed circuit board, where the circuit pattern is planned, is called an effective area, otherwise, the area of the printed circuit board, where the circuit pattern is not planned, is called an ineffective area, the existing method for fixing the printed circuit board is to arrange a plurality of fixing clips on the electroplating rack, and then the ineffective area of the printed circuit board is clamped by the fixing clips, so that the printed circuit board is fixed on the electroplating rack, and the effective area is prevented from being clamped, but the current is concentrated in the ineffective high current area, therefore, the copper plating thickness of the effective area is not uniform, the maximum value and the minimum value of the copper plating thickness are found in the effective area, and the formula is used as follows: the problem of a large R value is usually found when the R value is calculated from the maximum value to the minimum value. In view of the above problems, the present inventors have conceived a carrier with an offset angle, which is an object of the present invention.

Disclosure of Invention

The present invention is directed to a carrier with an offset angle, wherein the vertical surface of the vertical frame and the sliding path of the sliding table have an offset angle, so as to slightly offset the printed circuit board, overlap each inactive area, and pass current through each inactive area to each active area, thereby making the copper plating thickness of the active area uniform, and further reducing the R value of the copper plating thickness of the active area.

It is another object of the present invention to provide a carrier with an offset angle, which uses a light-weight plate to form a vertical frame, thereby reducing the weight of the carrier.

To achieve the above object, the present invention adopts a technical means comprising: a sliding table, which is provided with a sliding path; the top end of the vertical frame is combined with the bottom end of the sliding table, the vertical frame is provided with a vertical surface, and the vertical surface slightly deviates from the sliding path so that the vertical surface and the sliding path have a deviation angle; and a plurality of clamping elements, each clamping element is arranged at a predetermined position on the vertical frame, so that each clamping element is slightly deviated along with the vertical frame.

According to the characteristics disclosed in the previous paragraph, the offset angle is 1 degree to 5 degrees.

According to a feature of the foregoing, the vertical frame is constructed from a plurality of lightweight panel members.

According to the characteristics of the disclosure, a plurality of guiding rods are disposed below the vertical frame.

According to the aforementioned feature, the retaining element is a spring clip.

According to the characteristics disclosed in the previous paragraph, the electrode device further comprises an electrode rod, and the electrode rod is arranged on the sliding table.

According to the foregoing feature, the apparatus further includes a plurality of printed circuit boards, the surface of the printed circuit board has an active area and an inactive area surrounding the active area, and each of the holding members can hold the inactive area, so that the printed circuit board can slightly shift with the vertical frames.

By means of the technical means disclosed in the invention, the offset angle is formed between the vertical surface of the vertical frame and the sliding path of the sliding table, the printed circuit board can be slightly offset, the invalid regions are overlapped, and the current passes through the invalid regions to the effective regions, so that the copper plating thickness of the effective regions is uniform, and the vertical frame is formed by matching with the light-weight plate, so that the effect of reducing the R value of the copper plating thickness of the effective regions is improved, and the effect of reducing the weight of the carrier is also improved.

Drawings

Fig. 1 is a perspective view of a carrier with an offset angle according to the present invention.

Fig. 2 is a perspective view of the present invention clamping a printed circuit board.

Fig. 3 is a top view of a carrier with an offset angle according to the present invention.

FIG. 4 is a schematic diagram of a plurality of carriers with offset angles according to the present invention.

Fig. 5 is a schematic view showing that a vertical surface of the frame of the present invention has an offset angle from a sliding path of the slide table.

Fig. 6 is an enlarged view of fig. 5 at 6.

FIG. 7 is a schematic illustration of the overlap of the inactive regions of the present invention.

Description of reference numerals: 10 a carrier having an offset angle; 11, a sliding table; 12 a vertical frame; 121 a lightweight panel member; 122 a guide rod; 123 a front side; 124 rear side surface; 13 a clamping element; 20 electrode rods; 30 a printed circuit board; 31 an effective area; 32 an invalid region; d, conveying distance; s vertical plane; an X sliding path; theta is offset by an angle.

Detailed Description

Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the disclosure herein, wherein the following detailed description is provided for illustrative embodiments of the present invention. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

First, referring to fig. 1 to 7, a preferred embodiment of a carrier 10 with an offset angle according to the present invention includes: a slide table 11, the slide table 11 is provided with a slide path X, and in the embodiment, the slide table further includes an electrode rod 20, and the electrode rod 20 is provided on the slide table 11, but is not limited thereto.

A vertical frame 12, the top end of the vertical frame 12 is combined with the bottom end of the sliding table 11, and the vertical frame 12 has a vertical surface S slightly deviating from the sliding path X, so that the vertical surface S of the vertical frame 12 and the sliding path X of the sliding table 11 have a deviation angle θ, in this embodiment, the deviation angle θ is 1-5 degrees; the vertical frame 12 is formed of a plurality of lightweight plate members 121; a plurality of guide rods 122 are provided below the vertical frame 12, but not limited thereto.

A plurality of clamping elements 13, each clamping element 13 is disposed at a predetermined position on the vertical frame 12, so that each clamping element 13 slightly deflects along with the vertical frame 12, in the embodiment, the clamping elements 13 are spring clips, but not limited thereto.

As shown in fig. 2, 4, 5, 6 and 7, the carrier includes a plurality of printed circuit boards 30, the surface of the printed circuit board 30 has an active area 31 and an inactive area 32 surrounding the active area 31, and the carriers 10 with offset angles are plural, and each of the clamping elements 13 can clamp the inactive area 32, so that the printed circuit board 30 is slightly offset along with the vertical frames 12, when the sliding tables 11 are at a predetermined conveying distance D, the rear side 124 of one of the vertical frames 12 is staggered with the front side 123 of the other vertical frame 12, so that the rear side 124 of one of the vertical frames 12 slightly protrudes the inactive area 32 and the front side 123 of the other vertical frame 12 slightly protrudes the inactive area 32 to overlap.

Based on such a structure, when the current flows through the electrode rod 20, the sliding table 11, the vertical frame 12, the clamping element 13 to the printed circuit board 30, the current is uniformly distributed from each of the inactive areas 32 to each of the active areas 31, so that the copper plating thickness of the active areas 31 is uniform, and the maximum value and the minimum value of the copper plating thickness are found in the active areas 31 according to the formula: the calculation of the R value from the maximum value to the minimum value also yields a smaller R value, and the vertical frame 12 formed by the light-weight plates 121 also reduces the weight of the offset-angle carrier 10, which is an effect of a synergistic effect.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A carrier with an offset angle, comprising:

a sliding table, which is provided with a sliding path;

the top end of the vertical frame is combined with the bottom end of the sliding table, the vertical frame is provided with a vertical surface, and the vertical surface slightly deviates from the sliding path so that the vertical surface and the sliding path have a deviation angle; and

a plurality of clamping elements, each of which is arranged at a predetermined position on the vertical frame so that each clamping element is slightly deviated along with the vertical frame.

2. The carrier according to claim 1, wherein the offset angle is 1-5 degrees.

3. The carrier with offset angle as claimed in claim 1, wherein the vertical frame is composed of a plurality of lightweight plate members.

4. The carrier according to claim 1, wherein a plurality of alignment rods are disposed under the vertical frame.

5. The carrier according to claim 1, wherein the retaining member is a spring clip.

6. The carrier with offset angle as claimed in claim 1, further comprising an electrode rod disposed on the slide.

7. The carrier with offset angle as claimed in claim 1, further comprising a plurality of printed circuit boards, wherein the surface of the printed circuit board has an active area and an inactive area surrounding the active area, each of the holding elements is capable of holding the inactive area to slightly offset the printed circuit board with the vertical frames, when the sliding tables are at a predetermined conveying distance, the rear side of one of the vertical frames is interlaced with the front side of the other vertical frame, so that the portion of the rear side of one of the vertical frames protruding the inactive area overlaps the portion of the front side of the other vertical frame protruding the inactive area.