CN114945245B - Precision transfer printing circuit board of multi-end surface mount electronic element and production process - Google Patents
Precision transfer printing circuit board of multi-end surface mount electronic element and production process Download PDFInfo
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- CN114945245B CN114945245B CN202210549316.0A CN202210549316A CN114945245B CN 114945245 B CN114945245 B CN 114945245B CN 202210549316 A CN202210549316 A CN 202210549316A CN 114945245 B CN114945245 B CN 114945245B
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- transfer
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- 238000010023 transfer printing Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 62
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 238000005530 etching Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims description 39
- 230000014759 maintenance of location Effects 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a precise transfer printing circuit board of a multi-end patch electronic element and a production process thereof, and belongs to the technical field of circuit board processing. The invention relates to a precise transfer printing circuit board of a multi-end patch electronic element and a production process thereof. In order to solve the problem that the existing transfer printing circuit board is limited comprehensively in the production process, the expansibility of the transfer printing circuit board is low and can not be selected according to the actual use condition, the transfer printing integrated circuit board is formed by hot-pressing and splicing three-layer main structures of a resin flitch, a transfer printing board and a resin base plate, wherein the transfer printing board is clamped between the resin flitch and the resin base plate, and an external resin board can play a role in oxidation resistance protection on an etching circuit on the surface of the transfer printing board, so that the condition that the circuit structure is worn in the long-term use process can be avoided.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a precise transfer printing circuit board of a multi-end surface mount electronic component and a production process thereof.
Background
A PCB, a printed wiring board, is one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components. The printed circuit board consists of an insulating base plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating base plate. The wiring device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly lightens labor intensity of workers; and the whole volume is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is favorable for realizing mechanization and automation in the production process.
The existing transfer printing circuit board has fully limited the circuit structure board in the production process, so that the expansibility of the transfer printing circuit board is low, and the transfer printing circuit board cannot be selected according to the actual use condition; therefore, the existing requirements are not met, and for this reason we propose a precision transfer circuit board of a multi-end chip electronic component and a production process.
Disclosure of Invention
The invention aims to provide a precise transfer printing circuit board of a multi-end patch electronic element and a production process thereof, wherein a path transfer printing end head and a single path transfer printing end head can be directly connected with a transfer printing integrated circuit board in an expanding way, the use of a multipath transfer printing end head and a single path transfer printing end head can be selected according to different actual conditions, and the problems in the prior art can be solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a multiport paster electronic component's accurate transfer printing circuit board, includes transfer printing integrated circuit board, multichannel switching end and single-channel switching end, the surface of transfer printing integrated circuit board is provided with integrated chip, and all is provided with paster inductance element around the integrated chip, one side of transfer printing integrated circuit board is provided with the data external interface, and the below of data external interface is provided with the transformer component, the top of data external interface is provided with piezoresistor component, and one side of transformer component is provided with capacitive element, the transfer printing integrated circuit board includes resin flitch, transfer printing plate and resin bottom plate, and the transfer printing plate sets up between resin flitch and resin bottom plate.
Preferably, the outer surface of resin flitch is provided with tin limit and pastes the frame, and tin limit pastes the frame and runs through the bottom that extends to the resin flitch, both sides of resin flitch and resin bottom plate all are provided with the end preformed hole, and resin flitch and resin bottom plate are connected with the laminating of transfer plate.
Preferably, the outer surface of transfer plate is provided with etching circuit, and the tin limit pastes the frame and is connected with etching circuit laminating, all be provided with the location dress hole around the transfer plate, capacitive element, integrated chip, data external interface, piezo-resistor element and transformer element and transfer plate electric connection, and paster inductance element and tin limit paste frame welded connection.
Preferably, the multiplexing end head comprises a pin guide plate and a binding post, one end of the pin guide plate is provided with a disassembling pin, a protective shell is arranged above the pin guide plate, and the protective shell is connected with the pin guide plate through a clamping groove.
Preferably, the bottom of stitch baffle is provided with the touch pad, and the touch pad is connected with the laminating of stitch baffle, the below of touch pad is provided with the external screw thread sleeve, and external screw thread sleeve and stitch baffle electric connection.
Preferably, the binding post runs through and extends to the inside of external screw thread sleeve, and the multiplexing end passes through external screw thread sleeve and end preformed hole rotation to be connected, the inboard of stitch baffle is provided with the switching groove, and dismouting stitch passes through the metal bullet and detains and be connected with the stitch baffle.
Preferably, the single-way switching end comprises a guide screw and a reverse-folding plate, the reverse-folding plate is connected with the end preformed hole through the guide screw, one end of the reverse-folding plate is provided with a retention stitch, and the retention stitch and the reverse-folding plate are arranged into an integrated structure.
Preferably, the other end of the reverse-folding plate is provided with a retention perforation, and the guide screw extends to the inner side of the reverse-folding plate through the retention perforation.
Preferably, a sheet metal lapping piece is arranged between the retention pins, and the sheet metal lapping piece and the reverse-folding plate are arranged into an integrated structure.
A production process of a precision transfer printing circuit board of a multi-end surface mount electronic component comprises the following steps:
step one: cutting a single panel according to the outline size set by a drawing by using a panel cutting machine, cutting a regular rectangular plate by using the panel cutting machine, and processing the surface of the single panel by using a sander, wherein the function is to polish an oxide layer on the surface layer of the single panel, so that the circuit board is easier to carry out heat transfer printing operation, the color of an untreated circuit board is dark red, and the color of the processed circuit board is close to pink;
step two: after polishing the circuit board, fixing one end of the thermal transfer paper printed with the circuit on the back surface of the single panel by using glue, wherein the surface with the film faces inwards, attaching the paper on the circuit board in a homeotropic manner, and paying attention to the fact that the circuit in the middle of the paper is necessarily aligned to the center of the circuit board;
step three: after the circuit board is processed, the heat transfer printing is to be carried out, the heat transfer printing machine is powered on and preheated for 5min, the circuit board with the paper attached is inserted into a board inlet of the heat transfer printing machine, the paper is tightly attached to the circuit board, no gap exists, and the circuit board slowly enters the heating roller along with the rotation of the heating roller;
step four: when the circuit board comes out from the board outlet completely, the thermal transfer paper is required to be stripped off when the circuit board is hot, after the thermal transfer paper is successfully stripped off, the circuit board graph is completely printed on the single panel and is used as a transfer plate, finally, the transfer plate is clamped between the resin flitch and the resin bottom plate, the plastic packaging operation is completed by means of the cooperation of the adhesive and the hot pressing, and the circuit structure on the transfer plate is required to correspond to the contact structures on the resin flitch and the resin bottom plate.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention, the multiplex connection end and the single way connection end can be directly connected with the transfer printing integrated circuit board in an expanding way, the use of the multiplex connection end and the single way connection end can be selected according to different actual conditions, the transfer printing integrated circuit board is formed by hot-pressing and splicing three-layer main structures of a resin flitch, a transfer printing plate and a resin bottom plate, wherein the transfer printing plate is clamped between the resin flitch and the resin bottom plate, the external resin plate can play an oxidation-resistant protection role on an etching circuit on the surface of the transfer printing plate, and meanwhile, the condition that the circuit structure is worn in the long-term use process can be avoided;
2. according to the invention, the end reserved holes on the surfaces of the resin flitch and the resin bottom plate correspond to each other, the etched circuit on the transfer printing plate is cut off by the end reserved holes, and when a metal conductor enters the inside of the end reserved holes, the metal conductor is contacted with the etched circuit on the transfer printing plate, so that the conduction of current data is realized, in the drilling process, the drop point of a drill bit is selected at the center of each bonding pad as much as possible, and otherwise, the situation that the bonding pad is broken and separated from the circuit board easily occurs;
3. the invention directly passes the binding post through the end preformed hole on the surface of the plate when the multiplexing end is used, the whole multiplexing end is screwed and fixed in the hole groove of the plate by utilizing the external thread sleeve at the tail end of the binding post after the binding post passes through, the disassembling and assembling pins on one side of the pin guide plate are kept in a horizontal parallel state, the binding post and the disassembling and assembling pins can be used for butting components, and meanwhile, the disassembling and assembling pins can be disassembled and assembled through a metal elastic buckle on the pin guide plate;
4. according to the invention, the retaining perforation at one end of the reverse-folded plate is attached to the outer side of the end reserved hole, the retaining stitch at the other end is vertically upwards, then the guide screw is inserted and screwed from the end reserved hole at the other side of the transfer printing integrated circuit board, and the guide screw penetrates through the retaining perforation to extend to the inner side of the reverse-folded plate, so that the reverse-folded plate can be fixed on the surface of the plate, and meanwhile, the inner etching circuit conducts current by means of the guide screw.
Drawings
FIG. 1 is an overall front view of the present invention;
FIG. 2 is a transfer integrated circuit board of the present invention;
FIG. 3 is a schematic view of a transfer plate structure according to the present invention;
FIG. 4 is a schematic view of a multiplexing terminal structure according to the present invention;
FIG. 5 is a schematic view of an externally threaded sleeve according to the present invention;
FIG. 6 is a schematic diagram of the detachable pin structure of the present invention;
FIG. 7 is a schematic view of a single-pass adapter according to the present invention;
fig. 8 is a schematic view of a structure of a reverse-folded plate member according to the present invention.
In the figure: 1. transferring the integrated circuit board; 2. a capacitive element; 3. an integrated chip; 4. a data external interface; 5. a varistor element; 6. a patch inductance element; 7. a transformer element; 8. a multiplexing end; 9. a single-way switching end; 101. a resin veneer; 102. transferring the plate; 103. a resin base plate; 104. a head preformed hole; 105. attaching a tin edge to a frame; 106. positioning and installing holes; 107. etching the circuit; 801. binding posts; 802. a stitch guide; 803. disassembling and assembling the stitch; 804. a protective housing; 805. a touch pad; 806. an externally threaded sleeve; 807. a transfer groove; 808. a metal spring buckle; 901. a guide screw; 902. folding back the plate; 903. a retention stitch; 904. a retention aperture; 905. sheet metal tabs.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, an embodiment of the present invention is provided: the utility model provides a multiport paster electronic component's accurate transfer printing circuit board, including transfer printing integrated circuit board 1, multiplex end 8 and single-way switching end 9, transfer printing integrated circuit board 1's surface is provided with integrated chip 3, and integrated chip 3 all is provided with paster inductance element 6 all around, transfer printing integrated circuit board 1's one side is provided with data external interface 4, and data external interface 4's below is provided with transformer element 7, data external interface 4's top is provided with piezo-resistor element 5, and transformer element 7's one side is provided with capacitive element 2, transfer printing integrated circuit board 1 includes resin flitch 101, transfer printing plate 102 and resin bottom plate 103, and transfer printing plate 102 sets up between resin flitch 101 and resin bottom plate 103, multiplex end 8 and single-way switching end 9 can directly expand the connection with transfer printing integrated circuit board 1, the use of multiplex end 8 and single-way switching end 9 can select according to different actual conditions, this transfer printing integrated circuit board 1 is by resin flitch 101, transfer printing plate 102 and resin bottom plate 103 three-layer structure splice, wherein transfer printing plate 102 presss clamp is at resin bottom plate 102 and resin bottom plate 103 and the resin bottom plate 102 can be used to the oxidation protection in the long-term in the process of the surface of the circuit board that can prevent the wearing and tearing.
Referring to fig. 2-3, a tin frame 105 is disposed on an outer surface of the resin board 101, the tin frame 105 extends to a bottom of the resin board 101, two sides of the resin board 101 and the resin base plate 103 are respectively provided with an end preformed hole 104, the end preformed holes 104 on surfaces of the resin board 101 and the resin base plate 103 correspond to each other, the end preformed holes 104 intercept an etching circuit 107 on the transfer plate 102, when a metal conductor enters the end preformed holes 104, the metal conductor contacts the etching circuit 107 on the transfer plate 102, thereby realizing conduction of current data, a drop point of a drill bit is selected in a center of each bonding pad as much as possible in a drilling process, otherwise, the condition that the bonding pad is drilled to be separated from the circuit board easily occurs, the resin board 101 and the resin base plate 103 are in lamination connection with the transfer plate 102, the outer surface of the transfer plate 102 is provided with the etching circuit 107, the tin frame 105 is in lamination connection with the etching circuit 107, and four sides of the transfer plate 102 are respectively provided with a positioning mounting hole 106, and the capacitor element 2, the integrated chip 3, the data interface 4, the transformer element 5 and the transformer element 7 are electrically connected with the inductor element 102 and the transfer plate 102 by welding the tin frame 105.
Example 1: referring to fig. 4-6, the multiplexing terminal 8 includes a pin guide 802 and a terminal 801, one end of the pin guide 802 is provided with a detachable pin 803, a shield 804 is provided above the pin guide 802, the shield 804 is connected with the pin guide 802 through a clamping groove, a touch pad 805 is provided at the bottom of the pin guide 802, the touch pad 805 is attached to the pin guide 802, an external thread sleeve 806 is provided below the touch pad 805, the external thread sleeve 806 is electrically connected with the pin guide 802, the terminal 801 extends to the inside of the external thread sleeve 806, the multiplexing terminal 8 is rotatably connected with the pin guide 802 through the external thread sleeve 806, a adapting groove 807 is provided at the inner side of the pin guide 802, the detachable pin 803 is connected with the pin guide 802 through a metal snap 808, the terminal 801 directly passes through the terminal reserved hole 104 on the surface of the plate, the whole pin adapting terminal 8 is fixed inside the hole groove of the plate by the external thread sleeve 806 at the tail end of the terminal 801 after the terminal 801 passes, the detachable pin 803 is kept in a horizontal parallel state with the plate 803, and the detachable pin 803 can be detached and assembled and disassembled by the metal snap 803.
Example 2: referring to fig. 7-8, the single pass switching terminal 9 includes a guide screw 901 and a return plate 902, wherein the return plate 902 is connected to the terminal pre-hole 104 by the guide screw 901, one end of the return plate 902 is provided with a retention pin 903, the retention pin 903 and the return plate 902 are integrally formed, the other end of the return plate 902 is provided with a retention hole 904, the guide screw 901 extends to the inner side of the return plate 902 through the retention hole 904, a sheet metal tab 905 is provided between the retention pins 903, the sheet metal tab 905 and the return plate 902 are integrally formed, the use of the single pass switching terminal 9 is to attach the retention hole 904 at one end of the return plate 902 to the outer side of the terminal pre-hole 104, the retention pin at the other end is vertically upward, then the guide screw 901 is inserted from the terminal pre-hole 104 at the other side of the transfer integrated circuit board 1 and screwed in the guide screw 901 extends through the retention hole 904 to the inner side of the return plate 902, thus the return plate 902 is fixed to the surface of the plate 902, and the conductive current is conducted by means of the etched circuit 107 inside.
A production process of a precision transfer printing circuit board of a multi-end surface mount electronic component comprises the following steps:
step one: cutting a single panel according to the outline size set by a drawing by using a panel cutting machine, cutting a regular rectangular plate by using the panel cutting machine, and processing the surface of the single panel by using a sander, wherein the function is to polish an oxide layer on the surface layer of the single panel, so that the circuit board is easier to carry out heat transfer printing operation, the color of an untreated circuit board is dark red, and the color of the processed circuit board is close to pink;
step two: after polishing the circuit board, fixing one end of the thermal transfer paper printed with the circuit on the back surface of the single panel by using glue, wherein the surface with the film faces inwards, attaching the paper on the circuit board in a homeotropic manner, and paying attention to the fact that the circuit in the middle of the paper is necessarily aligned to the center of the circuit board;
step three: after the circuit board is processed, the heat transfer printing is to be carried out, the heat transfer printing machine is powered on and preheated for 5min, the circuit board with the paper attached is inserted into a board inlet of the heat transfer printing machine, the paper is tightly attached to the circuit board, no gap exists, and the circuit board slowly enters the heating roller along with the rotation of the heating roller;
step four: when the circuit board comes out from the board outlet completely, the thermal transfer paper is removed while the circuit board is hot, after the thermal transfer paper is removed successfully, the circuit board is printed on the single panel completely, and is used as a transfer plate 102, finally the transfer plate 102 is clamped between the resin flitch 101 and the resin bottom plate 103, the plastic packaging operation is completed by means of the cooperation of the adhesive and the hot pressing, and the circuit structure on the transfer plate 102 needs to correspond to the contact structures on the resin flitch 101 and the resin bottom plate 103.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The utility model provides a multiport paster electronic component's accurate transfer printing circuit board, includes transfer printing integrated circuit board (1), multiplex end (8) and single-channel adapter (9), its characterized in that: the integrated chip (3) is arranged on the outer surface of the transfer printing integrated circuit board (1), the chip inductor elements (6) are arranged around the integrated chip (3), a data external interface (4) is arranged on one side of the transfer printing integrated circuit board (1), a transformer element (7) is arranged below the data external interface (4), a piezoresistor element (5) is arranged above the data external interface (4), a capacitor element (2) is arranged on one side of the transformer element (7), the transfer printing integrated circuit board (1) comprises a resin flitch (101), a transfer printing plate (102) and a resin bottom plate (103), the transfer printing plate (102) is arranged between the resin flitch (101) and the resin bottom plate (103), a tin edge attaching frame (105) is arranged on the outer surface of the resin flitch (101), the tin edge attaching frame (105) penetrates through to the bottom of the resin flitch (101), end reserved holes (104) are formed in two sides of the resin flitch (101) and the resin bottom plate (103), and the resin bottom plate (103) are connected with the transfer printing plate (102) in a penetrating mode.
The multiplexing end head (8) comprises a pin guide plate (802) and a binding post (801), wherein a disassembling pin (803) is arranged at one end of the pin guide plate (802), a protective shell (804) is arranged above the pin guide plate (802), the protective shell (804) is connected with the pin guide plate (802) through a clamping groove, a touch pad (805) is arranged at the bottom of the pin guide plate (802), the touch pad (805) is connected with the pin guide plate (802) in a fitting mode, an external thread sleeve (806) is arranged below the touch pad (805), the external thread sleeve (806) is electrically connected with the pin guide plate (802), the binding post (801) penetrates through and extends to the inside of the external thread sleeve (806), the multiplexing end head (8) is rotationally connected with an end head preformed hole (104) through the external thread sleeve (806), a switching groove (807) is arranged on the inner side of the pin guide plate (802), and the disassembling pin (803) is connected with the guide plate (802) through a pin elastic buckle (808);
the utility model provides a single pass switching end (9) is including leading bit screw (901) and inflection plate (902), and inflection plate (902) are connected with end preformed hole (104) through leading bit screw (901), the one end of inflection plate (902) is provided with retainer stitch (903), and retainer stitch (903) set up as an organic whole structure with inflection plate (902), the other end of inflection plate (902) is provided with retention perforation (904), and leads bit screw (901) and extend to the inboard of inflection plate (902) through retention perforation (904), be provided with sheet metal tab (905) between retainer stitch (903), and sheet metal tab (905) set up as an organic whole structure with inflection plate (902).
2. The precision transfer circuit board for a multi-ended patch electronic component of claim 1, wherein: the outer surface of transfer plate (102) is provided with etching circuit (107), and tin limit pastes frame (105) and etching circuit (107) laminating and be connected, all be provided with locating mounting hole (106) around transfer plate (102), capacitive element (2), integrated chip (3), data external interface (4), piezo-resistor element (5) and transformer element (7) and transfer plate (102) electric connection, and paster inductance element (6) and tin limit paste frame (105) welded connection.
3. A process for producing a precision transfer circuit board of a multi-end chip electronic component, based on the precision transfer circuit board of a multi-end chip electronic component according to claim 2, comprising the steps of:
step one: cutting a single panel according to the outline size set by a drawing by using a panel cutting machine, cutting a regular rectangular plate by using the panel cutting machine, and processing the surface of the single panel by using a sander, wherein the function is to polish an oxide layer on the surface layer of the single panel, so that the circuit board is easier to carry out heat transfer printing operation, the color of an untreated circuit board is dark red, and the color of the processed circuit board is close to pink;
step two: after polishing the circuit board, fixing one end of the thermal transfer paper printed with the circuit on the back surface of the single panel by using glue, wherein the surface with the film faces inwards, attaching the paper on the circuit board in a homeotropic manner, and paying attention to the fact that the circuit in the middle of the paper is necessarily aligned to the center of the circuit board;
step three: after the circuit board is processed, the heat transfer printing is to be carried out, the heat transfer printing machine is powered on and preheated for 5min, the circuit board with the paper attached is inserted into a board inlet of the heat transfer printing machine, the paper is tightly attached to the circuit board, no gap exists, and the circuit board slowly enters the heating roller along with the rotation of the heating roller;
step four: when the circuit board comes out from the board outlet completely, the thermal transfer paper is required to be stripped off, after the thermal transfer paper is stripped off successfully, the circuit board is printed on the single panel completely and is used as a transfer plate (102), finally the transfer plate (102) is clamped between the resin flitch (101) and the resin bottom plate (103), the plastic packaging operation is completed by means of the cooperation of the adhesive and the hot pressing, and the circuit structure on the transfer plate (102) is required to correspond to the contact structure on the resin flitch (101) and the resin bottom plate (103).
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| JP2009147115A (en) * | 2007-12-14 | 2009-07-02 | Rohm Co Ltd | Module board |
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| CN213071645U (en) * | 2020-09-08 | 2021-04-27 | 昆山欧德斯电子科技有限公司 | USB adapter for engineering |
| CN213547905U (en) * | 2020-10-12 | 2021-06-25 | 晶测电子科技(上海)有限公司 | Mounting structure of through adapter on PCB circuit board |
| CN213783680U (en) * | 2020-09-23 | 2021-07-23 | 佛山市顺德区博为电器有限公司 | Anti-welding dry film circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7942705B2 (en) * | 2009-03-20 | 2011-05-17 | Apple Inc. | Audio jack with pogo pins for conductive contacts |
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| JP2009147115A (en) * | 2007-12-14 | 2009-07-02 | Rohm Co Ltd | Module board |
| CN104315359A (en) * | 2014-10-28 | 2015-01-28 | 昆山市圣光新能源科技有限公司 | Chargeable anion flashlight with adapter and laser lamp |
| CN208352707U (en) * | 2018-05-24 | 2019-01-08 | 大连藏龙光电子科技有限公司 | It is a kind of for extending the soft board of optical device operating temperature range |
| CN213071645U (en) * | 2020-09-08 | 2021-04-27 | 昆山欧德斯电子科技有限公司 | USB adapter for engineering |
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| CN114945245A (en) | 2022-08-26 |
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