CN114916122A - 部件承载件以及制造部件承载件的方法 - Google Patents
部件承载件以及制造部件承载件的方法 Download PDFInfo
- Publication number
- CN114916122A CN114916122A CN202210124766.5A CN202210124766A CN114916122A CN 114916122 A CN114916122 A CN 114916122A CN 202210124766 A CN202210124766 A CN 202210124766A CN 114916122 A CN114916122 A CN 114916122A
- Authority
- CN
- China
- Prior art keywords
- heat removing
- heat
- component
- component carrier
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 114
- 230000001070 adhesive effect Effects 0.000 claims description 114
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 49
- 239000012782 phase change material Substances 0.000 claims description 35
- 238000005553 drilling Methods 0.000 claims description 22
- 238000000059 patterning Methods 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 9
- 230000036961 partial effect Effects 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000013532 laser treatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 91
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 8
- 238000004381 surface treatment Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- -1 salt hydrates Chemical class 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000007726 management method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004643 cyanate ester Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005290 antiferromagnetic effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005293 ferrimagnetic effect Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920001002 functional polymer Polymers 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21156188.1A EP4044221A1 (fr) | 2021-02-10 | 2021-02-10 | Architecture d'élimination de la chaleur pour support de composant de type pile avec composant intégré |
| EP21156188.1 | 2021-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114916122A true CN114916122A (zh) | 2022-08-16 |
Family
ID=74586842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210124766.5A Pending CN114916122A (zh) | 2021-02-10 | 2022-02-10 | 部件承载件以及制造部件承载件的方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20220272828A1 (fr) |
| EP (1) | EP4044221A1 (fr) |
| CN (1) | CN114916122A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022128625A1 (de) | 2022-10-28 | 2024-05-08 | Rolls-Royce Deutschland Ltd & Co Kg | Elektrisches Modul und Verfahren zur Herstellung eines elektrischen Moduls |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7025129B2 (en) * | 1998-09-22 | 2006-04-11 | Intel Corporation | Adhesive to attach a cooling device to a thermal interface |
| US20120007252A1 (en) * | 2010-07-08 | 2012-01-12 | Subtron Technology Co. Ltd. | Semiconductor package structure and fabricating method of semiconductor package structure |
| KR20130140354A (ko) * | 2012-06-14 | 2013-12-24 | 하나 마이크론(주) | 반도체 패키지 및 그 제조방법 |
| JP2014007323A (ja) * | 2012-06-26 | 2014-01-16 | Mitsubishi Electric Corp | 半導体パッケージ |
| US20180042139A1 (en) * | 2016-08-02 | 2018-02-08 | Qualcomm Incorporated | Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device |
| US20180211899A1 (en) * | 2017-01-26 | 2018-07-26 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Efficient Heat Removal From Component Carrier With Embedded Diode |
| CN109411423A (zh) * | 2017-08-16 | 2019-03-01 | 三星电机株式会社 | 半导体封装件及包括半导体封装件的电子装置 |
| US20200395263A1 (en) * | 2019-06-14 | 2020-12-17 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW546800B (en) * | 2002-06-27 | 2003-08-11 | Via Tech Inc | Integrated moduled board embedded with IC chip and passive device and its manufacturing method |
| TW200901409A (en) * | 2007-06-22 | 2009-01-01 | Nan Ya Printed Circuit Board Corp | Packaging substrate with embedded chip and buried heatsink |
| WO2011125354A1 (fr) * | 2010-04-06 | 2011-10-13 | 日本電気株式会社 | Substrat doté d'un élément fonctionnel incorporé |
| US20170374748A1 (en) * | 2011-10-31 | 2017-12-28 | Unimicron Technology Corp. | Package structure and manufacturing method thereof |
| JP6221221B2 (ja) * | 2012-03-27 | 2017-11-01 | Tdk株式会社 | 電子部品内蔵基板及びその製造方法 |
| JP5716972B2 (ja) * | 2013-02-05 | 2015-05-13 | 株式会社デンソー | 電子部品の放熱構造およびその製造方法 |
| US9613886B2 (en) * | 2013-08-29 | 2017-04-04 | Industrial Technology Research Institute | Optical coupling module |
| SG10201401622RA (en) * | 2014-04-17 | 2015-11-27 | Delta Electronics Int’L Singapore Pte Ltd | Package structure |
| EP3488669B1 (fr) * | 2016-10-03 | 2022-09-14 | Hewlett-Packard Development Company, L.P. | Boîtiers multicouches |
| US20180177045A1 (en) * | 2016-12-21 | 2018-06-21 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding Component in Component Carrier by Component Fixation Structure |
| US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
| JP7231128B2 (ja) * | 2020-12-15 | 2023-03-01 | Dic株式会社 | 接着シート、並びに物品及び物品の製造方法 |
-
2021
- 2021-02-10 EP EP21156188.1A patent/EP4044221A1/fr active Pending
-
2022
- 2022-02-09 US US17/650,405 patent/US20220272828A1/en active Pending
- 2022-02-10 CN CN202210124766.5A patent/CN114916122A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7025129B2 (en) * | 1998-09-22 | 2006-04-11 | Intel Corporation | Adhesive to attach a cooling device to a thermal interface |
| US20120007252A1 (en) * | 2010-07-08 | 2012-01-12 | Subtron Technology Co. Ltd. | Semiconductor package structure and fabricating method of semiconductor package structure |
| KR20130140354A (ko) * | 2012-06-14 | 2013-12-24 | 하나 마이크론(주) | 반도체 패키지 및 그 제조방법 |
| JP2014007323A (ja) * | 2012-06-26 | 2014-01-16 | Mitsubishi Electric Corp | 半導体パッケージ |
| US20180042139A1 (en) * | 2016-08-02 | 2018-02-08 | Qualcomm Incorporated | Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device |
| US20180211899A1 (en) * | 2017-01-26 | 2018-07-26 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Efficient Heat Removal From Component Carrier With Embedded Diode |
| CN109411423A (zh) * | 2017-08-16 | 2019-03-01 | 三星电机株式会社 | 半导体封装件及包括半导体封装件的电子装置 |
| US20200395263A1 (en) * | 2019-06-14 | 2020-12-17 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220272828A1 (en) | 2022-08-25 |
| EP4044221A1 (fr) | 2022-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3547361B1 (fr) | Support de composant connecté à un autre support de composant incliné pour une connexion électrique courte | |
| US11051391B2 (en) | Thermally highly conductive coating on base structure accommodating a component | |
| US10790234B2 (en) | Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure | |
| US10743422B2 (en) | Embedding a component in a core on conductive foil | |
| EP3589087A1 (fr) | Support de composants avec des structures de refroidissement thermiquement conductrices intégrées | |
| EP3840041A1 (fr) | Support de composants avec intercalaire intégré latéralement entre les structures électriquement conductrices de la pile | |
| US11523496B2 (en) | Cooling profile integration for embedded power systems | |
| CN111757589A (zh) | 部件承载件、其制造方法及使用方法 | |
| US11470714B2 (en) | Component carrier with embedded component and horizontally elongated via | |
| US11864306B2 (en) | Component carrier with an embedded thermally conductive block and manufacturing method | |
| CN111952193A (zh) | 具有嵌入层压叠置件中的表面可接触部件的部件承载件 | |
| US11324122B2 (en) | Component carrier and method of manufacturing the same | |
| EP3621107A1 (fr) | Composant avec couche diélectrique pour intégrer dans une porteuse de composant | |
| EP3349247B1 (fr) | Couche de recouvrement à motifs sur une cavité délimitant une structure de base et marqueur d'alignement | |
| US20220272828A1 (en) | Heat Removal Architecture for Stack-Type Component Carrier With Embedded Component | |
| US20220386464A1 (en) | Component Carrier Interconnection and Manufacturing Method | |
| US11810844B2 (en) | Component carrier and method of manufacturing the same | |
| EP3840020A2 (fr) | Support de composant ayant une double couche diélectrique et son procédé de fabrication | |
| US20240021440A1 (en) | Component Carrier and Method of Manufacturing the Same | |
| US20240090118A1 (en) | Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method | |
| CN211320082U (zh) | 部件承载件 | |
| EP3709340A1 (fr) | Support de composant comprenant un composant ayant une connexion verticale |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |