CN114889325B - High-precision piezoelectric type inkjet printer nozzle and preparation method thereof - Google Patents
High-precision piezoelectric type inkjet printer nozzle and preparation method thereof Download PDFInfo
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- CN114889325B CN114889325B CN202210423703.XA CN202210423703A CN114889325B CN 114889325 B CN114889325 B CN 114889325B CN 202210423703 A CN202210423703 A CN 202210423703A CN 114889325 B CN114889325 B CN 114889325B
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 157
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 145
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 145
- 239000010703 silicon Substances 0.000 claims abstract description 145
- 239000000758 substrate Substances 0.000 claims abstract description 143
- 238000005520 cutting process Methods 0.000 claims abstract description 134
- 238000003860 storage Methods 0.000 claims abstract description 62
- 238000005507 spraying Methods 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000013589 supplement Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims 4
- 238000007641 inkjet printing Methods 0.000 abstract description 3
- 238000001259 photo etching Methods 0.000 description 25
- 238000005516 engineering process Methods 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention relates to a high-precision piezoelectric type ink-jet printer nozzle and a preparation method thereof, wherein the nozzle comprises a first silicon substrate and a second silicon substrate which are mutually bonded, a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and the liquid spraying passage comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the liquid inlet flow direction; the piezoelectric ink-jet driving piece is arranged corresponding to the liquid-jet liquid storage tank, and the joint surface of the piezoelectric ink-jet driving piece and the liquid-jet liquid storage tank is a vibration surface; the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving piece thereof, a second cutting head and a driving piece thereof, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals; the first cutting head driving piece and the second cutting head driving piece are respectively used for driving the first cutting head and the second cutting head to be close to each other so as to cut ink columns sprayed by the nozzles. The invention can avoid the generation of satellite liquid drops, and simultaneously controls the volume of ink drops through cutting, thereby improving the ink-jet printing precision.
Description
Technical Field
The invention belongs to the technical field of inkjet printer nozzles, and particularly relates to a high-precision piezoelectric type inkjet printer nozzle and a preparation method thereof.
Background
In the existing piezoelectric ink jet printer nozzle, satellite ink drops are easy to generate in the process of ejecting ink drops, the satellite ink drops with high enough speed can catch up with main ink drops and be fused into one ink drop, the satellite ink drops with low speed cannot be fused with the main ink drops, and the satellite ink drops can reach the substrate after being ejected to the substrate, so that the accuracy of printed images is affected.
Disclosure of Invention
Based on the defects in the prior art, the invention aims to provide a high-precision piezoelectric type inkjet printer nozzle and a preparation method thereof.
In order to achieve the above object, the present invention adopts the following technical scheme:
the high-precision piezoelectric type ink-jet printer nozzle comprises a first silicon substrate and a second silicon substrate which are mutually bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the liquid inlet flow direction;
the piezoelectric ink-jet driving piece is arranged corresponding to the liquid-jet liquid storage tank, and the joint surface of the piezoelectric ink-jet driving piece and the liquid-jet liquid storage tank is a vibration surface;
the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving piece thereof, a second cutting head and a driving piece thereof, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals;
the first cutting head driving piece and the second cutting head driving piece are respectively used for driving the first cutting head and the second cutting head to be close to each other so as to cut ink columns sprayed by the nozzles.
Preferably, the liquid spraying passages are distributed in an array along the bonding surface of the first silicon substrate and the second silicon substrate.
Preferably, the lower surface of the first silicon substrate is provided with a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank, a nozzle and a first cutting head, and the upper surface of the first silicon substrate is provided with a piezoelectric ink jet driving piece and a first cutting head driving piece.
Preferably, the upper surface of the second silicon substrate is provided with a second cutting head, and the lower surface of the second silicon substrate is provided with a second cutting head driving piece.
Preferably, the structure of the second silicon substrate and the structure of the first silicon substrate are mirror symmetry, and the lower surface of the second silicon substrate is provided with another piezoelectric ink jet driving piece and a second cutting head driving piece.
Preferably, the piezoelectric ink jet driving piece, the first cutting head driving piece and the second cutting head driving piece are all PZT piezoelectric ceramic plates.
As a preferred scheme, the high-precision piezoelectric type ink-jet printer nozzle comprises the following ink-jet processes:
firstly, the piezoelectric ink-jet driving piece receives a forward voltage signal to vibrate so as to pull the vibration surface, and ink is sucked into the liquid-jet liquid storage tank from the liquid-inlet liquid storage tank; then, the piezoelectric ink-jet driving piece receives the reverse voltage signal to vibrate so as to push the vibration surface, and ink is extruded out through the nozzle;
when the ejected ink column reaches the maximum length, the first cutting head driving piece and the second cutting head driving piece synchronously receive reverse voltage signals to push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving piece and the second cutting head driving piece receive forward voltage signals for back vibration, and the piezoelectric ink jet driving piece receives the forward voltage signals to pull the vibration surface, absorb ink drops back and simultaneously supplement ink to prepare for next ink jet.
The invention also provides a preparation method of the high-precision piezoelectric type ink-jet printer nozzle, which comprises the following steps:
s1, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
a piezoelectric ink jet driving piece is arranged on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and a first cutting head driving piece is arranged corresponding to the first cutting head;
s2, selecting a second silicon substrate, etching a second cutting head on the upper surface of the second silicon substrate, and arranging a second cutting head driving piece on the lower surface of the second silicon substrate corresponding to the second cutting head;
and S3, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
The invention also provides a preparation method of the high-precision piezoelectric type ink-jet printer nozzle, which comprises the following steps:
s10, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
a piezoelectric ink jet driving piece is arranged on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and a first cutting head driving piece is arranged corresponding to the first cutting head;
s20, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a second cutting head on the upper surface of the second silicon substrate; the etched structure of the second silicon substrate and the etched structure of the first silicon substrate are mirror symmetry;
a piezoelectric ink jet driving piece is arranged on the lower surface of the second silicon substrate corresponding to the liquid spraying liquid storage tank, and a second cutting head driving piece is arranged corresponding to the second cutting head;
and S30, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
Compared with the prior art, the invention has the beneficial effects that:
the high-precision piezoelectric type inkjet printer nozzle can avoid satellite liquid drop generation, and simultaneously controls the volume of ink drops through cutting, thereby improving the inkjet printing precision.
Drawings
FIG. 1 is a schematic plan view of a high-precision piezoelectric ink jet printer nozzle according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating the operation of a high-precision piezoelectric ink jet printer nozzle according to a first embodiment of the present invention;
FIG. 3 is a schematic perspective view of a high-precision piezoelectric ink-jet printer nozzle according to an embodiment of the present invention;
FIG. 4 is a schematic view showing a structure of a portion of a lower surface of a first silicon substrate according to a first embodiment of the present invention;
FIG. 5 is a schematic view showing a structure of a portion of an upper surface of a second silicon substrate according to a first embodiment of the present invention;
FIG. 6 is a schematic view showing a structure of a lower surface portion of a second silicon substrate according to the first embodiment of the present invention;
FIG. 7 is a schematic view of a nozzle and a cutting head according to a first embodiment of the present invention;
FIG. 8 is a process flow diagram of a high precision piezoelectric ink jet printer nozzle according to a first embodiment of the present invention;
FIG. 9 is a schematic plan view of a nozzle of a high-precision piezoelectric ink-jet printer according to a second embodiment of the present invention;
FIG. 10 is a schematic diagram illustrating the operation of a nozzle of a high-precision piezoelectric ink-jet printer according to a second embodiment of the present invention;
FIG. 11 is a schematic perspective view of a high-precision piezoelectric ink jet printer nozzle according to a second embodiment of the present invention;
FIG. 12 is a process flow diagram of a high precision piezoelectric ink jet printer nozzle according to a second embodiment of the present invention;
1, a first silicon substrate; 101. a liquid inlet storage tank; 102. a liquid spraying liquid storage tank; 103. a liquid inlet channel; 104. a flow restricting passage; 105. a nozzle; 106. a first cutting head; 107. a piezoelectric inkjet driver lower electrode layer; 108. piezoelectric layer of piezoelectric ink jet driving piece; 109. an upper electrode layer of the piezoelectric inkjet driver; 110. a first cutting head driver lower electrode layer; 111. a first cutting head driver piezoelectric layer; 112. an upper electrode layer of the first cutting head driving member; 2. a second silicon substrate; 201. a second cutting head; 202. a second cutting head driver lower electrode layer; 203. a second cutting head driver piezoelectric layer; 204. an electrode layer on the second cutting head driver; 3. a third silicon substrate; 301. a liquid inlet storage tank; 302. a liquid spraying liquid storage tank; 303. a liquid inlet channel; 304. a flow restricting passage; 305. a nozzle; 306. a third cutting unit; 307. a piezoelectric inkjet driver lower electrode layer; 308. piezoelectric layer of piezoelectric ink jet driving piece; 309. an upper electrode layer of the piezoelectric inkjet driver; 310. a third cutting head driver lower electrode layer; 311. a third cutting head driver piezoelectric layer; 312. and a third cutting head driver upper electrode layer.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, specific embodiments of the present invention will be described below with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
Embodiment one:
as shown in fig. 1 to 8, the high-precision piezoelectric ink-jet printer nozzle of this embodiment includes a first silicon substrate 1 and a second silicon substrate 2 bonded to each other, and a liquid spraying path is formed between the first silicon substrate 1 and the second silicon substrate 2, and the liquid spraying path includes a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank and a nozzle sequentially distributed along a liquid inlet flow direction. The liquid spraying passages of this embodiment have six, and are distributed in an array along the bonding surfaces of the first silicon substrate 1 and the second silicon substrate 2.
Specifically, the lower surface of the first silicon substrate 1 is provided with a liquid inlet channel 103, a liquid inlet liquid storage tank 101, a current limiting channel 104, a liquid spraying liquid storage tank 102, a nozzle 105 and a first cutting head 106, the upper surface of the first silicon substrate 1 is provided with a piezoelectric ink-jet driving piece arranged corresponding to the liquid spraying liquid storage tank, and the joint surface of the piezoelectric ink-jet driving piece and the liquid spraying liquid storage tank is a vibration surface; the piezoelectric inkjet driver is a PZT piezoelectric ceramic sheet, and includes a lower electrode layer 107, a piezoelectric layer 108, and an upper electrode layer 109 stacked in this order. In addition, the upper surface of the first silicon substrate 1 is further provided with a first cutting head driving member, which is a PZT piezoelectric ceramic sheet and includes a lower electrode layer 110, a piezoelectric layer 111 and an upper electrode layer 112 stacked in order.
The second silicon substrate 2 is used as a cover plate to form a liquid spraying passage, the upper surface of the second silicon substrate 2 is provided with a second cutting head 201, and the lower surface of the second silicon substrate 2 is provided with a second cutting head driving piece; specifically, the second cutting head driving member is a PZT piezoelectric ceramic sheet, and includes a lower electrode layer 202, a piezoelectric layer 203, and an upper electrode layer 204 stacked in this order.
Wherein the first cutting head 106 is opposite to and spaced apart from the second cutting head 201; the first and second cutter head drivers are for driving the first and second cutter heads to close together, respectively, to cut the ink column ejected from the nozzles 105.
The working process of the high-precision piezoelectric type inkjet printer nozzle of the embodiment comprises the following steps:
the piezoelectric ink-jet driving piece receives the forward voltage signal to vibrate and pulls the vibration surface, and ink is sucked from the liquid inlet liquid storage tank 101 to the liquid spraying liquid storage tank 102; the piezoelectric ink jet driving piece receives the reverse voltage signal to vibrate so as to push the vibration surface, ink is extruded through the nozzle 105, and when the ink column reaches the maximum length, the first cutting head driving piece and the second cutting head driving piece synchronously receive the reverse voltage signal so as to push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving piece and the second cutting head driving piece receive forward voltage signals for back vibration, and the piezoelectric ink jet driving piece receives the forward voltage signals to pull the vibration surface, absorb ink drops back and simultaneously supplement ink to prepare for next ink jet.
The preparation method of the high-precision piezoelectric type inkjet printer nozzle of the embodiment comprises the following steps:
s1, selecting a 4inch silicon wafer, transferring the patterns of a liquid inlet liquid storage tank 101 and a liquid spraying liquid storage tank 102 to the lower surface of a first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 101 and the liquid spraying liquid storage tank 102 by adopting a reactive ion etching technology;
s2, transferring the pattern of the liquid inlet channel 103 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet channel 103 by adopting a reactive ion etching technology;
s3, transferring the pattern of the current-limiting channel 104 and the nozzle 105 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the current-limiting channel 104 and the nozzle 105 by adopting a reactive ion etching technology, wherein the depth of the current-limiting channel 104 and the nozzle 105 is 20-100 mu m;
s4, transferring the pattern of the first cutting head 106 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and adopting a reactive ion etching technology to etch and prepare the first cutting head 106, wherein the distance between the first cutting head 106 and the nozzle is 50-200 mu m; cleaning the first silicon substrate 1;
s5, preparing a piezoelectric ink-jet driving piece lower electrode layer 107 and a first cutting head driving piece lower electrode layer 110 on the upper surface of the first silicon substrate by adopting a photoetching process and a metal sputtering process;
s6, preparing a piezoelectric ink-jet driving piece piezoelectric layer 108 and a first cutting head driving piece piezoelectric layer 111 on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a PECVD process;
s7, preparing a piezoelectric layer 109 of a piezoelectric ink-jet driving piece and an upper electrode layer 112 of a first cutting head driving piece on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a metal sputtering process; cleaning the first silicon substrate 1;
s8, selecting a 4inch silicon wafer, transferring the pattern of the second cutting head 201 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and adopting a reactive ion etching technology to etch and prepare the second cutting head 201, wherein the distance between the second cutting head 206 and a nozzle is 50-200 mu m (the same as that of the first cutting head); cleaning the second silicon substrate 2;
s9, preparing a second cutting head driving piece lower electrode layer 202 on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a metal sputtering process;
s10, preparing a second cutting head driving piece piezoelectric layer 203 on the lower surface of a second silicon substrate 2 by adopting a photoetching process and a PECVD process;
s11, preparing a second cutting head driving piece upper electrode layer 204 on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a metal sputtering process; cleaning the second silicon substrate 2;
s12, rinsing the lower surface of the first silicon substrate 1 and the upper surface of the second silicon substrate 2 by adopting hydrofluoric acid, and bonding the lower surface of the first silicon substrate 1 and the upper surface of the second silicon substrate 2 by adopting a silicon-silicon bonding process;
s13, cleaning and scribing.
The high-precision piezoelectric type ink jet printer nozzle of the embodiment is added with the cutting head on the basis of the traditional ink jet printer nozzle, the ink column is cut when the ink column reaches the maximum length, satellite liquid drops are avoided, meanwhile, the volume of the ink drops is controlled through cutting, and the ink jet printing precision is improved.
The number of liquid spraying passages in the array type liquid spraying passages in this embodiment is not limited to the number shown in fig. 4, and may be increased or decreased according to actual application requirements.
Embodiment two:
the high-precision piezoelectric inkjet printer head of the present embodiment is different from the first embodiment in that:
as shown in fig. 9 to 12, the high-precision piezoelectric type inkjet printer head of the present embodiment includes a first silicon substrate 1 and a third silicon substrate 3 bonded to each other:
the structure of the first silicon substrate 1 is the same as that of the first silicon substrate of the first embodiment, and the structure of the third silicon substrate 3 and that of the first silicon substrate of the first embodiment are mirror symmetry with each other; specifically, the upper surface of the third silicon substrate 3 is provided with a liquid inlet channel 303, a liquid inlet liquid storage tank 301, a flow limiting channel 304, a liquid spraying liquid storage tank 302, a nozzle 305 and a third cutting head 306, and the lower surface of the third silicon substrate is provided with a piezoelectric ink jet driving piece and a third cutting head driving piece;
the piezoelectric ink-jet driving piece is a PZT piezoelectric ceramic piece and comprises a lower electrode layer 307, a piezoelectric layer 308 and an upper electrode layer 309 which are sequentially stacked;
the third cutting head driving part is a PZT piezoelectric ceramic plate, and includes a lower electrode layer 310, a piezoelectric layer 311 and an upper electrode layer 312 which are stacked in sequence.
The high-precision piezoelectric ink-jet printer nozzle of the embodiment is similar to the working process of the first embodiment, but can realize double-side driving, provide larger ink-jet power and improve the ink-jet speed.
The preparation method of the high-precision piezoelectric type inkjet printer nozzle of the embodiment comprises the following steps:
s1, selecting a 4inch silicon wafer, transferring the patterns of a liquid inlet liquid storage tank 101 and a liquid spraying liquid storage tank 102 to the lower surface of a first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 101 and the liquid spraying liquid storage tank 102 by adopting a reactive ion etching technology;
s2, transferring the pattern of the liquid inlet channel 103 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet channel 103 by adopting a reactive ion etching technology;
s3, transferring the pattern of the current-limiting channel 104 and the nozzle 105 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the current-limiting channel 104 and the nozzle 105 by adopting a reactive ion etching technology, wherein the depth of the current-limiting channel 104 and the nozzle 105 is 20-100 mu m;
s4, transferring the pattern of the first cutting head 106 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and adopting a reactive ion etching technology to etch and prepare the first cutting head 106, wherein the distance between the first cutting head 106 and the nozzle is 50-200 mu m; cleaning the first silicon substrate 1;
s5, preparing a piezoelectric ink-jet driving piece lower electrode layer 107 and a first cutting head driving piece lower electrode layer 110 on the upper surface of the first silicon substrate by adopting a photoetching process and a metal sputtering process;
s6, preparing a piezoelectric ink-jet driving piece piezoelectric layer 108 and a first cutting head driving piece piezoelectric layer 111 on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a PECVD process;
s7, preparing a piezoelectric layer 109 of a piezoelectric ink-jet driving piece and an upper electrode layer 112 of a first cutting head driving piece on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a metal sputtering process; cleaning the first silicon substrate 1;
s8, selecting a 4inch silicon wafer, transferring the patterns of the liquid inlet liquid storage tank 301 and the liquid spraying liquid storage tank 302 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 301 and the liquid spraying liquid storage tank 302 by adopting a reactive ion etching technology;
s9, transferring the pattern of the liquid inlet channel 303 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet channel 303 by adopting a reactive ion etching technology;
s10, transferring the pattern of the flow-limiting channel 304 and the nozzle 305 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the flow-limiting channel 304 and the nozzle 305 by adopting a reactive ion etching technology;
s11, transferring the pattern of the third cutting unit 306 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and adopting a reactive ion etching technology to etch and prepare the third cutting unit 306, wherein the distance between the third cutting unit 306 and a nozzle is 50-200 mu m (the same as that of the first cutting head); cleaning the third silicon substrate 3;
s12, preparing a piezoelectric ink-jet driving piece lower electrode layer 307 and a third cutting head driving piece lower electrode layer 310 on the upper surface of a third silicon substrate by adopting a photoetching process and a metal sputtering process;
s13, preparing a piezoelectric ink-jet driving piece piezoelectric layer 308 and a third cutting head driving piece piezoelectric layer 311 on the upper surface of the third silicon substrate 3 by adopting a photoetching process and a PECVD process;
s14, preparing a piezoelectric layer 309 of a piezoelectric ink-jet driving piece and an upper electrode layer 312 of a third cutting head driving piece on the upper surface of the third silicon substrate 3 by adopting a photoetching process and a metal sputtering process; cleaning the third silicon substrate 3;
s15, rinsing the lower surface of the first silicon substrate 1 and the upper surface of the third silicon substrate 3 by adopting hydrofluoric acid, and bonding the lower surface of the first silicon substrate 1 and the upper surface of the third silicon substrate 3 by adopting a silicon-silicon bonding process;
s16, cleaning and scribing.
Wherein, the processing procedures of S8-S14 and S1-S7 are the same;
in the structure of the embodiment, the upper silicon substrate and the lower silicon substrate adopt the same structure, so that the manufacturing cost of the other silicon substrate is reduced, the cost is reduced, and simultaneously, the two piezoelectric ink-jet driving parts can provide larger ink-jet power and improve the ink-jet speed;
the number of the liquid spraying passages in the array liquid spraying passages in this embodiment is not limited to the number shown in fig. 4, and may be increased or decreased according to the actual application requirements;
other structures may be referred to in embodiment one.
The foregoing is only illustrative of the preferred embodiments and principles of the present invention, and changes in specific embodiments will occur to those skilled in the art upon consideration of the teachings provided herein, and such changes are intended to be included within the scope of the invention as defined by the claims.
Claims (8)
1. The high-precision piezoelectric type spray head of the ink-jet printer is characterized by comprising a first silicon substrate and a second silicon substrate which are mutually bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a spray nozzle which are sequentially distributed along the liquid inlet flow direction;
the piezoelectric ink-jet driving piece is arranged corresponding to the liquid-jet liquid storage tank, and the joint surface of the piezoelectric ink-jet driving piece and the liquid-jet liquid storage tank is a vibration surface;
the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving piece thereof, a second cutting head and a driving piece thereof, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals;
the first cutting head driving piece and the second cutting head driving piece are respectively used for driving the first cutting head and the second cutting head to be close together so as to cut the ink column sprayed by the nozzle;
the ink jet process comprises the following steps:
firstly, the piezoelectric ink-jet driving piece receives a forward voltage signal to vibrate so as to pull the vibration surface, and ink is sucked into the liquid-jet liquid storage tank from the liquid-inlet liquid storage tank; then, the piezoelectric ink-jet driving piece receives the reverse voltage signal to vibrate so as to push the vibration surface, and ink is extruded out through the nozzle;
when the ejected ink column reaches the maximum length, the first cutting head driving piece and the second cutting head driving piece synchronously receive reverse voltage signals to push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving piece and the second cutting head driving piece receive forward voltage signals for back vibration, and the piezoelectric ink jet driving piece receives the forward voltage signals to pull the vibration surface, absorb ink drops back and simultaneously supplement ink to prepare for next ink jet.
2. The high precision piezoelectric ink jet printer nozzle as in claim 1, wherein said plurality of liquid spray passages are arranged in an array along the bonding surface of the first silicon substrate and the second silicon substrate.
3. The high precision piezoelectric ink jet printer nozzle as claimed in claim 1, wherein the lower surface of the first silicon substrate has a liquid inlet channel, a liquid inlet reservoir, a flow limiting channel, a liquid spray reservoir, a nozzle and a first cutting head, and the upper surface of the first silicon substrate is provided with a piezoelectric ink jet driving member and a first cutting head driving member.
4. A high precision piezoelectric ink jet printer nozzle as defined in claim 3, wherein said second silicon substrate has a second cutting head on its upper surface and a second cutting head driver is disposed on its lower surface.
5. A high precision piezoelectric ink jet printer nozzle as defined in claim 3, wherein the structure of the second silicon substrate and the structure of the first silicon substrate are mirror symmetry, and the lower surface of the second silicon substrate is provided with another piezoelectric ink jet driving member and a second cutting head driving member.
6. The high precision piezoelectric inkjet printer nozzle according to claim 4 or 5 wherein the piezoelectric inkjet driver, the first cutter driver and the second cutter driver are all PZT piezoelectric ceramic plates.
7. The method for manufacturing a high-precision piezoelectric inkjet printer head according to claim 4, comprising the steps of:
s1, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
a piezoelectric ink jet driving piece is arranged on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and a first cutting head driving piece is arranged corresponding to the first cutting head;
s2, selecting a second silicon substrate, etching a second cutting head on the upper surface of the second silicon substrate, and arranging a second cutting head driving piece on the lower surface of the second silicon substrate corresponding to the second cutting head;
and S3, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
8. The method for manufacturing a high-precision piezoelectric inkjet printer head according to claim 5, comprising the steps of:
s10, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
a piezoelectric ink jet driving piece is arranged on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and a first cutting head driving piece is arranged corresponding to the first cutting head;
s20, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a second cutting head on the upper surface of the second silicon substrate; the etched structure of the second silicon substrate and the etched structure of the first silicon substrate are mirror symmetry;
a piezoelectric ink jet driving piece is arranged on the lower surface of the second silicon substrate corresponding to the liquid spraying liquid storage tank, and a second cutting head driving piece is arranged corresponding to the second cutting head;
and S30, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
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| US4016571A (en) * | 1974-09-17 | 1977-04-05 | Hitachi, Ltd. | Ink jet recording apparatus |
| US4068241A (en) * | 1975-12-08 | 1978-01-10 | Hitachi, Ltd. | Ink-jet recording device with alternate small and large drops |
| JPH0211331A (en) * | 1988-06-30 | 1990-01-16 | Fuji Xerox Co Ltd | Inkjet recording apparatus |
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| CN113352758A (en) * | 2021-05-28 | 2021-09-07 | 杭州电子科技大学 | High-speed printer ink-jet head based on magnetostrictive effect and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6851796B2 (en) * | 2001-10-31 | 2005-02-08 | Eastman Kodak Company | Continuous ink-jet printing apparatus having an improved droplet deflector and catcher |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4016571A (en) * | 1974-09-17 | 1977-04-05 | Hitachi, Ltd. | Ink jet recording apparatus |
| US4068241A (en) * | 1975-12-08 | 1978-01-10 | Hitachi, Ltd. | Ink-jet recording device with alternate small and large drops |
| JPH0211331A (en) * | 1988-06-30 | 1990-01-16 | Fuji Xerox Co Ltd | Inkjet recording apparatus |
| US6022099A (en) * | 1997-01-21 | 2000-02-08 | Eastman Kodak Company | Ink printing with drop separation |
| JPH11207946A (en) * | 1998-01-29 | 1999-08-03 | Fuji Xerox Co Ltd | Ink jet recording device |
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