CN114889327B - Electrostatic inkjet printer nozzle and preparation method thereof - Google Patents
Electrostatic inkjet printer nozzle and preparation method thereof Download PDFInfo
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- CN114889327B CN114889327B CN202210423716.7A CN202210423716A CN114889327B CN 114889327 B CN114889327 B CN 114889327B CN 202210423716 A CN202210423716 A CN 202210423716A CN 114889327 B CN114889327 B CN 114889327B
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- 238000002360 preparation method Methods 0.000 title description 6
- 239000007788 liquid Substances 0.000 claims abstract description 107
- 239000000758 substrate Substances 0.000 claims abstract description 102
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 80
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 80
- 239000010703 silicon Substances 0.000 claims abstract description 80
- 238000003860 storage Methods 0.000 claims abstract description 30
- 238000005507 spraying Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 230000005684 electric field Effects 0.000 claims description 2
- 238000001259 photo etching Methods 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 boron ions Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
An electrostatic ink jet printer nozzle includes a first silicon substrate and a second silicon substrate disposed over the first silicon substrate; the side, facing the first silicon substrate, of the second silicon substrate is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage tank to enable liquid to enter the liquid storage tank and a nozzle which is arranged at intervals with the liquid inlet channel to enable liquid in the liquid storage tank to flow out; a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area is also arranged in the liquid storage tank; the flow restrictor is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel communicated with the liquid inlet and the liquid spraying area; a flow limiting column is arranged on the flow limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area.
Description
Technical Field
The invention belongs to the technical field of manufacturing of micro-electromechanical systems, and particularly relates to an electrostatic ink-jet printer nozzle and a preparation method thereof.
Background
The droplet ejecting printing technology is a printing technology which generates pressure difference between an ink chamber and the outside through a certain extrusion mode, so that the internal pressure of a nozzle is larger than the outside pressure, and ink is pushed out of the nozzle to generate tiny ink droplets.
In the electrostatic ink jet printing head, ink can directly flow into each pressure cavity through the main ink channel, so that the pressure difference between the main ink channel and each pressure cavity is smaller, the driving force for the ink to enter the cavity from the main ink channel is smaller, and the condition that the ink in the cavity is easy to flow back and cross talk is caused.
In view of the above, improvements are needed.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention provides an electrostatic type inkjet printer nozzle and a preparation method thereof.
In order to achieve the above purpose, the invention adopts the following technical scheme:
an electrostatic ink jet printer nozzle includes a first silicon substrate and a second silicon substrate disposed over the first silicon substrate; the side, facing the first silicon substrate, of the second silicon substrate is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage tank to enable liquid to enter the liquid storage tank and a nozzle which is arranged at intervals with the liquid inlet channel to enable liquid in the liquid storage tank to flow out; a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area is also arranged in the liquid storage tank; the flow restrictor is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel which is communicated with the liquid inlet area and the liquid spraying area; a flow limiting column is arranged on the flow limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area.
As a preferable scheme, the current-limiting columns are distributed on two sides of the current-limiting channel in an array mode, the current-limiting columns are zigzag, and the zigzag inclined planes face the liquid inlet area; the flow limiting columns at two sides of the flow limiting channel are staggered.
As a preferable scheme, the current-limiting columns are distributed on two sides of the current-limiting channel in an array mode, and the current-limiting columns are arc-shaped; the flow limiting columns on two sides of the flow limiting channel are staggered, and the inner side of the circular arc of the flow limiting column faces the liquid spraying area.
Preferably, the flow restrictor has a plurality of flow restricting passages.
As a preferable scheme, the liquid spraying area is divided into a plurality of chambers; the chambers are in one-to-one correspondence with the flow limiting channels.
Preferably, an ink-jet assembly is further arranged in the liquid storage tank, and the ink-jet assembly comprises a vibrating diaphragm arranged in the liquid inlet area and a fixed electrode arranged above the vibrating diaphragm to enable the vibrating diaphragm to vibrate.
Preferably, the upper surface and the lower surface of the second silicon substrate are both provided with silicon dioxide insulating layers.
The invention also provides a preparation method of the electrostatic ink-jet printer nozzle, which comprises the following steps:
s1, preparing a first silicon substrate; selecting a silicon substrate, and carving out a liquid inlet channel and a nozzle on the lower surface of the first silicon substrate;
s2, preparing a second silicon substrate; selecting a silicon substrate, etching a liquid storage tank groove on the lower surface of the second silicon substrate, and etching a flow limiting part in the liquid storage tank;
s3, preparing a glass substrate; selecting a glass substrate, and etching a fixed electrode groove on the lower surface of the glass substrate;
s4, mounting; bonding and mounting the first silicon substrate and the second silicon substrate by adopting silicon-silicon bonding treatment; and bonding and mounting the second silicon substrate and the glass substrate by adopting a silicon-glass bonding process.
Preferably, in step S2, the width of the groove of the vibration diaphragm is about 200-500 μm and the thickness is about 5-50 μm etched in the second silicon substrate; in the step S3, the length of the fixed electrode groove etched on the glass substrate is 3000-6000 mu m, the width is 200-500 mu m, and the depth is about 50-100 mu m.
Compared with the prior art, the invention has the beneficial effects that: through setting up the restriction post in the restriction passageway, make the velocity of flow of the liquid through the restriction passageway accelerate, increase the pressure differential in feed liquor district and hydrojet district according to Bernoulli's principle and then make liquid after passing through the restriction passageway, under the effect of pressure differential, the condition that can not take place backward flow or crosstalk, and then improved the print quality of printer, reduced the consumption of ink.
Drawings
FIG. 1 is a schematic plan view of an electrostatic ink jet printer nozzle according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing the overall structure of an electrostatic ink jet printer nozzle according to an embodiment of the present invention;
FIG. 3 is a schematic view of a first silicon substrate portion of an electrostatic ink jet printer nozzle according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a second silicon substrate portion of an electrostatic ink jet printer nozzle according to an embodiment of the present invention;
FIG. 5 is a schematic view of a part of a glass substrate of a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 6 is a flow chart of a first silicon substrate manufacturing process of an electrostatic ink jet printer nozzle according to an embodiment of the present invention;
FIG. 7 is a flow chart of a second silicon substrate manufacturing process of the electrostatic ink jet printer nozzle according to the first embodiment of the present invention;
FIG. 8 is a flow chart of a process for fabricating a glass substrate for a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating final bonding of a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
wherein: 1. a first silicon substrate; 11. a liquid inlet channel; 12. a nozzle; 13. an upper electrode layer; a pzt piezoelectric layer; 15. a lower electrode layer; 2. a second silicon substrate; 21. a liquid storage tank; 22. a flow restrictor; 23. a vibrating diaphragm; 24. an electrode interface of the vibrating diaphragm; 25. vibrating diaphragm electrodes; 26. a silicon dioxide insulating layer; 27. a silicon dioxide insulating layer; 3. a glass substrate; 31. fixing the electrode; 32. an electric connection port; 200. a liquid inlet area; 201. a liquid spraying area; 202. a flow restricting passage; 203. a flow-limiting column; 40. an inkjet assembly.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Embodiment one:
the electrostatic ink jet printer head of the present embodiment, as shown in fig. 1 to 5, includes a first silicon substrate 1, a second silicon substrate 2 disposed above the first silicon substrate 1, and a glass substrate 3 disposed above the second silicon substrate 2.
The first silicon substrate 1 is provided with a liquid inlet channel 11 and nozzles 12, a plurality of nozzles 12 can form a liquid spraying passage, and a liquid spraying passage array is positioned between bonding surfaces of the first silicon substrate 1 and the second silicon substrate 2.
The lower surface of the second silicon substrate 2 is also provided with a reservoir 21 communicating with the liquid inlet channel 11 and a flow restrictor 22 provided in the reservoir 21 to restrict the backflow of ink.
As shown in fig. 4, the flow-limiting part 22 divides the liquid storage tank 21 into a liquid inlet area 200 and a liquid spraying area 201, the flow-limiting part 22 is also provided with a flow-limiting channel 202 which is communicated with the liquid inlet area 200 and the liquid spraying area 201, liquid enters the liquid inlet area of the liquid storage tank 21 through the liquid inlet channel 11, flows to the liquid spraying area 201 through the flow-limiting channel 202 in the flow-limiting part 22, and finally the liquid leaves from the liquid spraying area 201 through the nozzle 12.
The flow-limiting channel 202 is internally provided with flow-limiting columns 203 for increasing the flow rate of liquid passing through the flow-limiting channel 202, the flow-limiting columns 203 are distributed on two sides of the flow-limiting channel 202 in an array manner, and the flow-limiting columns 203 are zigzag. The sawtooth inclined surfaces of the flow limiting columns 203 face the liquid inlet area 200, and the limiting columns 203 on two sides of the flow limiting channel 202 are staggered.
Through the staggered flow limiting columns 203 at two sides of the flow limiting channel 202, the flow limiting channel 202 forms a zigzag flow path, and the liquid inlet of the flow limiting channel 202 is larger than the liquid outlet, so that the zigzag structure not only can play a role in preventing backflow, but also can further increase the pressure difference in the flow limiting channel 202.
The liquid passes through the inclined plane on the flow limiting column 203, under the condition that the flow rate is unchanged, the travel of the liquid is increased, the flow rate of the liquid passing through the flow limiting channel 202 is increased, the pressure difference is generated between the liquid inlet area 200 and the liquid spraying area 201, and the liquid entering the liquid spraying area 201 through the flow limiting channel 202 cannot return and cross talk under the action of the pressure difference.
The flow restrictor 22 has a plurality of flow restricting passages 202 disposed therein, each having a flow restricting post 203 disposed therein. The spray zone is divided into a plurality of chambers, each chamber corresponding to one of the flow restricting channels 202, and liquid can flow from the spray zone to a different chamber through a different flow restricting channel 202.
An inkjet assembly 40 is disposed above the reservoir 21. The ink jet assembly 40 includes a vibrating diaphragm 23 capable of generating suction force by being bent by force and a fixed electrode 31 disposed above the vibrating diaphragm 23 to provide electrostatic force thereto. The second silicon substrate 2 is further provided with a diaphragm electrode interface 24 and a diaphragm electrode 25 adapted to the diaphragm 23. The upper surface of the second silicon substrate is further provided with a silicon dioxide insulating layer 27.
As shown in fig. 3, a cutting head for cutting ink drops is arranged below the first silicon substrate 1, the cutting head comprises an upper electrode layer 13 arranged on the first silicon substrate 1, a PZT piezoelectric layer 14 arranged below the upper electrode layer 13 and a lower electrode layer 15 embedded on the lower surface of the PZT piezoelectric layer, the deformation direction of the inverse piezoelectric effect of the PZT piezoelectric layer 14 is perpendicular to the direction of an electric field, and the PZT piezoelectric layer 14 wraps two sides of the lower electrode layer 15.
As shown in fig. 5, the fixed electrode 31 is surrounded by the glass substrate 3, and the fixed electrode 31 is arranged on the lower surface of the glass substrate 3 by wires and connected to an external circuit through the electrical connection port 32.
As shown in fig. 6 to 9, the method for manufacturing the electrostatic ink jet printer head according to the present embodiment includes the steps of:
s1, selecting a 4inch silicon substrate, transferring a liquid inlet channel and a nozzle pattern to the lower surface of a first silicon substrate 1 by adopting a photoetching process, and etching a liquid inlet channel 11 and a nozzle area by adopting a deep reactive ion etching technology;
s2, transferring the pattern of the cutting head to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching a groove of the cutting head by adopting a reactive ion etching technology to about 10-100 mu m;
s3, depositing a layer of silicon dioxide on the lower surface of the first silicon substrate 1 by adopting a PECVD process;
s4, preparing an upper electrode layer 13 of the cutting head in the groove of the cutting head by adopting a photoetching process and a metal sputtering process;
s5, adopting a photoetching process and a PECVD process to deposit PZT into a groove of the cutting head to form a PZT piezoelectric layer 14;
s6, preparing a lower electrode layer 15 of the cutting head in the groove of the cutting head by adopting a photoetching process and a metal sputtering process, removing photoresist and cleaning a silicon wafer;
s7, selecting a 4inch silicon substrate, transferring a pattern of the liquid storage tank 21 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a groove of the liquid storage tank 21 by adopting a reactive ion etching technology, so that the width of the vibrating diaphragm 23 is about 200-500 mu m, and the thickness is about 5-50 mu m;
s8, doping boron ions into the silicon wafer sheet on the liquid storage tank 21 by adopting a photoetching process and a concentrated boron diffusion process to prepare a vibrating diaphragm 23 of a boron-silicon film;
s9, transferring the pattern of the current limiter 22 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a groove of the current limiter 22 by adopting a reactive ion etching technology;
s10, transferring the pattern of the vibrating diaphragm 23 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a vibrating diaphragm groove by adopting a reactive ion etching technology;
s11, preparing a vibrating diaphragm 23 in the vibrating diaphragm groove by adopting a metal sputtering process;
s12, preparing a vibrating diaphragm electrode 25 on the lower surfaces of the groove of the liquid storage tank 21 and the groove of the current limiter 22 by adopting a photoetching process and a metal sputtering process;
s13, depositing a silicon dioxide insulating layer 26 on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a PECVD process; cleaning a silicon wafer;
s14, depositing a silicon dioxide insulating layer 27 on the upper surface of the second silicon substrate 2 by adopting a photoetching process and a PECVD process;
s15, selecting a 4inch glass substrate, transferring an electrostatic electrode groove pattern to the lower surface of the glass substrate 3 by adopting a photoetching process, etching a fixed electrode 31 groove by adopting a reactive ion etching technology, wherein the length of the fixed electrode groove is 3000-6000 mu m, the width is 200-500 mu m, and the depth is about 20-50 mu m;
s16, transferring the pattern of the electric connection port 32 to the lower surface of the glass substrate 3 by adopting a photoetching process, and etching the electric connection port 32 by adopting a reactive ion etching technology;
s17, preparing a fixed electrode 31 and a wire array on the glass substrate 3 by adopting a photoetching process and a metal sputtering process, removing photoresist and cleaning the glass substrate 3;
s18, rinsing the upper surface of the first silicon substrate 1 and the lower surface of the second silicon substrate 2 by adopting hydrofluoric acid, and bonding the upper surface of the first silicon substrate 1 and the lower surface of the second silicon substrate 2 by adopting a silicon-silicon bonding process;
s19, rinsing the upper surface of the second silicon substrate 2 and the lower surface of the glass substrate 3 by adopting hydrofluoric acid, and bonding the upper surface of the second silicon substrate 2 and the lower surface of the glass substrate 3 by adopting a silicon-glass bonding process;
s20, cleaning and scribing to finish the preparation.
When the printer nozzle works, the fixed electrode 31 receives voltage, the vibrating diaphragm 23 bends upwards under the action of electrostatic force, and ink is sucked in; then the voltage of the fixed electrode 31 disappears, the vibrating diaphragm 23 resets, the extrusion ink is ejected, after the ink is extruded, the cutting head starts to work, and when the ink drop speed reaches the maximum, the deformation of the cutting head is utilized to push the extrusion nozzle 12 to cut the ink drop, so that the satellite ink drop is avoided; after the ink drops are ejected, the cutting head is opened to start the ejection of the next round of ink drops.
The electrostatic type ink-jet printer nozzle of the embodiment is added with the cutting head on the basis of the traditional ink-jet printer nozzle, so that long tail posts generated in the ink drop spraying process are avoided, the volume of the ink drop can be effectively controlled, and the ink drop spraying speed is improved; meanwhile, the serrated current limiting part is designed, ink is prevented from flowing back through the multiple current limiting columns, crosstalk between nozzles is reduced, the size of the spray head can be further reduced under the condition that the process allows, and the spray heads are arranged more tightly.
The number of liquid spraying passages in the array liquid spraying passage of the embodiment is not limited to the number shown in the first embodiment, and may be increased or decreased according to the actual application requirement.
Embodiment two:
the difference between the present embodiment and the first embodiment is that the current-limiting column is in a circular arc shape, the circular arc inner side of the current-limiting column faces the liquid spraying area, and other specific structures are the same as those of the first embodiment.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. An electrostatic ink jet printer nozzle, comprising a first silicon substrate and a second silicon substrate arranged above the first silicon substrate; the side, facing the first silicon substrate, of the second silicon substrate is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage tank to enable liquid to enter the liquid storage tank and a nozzle which is arranged at intervals with the liquid inlet channel to enable liquid in the liquid storage tank to flow out;
a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area is also arranged in the liquid storage tank; the flow restrictor is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel which is communicated with the liquid inlet area and the liquid spraying area;
a flow limiting column is arranged on the flow limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area; the flow-limiting columns are distributed on two sides of the flow-limiting channel in an array mode, and the flow-limiting columns on two sides of the flow-limiting channel are arranged in a staggered mode;
the cutting head for cutting ink drops is arranged below the first silicon substrate and comprises an upper electrode layer arranged on the first silicon substrate, a PZT piezoelectric layer arranged below the upper electrode layer and a lower electrode layer embedded on the lower surface of the PZT piezoelectric layer, the deformation direction of the PZT piezoelectric layer with the inverse piezoelectric effect is perpendicular to the direction of an electric field, and the PZT piezoelectric layer wraps two sides of the lower electrode layer.
2. The electrostatic inkjet printer head of claim 1, wherein the restrictor post is serrated and the serrated bevel faces the liquid inlet region.
3. The electrostatic inkjet printer head of claim 1, wherein the flow-restricting post is circular in shape, the circular inner side of the flow-restricting post facing the liquid-ejecting zone.
4. An electrostatic inkjet printer head according to claim 2 or claim 3 wherein the flow restrictor has a plurality of flow restrictor passages.
5. The electrostatic ink jet printer nozzle of claim 4, wherein said spray zone is divided into a plurality of chambers; the chambers are in one-to-one correspondence with the flow limiting channels.
6. The electrostatic inkjet printer head of claim 5, wherein an inkjet assembly is further disposed within the reservoir, the inkjet assembly including a vibrating diaphragm disposed within the liquid inlet region and a stationary electrode disposed above the vibrating diaphragm to vibrate the vibrating diaphragm.
7. The electrostatic ink jet printer nozzle of claim 6, wherein a glass substrate is further disposed over said second silicon substrate, said stationary electrode being mounted on the glass substrate.
8. The electrostatic ink jet printer nozzle of claim 7, wherein the upper and lower surfaces of the second silicon substrate are each provided with a silicon dioxide insulating layer.
9. A method of manufacturing an electrostatic ink jet printer head according to any one of claims 1 to 8, comprising the steps of:
s1, preparing a first silicon substrate; selecting a silicon substrate, and carving out a liquid inlet channel and a nozzle on the lower surface of the first silicon substrate;
s2, preparing a second silicon substrate; selecting a silicon substrate, etching a liquid storage tank groove on the lower surface of the second silicon substrate, and etching a flow limiting part in the liquid storage tank;
s3, preparing a glass substrate; selecting a glass substrate, and etching a fixed electrode groove on the lower surface of the glass substrate;
s4, mounting; bonding and mounting the first silicon substrate and the second silicon substrate by adopting silicon-silicon bonding treatment; and bonding and mounting the second silicon substrate and the glass substrate by adopting a silicon-glass bonding process.
10. The method for manufacturing a showerhead of an electrostatic type ink jet printer according to claim 9, wherein in the step S2, a groove width of the vibrating diaphragm is 200-500 μm and a thickness is 5-50 μm etched in the second silicon substrate; in the step S3, the length of the fixed electrode groove etched on the glass substrate is 3000-6000 mu m, the width is 200-500 mu m, and the depth is 50-100 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210423716.7A CN114889327B (en) | 2022-04-21 | 2022-04-21 | Electrostatic inkjet printer nozzle and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210423716.7A CN114889327B (en) | 2022-04-21 | 2022-04-21 | Electrostatic inkjet printer nozzle and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114889327A CN114889327A (en) | 2022-08-12 |
| CN114889327B true CN114889327B (en) | 2023-05-12 |
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| KR20110139494A (en) * | 2010-06-23 | 2011-12-29 | 삼성전기주식회사 | Ink path structure and inkjet head including the same |
| CN108909185B (en) * | 2018-06-15 | 2020-07-17 | 大连瑞林数字印刷技术有限公司 | Piezoelectric ink-jet printing nozzle driven by thick-film piezoelectric element |
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| CN109130509B (en) * | 2018-09-30 | 2024-01-09 | 西安增材制造国家研究院有限公司 | Restrictor in a droplet ejection printhead |
| CN111038105B (en) * | 2019-12-19 | 2021-09-07 | 西安增材制造国家研究院有限公司 | Piezoelectric type ink-jet printing head |
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| US4068241A (en) * | 1975-12-08 | 1978-01-10 | Hitachi, Ltd. | Ink-jet recording device with alternate small and large drops |
| US6382782B1 (en) * | 2000-12-29 | 2002-05-07 | Eastman Kodak Company | CMOS/MEMS integrated ink jet print head with oxide based lateral flow nozzle architecture and method of forming same |
| EP1219424A2 (en) * | 2000-12-29 | 2002-07-03 | Eastman Kodak Company | Cmos/mems integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same |
| CN101308339A (en) * | 2007-05-16 | 2008-11-19 | 株式会社理光 | Toner preparation method and apparatus, and toner prepared thereby |
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| CN114889327A (en) | 2022-08-12 |
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