CN115091854B - High-precision electrostatic type inkjet printer nozzle and processing method thereof - Google Patents
High-precision electrostatic type inkjet printer nozzle and processing method thereof Download PDFInfo
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- CN115091854B CN115091854B CN202210424156.7A CN202210424156A CN115091854B CN 115091854 B CN115091854 B CN 115091854B CN 202210424156 A CN202210424156 A CN 202210424156A CN 115091854 B CN115091854 B CN 115091854B
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- 238000003672 processing method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 238000005520 cutting process Methods 0.000 claims abstract description 117
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 109
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 109
- 239000010703 silicon Substances 0.000 claims abstract description 109
- 239000007788 liquid Substances 0.000 claims abstract description 101
- 239000011521 glass Substances 0.000 claims abstract description 39
- 238000003860 storage Methods 0.000 claims abstract description 36
- 238000005507 spraying Methods 0.000 claims abstract description 14
- 239000007921 spray Substances 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 7
- -1 boron ions Chemical class 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 40
- 238000001259 photo etching Methods 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention relates to a high-precision electrostatic ink-jet printer nozzle and a processing method thereof, wherein the nozzle comprises a glass substrate, a first silicon substrate and a second silicon substrate which are sequentially bonded, a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and the liquid spraying passage comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along a liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and is used for driving ink to be ejected from the nozzle and sucking the ink into the liquid spraying liquid storage tank; the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spray path of the nozzle, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals; the ink jet printer further comprises a first cutting head driving unit and a second cutting head driving unit, so that the first cutting head and the second cutting head are mutually close to cut ink columns ejected by the nozzles. The invention can avoid the generation of satellite ink drops, control the ink drop ejection volume and improve the printing precision.
Description
Technical Field
The invention belongs to the technical field of inkjet printer nozzles, and particularly relates to a high-precision electrostatic inkjet printer nozzle and a processing method thereof.
Background
The existing inkjet printer nozzle is provided with a thermal bubble type nozzle, a piezoelectric type nozzle and an electrostatic type nozzle, in the process of jetting ink drops, the ink drops easily form long tail columns, the long tail columns are easily broken to form satellite ink drops, and the satellite ink drops reach the substrate after the main ink drops are jetted to the substrate, so that the accuracy of printed images is affected.
The process of breaking the long tail into a main droplet and satellite droplets is mainly affected by the viscosity and tension of the droplets themselves and the application of voltage pulses. In the electrostatic ink jet printer, the generation of satellite ink droplets can be suppressed by setting an appropriate voltage pulse, but the voltage pulse is related to the velocity and volume of ink droplets, and is inevitably limited by the volume and velocity of ejected ink droplets when the voltage pulse signal is designed to suppress satellite ink droplets.
Disclosure of Invention
Based on the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a high-precision electrostatic inkjet printer head and a method for manufacturing the same.
In order to achieve the above object, the present invention adopts the following technical scheme:
the high-precision electrostatic ink-jet printer nozzle comprises a glass substrate, a first silicon substrate and a second silicon substrate which are sequentially bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and is used for driving ink to be ejected from the nozzle and sucking the ink into the liquid spraying liquid storage tank;
the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spray path of the nozzle, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals;
the high-precision electrostatic ink jet printer nozzle further comprises a first cutting head driving unit and a second cutting head driving unit which are respectively used for driving the first cutting head and the second cutting head so as to enable the first cutting head and the second cutting head to be close to each other to cut ink columns sprayed out by the nozzles.
Preferably, the liquid spraying passages are distributed along the bonding surface of the first silicon substrate and the second silicon substrate.
Preferably, the surface of the first silicon substrate opposite to the second silicon substrate is provided with an ink-jet liquid storage tank and a first cutting head;
the surface of the second silicon substrate opposite to the first silicon substrate is provided with a liquid inlet channel, a liquid inlet storage tank, a flow limiting channel, an ink jet storage tank, a nozzle and a second cutting head.
As a preferred scheme, the back of the ink jet liquid storage pool of the first silicon substrate, which faces the glass substrate, is a vibrating surface, the electrostatic driving unit comprises a fixed electrode and a vibrating surface electrode, the vibrating surface electrode is arranged on the inner side of the vibrating surface, the fixed electrode is arranged on the glass substrate corresponding to the vibrating surface, and the fixed electrode is in clearance fit with the vibrating surface.
Preferably, the vibration surface is doped with boron ions.
Preferably, the first cutting head driving unit and the second cutting head driving unit both adopt PZT piezoelectric ceramic plates.
Preferably, the PZT piezoelectric ceramic sheet includes a first electrode layer, a PZT piezoelectric layer, and a second electrode layer stacked in order.
Preferably, the first cutting head driving unit is embedded in the mounting groove of the glass substrate, and the second cutting head driving unit is arranged on the second silicon substrate.
As a preferred scheme, the glass substrate is provided with a bus interface and a wire array, and the bus interface is respectively connected with the fixed electrode, the first electrode layer and the second electrode layer of the first cutting head driving unit through the wire array;
the first silicon substrate is provided with a vibration surface electrode interface, and the vibration surface electrode interface is electrically connected with the vibration surface electrode.
The invention also provides a processing method of the high-precision electrostatic ink-jet printer nozzle, which comprises the following steps:
s1, selecting a glass substrate, etching a mounting groove, a fixed electrode groove and a total wiring port, wherein the mounting groove, the fixed electrode groove and the total wiring port are used for embedding a first cutting head driving unit, the first cutting head driving unit is arranged in the mounting groove, a fixed electrode is arranged in the fixed electrode groove, and a wire array for connecting the total wiring port with the fixed electrode and the first cutting head driving unit is arranged on the lower surface of the glass substrate; depositing a silicon dioxide insulating layer on the lower surface of the glass substrate;
s2, selecting a first silicon substrate, etching a first cutting head, an ink-jet liquid storage tank and a vibration surface electrode interface groove on the lower surface of the first silicon substrate, doping boron ions on the back surface of the ink-jet liquid storage tank to obtain a vibration surface, and then arranging a vibration surface electrode below the vibration surface; the vibration surface electrode interface groove is provided with a vibration surface electrode interface, the vibration surface electrode interface is electrically connected with a vibration surface electrode, and then a silicon dioxide insulating layer is deposited on the lower surface of the first silicon substrate;
depositing a silicon dioxide insulating layer on the upper surface of the first silicon substrate;
s3, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head on the upper surface of the second silicon substrate;
disposing a second cutting head driving unit on a lower surface of the second silicon substrate corresponding to the second cutting head, and then depositing a silicon dioxide insulating layer on the lower surface of the second silicon substrate;
and S4, bonding the lower surface of the glass substrate and the upper surface of the first silicon substrate, and bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
Compared with the prior art, the invention has the following technical effects:
when the liquid column is at maximum, the corresponding cutting driving cutting heads are mutually close to each other to cut the liquid column, so that liquid drops are obtained; meanwhile, the vibration surface and the fixed electrode are indirectly opposite in voltage, so that the vibration surface is upwards bent, the residual liquid column is sucked back, and the ink is replenished; the invention can avoid the generation of satellite ink drops, simultaneously control the volume of the ejected ink drops and improve the printing precision.
Drawings
FIG. 1 is a schematic plan view of a high-precision electrostatic ink jet printer head according to embodiment 1 of the present invention;
FIG. 2 is a schematic perspective view of a high-precision electrostatic ink jet printer head according to embodiment 1 of the present invention;
FIG. 3 is a schematic view showing the structure of a portion of the lower surface of a glass substrate of a high-precision electrostatic ink-jet printer head according to example 1 of the present invention;
FIG. 4 is a schematic view showing the structure of a portion of the lower surface of a first silicon substrate of a nozzle of a high-precision electrostatic ink-jet printer according to embodiment 1 of the present invention;
FIG. 5 is a schematic view showing the structure of the upper surface of a second silicon substrate of the nozzle of the high-precision electrostatic ink-jet printer according to embodiment 1 of the present invention;
FIG. 6 is a schematic view showing the structure of the lower surface of a second silicon substrate of the nozzle of the high-precision electrostatic ink-jet printer according to embodiment 1 of the present invention;
FIG. 7 is a flow chart of the process for fabricating a glass substrate for a high-precision electrostatic ink jet printer head according to example 1 of the present invention;
FIG. 8 is a flow chart of a first silicon substrate manufacturing process of the high-precision electrostatic ink jet printer nozzle of embodiment 1 of the present invention;
FIG. 9 is a flow chart of a second silicon substrate manufacturing process of the high-precision electrostatic ink jet printer nozzle of embodiment 1 of the present invention;
FIG. 10 is a schematic diagram showing the final bonding of the nozzle of the high-precision electrostatic ink-jet printer according to example 1 of the present invention;
1, a glass substrate; 11. a lower electrode layer of the first cutting driving unit; 12. a PZT piezoelectric layer of a first cutting driving unit; 13. an upper electrode layer of the first cutting driving unit; 14. fixing the electrode; 15. a wire array; 16. a main wiring port; 2. a first silicon substrate; 21. a first cutting head; 22. a vibration surface; 23. a vibrating surface electrode; 24. a vibrating surface electrode interface; 25. an inkjet reservoir; 3. a second silicon substrate; 31. a liquid inlet channel; 32. a liquid inlet storage tank; 33. a flow restricting passage; 34. an inkjet reservoir; 35. a nozzle; 36. a second cutting head; 37. a lower electrode layer of the second cutting driving unit; 38. a PZT piezoelectric layer of a second dicing driving unit; 39. and an upper electrode layer of the second cutting driving unit.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, specific embodiments of the present invention will be described below with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
Example 1:
as shown in fig. 1 to 10, the high-precision electrostatic ink jet printer head of the present embodiment includes a glass substrate 1, a first silicon substrate 2, and a second silicon substrate 3 bonded in this order, an array-type liquid ejection path is formed between the first silicon substrate 1 and the second silicon substrate 2, and each liquid ejection path in the array-type liquid ejection path includes a liquid inlet channel 31, a liquid inlet liquid reservoir 32, a flow restriction channel 33, a liquid ejection liquid reservoir 34, and a nozzle 35 distributed in this order along the liquid inlet direction. Wherein, all liquid inlet channels 31 of the liquid spraying passages share one, and liquid inlet liquid storage tanks 32 share one.
An electrostatic driving unit is arranged between the glass substrate 1 and the first silicon substrate 2, and is used for driving ink to be ejected from the nozzle 35 and sucking the ink into the liquid spraying liquid storage tank 34;
wherein the first silicon substrate 2 and the second silicon substrate 3 are provided with a first cutting head 21 and a second cutting head 36 corresponding to the nozzle ejection path, and the first cutting head 21 is opposite to the second cutting head 36 and matched with the second cutting head 36 at intervals;
the high-precision electrostatic inkjet printer head of the present embodiment further includes a first cutting head driving unit and a second cutting head driving unit for driving the first cutting head 21 and the second cutting head 36, respectively, so that the first cutting head 21 and the second cutting head 36 are brought close to each other to cut the ink column ejected from the nozzle 35.
The liquid ejection paths of the present embodiment are distributed along the bonding surface of the first silicon substrate 2 and the second silicon substrate 3. Specifically, the lower surface of the first silicon substrate 2 has an ink-jet liquid reservoir, a first cutting head 21 and a vibrating surface electrode interface 24, the upper surface of the second silicon substrate 3 has a liquid-feed passage 31, a liquid-feed liquid reservoir 32, a flow-restricting passage 33, an ink-jet liquid reservoir 34, a nozzle 35 and a second cutting head 36, and the lower surface of the second silicon substrate is provided with a second cutting drive unit.
In addition, the back of the ink jet liquid reservoir of the first silicon substrate 2 facing the glass substrate 1 is a vibration surface 22, the electrostatic driving unit includes a fixed electrode 14 and a vibration surface electrode 23, the vibration surface electrode 23 is disposed on the inner side of the vibration surface, the fixed electrode 14 is disposed on the glass substrate corresponding to the vibration surface, and the fixed electrode 14 is in clearance fit with the vibration surface. Wherein the vibration surface is doped with boron ions, so that the vibration surface is conductive.
The first cutting head driving unit and the second cutting head driving unit of the embodiment both adopt PZT piezoelectric ceramic plates, and the PZT piezoelectric ceramic plates comprise a first electrode layer, a PZT piezoelectric layer and a second electrode layer which are sequentially stacked. Specifically, the first cutting head driving unit includes a first cutting driving unit lower electrode layer 11, a first cutting driving unit piezoelectric layer 12, and a first cutting driving unit upper electrode layer 13 stacked in this order; the second cutting head driving unit includes a second cutting driving unit lower electrode layer 37, a first cutting driving unit piezoelectric layer 38, and a first cutting driving unit upper electrode layer 39, which are stacked in this order.
Wherein the first cutting head driving unit is embedded in the mounting groove of the glass substrate 1, and the second cutting head driving unit is arranged on the lower surface of the second silicon substrate.
The glass substrate 1 is provided with a bus interface 16 and a wire array 15, and the bus interface 16 is connected to the fixed electrode 14 provided corresponding to each liquid ejecting path and the two electrode layers of the first cutting head driving unit through the wire array 15.
The first silicon substrate 2 is further provided with a vibrating surface electrode interface 24, and the vibrating surface electrode interface 24 is electrically connected with the vibrating surface electrode 23 so as to lead out wiring.
In the high-precision electrostatic ink jet printer nozzle of this embodiment, when in operation, the vibration surface 22 is bent upward by the voltage indirectly opposite to the vibration surface 22 and the fixed electrode 14, ink is sucked through the current limiting channel 33, then the voltage between the vibration surface 22 and the fixed electrode 14 is disconnected, the vibration surface 22 vibrates downward to extrude the ink out of the nozzle 35, when the liquid column reaches the maximum, the cutting driving unit pushes the cutting head to cut the liquid column to obtain liquid drops, and meanwhile, the vibration surface 22 is bent upward by the voltage indirectly opposite to the vibration surface 22 and the fixed electrode 14, the residual liquid column is sucked back, and the ink is replenished.
The processing method of the high-precision electrostatic ink-jet printer nozzle of the embodiment comprises the following steps:
s1, selecting a 4inch silicon wafer, transferring a pattern of a first cutting driving unit groove to the lower surface of a glass substrate 1 by adopting a photoetching process, and etching to prepare the first cutting driving unit groove by adopting a reactive ion etching technology;
s2, transferring the patterns of the grooves and the total wiring ports 16 of the fixed electrode 14 to the lower surface of the glass substrate 1 by adopting a photoetching process, and etching to prepare the grooves and the total wiring ports 16 of the fixed electrode 22 by adopting a reactive ion etching technology, wherein the length of the grooves of the fixed electrode is 3000-6000 mu m, the width of the grooves of the fixed electrode is 200-500 mu m, and the width of the grooves of the fixed electrode is about 50-100 mu m;
s3, preparing a first cutting driving unit lower electrode layer 11 in the groove of the first cutting driving unit by adopting a photoetching process and a metal sputtering process;
s4, preparing a piezoelectric layer 12 of the first cutting driving unit on the lower electrode layer 11 of the first cutting driving unit by adopting a photoetching process and a PECVD process;
s5, preparing an upper electrode layer 13, a fixed electrode 14 and a wire array 15 of the first cutting driving unit on the piezoelectric layer 12, the fixed electrode 14 groove and the lower surface of the glass substrate 1 by adopting a photoetching process and a metal sputtering process;
s6, adopting a photoetching process and a PECVD process to deposit and prepare a silicon dioxide insulating layer on the lower surface of the glass substrate 1; cleaning the glass substrate;
s7, selecting a 4inch silicon substrate, transferring the pattern of the first cutting head 21 to the lower surface of the first silicon substrate 2 by adopting a photoetching process, and adopting a reactive ion etching technology to etch and prepare the first cutting head 21, wherein the distance between the first cutting head 21 and the nozzle 35 is 50-200 mu m;
s8, transferring the pattern of the ink-jet liquid storage tank 34 to the lower surface of the first silicon substrate 2 by adopting a photoetching process, etching to prepare the ink-jet liquid storage tank 34 by adopting a reactive ion etching technology, wherein the length and the width of the ink-jet liquid storage tank 34 are consistent with those of the grooves of the fixed electrode 22, and the thickness of the residual vibration surface 22 is 5-10 mu m;
s9, doping boron ions into the silicon wafer sheet on the ink-jet liquid storage tank by adopting a photoetching process and a concentrated boron diffusion process, so as to prepare a vibration surface 22 of the boron-silicon film;
s10, preparing a vibration surface electrode 23 below the vibration surface 22 and on the lower surface of the first silicon substrate 2 by adopting a photoetching process and a metal sputtering process;
s11, transferring the pattern of the vibration surface electrode interface 24 to the lower surface of the first silicon substrate 2 by adopting a photoetching process, and etching to prepare a groove of the vibration surface electrode interface 24 by adopting a reactive ion etching technology;
s12, preparing a vibration surface electrode interface 24 in a groove of the vibration surface electrode interface 4 by adopting a photoetching process and a metal sputtering process;
s13, adopting a photoetching process and a PECVD process to deposit and prepare a silicon dioxide insulating layer on the lower surface of the first silicon substrate 2;
s14, adopting a photoetching process and a PECVD process to deposit and prepare a silicon dioxide insulating layer on the upper surface of the first silicon substrate 2; cleaning the first silicon substrate 2;
s15, selecting a 4inch silicon substrate, transferring the pattern of the liquid inlet channel 31 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and preparing the liquid inlet channel 31 by adopting a deep reactive ion etching technology;
s16, transferring the pattern of the liquid inlet liquid storage pool 32 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage pool 32 by adopting a reactive ion etching technology;
s17, transferring the patterns of the flow-limiting channel 33, the ink-jet liquid storage tank 34 and the nozzle 35 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the flow-limiting channel 33, the ink-jet liquid storage tank 34 and the nozzle 35 by adopting a reactive ion etching technology, wherein the depth of the flow-limiting channel 33 and the nozzle 35 is 20-100 mu m;
s18, transferring the pattern of the second cutting head 36 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the second cutting head 36 by adopting a reactive ion etching technology, wherein the distance between the second cutting head 36 and the nozzle 35 is 50-200 mu m (the same as that of the first cutting head);
s19, preparing a second cutting driving unit lower electrode layer 37 on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a metal sputtering process;
s20, preparing a second cutting driving unit piezoelectric layer 38 on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a PECVD process;
s21, preparing a second cutting driving unit upper electrode layer 39 on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a metal sputtering process;
s22, adopting a photoetching process and a PECVD process to deposit and prepare a silicon dioxide insulating layer on the lower surface of the second silicon substrate 3; cleaning the second silicon substrate;
s23, rinsing the lower surface of the glass substrate 1 and the upper surface of the first silicon substrate 2 by adopting hydrofluoric acid, and bonding the lower surface of the glass substrate 1 and the upper surface of the first silicon substrate 2 by adopting a silicon-glass bonding process;
s24, rinsing the lower surface of the first silicon substrate 2 and the lower surface of the second silicon substrate 3 by adopting hydrofluoric acid, and bonding the lower surface of the first silicon substrate 2 and the upper surface of the second silicon substrate 3 by adopting a silicon-silicon bonding process;
s25, cleaning and scribing to finish the preparation.
The high-precision electrostatic ink-jet printer nozzle of the embodiment is additionally provided with the cutting head on the basis of the traditional ink-jet printer nozzle, and the cutting head is cut when the liquid column reaches the maximum length, so that ink drops to be ejected are directly obtained, satellite ink drops can be prevented from being generated, the volume of the ejected ink drops is controlled, and the printing precision is improved.
Example 2:
the high-precision electrostatic inkjet printer head of the present embodiment is different from embodiment 1 in that:
the number of liquid ejecting passages in the array type liquid ejecting passage is not limited to the number shown in embodiment 1, and may be increased or decreased according to the actual application requirements;
other structures can be referred to embodiment 1.
The foregoing is only illustrative of the preferred embodiments and principles of the present invention, and changes in specific embodiments will occur to those skilled in the art upon consideration of the teachings provided herein, and such changes are intended to be included within the scope of the invention as defined by the claims.
Claims (7)
1. The high-precision electrostatic ink-jet printer nozzle is characterized by comprising a glass substrate, a first silicon substrate and a second silicon substrate which are sequentially bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and is used for driving ink to be ejected from the nozzle and sucking the ink into the liquid spraying liquid storage tank;
the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spray path of the nozzle, and the first cutting head is opposite to the second cutting head and is matched with the second cutting head at intervals;
the high-precision electrostatic ink jet printer nozzle further comprises a first cutting head driving unit and a second cutting head driving unit which are respectively used for driving the first cutting head and the second cutting head so as to enable the first cutting head and the second cutting head to be close to each other to cut ink columns sprayed out by the nozzles;
the liquid spraying passages are distributed along the bonding surface of the first silicon substrate and the second silicon substrate;
the surface of the first silicon substrate, which is opposite to the second silicon substrate, is provided with an ink-jet liquid storage tank and a first cutting head;
the surface of the second silicon substrate, which is opposite to the first silicon substrate, is provided with a liquid inlet channel, a liquid inlet storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head;
the ink jet liquid storage tank of the first silicon substrate faces the back of the glass substrate to form a vibration surface, the electrostatic driving unit comprises a fixed electrode and a vibration surface electrode, the vibration surface electrode is arranged on the inner side of the vibration surface, the fixed electrode is arranged on the glass substrate corresponding to the vibration surface, and the fixed electrode is in clearance fit with the vibration surface;
when the liquid column is maximum, each cutting head driving unit drives the corresponding cutting heads to mutually close to cut the liquid column, so that liquid drops are obtained; meanwhile, the vibration surface and the fixed electrode are indirectly opposite in voltage, so that the vibration surface is bent upwards, the residual liquid column is sucked back, and ink is replenished.
2. A high precision electrostatic ink jet printer nozzle as defined in claim 1, wherein said vibration surface is doped with boron ions.
3. The high precision electrostatic inkjet printer head of claim 2, wherein the first cutting head drive unit and the second cutting head drive unit each employ PZT piezoelectric ceramic plates.
4. A high precision electrostatic ink jet printer nozzle as defined in claim 3, wherein said PZT piezoelectric ceramic plate comprises a first electrode layer, a PZT piezoelectric layer and a second electrode layer stacked in sequence.
5. The high precision electrostatic ink jet printer nozzle as defined in claim 4, wherein said first cutting head driving unit is embedded in a mounting groove of a glass substrate, and said second cutting head driving unit is provided in a second silicon substrate.
6. The high-precision electrostatic ink jet printer nozzle as in claim 5, wherein said glass substrate is provided with a bus interface and a wire array, said bus interface being connected to said fixed electrode, said first electrode layer and said second electrode layer of said first cutter head drive unit, respectively, by said wire array;
the first silicon substrate is provided with a vibration surface electrode interface, and the vibration surface electrode interface is electrically connected with the vibration surface electrode.
7. The method of manufacturing a high-precision electrostatic inkjet printer head according to claim 6, comprising the steps of:
s1, selecting a glass substrate, etching a mounting groove, a fixed electrode groove and a total wiring port, wherein the mounting groove, the fixed electrode groove and the total wiring port are used for embedding a first cutting head driving unit, the first cutting head driving unit is arranged in the mounting groove, a fixed electrode is arranged in the fixed electrode groove, and a wire array for connecting the total wiring port with the fixed electrode and the first cutting head driving unit is arranged on the lower surface of the glass substrate; depositing a silicon dioxide insulating layer on the lower surface of the glass substrate;
s2, selecting a first silicon substrate, etching a first cutting head, an ink-jet liquid storage tank and a vibration surface electrode interface groove on the lower surface of the first silicon substrate, doping boron ions on the back surface of the ink-jet liquid storage tank to obtain a vibration surface, and then arranging a vibration surface electrode below the vibration surface; the vibration surface electrode interface groove is provided with a vibration surface electrode interface, the vibration surface electrode interface is electrically connected with a vibration surface electrode, and then a silicon dioxide insulating layer is deposited on the lower surface of the first silicon substrate;
depositing a silicon dioxide insulating layer on the upper surface of the first silicon substrate;
s3, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head on the upper surface of the second silicon substrate;
disposing a second cutting head driving unit on a lower surface of the second silicon substrate corresponding to the second cutting head, and then depositing a silicon dioxide insulating layer on the lower surface of the second silicon substrate;
and S4, bonding the lower surface of the glass substrate and the upper surface of the first silicon substrate, and bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
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| EP0565280A2 (en) * | 1992-03-26 | 1993-10-13 | Kabushiki Kaisha TEC | Method of producing printer head using piezoelectric member |
| JP2007245686A (en) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | Electrostatic actuator, liquid droplet discharge head, and their manufacturing methods |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5269628A (en) * | 1975-12-08 | 1977-06-09 | Hitachi Ltd | Ink jet recorder |
| CN101497269B (en) * | 2009-03-02 | 2010-07-21 | 厦门大学 | Electrostatic driven jet printing head |
| JP5484217B2 (en) * | 2010-06-25 | 2014-05-07 | キヤノン株式会社 | Liquid ejection apparatus and method |
| CN203343616U (en) * | 2013-07-23 | 2013-12-18 | 何亚彬 | Clutch type ink-jet printing and laser cutting machine handpiece |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0565280A2 (en) * | 1992-03-26 | 1993-10-13 | Kabushiki Kaisha TEC | Method of producing printer head using piezoelectric member |
| JP2007245686A (en) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | Electrostatic actuator, liquid droplet discharge head, and their manufacturing methods |
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