CN115091854A - High-precision electrostatic ink-jet printer nozzle and processing method thereof - Google Patents
High-precision electrostatic ink-jet printer nozzle and processing method thereof Download PDFInfo
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- CN115091854A CN115091854A CN202210424156.7A CN202210424156A CN115091854A CN 115091854 A CN115091854 A CN 115091854A CN 202210424156 A CN202210424156 A CN 202210424156A CN 115091854 A CN115091854 A CN 115091854A
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- 238000003672 processing method Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 238000005520 cutting process Methods 0.000 claims abstract description 112
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 109
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 109
- 239000010703 silicon Substances 0.000 claims abstract description 109
- 239000007788 liquid Substances 0.000 claims abstract description 100
- 238000003860 storage Methods 0.000 claims abstract description 42
- 239000011521 glass Substances 0.000 claims abstract description 41
- 238000005507 spraying Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 15
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 10
- 229910052796 boron Inorganic materials 0.000 claims description 7
- -1 boron ions Chemical class 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 3
- 238000001259 photo etching Methods 0.000 description 22
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention relates to a high-precision electrostatic ink-jet printer nozzle and a processing method thereof, wherein the nozzle comprises a glass substrate, a first silicon substrate and a second silicon substrate which are sequentially bonded, a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and the liquid spraying passage comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along a liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and is used for driving ink to be sprayed out of the nozzle and sucking the ink into a liquid spraying liquid storage tank; the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spraying paths of the nozzles, and the first cutting head and the second cutting head are opposite and matched at intervals; the ink jet printer further comprises a first cutting head driving unit and a second cutting head driving unit, so that the first cutting head and the second cutting head are mutually close to cut ink columns ejected by the nozzles. The invention can avoid the generation of satellite ink drops, control the volume of the ejected ink drops and improve the printing precision.
Description
Technical Field
The invention belongs to the technical field of ink-jet printer nozzles, and particularly relates to a high-precision electrostatic ink-jet printer nozzle and a processing method thereof.
Background
The existing ink-jet printer nozzle is provided with a hot bubble type, piezoelectric type and electrostatic type nozzle, in the ink drop ejection process, ink drops are easy to form long tail columns, the long tail columns are easy to break to form satellite ink drops, and the satellite ink drops reach a substrate after main ink drops are ejected to the substrate, so that the accuracy of printed images is affected.
The process of breaking the long tail pillars into main and satellite drops is mainly influenced by the viscosity and tension of the drops themselves and the application of voltage pulses. For the electrostatic ink jet printer, the generation of satellite ink droplets can be suppressed by setting appropriate voltage pulses, but the voltage pulses are related to the velocity and volume of the ink droplets, and the volume and velocity of the ejected ink droplets are inevitably limited when designing voltage pulse signals to suppress the satellite ink droplets.
Disclosure of Invention
Based on the above-mentioned defects of the prior art, the present invention provides a high-precision electrostatic ink-jet printer head and a processing method thereof.
In order to realize the purpose, the invention adopts the following technical scheme:
a high-precision electrostatic ink-jet printer nozzle comprises a glass substrate, a first silicon substrate and a second silicon substrate which are bonded in sequence, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank and a nozzle which are distributed in sequence along a liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and is used for driving ink to be sprayed out of the nozzle and sucking the ink into a liquid spraying liquid storage tank;
the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spraying paths of the nozzles, and the first cutting head and the second cutting head are opposite and matched at intervals;
the high-precision electrostatic ink-jet printer nozzle further comprises a first cutting head driving unit and a second cutting head driving unit which are respectively used for driving the first cutting head and the second cutting head so as to enable the first cutting head and the second cutting head to be close to each other to cut ink columns sprayed out from the nozzles.
Preferably, the liquid spraying passages are distributed along the bonding surface of the first silicon substrate and the second silicon substrate.
Preferably, the side of the first silicon substrate, which is opposite to the second silicon substrate, is provided with an ink-jet liquid storage tank and a first cutting head;
the surface of second silicon chip relative with first silicon chip has inlet channel, feed liquor liquid storage tank, current-limiting channel, inkjet liquid storage tank, nozzle and second cutting head.
Preferably, the back surface of the ink-jet liquid storage tank of the first silicon substrate facing the glass substrate is a vibration surface, the electrostatic driving unit comprises a fixed electrode and a vibration surface electrode, the vibration surface electrode is arranged on the inner side of the vibration surface, the fixed electrode is arranged on the glass substrate corresponding to the vibration surface, and the fixed electrode is in clearance fit with the vibration surface.
Preferably, the vibration surface is doped with boron ions.
Preferably, the first cutting head driving unit and the second cutting head driving unit both adopt PZT piezoelectric ceramic plates.
Preferably, the PZT piezoelectric ceramic sheet includes a first electrode layer, a PZT piezoelectric layer, and a second electrode layer stacked in sequence.
Preferably, the first cutting head driving unit is embedded in the mounting groove of the glass substrate, and the second cutting head driving unit is arranged on the second silicon substrate.
As a preferred scheme, the glass substrate is provided with a bus interface and a lead array, and the bus interface is respectively connected with the fixed electrode, a first electrode layer and a second electrode layer of the first cutting head driving unit through the lead array;
the first silicon substrate is provided with a vibration surface electrode interface, and the vibration surface electrode interface is electrically connected with the vibration surface electrode.
The invention also provides a processing method of the high-precision electrostatic ink-jet printer nozzle, which comprises the following steps:
s1, selecting a glass substrate, etching a mounting groove, a fixed electrode groove and a main wiring port for embedding a first cutting head driving unit on the lower surface of the glass substrate, arranging the first cutting head driving unit in the mounting groove, arranging a fixed electrode in the fixed electrode groove, and arranging a lead array for connecting the main wiring port, the fixed electrode and the first cutting head driving unit on the lower surface of the glass substrate; then depositing a silicon dioxide insulating layer on the lower surface of the glass substrate;
s2, selecting a first silicon substrate, etching a first cutting head, an ink-jet liquid storage tank and a vibration surface electrode interface groove on the lower surface of the first silicon substrate, doping boron ions on the back surface of the ink-jet liquid storage tank to obtain a vibration surface, and arranging a vibration surface electrode below the vibration surface; the vibration surface electrode interface groove is provided with a vibration surface electrode interface which is electrically connected with the vibration surface electrode, and then a silicon dioxide insulating layer is deposited on the lower surface of the first silicon substrate;
depositing a silicon dioxide insulating layer on the upper surface of the first silicon substrate;
s3, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head on the upper surface of the second silicon substrate;
arranging a second cutting head driving unit on the lower surface of the second silicon substrate corresponding to the second cutting head, and depositing a silicon dioxide insulating layer on the lower surface of the second silicon substrate;
and S4, bonding the lower surface of the glass substrate and the upper surface of the first silicon substrate, and bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
Compared with the prior art, the invention has the following technical effects:
when the liquid column reaches the maximum, the corresponding cutting driving cutting heads mutually approach to cut the liquid column to obtain liquid drops; simultaneously, indirectly opposite voltages of the vibration surface and the fixed electrode enable the vibration surface to bend upwards, suck the residual liquid column back and replenish ink; the invention can avoid the generation of satellite ink drops, and simultaneously control the volume of the ejected ink drops, thereby improving the printing precision.
Drawings
FIG. 1 is a schematic plan view of a high-precision electrostatic ink jet printer head according to embodiment 1 of the present invention;
FIG. 2 is a schematic perspective view of a high precision electrostatic ink jet printer head according to embodiment 1 of the present invention;
FIG. 3 is a schematic view showing a partial structure of a lower surface of a glass substrate of a head of a high precision electrostatic ink jet printer according to embodiment 1 of the present invention;
FIG. 4 is a schematic view showing a partial structure of a lower surface of a first silicon substrate of a head for a high-precision electrostatic ink jet printer according to embodiment 1 of the present invention;
FIG. 5 is a schematic top surface view of a second silicon substrate of a high precision electrostatic ink jet printer head according to embodiment 1 of the present invention;
FIG. 6 is a schematic view showing the lower surface of a second silicon substrate of a head of a high precision electrostatic ink jet printer according to embodiment 1 of the present invention;
FIG. 7 is a flow chart showing a process for manufacturing a glass substrate for a head of a high-precision electrostatic ink jet printer according to example 1 of the present invention;
FIG. 8 is a flow chart showing a process for manufacturing a first silicon substrate for a head of a high precision electrostatic ink jet printer according to example 1 of the present invention;
FIG. 9 is a flow chart showing a process for manufacturing a second silicon substrate for a head of a high precision electrostatic ink jet printer according to example 1 of the present invention;
FIG. 10 is a schematic view showing the final bonding of a head of a high precision electrostatic ink jet printer according to example 1 of the present invention;
wherein, 1, a glass substrate; 11. a lower electrode layer of a first cutting driving unit; 12. a PZT piezoelectric layer of a first cutting drive unit; 13. an upper electrode layer of the first cutting driving unit; 14. a fixed electrode; 15. an array of conductive lines; 16. a main wiring port; 2. a first silicon substrate; 21. a first cutting head; 22. a vibrating surface; 23. a vibrating surface electrode; 24. a vibration plane electrode interface; 25. an ink jet liquid storage tank; 3. a second silicon substrate; 31. a liquid inlet channel; 32. a liquid inlet and storage tank; 33. a flow-restricting passage; 34. an ink jet liquid storage tank; 35. a nozzle; 36. a second cutting head; 37. a lower electrode layer of a second cutting driving unit; 38. a PZT piezoelectric layer of a second cutting drive unit; 39. and an upper electrode layer of the second cutting driving unit.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, the following description will explain the embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and other embodiments can be derived from them without inventive effort.
Example 1:
as shown in fig. 1 to 10, the high-precision electrostatic inkjet printer head of this embodiment includes a glass substrate 1, a first silicon substrate 2, and a second silicon substrate 3 which are bonded in sequence, an array type liquid spraying passage is formed between the first silicon substrate 1 and the second silicon substrate 2, and each liquid spraying passage in the array type liquid spraying passage includes a liquid inlet channel 31, a liquid inlet liquid storage tank 32, a flow limiting channel 33, a liquid spraying liquid storage tank 34, and a nozzle 35 which are distributed in sequence along a liquid inlet direction. The liquid inlet channels 31 of all the liquid spraying passages share one liquid inlet channel, and the liquid inlet liquid storage tank 32 shares one liquid inlet channel.
An electrostatic driving unit is arranged between the glass substrate 1 and the first silicon substrate 2 and is used for driving ink to be sprayed out from a nozzle 35 and sucking the ink into a liquid spraying liquid storage tank 34;
the first silicon substrate 2 and the second silicon substrate 3 are provided with a first cutting head 21 and a second cutting head 36 corresponding to the spraying paths of the nozzles, and the first cutting head 21 and the second cutting head 36 are opposite and matched at intervals;
the high-precision electrostatic ink jet printer head of the present embodiment further includes a first cutting head driving unit and a second cutting head driving unit for driving the first cutting head 21 and the second cutting head 36, respectively, so that the first cutting head 21 and the second cutting head 36 are brought close to each other to cut the ink column ejected from the nozzle 35.
The liquid spray paths of this embodiment are distributed along the bonding surface of the first silicon substrate 2 and the second silicon substrate 3. Specifically, the lower surface of the first silicon substrate 2 is provided with an ink jet liquid storage tank, a first cutting head 21 and a vibration surface electrode interface 24, the upper surface of the second silicon substrate 3 is provided with a liquid inlet channel 31, a liquid inlet liquid storage tank 32, a current limiting channel 33, an ink jet liquid storage tank 34, a nozzle 35 and a second cutting head 36, and the lower surface of the second silicon substrate is provided with a second cutting driving unit.
In addition, the back of the ink-jet liquid storage tank of the first silicon substrate 2 facing the glass substrate 1 is a vibration surface 22, the electrostatic driving unit comprises a fixed electrode 14 and a vibration surface electrode 23, the vibration surface electrode 23 is arranged on the inner side of the vibration surface, the fixed electrode 14 is arranged on the glass substrate corresponding to the vibration surface, and the fixed electrode 14 is in clearance fit with the vibration surface. The vibration surface is doped with boron ions, so that the vibration surface is conductive.
The first cutting head driving unit and the second cutting head driving unit of the embodiment both adopt PZT piezoelectric ceramic pieces, and the PZT piezoelectric ceramic pieces comprise a first electrode layer, a PZT piezoelectric layer and a second electrode layer which are sequentially stacked. Specifically, the first cutting head driving unit comprises a first cutting driving unit lower electrode layer 11, a first cutting driving unit piezoelectric layer 12 and a first cutting driving unit upper electrode layer 13 which are sequentially stacked; the second cutting head driving unit includes a second cutting driving unit lower electrode layer 37, a first cutting driving unit piezoelectric layer 38, and a first cutting driving unit upper electrode layer 39, which are sequentially stacked.
Wherein, the first cutting head driving unit is embedded in the mounting groove of the glass substrate 1, and the second cutting head driving unit is arranged on the lower surface of the second silicon substrate.
In addition, the glass substrate 1 is provided with a bus interface 16 and a lead array 15, and the bus interface 16 is connected with the fixed electrode 14 and the two electrode layers of the first cutting head driving unit which are respectively arranged corresponding to each liquid spraying passage through the lead array 15.
The first silicon substrate 2 is also provided with a vibration plane electrode port 24, and the vibration plane electrode port 24 is electrically connected with the vibration plane electrode 23 so as to lead out a wiring.
In the operation of the high-precision electrostatic ink-jet printer nozzle of the embodiment, firstly, the vibration surface 22 is bent upwards by indirectly opposite voltages of the vibration surface 22 and the fixed electrode 14, ink is sucked in through the current limiting channel 33, then the voltage between the vibration surface 22 and the fixed electrode 14 is cut off, the vibration surface 22 vibrates downwards and returns, the ink is extruded out of the nozzle 35, when a liquid column reaches the maximum, the cutting driving unit pushes the cutting head to cut the liquid column to obtain liquid drops, and meanwhile, the vibration surface 22 is bent upwards by indirectly opposite voltages of the vibration surface 22 and the fixed electrode 14, the residual liquid column is sucked back, and the ink is replenished.
The processing method of the high-precision electrostatic ink-jet printer nozzle comprises the following steps:
s1, selecting 4inch silicon wafers, transferring the pattern of a groove of a first cutting driving unit to the lower surface of a glass substrate 1 by adopting a photoetching process, and etching to prepare the groove of the first cutting driving unit by adopting a reactive ion etching technology;
s2, transferring the patterns of the groove of the fixed electrode 14 and the main wiring port 16 to the lower surface of the glass substrate 1 by adopting a photoetching process, and etching to prepare the groove of the fixed electrode 22 and the main wiring port 16 by adopting a reactive ion etching technology, wherein the length of the groove of the fixed electrode is 3000-6000 mu m, the width of the groove of the fixed electrode is 200-500 mu m, and the width of the groove of the fixed electrode is about 50-100 mu m;
s3, preparing a lower electrode layer 11 of the first cutting driving unit in the groove of the first cutting driving unit by adopting a photoetching process and a metal sputtering process;
s4, preparing a first cutting driving unit piezoelectric layer 12 on the first cutting driving unit lower electrode layer 11 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process;
s5, preparing an electrode layer 13, a fixed electrode 14 and a lead array 15 on the first cutting driving unit on the piezoelectric layer 12, the fixed electrode 14 groove and the lower surface of the glass substrate 1 by adopting a photoetching process and a metal sputtering process;
s6, depositing and preparing a silicon dioxide insulating layer on the lower surface of the glass substrate 1 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process; cleaning the glass substrate;
s7, selecting a 4inch silicon substrate, transferring the graph of the first cutting head 21 to the lower surface of the first silicon substrate 2 by adopting a photoetching process, and etching to prepare the first cutting head 21 by adopting a reactive ion etching technology, wherein the distance between the first cutting head 21 and the nozzle 35 is 50-200 mu m;
s8, transferring the pattern of the ink-jet liquid storage tank 34 to the lower surface of the first silicon substrate 2 by adopting a photoetching process, and etching to prepare the ink-jet liquid storage tank 34 by adopting a reactive ion etching technology, wherein the length and the width of the ink-jet liquid storage tank 34 are consistent with those of the groove of the fixed electrode 22, and the thickness of the residual vibration surface 22 is 5-10 mu m;
s9, doping boron ions into the silicon wafer sheet on the ink-jet liquid storage tank by adopting a photoetching process and a concentrated boron diffusion process to prepare a vibration surface 22 of the boron-silicon film;
s10, preparing a vibration surface electrode 23 below the vibration surface 22 and on the lower surface of the first silicon substrate 2 by adopting a photoetching process and a metal sputtering process;
s11, transferring the vibration plane electrode interface 24 graph to the lower surface of the first silicon substrate 2 by adopting a photoetching process, and etching to prepare a vibration plane electrode interface 24 groove by adopting a reactive ion etching technology;
s12, preparing a vibration surface electrode interface 24 in a groove of the vibration surface electrode interface 4 by adopting a photoetching process and a metal sputtering process;
s13, depositing and preparing a silicon dioxide insulating layer on the lower surface of the first silicon substrate 2 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process;
s14, depositing and preparing a silicon dioxide insulating layer on the upper surface of the first silicon substrate 2 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process; cleaning the first silicon substrate 2;
s15, selecting 4inch silicon substrates, transferring the graph of the liquid inlet channel 31 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and preparing the liquid inlet channel 31 by completely etching by adopting a deep reactive ion etching technology;
s16, transferring the graph of the liquid inlet storage tank 32 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet storage tank 32 by adopting a reactive ion etching technology;
s17, transferring the patterns of the flow limiting channel 33, the ink-jet liquid storage tank 34 and the nozzle 35 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the flow limiting channel 33, the ink-jet liquid storage tank 34 and the nozzle 35 by adopting a reactive ion etching technology, wherein the depth of the flow limiting channel 33 and the depth of the nozzle 35 are 20-100 mu m;
s18, transferring the pattern of the second cutting head 36 to the upper surface of the second silicon substrate 3 by adopting a photoetching process, and etching to prepare the second cutting head 36 by adopting a reactive ion etching technology, wherein the distance between the second cutting head 36 and the nozzle 35 is 50-200 mu m (the same as that of the first cutting head);
s19, preparing a lower electrode layer 37 of a second cutting driving unit on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a metal sputtering process;
s20, preparing a second cutting driving unit piezoelectric layer 38 on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process;
s21, preparing an electrode layer 39 on the second cutting driving unit on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a metal sputtering process;
s22, depositing and preparing a silicon dioxide insulating layer on the lower surface of the second silicon substrate 3 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process; cleaning the second silicon substrate;
s23, rinsing the lower surface of the glass substrate 1 and the upper surface of the first silicon substrate 2 by hydrofluoric acid, and bonding the lower surface of the glass substrate 1 and the upper surface of the first silicon substrate 2 by a silicon-glass bonding process;
s24, rinsing the lower surface of the first silicon substrate 2 and the lower surface of the second silicon substrate 3 by hydrofluoric acid, and bonding the lower surface of the first silicon substrate 2 and the upper surface of the second silicon substrate 3 by a silicon-silicon bonding process;
and S25, cleaning and scribing to finish preparation.
The high accuracy electrostatic ink jet printer shower nozzle of this embodiment has increased the cutting head on traditional ink jet printer shower nozzle's basis, with its cutting when the liquid column reaches maximum length, directly obtains needing the spun ink droplet, can avoid the production of satellite ink droplet, and the volume of simultaneous control spun ink droplet improves the printing precision.
Example 2:
the high-precision electrostatic ink jet printer head of the present embodiment is different from that of embodiment 1 in that:
the number of the liquid spraying passages in the array type liquid spraying passages is not limited to the number shown in embodiment 1, and can be increased or decreased according to the actual application requirements;
other structures can refer to embodiment 1.
The foregoing has outlined rather broadly the preferred embodiments and principles of the present invention and it will be appreciated that those skilled in the art may devise variations of the present invention that are within the spirit and scope of the appended claims.
Claims (10)
1. A high-precision electrostatic ink-jet printer nozzle is characterized by comprising a glass substrate, a first silicon substrate and a second silicon substrate which are sequentially bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a current limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along a liquid inlet direction; an electrostatic driving unit is arranged between the glass substrate and the first silicon substrate and used for driving ink to be sprayed out from the nozzle and sucking the ink into a liquid spraying liquid storage tank;
the first silicon substrate and the second silicon substrate are provided with a first cutting head and a second cutting head corresponding to the spraying paths of the nozzles, and the first cutting head and the second cutting head are opposite and matched at intervals;
the high-precision electrostatic ink-jet printer nozzle further comprises a first cutting head driving unit and a second cutting head driving unit which are respectively used for driving the first cutting head and the second cutting head so as to enable the first cutting head and the second cutting head to be close to each other to cut ink columns sprayed out from the nozzles.
2. A high precision electrostatic ink jet printer head as claimed in claim 1, wherein said liquid ejection paths are distributed along the bonding face of the first silicon substrate and the second silicon substrate.
3. A high precision electrostatic ink jet printer head according to claim 2, wherein the first silicon substrate has an ink jet reservoir and a first cutting head on the side opposite to the second silicon substrate;
the surface of the second silicon substrate opposite to the first silicon substrate is provided with a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head.
4. A high accuracy electrostatic ink jet printer head as claimed in claim 3, wherein the ink jet reservoir of the first silicon substrate is a vibrating surface facing a back surface of the glass substrate, the electrostatic driving unit comprises a fixed electrode and a vibrating surface electrode, the vibrating surface electrode is disposed inside the vibrating surface, the fixed electrode is disposed on the glass substrate corresponding to the vibrating surface, and the fixed electrode is in clearance fit with the vibrating surface.
5. A high precision electrostatic ink jet printer head as claimed in claim 4, wherein said vibration surface is doped with boron ions.
6. The head of claim 5, wherein the first and second cutting head driving units are PZT piezoceramic wafers.
7. The high precision electrostatic ink jet printer head of claim 6, wherein said PZT piezoelectric ceramic plate comprises a first electrode layer, a PZT piezoelectric layer and a second electrode layer stacked in sequence.
8. A high precision electrostatic ink jet printer head according to claim 7, wherein said first cutting head driving unit is embedded in the mounting groove of the glass substrate, and said second cutting head driving unit is provided on the second silicon substrate.
9. A high precision electrostatic ink jet printer head as claimed in claim 8, wherein said glass substrate is provided with a bus interface and a wire array, the bus interface is connected with the fixed electrode, the first electrode layer and the second electrode layer of the first cutting head driving unit through the wire array respectively;
the first silicon substrate is provided with a vibration surface electrode interface, and the vibration surface electrode interface is electrically connected with the vibration surface electrode.
10. The method for processing a high precision electrostatic ink jet printer head as claimed in claim 9, comprising the steps of:
s1, selecting a glass substrate, etching a mounting groove, a fixed electrode groove and a main wiring port for embedding a first cutting head driving unit on the lower surface of the glass substrate, arranging the first cutting head driving unit in the mounting groove, arranging a fixed electrode in the fixed electrode groove, and arranging a lead array for connecting the main wiring port, the fixed electrode and the first cutting head driving unit on the lower surface of the glass substrate; then depositing a silicon dioxide insulating layer on the lower surface of the glass substrate;
s2, selecting a first silicon substrate, etching a first cutting head, an ink-jet liquid storage tank and a vibration surface electrode interface groove on the lower surface of the first silicon substrate, doping boron ions on the back surface of the ink-jet liquid storage tank to obtain a vibration surface, and arranging a vibration surface electrode below the vibration surface; the vibration surface electrode interface groove is provided with a vibration surface electrode interface which is electrically connected with the vibration surface electrode, and then a silicon dioxide insulating layer is deposited on the lower surface of the first silicon substrate;
depositing a silicon dioxide insulating layer on the upper surface of the first silicon substrate;
s3, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, an ink jet liquid storage tank, a nozzle and a second cutting head on the upper surface of the second silicon substrate;
arranging a second cutting head driving unit corresponding to the second cutting head on the lower surface of the second silicon substrate, and depositing a silicon dioxide insulating layer on the lower surface of the second silicon substrate;
and S4, bonding the lower surface of the glass substrate and the upper surface of the first silicon substrate, and bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
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| CN102294889A (en) * | 2010-06-25 | 2011-12-28 | 佳能株式会社 | Liquid ejection apparatus and method |
| CN203343616U (en) * | 2013-07-23 | 2013-12-18 | 何亚彬 | Clutch type ink-jet printing and laser cutting machine handpiece |
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| US4068241A (en) * | 1975-12-08 | 1978-01-10 | Hitachi, Ltd. | Ink-jet recording device with alternate small and large drops |
| EP0565280A2 (en) * | 1992-03-26 | 1993-10-13 | Kabushiki Kaisha TEC | Method of producing printer head using piezoelectric member |
| JP2007245686A (en) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | Electrostatic actuator, liquid droplet discharge head, and their manufacturing methods |
| CN101497269A (en) * | 2009-03-02 | 2009-08-05 | 厦门大学 | Electrostatic driven jet printing head |
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| CN115091854B (en) | 2023-05-19 |
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