CN114889325A - High-precision piezoelectric ink-jet printer nozzle and preparation method thereof - Google Patents
High-precision piezoelectric ink-jet printer nozzle and preparation method thereof Download PDFInfo
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- CN114889325A CN114889325A CN202210423703.XA CN202210423703A CN114889325A CN 114889325 A CN114889325 A CN 114889325A CN 202210423703 A CN202210423703 A CN 202210423703A CN 114889325 A CN114889325 A CN 114889325A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 157
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 146
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 146
- 239000010703 silicon Substances 0.000 claims abstract description 146
- 239000000758 substrate Substances 0.000 claims abstract description 144
- 238000005520 cutting process Methods 0.000 claims abstract description 140
- 238000003860 storage Methods 0.000 claims abstract description 60
- 238000005507 spraying Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 50
- 238000005530 etching Methods 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000013589 supplement Substances 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 54
- 238000001259 photo etching Methods 0.000 description 25
- 238000005516 engineering process Methods 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention relates to a high-precision piezoelectric ink-jet printer nozzle and a preparation method thereof, wherein the nozzle comprises a first silicon substrate and a second silicon substrate which are mutually bonded, a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate, and the liquid spraying passage comprises a liquid inlet channel, a liquid inlet liquid storage pool, a flow limiting channel, a liquid spraying liquid storage pool and a nozzle which are sequentially distributed along the flow direction of liquid inlet; the piezoelectric ink-jet drive part is arranged corresponding to the liquid-spraying liquid storage tank, and the binding surface of the piezoelectric ink-jet drive part and the liquid-spraying liquid storage tank is a vibration surface; the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving part thereof, a second cutting head and a driving part thereof, and the first cutting head and the second cutting head are opposite and are matched at intervals; the first cutting head driving part and the second cutting head driving part are respectively used for driving the first cutting head and the second cutting head to be close to cut the ink column ejected by the nozzle. The invention can avoid the generation of satellite droplets, and simultaneously controls the volume of ink droplets by cutting, thereby improving the ink-jet printing precision.
Description
Technical Field
The invention belongs to the technical field of ink-jet printer nozzles, and particularly relates to a high-precision piezoelectric ink-jet printer nozzle and a preparation method thereof.
Background
The existing piezoelectric ink-jet printer nozzle is easy to generate satellite ink drops in the ink drop spraying process, the satellite ink drops with enough high speed can catch up the main ink drops and be fused into one ink drop, the satellite ink drops with not enough high speed cannot be fused with the main ink drops, the main ink drops can reach the substrate after being sprayed to the substrate, and the precision of printing images is influenced.
Disclosure of Invention
Based on the above defects of the prior art, the present invention provides a high precision piezoelectric inkjet printer head and a method for manufacturing the same.
In order to realize the purpose, the invention adopts the following technical scheme:
a high-precision piezoelectric ink-jet printer nozzle comprises a first silicon substrate and a second silicon substrate which are bonded with each other, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the flow direction of liquid inlet;
the piezoelectric ink-jet drive part is arranged corresponding to the liquid-spraying liquid storage tank, and the binding surface of the piezoelectric ink-jet drive part and the liquid-spraying liquid storage tank is a vibration surface;
the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving part thereof, a second cutting head and a driving part thereof, and the first cutting head and the second cutting head are opposite and are matched at intervals;
the first cutting head driving part and the second cutting head driving part are respectively used for driving the first cutting head and the second cutting head to be close to cut the ink column sprayed out by the nozzle.
Preferably, the liquid spraying passages are distributed in an array mode along the bonding surface of the first silicon substrate and the second silicon substrate.
Preferably, the lower surface of the first silicon substrate is provided with a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank, a nozzle and a first cutting head, and the upper surface of the first silicon substrate is provided with a piezoelectric ink jet driving part and a first cutting head driving part.
Preferably, the upper surface of the second silicon substrate is provided with a second cutting head, and the lower surface of the second silicon substrate is provided with a second cutting head driving member.
Preferably, the structure of the second silicon substrate and the structure of the first silicon substrate are mirror images, and the lower surface of the second silicon substrate is provided with another piezoelectric ink jet driving part and a second cutting head driving part.
Preferably, the piezoelectric ink-jet driving part, the first cutting head driving part and the second cutting head driving part are all PZT piezoelectric ceramic plates.
Preferably, the high-precision piezoelectric ink jet printer nozzle comprises the following ink jet processes:
firstly, the piezoelectric ink-jet driving part receives a positive voltage signal and vibrates to pull a vibration surface, and ink is sucked from a liquid inlet liquid storage tank to a liquid spraying liquid storage tank; then, the piezoelectric ink-jet driving part receives the reverse voltage signal to vibrate so as to push a vibration surface, and the ink is extruded out through a nozzle;
when the ejected ink column reaches the maximum length, the first cutting head driving part and the second cutting head driving part synchronously receive reverse voltage signals and push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving part and the second cutting head driving part receive the positive voltage signal to vibrate back, and the piezoelectric ink jet driving part receives the positive voltage signal to pull the vibration surface, suck back ink drops and simultaneously supplement the ink level for next ink jet.
The invention also provides a preparation method of the high-precision piezoelectric ink-jet printer nozzle, which comprises the following steps:
s1, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
arranging a piezoelectric ink jet driving part on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and arranging a first cutting head driving part corresponding to the first cutting head;
s2, selecting a second silicon substrate, etching a second cutting head on the upper surface of the second silicon substrate, and arranging a second cutting head driving part on the lower surface of the second silicon substrate corresponding to the second cutting head;
and S3, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
The invention also provides a preparation method of the high-precision piezoelectric ink-jet printer nozzle, which comprises the following steps:
s10, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
arranging a piezoelectric ink jet driving part on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and arranging a first cutting head driving part corresponding to the first cutting head;
s20, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a second cutting head on the upper surface of the second silicon substrate; the etching structure of the second silicon substrate and the etching structure of the first silicon substrate are in mirror symmetry;
a piezoelectric ink jet driving part is arranged on the lower surface of the second silicon substrate corresponding to the liquid spraying liquid storage tank, and a second cutting head driving part is arranged corresponding to the second cutting head;
and S30, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
Compared with the prior art, the invention has the beneficial effects that:
the high-precision piezoelectric ink-jet printer nozzle can avoid the generation of satellite droplets, and simultaneously controls the volume of ink droplets by cutting, thereby improving the ink-jet printing precision.
Drawings
FIG. 1 is a schematic plan view of a high precision piezoelectric inkjet printer head according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the operation of a high precision piezoelectric inkjet printer head according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a high precision piezoelectric inkjet printer head according to an embodiment of the present invention;
FIG. 4 is a schematic view of a bottom surface portion of a first silicon substrate according to a first embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a top surface of a second silicon substrate according to a first embodiment of the present invention;
FIG. 6 is a schematic view of a lower surface portion of a second silicon substrate according to a first embodiment of the present invention;
FIG. 7 is a schematic view of a nozzle and a cutting head according to a first embodiment of the present invention;
FIG. 8 is a flow chart of a process for manufacturing a nozzle of a high precision piezoelectric ink jet printer according to an embodiment of the present invention;
FIG. 9 is a schematic plan view of a high precision piezoelectric inkjet printer head according to a second embodiment of the present invention;
FIG. 10 is a schematic diagram of the operation of a high precision piezoelectric inkjet printer head according to a second embodiment of the present invention;
FIG. 11 is a schematic perspective view of a high precision piezoelectric inkjet printer head according to a second embodiment of the present invention;
FIG. 12 is a flow chart of a process for manufacturing a nozzle of a high precision piezoelectric ink jet printer according to a second embodiment of the present invention;
wherein, 1, a first silicon substrate; 101. a liquid inlet and storage tank; 102. a liquid spraying liquid storage tank; 103. a liquid inlet channel; 104. a flow-restricting passage; 105. a nozzle; 106. a first cutting head; 107. a piezoelectric ink jet drive lower electrode layer; 108. a piezoelectric inkjet drive member piezoelectric layer; 109. an electrode layer on the piezoelectric ink jet drive; 110. a first cutting head driving member lower electrode layer; 111. a first cutting head drive piezoelectric layer; 112. an electrode layer on the first cutting head driving member; 2. a second silicon substrate; 201. a second cutting head; 202. a second cutting head drive lower electrode layer; 203. a second cutting head drive piezoelectric layer; 204. an electrode layer on the second cutting head driving member; 3. a third silicon substrate; 301. a liquid inlet and storage tank; 302. a liquid spraying liquid storage tank; 303. a liquid inlet channel; 304. a flow-restricting passage; 305. a nozzle; 306. a third cutting unit; 307. a piezoelectric ink jet drive lower electrode layer; 308. a piezoelectric inkjet driver piezoelectric layer; 309. an electrode layer on the piezoelectric inkjet driver; 310. a third cutting head drive lower electrode layer; 311. a third cutting head drive piezoelectric layer; 312. an electrode layer on the third cutting head driving member.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, the following description will explain the embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
The first embodiment is as follows:
as shown in fig. 1 to 8, the high-precision piezoelectric inkjet printer head of this embodiment includes a first silicon substrate 1 and a second silicon substrate 2 bonded to each other, a liquid ejection path is formed between the first silicon substrate 1 and the second silicon substrate 2, and the liquid ejection path includes a liquid inlet channel, a liquid inlet reservoir, a flow limiting channel, a liquid ejection reservoir and a nozzle, which are sequentially distributed along a liquid inlet flow direction. The liquid spraying passages of the embodiment are six in number and distributed in an array along the bonding surface of the first silicon substrate 1 and the second silicon substrate 2.
Specifically, the lower surface of the first silicon substrate 1 is provided with a liquid inlet channel 103, a liquid inlet liquid storage tank 101, a flow limiting channel 104, a liquid spraying liquid storage tank 102, a nozzle 105 and a first cutting head 106, the upper surface of the first silicon substrate 1 is provided with a piezoelectric inkjet driving piece arranged corresponding to the liquid spraying liquid storage tank, and the binding surface of the piezoelectric inkjet driving piece and the liquid spraying liquid storage tank is a vibration surface; the piezoelectric ink-jet driving member is a PZT piezoelectric ceramic sheet, and comprises a lower electrode layer 107, a piezoelectric layer 108 and an upper electrode layer 109 which are sequentially stacked. In addition, the upper surface of the first silicon substrate 1 is further provided with a first cutting head driving member, and the first cutting head driving member is a PZT piezoelectric ceramic sheet and comprises a lower electrode layer 110, a piezoelectric layer 111 and an upper electrode layer 112 which are sequentially stacked.
The second silicon substrate 2 is used as a cover plate to form a liquid spraying passage, the upper surface of the second silicon substrate 2 is provided with a second cutting head 201, and the lower surface of the second silicon substrate 2 is provided with a second cutting head driving part; specifically, the second cutting head driving member is a PZT piezoelectric ceramic sheet, and includes a lower electrode layer 202, a piezoelectric layer 203, and an upper electrode layer 204 stacked in sequence.
Wherein the first cutting head 106 is opposite to the second cutting head 201 and is matched with the second cutting head 201 at a distance; the first cutting head drive and the second cutting head drive are used for driving the first cutting head and the second cutting head to be close to cut the ink column ejected from the nozzle 105 respectively.
The high accuracy piezoelectric type inkjet printer shower nozzle of this embodiment, its working process includes:
the piezoelectric ink-jet driving piece receives a positive voltage signal to vibrate, and pulls a vibration surface to suck ink from the liquid inlet liquid storage tank 101 to the liquid spray liquid storage tank 102; then the piezoelectric ink jet driving part receives the reverse voltage signal to vibrate, the vibration surface is pushed, the ink is extruded out through the nozzle 105, and when the ink column reaches the maximum length, the first cutting head driving part and the second cutting head driving part synchronously receive the reverse voltage signal and push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving part and the second cutting head driving part receive the positive voltage signal to vibrate back, and the piezoelectric ink jet driving part receives the positive voltage signal to pull the vibration surface, suck back ink drops and simultaneously supplement the ink level for next ink jet.
The preparation method of the high-precision piezoelectric ink-jet printer nozzle comprises the following steps:
s1, selecting 4inch silicon wafers, transferring the patterns of a liquid inlet liquid storage tank 101 and a liquid spray liquid storage tank 102 to the lower surface of a first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 101 and the liquid spray liquid storage tank 102 by adopting a reactive ion etching technology;
s2, transferring the graph of the liquid inlet channel 103 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet channel 103 by adopting a reactive ion etching technology;
s3, transferring the patterns of the flow limiting channel 104 and the nozzle 105 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the flow limiting channel 104 and the nozzle 105 by adopting a reactive ion etching technology, wherein the depth of the flow limiting channel 104 and the depth of the nozzle 105 are 20-100 mu m;
s4, transferring the graph of the first cutting head 106 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the first cutting head 106 by adopting a reactive ion etching technology, wherein the distance between the first cutting head 106 and a nozzle is 50-200 mu m; cleaning the first silicon substrate 1;
s5, preparing a piezoelectric ink-jet driving part lower electrode layer 107 and a first cutting head driving part lower electrode layer 110 on the upper surface of the first silicon substrate by adopting a photoetching process and a metal sputtering process;
s6, preparing a piezoelectric layer 108 of a piezoelectric ink injection driving part and a piezoelectric layer 111 of a first cutting head driving part on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a PECVD process;
s7, preparing a piezoelectric layer 109 of a piezoelectric ink jet driving part and an upper electrode layer 112 of a first cutting head driving part on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a metal sputtering process; cleaning the first silicon substrate 1;
s8, selecting a 4inch silicon wafer, transferring the pattern of the second cutting head 201 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching to prepare the second cutting head 201 by adopting a reactive ion etching technology, wherein the distance between the second cutting head 206 and the nozzle is 50-200 mu m (the same as that of the first cutting head); cleaning the second silicon substrate 2;
s9, preparing a lower electrode layer 202 of a driving part of the second cutting head on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a metal sputtering process;
s10, preparing a piezoelectric layer 203 of a driving part of a second cutting head on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process;
s11, preparing an electrode layer 204 on a driving part of the second cutting head on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a metal sputtering process; cleaning the second silicon substrate 2;
s12, rinsing the lower surface of the first silicon substrate 1 and the upper surface of the second silicon substrate 2 by adopting hydrofluoric acid, and bonding the lower surface of the first silicon substrate 1 and the upper surface of the second silicon substrate 2 by adopting a silicon-silicon bonding process;
s13, cleaning and scribing.
The high accuracy piezoelectric type inkjet printer shower nozzle of this embodiment has increased the cutting head on the basis of traditional inkjet printer shower nozzle, with the china ink post cutting when china ink post reaches maximum length, avoids the production of satellite liquid drop, controls the volume of ink droplet through the cutting simultaneously, has improved the inkjet and has printed the precision.
The number of liquid ejecting passages in the array type liquid ejecting passages of the present embodiment is not limited to the number shown in fig. 4, and may be increased or decreased according to the actual application requirements.
Example two:
the difference between the high-precision piezoelectric ink jet printer head of the embodiment and the first embodiment is that:
as shown in fig. 9 to 12, the head of a high-precision piezoelectric type ink jet printer of the present embodiment includes a first silicon substrate 1 and a third silicon substrate 3 bonded to each other:
the structure of the first silicon substrate 1 is the same as that of the first silicon substrate in the first embodiment, and the structure of the third silicon substrate 3 is mirror-symmetrical to that of the first silicon substrate in the first embodiment; specifically, the upper surface of the third silicon substrate 3 is provided with a liquid inlet channel 303, a liquid inlet liquid storage tank 301, a flow limiting channel 304, a liquid spray liquid storage tank 302, a nozzle 305 and a third cutting head 306, and the lower surface of the third silicon substrate is provided with a piezoelectric inkjet driving part and a third cutting head driving part;
the piezoelectric ink-jet driving part is a PZT piezoelectric ceramic piece and comprises a lower electrode layer 307, a piezoelectric layer 308 and an upper electrode layer 309 which are sequentially stacked;
the third cutting head driving member is a PZT piezoelectric ceramic sheet, and includes a lower electrode layer 310, a piezoelectric layer 311, and an upper electrode layer 312, which are sequentially stacked.
The high-precision piezoelectric ink-jet printer nozzle of the embodiment is similar to the first embodiment in working process, but can realize bilateral driving, provide larger ink-jet power and improve ink-jet speed.
The preparation method of the high-precision piezoelectric ink-jet printer nozzle comprises the following steps:
s1, selecting 4inch silicon wafers, transferring the patterns of a liquid inlet liquid storage tank 101 and a liquid spray liquid storage tank 102 to the lower surface of a first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 101 and the liquid spray liquid storage tank 102 by adopting a reactive ion etching technology;
s2, transferring the graph of the liquid inlet channel 103 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the liquid inlet channel 103 by adopting a reactive ion etching technology;
s3, transferring the patterns of the flow limiting channel 104 and the nozzle 105 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the flow limiting channel 104 and the nozzle 105 by adopting a reactive ion etching technology, wherein the depth of the flow limiting channel 104 and the depth of the nozzle 105 are 20-100 mu m;
s4, transferring the graph of the first cutting head 106 to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching to prepare the first cutting head 106 by adopting a reactive ion etching technology, wherein the distance between the first cutting head 106 and a nozzle is 50-200 mu m; cleaning the first silicon substrate 1;
s5, preparing a piezoelectric ink-jet driving part lower electrode layer 107 and a first cutting head driving part lower electrode layer 110 on the upper surface of the first silicon substrate by adopting a photoetching process and a metal sputtering process;
s6, preparing a piezoelectric layer 108 of a piezoelectric ink injection driving part and a piezoelectric layer 111 of a first cutting head driving part on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a PECVD process;
s7, preparing a piezoelectric layer 109 of a piezoelectric ink jet driving part and an upper electrode layer 112 of a first cutting head driving part on the upper surface of the first silicon substrate 1 by adopting a photoetching process and a metal sputtering process; cleaning the first silicon substrate 1;
s8, selecting 4inch silicon wafers, transferring the patterns of the liquid inlet liquid storage tank 301 and the liquid spray liquid storage tank 302 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet liquid storage tank 301 and the liquid spray liquid storage tank 302 by adopting a reactive ion etching technology;
s9, transferring the graph of the liquid inlet channel 303 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the liquid inlet channel 303 by adopting a reactive ion etching technology;
s10, transferring the patterns of the flow limiting channel 304 and the nozzle 305 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the flow limiting channel 304 and the nozzle 305 by adopting a reactive ion etching technology;
s11, transferring the graph of the third cutting unit 306 to the lower surface of the third silicon substrate 3 by adopting a photoetching process, and etching to prepare the third cutting unit 306 by adopting a reactive ion etching technology, wherein the distance between the third cutting unit 306 and a nozzle is 50-200 mu m (the same as that of the first cutting head); cleaning the third silicon substrate 3;
s12, preparing a piezoelectric ink-jet driving part lower electrode layer 307 and a third cutting head driving part lower electrode layer 310 on the upper surface of a third silicon substrate by adopting a photoetching process and a metal sputtering process;
s13, preparing a piezoelectric layer 308 of a piezoelectric ink jet driving part and a piezoelectric layer 311 of a third cutting head driving part on the upper surface of the third silicon substrate 3 by adopting a photoetching process and a PECVD process;
s14, preparing a piezoelectric layer 309 of a piezoelectric ink jet driving part and an electrode layer 312 of a third cutting head driving part on the upper surface of the third silicon substrate 3 by adopting a photoetching process and a metal sputtering process; cleaning the third silicon substrate 3;
s15, rinsing the lower surface of the first silicon substrate 1 and the upper surface of the third silicon substrate 3 by adopting hydrofluoric acid, and bonding the lower surface of the first silicon substrate 1 and the upper surface of the third silicon substrate 3 by adopting a silicon-silicon bonding process;
and S16, cleaning and scribing.
Wherein the processing procedures of S8-S14 are the same as those of S1-S7;
in the structure of the embodiment, the upper silicon substrate and the lower silicon substrate adopt the same structure, so that the cost for manufacturing the other silicon substrate is reduced, the cost is reduced, and meanwhile, the two piezoelectric ink jet driving parts can provide larger ink jet power and improve the ink jet speed;
the number of the liquid spraying passages in the array type liquid spraying passage of the embodiment is not limited to the number shown in fig. 4, and can be increased or decreased according to the actual application requirement;
other structures can refer to the first embodiment.
The foregoing has outlined rather broadly the preferred embodiments and principles of the present invention and it will be appreciated that those skilled in the art may devise variations of the present invention that are within the spirit and scope of the appended claims.
Claims (9)
1. A high-precision piezoelectric ink-jet printer nozzle is characterized by comprising a first silicon substrate and a second silicon substrate which are mutually bonded, wherein a liquid spraying passage is formed between the first silicon substrate and the second silicon substrate and comprises a liquid inlet channel, a liquid inlet liquid storage tank, a flow limiting channel, a liquid spraying liquid storage tank and a nozzle which are sequentially distributed along the flow direction of liquid inlet;
the piezoelectric ink-jet drive part is arranged corresponding to the liquid-spraying liquid storage tank, and the binding surface of the piezoelectric ink-jet drive part and the liquid-spraying liquid storage tank is a vibration surface;
the first silicon substrate and the second silicon substrate are respectively provided with a first cutting head and a driving part thereof, a second cutting head and a driving part thereof, and the first cutting head and the second cutting head are opposite and are matched at intervals;
the first cutting head driving part and the second cutting head driving part are respectively used for driving the first cutting head and the second cutting head to be close to cut the ink column ejected by the nozzle.
2. The piezoelectric ink jet printer head with high precision according to claim 1, wherein the liquid ejecting paths are arranged in an array along a bonding surface of the first silicon substrate and the second silicon substrate.
3. The piezoelectric ink jet printer head with high precision according to claim 1, wherein the lower surface of the first silicon substrate has a liquid inlet channel, a liquid inlet reservoir, a flow restricting channel, a liquid discharge reservoir, a nozzle, and a first cutting head, and the upper surface of the first silicon substrate has a piezoelectric ink jet driving member and a first cutting head driving member.
4. The head of claim 3, wherein the second silicon substrate has a second cutting head on an upper surface thereof, and a second cutting head driving member is provided on a lower surface of the second silicon substrate.
5. The head of claim 3, wherein the second silicon substrate is a mirror image of the first silicon substrate, and the piezoelectric ink jet actuator and the second cutting head actuator are disposed on the lower surface of the second silicon substrate.
6. The piezoelectric ink jet printer head with high precision according to claim 4 or 5, wherein the piezoelectric ink jet driving member, the first cutting head driving member and the second cutting head driving member are PZT piezoelectric ceramic plates.
7. The piezoelectric ink jet printer head of claim 6, wherein the ink jet process comprises:
firstly, the piezoelectric ink-jet driving part receives a positive voltage signal and vibrates to pull a vibration surface, and ink is sucked from a liquid inlet liquid storage tank to a liquid spraying liquid storage tank; then, the piezoelectric ink-jet driving part receives the reverse voltage signal to vibrate so as to push a vibration surface, and the ink is extruded out through a nozzle;
when the ejected ink column reaches the maximum length, the first cutting head driving part and the second cutting head driving part synchronously receive reverse voltage signals and push the first cutting head and the second cutting head to cut the ink column; and then the first cutting head driving part and the second cutting head driving part receive the positive voltage signal to vibrate back, and the piezoelectric ink jet driving part receives the positive voltage signal to pull the vibration surface, suck back ink drops and simultaneously supplement the ink level for next ink jet.
8. The method for preparing a nozzle of a high-precision piezoelectric ink-jet printer according to claim 4, comprising the following steps:
s1, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
arranging a piezoelectric ink jet driving part on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and arranging a first cutting head driving part corresponding to the first cutting head;
s2, selecting a second silicon substrate, etching a second cutting head on the upper surface of the second silicon substrate, and arranging a second cutting head driving part on the lower surface of the second silicon substrate corresponding to the second cutting head;
and S3, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
9. The method for preparing a nozzle of a high precision piezoelectric ink jet printer according to claim 5, comprising the steps of:
s10, selecting a first silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a first cutting head on the lower surface of the first silicon substrate;
arranging a piezoelectric ink jet driving part on the upper surface of the first silicon substrate corresponding to the liquid spraying liquid storage tank, and arranging a first cutting head driving part corresponding to the first cutting head;
s20, selecting a second silicon substrate, and etching a liquid inlet channel, a liquid inlet liquid storage tank, a liquid spraying liquid storage tank, a flow limiting channel, a nozzle and a second cutting head on the upper surface of the second silicon substrate; the etching structure of the second silicon substrate and the etching structure of the first silicon substrate are in mirror symmetry;
a piezoelectric ink jet driving part is arranged on the lower surface of the second silicon substrate corresponding to the liquid spraying liquid storage tank, and a second cutting head driving part is arranged corresponding to the second cutting head;
and S30, bonding the lower surface of the first silicon substrate and the upper surface of the second silicon substrate.
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| US4016571A (en) * | 1974-09-17 | 1977-04-05 | Hitachi, Ltd. | Ink jet recording apparatus |
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| US20030081082A1 (en) * | 2001-10-31 | 2003-05-01 | Eastman Kodak Company | Continuous ink-jet printing apparatus having an improved droplet deflector and catcher |
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| US4016571A (en) * | 1974-09-17 | 1977-04-05 | Hitachi, Ltd. | Ink jet recording apparatus |
| US4068241A (en) * | 1975-12-08 | 1978-01-10 | Hitachi, Ltd. | Ink-jet recording device with alternate small and large drops |
| JPH0211331A (en) * | 1988-06-30 | 1990-01-16 | Fuji Xerox Co Ltd | Inkjet recording apparatus |
| US6022099A (en) * | 1997-01-21 | 2000-02-08 | Eastman Kodak Company | Ink printing with drop separation |
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