CN114843388B - Micro-LED芯片结构 - Google Patents
Micro-LED芯片结构 Download PDFInfo
- Publication number
- CN114843388B CN114843388B CN202210738007.8A CN202210738007A CN114843388B CN 114843388 B CN114843388 B CN 114843388B CN 202210738007 A CN202210738007 A CN 202210738007A CN 114843388 B CN114843388 B CN 114843388B
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- 239000004065 semiconductor Substances 0.000 claims abstract description 126
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 238000001579 optical reflectometry Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 312
- 239000002131 composite material Substances 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- 239000010953 base metal Substances 0.000 claims 1
- 238000002310 reflectometry Methods 0.000 abstract description 21
- 230000031700 light absorption Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005563 spheronization Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210738007.8A CN114843388B (zh) | 2022-06-28 | 2022-06-28 | Micro-LED芯片结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210738007.8A CN114843388B (zh) | 2022-06-28 | 2022-06-28 | Micro-LED芯片结构 |
Publications (2)
Publication Number | Publication Date |
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CN114843388A CN114843388A (zh) | 2022-08-02 |
CN114843388B true CN114843388B (zh) | 2022-09-23 |
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Application Number | Title | Priority Date | Filing Date |
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CN202210738007.8A Active CN114843388B (zh) | 2022-06-28 | 2022-06-28 | Micro-LED芯片结构 |
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CN (1) | CN114843388B (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860367B (zh) * | 2019-02-03 | 2020-04-21 | 泉州三安半导体科技有限公司 | 发光装置 |
CN112768484B (zh) * | 2019-11-04 | 2024-03-26 | 厦门三安光电有限公司 | 发光二极管及其制作方法 |
CN112447785B (zh) * | 2020-11-23 | 2022-09-23 | 厦门天马微电子有限公司 | 一种发光二极管显示面板及其制备方法、显示装置 |
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2022
- 2022-06-28 CN CN202210738007.8A patent/CN114843388B/zh active Active
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Publication number | Publication date |
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CN114843388A (zh) | 2022-08-02 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20220802 Assignee: Suzhou Heyu Finance Leasing Co.,Ltd. Assignor: Suzhou xinju Semiconductor Co.,Ltd. Contract record no.: X2022320010031 Denomination of invention: Micro LED chip structure Granted publication date: 20220923 License type: Exclusive License Record date: 20221210 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Micro LED chip structure Effective date of registration: 20221213 Granted publication date: 20220923 Pledgee: Suzhou Heyu Finance Leasing Co.,Ltd. Pledgor: Suzhou xinju Semiconductor Co.,Ltd. Registration number: Y2022320010799 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220923 Pledgee: Suzhou Heyu Finance Leasing Co.,Ltd. Pledgor: Suzhou xinju Semiconductor Co.,Ltd. Registration number: Y2022320010799 |
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EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Suzhou Heyu Finance Leasing Co.,Ltd. Assignor: Suzhou xinju Semiconductor Co.,Ltd. Contract record no.: X2022320010031 Date of cancellation: 20240313 |