CN114830308A - Ic芯片搭载装置、ic芯片搭载方法 - Google Patents
Ic芯片搭载装置、ic芯片搭载方法 Download PDFInfo
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- CN114830308A CN114830308A CN202080084985.4A CN202080084985A CN114830308A CN 114830308 A CN114830308 A CN 114830308A CN 202080084985 A CN202080084985 A CN 202080084985A CN 114830308 A CN114830308 A CN 114830308A
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Abstract
本发明的IC芯片搭载装置具备:输送部,其将在基材上连续地形成有嵌体用的多个天线的天线连续体以在各天线的规定的基准位置配置有粘合剂和IC芯片的状态在规定的输送面上进行输送;检测部,其检测天线连续体中相邻的2个天线的间隔;按压单元移动机构,其从待机位置按顺序送出具有按压面的多个按压单元,使各按压单元沿着输送面移动;以及控制部,其基于由检测部检测出的间隔,控制从待机位置送出各按压单元的时间点,以使得通过各按压单元的按压面来按压输送面上的各天线的包括基准位置在内的规定区域。
Description
技术领域
本发明涉及IC芯片搭载装置以及IC芯片搭载方法。
背景技术
伴随RFID标签的普及,具有天线和与该天线电连接的IC芯片的片状的嵌体的生产正在扩大。在制造嵌体时设置有如下工序,即:在形成于基底基材上的天线,对作为用于搭载IC芯片的基准的天线上的规定的基准位置,配置供给来的IC芯片(例如,日本特开2008-123406号公报)。
在日本特开2008-123406号公报中记载有:在膜基板上以等间隔连续地形成天线,并在各天线配置IC芯片。
发明内容
然而,对于RFID标签,根据应用而要求较高的设计自由度,随之开发出各种天线形状的嵌体。因此,从嵌体的生产效率的观点出发,优选为能够在同一生产线上生产相邻的天线的间隔不同的多个天线。
因此,本发明的一个方式的目的在于当在嵌体的制造工序中向天线依次搭载IC芯片时,能够在同一生产线上对相邻的天线的间隔不同的多个天线搭载IC芯片。
本发明的一个方式是IC芯片搭载装置,其具备:输送部,其将在基材上连续地形成有嵌体用的多个天线的天线连续体以在各天线的规定的基准位置配置有粘合剂和IC芯片的状态在规定的输送面上输送;检测部,其检测上述天线连续体中相邻的2个天线的间隔;按压单元移动机构,其从待机位置按顺序送出具有按压面的多个按压单元,使各按压单元沿着上述输送面移动;以及控制部,其基于由上述检测部检测出的间隔,控制从上述待机位置送出各按压单元的时间点,以使通过各按压单元的按压面来按压上述输送面上的各天线的包括上述基准位置的规定区域。
根据本发明的一个方式,当在嵌体的制造工序中向天线依次搭载IC芯片时,能够在同一生产线上对相邻的天线的间隔不同的多个天线搭载IC芯片。
附图说明
图1是实施方式的天线的俯视图和天线的IC芯片搭载前后的局部放大图。
图2是表示天线片和卷绕有天线片的辊体的图。
图3是表示在实施方式的IC芯片搭载装置中与IC芯片配置工序对应的部分的图。
图4是表示芯片包含带及其放大剖面的图。
图5是实施方式的IC芯片搭载装置中的旋转贴片机的侧视图。
图6是对旋转贴片机与天线片的关系概略地进行说明的图。
图7是表示芯片包含带由分离滚子分离的状态的立体图。
图8是对从芯片包含带向管嘴单元供给IC芯片的动作进行说明的图。
图9是表示在实施方式的IC芯片搭载装置中与固化工序对应的部分的图。
图10是表示从图9的箭头方向J观察到的按压单元的一部分和紫外线照射器的图。
图11是实施方式的固化装置所包括的按压单元的主视图和侧视图。
图12是实施方式的固化装置所包括的按压单元循环机构的俯视图。
图13是表示图12的B-B剖面以及C-C剖面的图。
图14是对在按压单元循环机构中按压单元在拉伸状态和按压状态下相对于导轨的位置关系进行说明的图。
图15是对按压单元的送出动作进行说明的图。
图16是控制固化装置的控制部的功能框图。
图17是表示由拍摄装置拍摄到的图像的例子的图。
图18是表示一个实施方式的天线片的输送方法的图。
图19是对一个实施方式的IC芯片配置工序进行说明的图。
图20是对一个实施方式的固化工序进行说明的图。
图21是表示图20中的紫外线固化单元的构成例的图。
图22是对一个实施方式的固化工序进行说明的图。
具体实施方式
本发明与如下专利申请相关联,即分别于2019年12月26日以及2020年12月25日向日本专利局申请的专利申请2019-235418以及专利申请2020-216459,通过参照将这些申请的全部内容整体合并至本说明书。
以下,参照附图,对实施方式所涉及的IC芯片搭载装置以及IC芯片搭载方法进行说明。
实施方式所涉及的IC芯片搭载装置1是在制造RFID嵌体等非接触通信用嵌体时对薄膜状的天线搭载IC芯片的装置。
在图1中示出了具有规定的天线图案的例示性的天线AN,但并不意图限定于该天线图案。另外,在图1中还示出了在天线AN搭载IC芯片C前和搭载后的E部的放大图。在该例子中,在以天线图案为基准而预先决定的规定的基准位置Pref搭载IC芯片C。IC芯片C极小,例如纵向以及横向的尺寸为数百μm,要求将该极小尺寸的IC芯片C正确搭载于基准位置Pref。
当在天线AN搭载IC芯片C时,需要进行IC芯片配置工序和固化工序,在IC芯片配置工序中,向天线AN的基准位置Pref涂覆粘合剂,并在该粘合剂上配置IC芯片C,在固化工序中,使粘合剂固化来使天线AN与IC芯片C的连接稳固。
如图2所示,在后述的IC芯片配置工序中,设置辊体PR,辊体PR卷绕有以恒定的间距在基材BM上形成有多个天线AN的带状的天线片AS(天线连续体的一个例子)。将天线片AS从辊体PR连续拉出,投入至IC芯片配置工序的生产线。
基材BM的材料并不特别限定,例如能够使用优质纸、涂料纸、铜版纸这样的纸基材、以PET(聚对苯二甲酸乙二醇酯)、PE(聚乙烯)、PP(聚丙烯)、PS(聚苯乙烯)为原料的合成树脂膜、组合了多种上述合成树脂的片、组合了合成树脂膜和纸的复合片。
天线AN例如通过在基材BM粘贴金属箔、或者以规定图案在基材BM丝网印刷或蒸镀导电材料等而形成。
此外,在以下说明中,如图2所示,定义XYZ坐标系。在以下说明中,在提及配置于各工序的状态的图时,将在YZ平面观察到的图称为主视图,将在XY平面观察到的图称为俯视图,将在XZ平面观察到的图称为侧视图。
X方向是在以下说明的各工序中输送从辊体PR拉出的天线片AS的方向,也适当称为输送方向D1。另外,Y方向是天线片AS的宽度方向,也适当称为宽度方向D2。Z方向是与天线片AS正交的方向。
(1)IC芯片配置工序
以下,参照图3~图10,对IC芯片配置工序进行说明。图3是表示在实施方式的IC芯片搭载装置1中与IC芯片配置工序对应的部分的图。图4示出芯片包含带CT的俯视图及其A-A剖面的放大图。
在IC芯片配置工序中,通过IC芯片搭载装置1,能够对天线片AS上的各天线AN的基准位置Pref(参照图1),高精度地配置极小的IC芯片。
如图3所示,在IC芯片配置工序中,IC芯片搭载装置1包括输送机81、分配器2、旋转贴片机3、紫外线照射器41、拍摄装置CA1~CA3、带送料机71、带主体收卷卷轴72、膜收卷卷轴73、分离滚子74。
输送机81向工序的下游以规定的输送速度输送从辊体PR(参照图2)拉出的天线片AS。输送机81的上表面相当于输送面。
分配器2向输送的各天线AN的基准位置Pref排出定量的各向异性导电膏(ACP(Anisotropic Conductive Paste);以下简称“导电膏”。)。该导电膏是紫外线固化型粘合剂的一个例子。为了对各天线AN的基准位置Pref正确地定位排出位置,分配器2构成为能够在宽度方向上调整排出位置。
拍摄装置CA1设置于比分配器2靠上游处,为了决定涂覆导电膏的位置而拍摄各天线AN的基准位置Pref附近的局部图像。拍摄装置CA2设置于比分配器2靠下游处,为了检查有无对各天线AN涂覆导电膏并且检查导电膏是否正确地涂覆于包括基准位置Pref在内的区域,而拍摄各天线AN的基准位置Pref附近的局部图像。
旋转贴片机3是在已涂覆于各天线AN的导电膏上配置IC芯片的芯片贴片机,其向图3的逆时针方向旋转。旋转贴片机3安装于悬架板86,悬架板86固定于支承台85。即、旋转贴片机3是从上方悬架于支承台85的构造。
如后所述,旋转贴片机3从芯片包含带吸附IC芯片,向天线片AS上的各天线AN的基准位置Pref释放并配置(搭载)已吸附的IC芯片。此时,为了将IC芯片正确地配置于天线AN的基准位置Pref,而进行修正已吸附的IC芯片的位置以及朝向的处理。为了在将IC芯片搭载于天线AN时进行修正IC芯片的位置以及朝向的修正处理,拍摄装置CA3拍摄已吸附于管嘴(后述)的状态下的IC芯片。
带送料机71构成为:将包含IC芯片的芯片包含带以卷绕的状态装填,向图3的箭头方向以与旋转贴片机3同步的速度依次拉出芯片包含带。
这里,参照图4,对芯片包含带的一个例子进行说明。
如图4所示,芯片包含带CT包括:带主体T,其以恒定的间隔形成有包含IC芯片C的凹陷Td;和包覆膜CF,其粘接于带主体T以便封堵凹陷Td。凹陷Td例如通过对带主体T实施压花加工而形成。IC芯片C沿着芯片包含带CT的延伸方向包含在各凹陷Td内。在芯片包含带CT的延伸方向上,以恒定的间隔形成有安装孔H。该安装孔H是为了相对于分离滚子74的周面进行正确的定位而设置的,在芯片包含带CT被输送至分离滚子74时,被设置于分离滚子74的突起74p(后述)插入安装孔H。
如图4所示,在凹陷Td的底面与带主体T的背面(与粘合有包覆膜CF的面相反的一侧的面)之间形成有吸附孔Ts。吸附孔Ts是为了通过分离滚子74来吸附IC芯片C而设置的,以使在剥离了包覆膜CF时IC芯片C不从凹陷Td落下。
再一次参照图3,在分离滚子74,包覆膜CF被从自带送料机71经过1个或者多个辅助滚子而供给的芯片包含带CT剥离,芯片包含带CT分离为带主体T和包覆膜CF。剥离包覆膜CF而露出的IC芯片C被设置于旋转贴片机3的各管嘴依次吸附。
在芯片包含带CT由分离滚子74分离为带主体T和包覆膜CF后,带主体T经过1个或者多个辅助滚子而被卷绕于带主体收卷卷轴72,包覆膜CF经过1个或者多个辅助滚子而被卷绕于膜收卷卷轴73。
接下来,参照图5~图6,对旋转贴片机3进行说明。
图5是实施方式的IC芯片搭载装置1中的旋转贴片机3的侧视图。图6A是搭载于旋转贴片机3的管嘴单元的俯视图。图6B是管嘴单元30的侧视图。图6是对旋转贴片机3与天线片AS的关系概略地进行说明的图。
如图5所示,在旋转贴片机3,从旋转头3H放射状地配设有多个(在图示的例子中为12个)管嘴单元30-1~30-12。在以下说明中,在提及对管嘴单元30-1~30-12共通的事项时,统称表述为管嘴单元30。
关于旋转头3H,详情虽未图示,但其与使管嘴单元30-1~30-12沿图5的逆时针方向旋转的旋转驱动马达、用于使管嘴单元30吸附IC芯片的真空泵、用于从管嘴单元30释放IC芯片的鼓风机连接。
照图6,由未图示的旋转驱动马达使旋转头3H沿逆时针方向旋转,由此各管嘴单元30的旋转头3H的周方向上的位置依次切换。即,特定的管嘴单元30根据旋转头3H的旋转,以在与输送面正交的平面上在环状轨道上运动的方式,依次位于从位置PA向逆时针方向到位置PL的旋转头3H的周方向上的12个位置PA~PL的每一个。
这里,位置PA是管嘴单元30从芯片包含带CT重新吸附IC芯片C的位置。位置PE是通过拍摄装置CA3拍摄已吸附于管嘴单元30的管嘴的状态下的IC芯片C的图像的位置。
位置PK是在涂覆于输送的天线片AS上的天线AN的导电膏上释放已吸附的IC芯片C的位置。在位置PK,管嘴前端的移动方向和天线片AS的输送方向D1一致。在位置PK,为了释放IC芯片C而从管嘴单元30的管嘴排出空气。
由于IC芯片C在位置PK释放完毕,所以在位置PL,管嘴单元30未吸附有IC芯片C。此外,在位置PL,也可以为了去除可能附着于管嘴的残留物而从管嘴释放空气。在图6中示出为了收集可能从管嘴释放的残留物而在位置PL配置了残留物收集托盘TR的例子。
例如,反复进行如下动作,即:在图6中处于位置PA的管嘴单元30-1在此处重新吸附IC芯片C,保持吸附IC芯片C的状态向逆时针方向旋转,到达位置PK时释放IC芯片C,并返回至位置PA时再次吸附新的IC芯片C。在该IC芯片搭载方法中,能够以不停止天线片AS的输送的方式连续地将IC芯片配置于各天线AN,从而生产性高。
设定或者控制旋转头3H的角速度和天线片AS的输送速度,以使依次到达位置PK的管嘴单元30向从上游输送的天线片AS的各天线AN的基准位置Pref释放IC芯片C。为了可靠地配置IC芯片C,优选为在位置PK设置附近的管嘴单元30的前端的速度与天线片AS的输送速度成为等速的区间。
此外,在本实施方式中示出了在旋转头3H配设有12个管嘴单元30的例子,但并不限于此。配设于旋转头3H的管嘴单元30的数量能够任意设定。
接下来,参照图7以及图8,对利用管嘴单元30吸附IC芯片C的动作进行说明。
图7是表示芯片包含带CT由分离滚子74分离的状态的立体图。图8是分离滚子74附近的侧视图,是对从芯片包含带CT向管嘴单元30供给IC芯片C的动作进行说明的图。在图8中仅用剖面示出芯片包含带CT,以使芯片包含带CT的状态清楚。
如图7所示,分离滚子74的突起74p插入至从带送料机71供给的芯片包含带CT的安装孔H,从而在进行了芯片包含带CT的宽度方向上的定位的状态下输送芯片包含带CT。此时,芯片包含带CT的包覆膜CF由分支部件75剥离而朝向膜收卷卷轴73。另一方面,芯片包含带CT的带主体T朝向带主体收卷卷轴72。
如图8所示,剥离包覆膜CF而露出的IC芯片C立即由管嘴单元30吸附。在分离滚子74设置用于朝向分离滚子74的旋转中心吸引IC芯片C的吸引路(未图示),以使此时从IC芯片C露出至由管嘴单元30吸附的短暂时间内IC芯片C不会掉落。通过该吸引路和设置于带主体T的吸附孔Ts(参照图4)吸附IC芯片C。
再次参照图3,在从旋转贴片机3的管嘴单元30向天线AN释放IC芯片的位置(图6的位置PK)附近,设置有紫外线照射器41。
紫外线照射器41构成为对输送的天线AN上的导电膏照射紫外线。由紫外线照射器41进行的紫外线的照射和在IC芯片配置工序的后工序亦即固化工序进行的紫外线照射(后述)两者目的不同,前者的目的是调整天线AN上的导电膏的粘度。在该观点上,优选为使由紫外线照射器41给予导电膏的紫外线的累计光量比在之后的固化工序中给予导电膏的紫外线的累计光量少。通过紫外线照射器41提高导电膏的粘度,从而配置在导电膏上的IC芯片C的姿势稳定。
(2)固化工序
接下来,参照图9~图15对固化工序进行说明。
在固化工序中,使涂覆于经过了上述IC芯片配置工序的各天线的导电膏固化,使天线与IC芯片的物理连接稳固,并且使天线与IC芯片的电导通可靠。
图9是表示在实施方式的IC芯片搭载装置1中与固化工序对应的部分的图。图10是表示从图9的箭头方向J观察到的按压单元6的一部分和紫外线照射器42的图。图11是表示实施方式的固化装置4所包括的按压单元6的图。图12是实施方式的固化装置4所包括的按压单元循环机构5的俯视图。此外,在图12中,省略了后述的下侧导轨51L。
如图9所示,在固化工序中,IC芯片搭载装置1包括输送机82、固化装置4、拍摄装置CA4。
输送机82(输送部的一个例子)向下游以规定的输送速度输送从上游的IC芯片配置工序输送来的天线片AS。输送机82的上表面相当于输送面。
拍摄装置CA4在固化工序中最上游侧(即,IC芯片配置工序的最下游侧)配置于天线片AS的上方,拍摄从IC芯片配置工序输送来的各天线AN的图像。拍摄装置CA4除了检查在IC芯片配置工序中IC芯片是否配置于适当的位置之外,还是为了检测天线AN间的间距而设置的。因此,优选为拍摄装置CA4构成为能够至少拍摄到天线片AS的相邻的2个天线AN的图像。
如图9所示,固化装置4具有按压单元循环机构5和紫外线照射器42(光线照射部的一个例子)。如图9以及图12所示,按压单元循环机构5(按压单元移动机构的一个例子)包括:由上侧导轨51U以及下侧导轨51L构成的循环导轨51;主带52和齿轮521、522;辅助带53、送出齿轮54以及按压单元6。
按压单元循环机构5使按压单元6在规定的环状轨道上循环移动。
按压单元6在与输送面正交的方向上进行升降动作,在向各天线AN照射紫外线的期间按压配置在天线AN的导电膏上的IC芯片。设置于按压单元循环机构5的按压单元6的数量不限,但从生产性和成本的观点出发,优选为能够设定为2以上的任意数量。
紫外线照射器42沿着输送方向D1配置。因此,能够对天线片AS上的多数天线AN同时照射紫外线。
在本实施方式的IC芯片搭载装置1中,也可以由分配器2在天线AN涂覆环氧类树脂等热固化型粘合剂,并取代紫外线照射器42而设置具有加热器等加热设备的热固化装置。
如图9所示,优选为多个(在图示的例子中为8个)按压单元6分别同时对配置在输送来的多个(在图示的例子中为8个)天线AN的导电膏上的IC芯片进行按压。此时,输送机82不停止天线片AS的输送,一边使进行按压的多个按压单元6和被按压的多个天线AN以等速向输送方向D1移动,一边对各天线AN进行借助紫外线照射器42的紫外线的照射。因此,具有将IC芯片固定于天线AN时的生产性极高的优点。
参照图10,示出由紫外线照射器42对各天线AN照射紫外线的状态。
紫外线照射器42具有例如LED(Light Emitting Device)等光源42e。光源42e构成为从相对于输送面歪斜而倾斜的方向朝向天线AN照射紫外线。
按压单元6的按压部61的侧面(即,配置有紫外线照射器42的一侧的面)开放。构成按压部61的按压面的玻璃板61p由能够透过紫外线的玻璃形成。
接下来,参照图11对按压单元6的结构进行说明。
如图11所示,按压单元6具有按压部61、外壳62、轴63以及滚子保持部66。在外壳62安装有在下侧导轨51L上转动的一对下侧滚子64L以及一对横方向滚子65。在滚子保持部66,安装有在上侧导轨51U上转动的一对上侧滚子64U。下侧滚子64L以及上侧滚子64U是适合在水平面上转动的滚子,横方向滚子65是适合在铅垂面上转动的滚子。
轴63的一端与按压部61连结,轴63的另一端与滚子保持部66连结。轴63能够相对于外壳62在图11的上下方向上位移。
在外壳62的内部装入有弹簧(未图示)。在图11中,关于按压部61、轴63以及滚子保持部66,用实线表示未施加外力的自由状态,用假想线表示拉伸状态(施加有外力的状态)。若解除拉伸状态下的外力,则通过弹簧的回复力而复原为自由状态。
可以使用螺旋弹簧作为弹簧,但优选为使用磁性弹簧。磁性弹簧具有如下优点,即:无论行程量如何,其按压力恒定,所以难以产生对IC芯片的损伤,另外,长期间使用后的特性劣化极小。
在外壳62形成有一对V槽部62g。V槽部62g的槽数不限,但各槽是与主带52以及送出齿轮54嵌合那样的形状。
优选为在外壳62内置有永久磁铁。通过内置永久磁铁,如后所述,能够使多个按压单元6在待机区间通过磁力而相互重叠,所以能够在正确的时间点送出按压单元6。
按压部61在形成有V槽部62g的一侧形成有空隙61h,在底部安装有透过紫外线的玻璃板61p。如图10所示,在进行借助紫外线照射器42的照射的状态下,通过玻璃板61p的底面按压IC芯片。通过在玻璃板61p的底部设置能够透过紫外线的玻璃板61p,从而能够边照射紫外线边按压IC芯片。
参照图12,在按压单元循环机构5中,通过主带驱动马达M41(在图12中未图示)驱动,以使齿轮521、522向逆时针方向以定角速度旋转。根据齿轮521、522的旋转,与各齿轮啮合的主带52沿着按压单元6的轨道以恒定速度在齿轮521、522的周围循环移动。
辅助带53例如是平带、V带,由辅助带驱动马达M42(在图12中未图示)以恒定速度在图12中向顺时针方向驱动。辅助带53具备通过与按压单元6的V槽部62g卡合而使按压单元6沿着导轨加速的作用。
送出齿轮54构成为与按压单元6的V槽部62g啮合,是通过送出带驱动马达M43(在图12中未图示)来进行动作的齿轮,向图12的逆时针方向旋转。送出齿轮54是为了从待机位置朝向输送来的天线片AS送出按压单元6而设置的。送出齿轮54进行动作的时间点由后述的控制部200控制。此外,也可以取代送出齿轮54而应用在外侧具备V槽部的送出带。
接下来,参照图12~图15对按压单元循环机构5的动作进行说明。
图13是表示图12的B-B剖面以及C-C剖面的图。图14是对在按压单元循环机构5中按压单元6在拉伸状态和按压状态下相对于循环导轨51的位置关系进行说明的图。图15是对按压单元6的送出动作进行说明的图。
为了以下说明的方便,在图12中,将按压单元6的循环路分为区间S1~S5,对各区间按顺序进行说明。
如图13所示,当按压单元6在循环导轨51上循环时,按压单元6的一对上侧滚子64U边与上侧导轨51U的上表面511接触边转动,按压单元6的一对下侧滚子64L边与下侧导轨51L的底面512接触边转动。
这里,以输送机82的输送面为基准的下侧导轨51L的底面512的高度在下侧导轨51L的一周恒定。
与此相对地,以输送机82的输送面为基准的上侧导轨51U的上表面511的高度在一周中变动。具体而言,上侧导轨51U的上表面511的高度在图12的区间S1内最低,在区间S3、S4内最高。上侧导轨51U的上表面511的高度在区间S2内随着向图12的逆时针方向移动而逐渐变高,在区间S5内随着向图12的逆时针方向移动而逐渐变低。
在按压单元6位于区间S1时,上侧导轨51U的上表面511在一周中最低,按压单元6成为接近自由状态的按压状态,按压部61位于一周中最低的位置。设定上侧导轨51U的上表面511以及下侧导轨51L的底面512的位置,以使在该状态下与天线接触并对天线进行按压。
如图12所示,在区间S1,各按压单元6沿着天线片AS的输送方向D1,在该天线片AS的各天线的正上方移动。在区间S1,各按压单元6的V槽部62g和主带52啮合,各按压单元6按照主带52的速度而移动。
如上所述,在区间S1,上侧导轨51U的上表面511在一周中最低,如图14所示,各按压单元6成为接近自由状态的按压状态,所以按压部61向下方突出。如图9所示,在按压单元6为按压状态时,通过内置于按压单元6的弹簧的排斥力,按压已配置于天线片AS的对应的天线上的导电膏的IC芯片。
在区间S2,如上所述,上侧导轨51U的上表面511的高度随着向图12的逆时针方向移动而逐渐变高。因此,与弹簧的回复力相反地轴63逐渐被提升(拉伸),在区间S2的最后,成为图14的拉伸状态。在区间S2,各按压单元6的V槽部62g和主带52啮合,各按压单元6按照主带52的速度而移动。
在区间S2,上侧导轨51U的上表面511相对于区间S1逐渐变高,所以各按压单元6的滚子保持部66克服弹簧的回复力而被向上方拉伸,由此按压部61向上方移动。
若到达区间S3的开始位置,则按压单元6和主带52的啮合被解除。即,对图13的B-B剖面和C-C剖面进行比较可知,在区间S3、S4(参照C-C剖面),相对于区间S2的最终位置以及区间S5的开始位置(均参照B-B剖面),上侧导轨51U以及下侧导轨51L整体向外侧偏移(图13的偏移量ofs),按压单元6的一对横方向滚子65追随下侧导轨51L的内侧面513进行转动,其结果是,按压单元6的V槽部62g从主带52离开。
在区间S3,在按压单元6不与主带52接触后,向图12的顺时针方向旋转的辅助带53与按压单元6的外侧的V槽部62g接触并将其强力挤出,由此,按压单元6沿着循环导轨51向逆时针方向加速。在区间S3使按压单元6加速是为了避免在按压单元6的待机区间亦即区间S4中按压单元6的数量不足的状况。
此外,在区间S3和后述的区间S4,上侧导轨51U的上表面511在一周内最高,如图14所示,各按压单元6成为拉伸状态。
区间S4是在区间S3中按顺序被加速送来的多个按压单元6在到送出为止的期间进行待机的待机区间(待机位置的例子)。如上所述,优选为在按压单元6的外壳62内置有永久磁铁,由此多个按压单元6通过磁力而紧贴,以相互重叠的状态待机。
在区间S4,送出齿轮54和正在待机的多个按压单元6中位于前端的按压单元6的V槽部62g啮合。然后,在由后述的控制部200决定的时间点,送出齿轮54向图12的顺时针方向旋转,由此,位于前端的按压单元6被送出。在待机区间内,各按压单元6通过磁力而相互重叠,所以能够在正确的时间点将按压单元6逐个从待机区间S4送出。
参照图15,对按压单元6的送出动作进一步进行说明。图15是关于送出齿轮54的附近的按压单元6而示出了V槽部62g与主带52以及送出齿轮54的啮合状态的图。
如图15所示,处于待机区间S4的多个按压单元6-1、6-2、…的内侧的V槽部62g未与主带52啮合,但位于前端的按压单元6-1成为外侧的V槽部62g和送出齿轮54啮合的状态。在该状态下,若基于由后述的控制部200进行的指令而送出齿轮54向顺时针方向旋转,则按压单元6-1向图15的左侧移动而被送出。此时,以使按压单元6的一对横方向滚子65按照以假想线示出的轨迹移动(即,以图13中示出的偏移量ofs向主带52侧移动)的方式形成有下侧导轨51L。因此,被挤出的按压单元6-1朝向主带52向内侧移动,在区间S5的开始位置,内侧的V槽部62g和主带52啮合。内侧的V槽部62g和主带52啮合后,在区间S5按压单元6-1追随主带52的移动而进行动作。
即,在区间S5,各按压单元6的V槽部62g和主带52啮合,各按压单元6按照主带52的速度而移动。
如上所述,上侧导轨51U的上表面511的高度随着向图12的逆时针方向移动而逐渐变低。因此,由于弹簧的回复力而轴63逐渐下降,在区间S5的最后,成为图14所示的按压状态。在按压状态下,按压单元6的按压部61处于一周内最低的位置,是能够按压输送来的各天线的状态。在该状态下各按压单元6进入区间S1,按压配置在输送来的各天线的导电膏上的IC芯片。
通过以上说明那样,各按压单元6按照循环导轨51的轨道(区间S1~S5)循环并且在与输送面正交的方向上进行升降动作,按压配置在天线AN的导电膏上的IC芯片。由于按压单元6循环移动,所以能够将规定数量的按压单元6持续地用于按压。
接下来,参照图16以及图17,对由控制固化装置4的控制部200进行的控制进行说明。图16是控制部200的功能框图。图17是表示由拍摄装置CA4拍摄到的天线片AS的一部分的图像的例子的图。
控制部200封装于未图示的电路基板,与拍摄装置CA4、主带驱动马达M41、辅助带驱动马达M42、送出带驱动马达M43以及紫外线照射器42电连接。
控制部200包括微型计算机、存储器(RAM(Random Access Memory),ROM(ReadOnly Memory))、储存器、驱动电路组。微型计算机读出并执行存储器中记录的程序,实现带驱动模块201、间距检测模块202、送出时间点决定模块203以及固化执行模块204的各功能。
带驱动模块201向主带驱动马达M41以及辅助带驱动马达M42的驱动电路送出控制信号,以使分别以等速驱动主带52以及辅助带53。带驱动模块201根据由送出时间点决定模块203决定的送出时间点,向送出带驱动马达M43的驱动电路送出控制信号,由此在该送出时间点使送出齿轮54旋转。由此,如图15所示,送出待机区间的前端的按压单元6。
间距检测模块202(检测部的一个例子)基于由拍摄装置CA4拍摄到的图像,检测输送来的天线片的相邻的天线间的间距。
在图17中,包括包含相邻的2个天线AN在内的天线片AS的局部图像。如图17所示,拍摄装置CA4拍摄包括各天线AN的应配置IC芯片C的基准位置在内的图像。作为一个例子,天线间的间距AP是配置于各天线AN的IC芯片C的中心间的距离,但也可以是各天线AN的形状中的规定的特征点之间的距离。
间距检测模块202例如解析由拍摄装置CA4拍摄到的图像,检测相邻的天线AN的IC芯片C的中心间的距离。
此外,天线间的间距的检测并不限于基于由拍摄装置CA4拍摄到的图像来进行的情况。在与各天线AN对应地在基材上实施有规定标记的情况下,例如也可以通过光学式检测机构来检测基材上的相邻的标记,从而检测天线间的间距。
送出时间点决定模块203基于由间距检测模块202检测到的天线间的间距,来决定送出在按压单元循环机构5中处于待机区间的多个按压单元6中的前端的按压单元6的送出时间点。在决定送出时间点时,考虑由间距检测模块202检测到的天线间的间距、主带52的速度以及由输送机82进行输送的输送速度的各参数。即,基于各参数来决定各按压单元6的送出时间点,以使从待机区间S4按顺序送出的各按压单元6与通过拍摄装置CA4的对应的各天线AN在区间S1的开始位置合流。
送出时间点决定模块203是控制从待机区间送出各按压单元的时间点的控制部的一个例子。
如上所述,在送出时间点决定模块203中,基于由间距检测模块202检测到的天线间的间距,来决定按压单元6从待机区间的送出时间点。因此,能够对在生产线上的天线片AS上相邻的天线间的间距(间隔)不同的多个天线固定IC芯片。即,在本实施方式的IC芯片搭载装置1中,能够在不同间距的多个天线搭载IC芯片。
固化执行模块204向紫外线照射器42送出规定的驱动信号,以使对正在输送的天线AN的每一个以预先设定的累计光量从紫外线照射器42照射紫外线。
通过以上说明那样,将以恒定的间距在基材上形成有多个天线的带状的天线片投入至生产线,经过IC芯片配置工序和固化工序,在各天线上搭载IC芯片。本实施方式的IC芯片搭载装置在IC芯片配置工序中向天线的基准位置涂覆粘合剂并且在该粘合剂上配置IC芯片,在固化工序中使粘合剂固化来使天线与IC芯片的连接稳固。特别是,在本实施方式中,当在IC芯片配置工序中在天线依次搭载IC芯片时,能够在同一生产线上对相邻的天线的间隔不同的多个天线搭载IC芯片。
以上,对IC芯片搭载装置、IC芯片搭载方法的实施方式进行了说明,但本发明并不限定于上述实施方式。另外,上述实施方式能够在不脱离本发明的主旨的范围内进行各种改进、变更。
例如,在图3所示的实施方式中,在IC芯片配置工序中示出了天线片AS在输送机81上单向输送的情况,但并不限于此。
如图18所示,在一个实施方式中,在IC芯片配置工序中,也可以通过吸附滚筒92、94和多个输送滚子(例如在图17中为输送滚子91、93、95)来输送天线片AS。在图19中,在吸附滚筒92的最高位置,通过分配器2在天线片AS的天线AN的基准位置排出导电膏。另外,在吸附滚筒94的最高位置,在导电膏上配置IC芯片。该情况下,优选为至少吸附滚筒92、94为吸附天线片AS的背面的吸附滚子。由此,能够防止天线片AS的位置偏移(特别是长边方向),能够高精度地进行导电膏的排出以及IC芯片的配置。
在一个实施方式中,也可以取代在涂覆于输送的天线片AS状的天线AN的导电膏上释放IC芯片,而通过将IC芯片推压于导电膏来进行配置。
图19按时间序列示出了通过将IC芯片推压于导电膏来进行配置的情况下的旋转贴片机3的动作。在一个实施方式中,旋转贴片机3的各管嘴单元30构成为借助内置的驱动装置而能够独立地在放射方向(径向)上移动。
状态ST1是管嘴单元30吸附有IC芯片C的状态。如状态ST2所示,在配置已吸附的IC芯片C时,使管嘴单元30以向放射方向(径向)延伸的方式朝向基准位置(即向下方向、即向图2的Z方向)移动,将IC芯片C推压在涂覆于天线AN的导电膏上,从而将IC芯片C配置在导电膏上。在配置了IC芯片C后,解除吸附并且将管嘴单元30返回到状态ST1中的位置。例如,在管嘴单元30到达位置PK(参照图6)的时间点进行状态ST1~ST3的动作,从而能够将IC芯片C配置在涂覆于天线AN的导电膏上。
固化工序并不限于使用使按压单元6循环的固化装置4的情况。
在图20中示出一个实施方式的固化工序。在图20中示出在一个实施方式的固化工序中使用的固化装置4A。对于固化装置4A而言,多个紫外线固化单元43以可拆卸的方式安装于安装板44。根据天线片AS的邻接的天线AN的间隔,准备安装位置不同的多个安装板44,根据该间隔更换安装板44,从而能够与各种天线片AS对应。
支承轴45支承安装板44,构成为能够使安装板44升降。从IC芯片配置工序输送来的天线片AS经由输送滚子96~98被送至固化工序。输送滚子97构成为能够由未图示的驱动装置升降。
在图21中示出紫外线固化单元43的构成例。如图21所示,紫外线固化单元43在壳体431内内置用于照射紫外线的光源432(例如LED光源)。光源432通过从紫外线固化单元43的外部提供的缆线436(在图21中未图示)供电。在壳体431内,也可以设置将由光源432照射的紫外线聚光的聚光透镜。保持板434与壳体431连结,保持玻璃板435。从光源432照射的紫外线向涂覆于各天线AN的导电膏照射,从而使导电膏固化。
再次参照图20,输送状态示出了从IC芯片配置工序输送天线片AS的状态。在涂覆有未固化的导电膏的天线AN位于紫外线固化单元43的正下方的时间点,停止天线片AS的输送。然后,在停止了天线片AS的输送的状态(停止状态)下,边使紫外线固化单元43向下方移动而通过玻璃板435按压天线AN,边照射紫外线,从而使导电膏固化。
即使在停止状态时,也从IC芯片配置工序输送来天线片AS,所以在照射紫外线的期间,输送滚子97通过自重下降,在输送滚子96与输送滚子98之间吸收输送来的天线片AS。若紫外线的照射结束,则向下游迅速输送与紫外线固化单元43的数量相当的天线AN,然后停止,以使未固化的天线AN位于紫外线固化单元43的正下方。即,在一个实施方式的固化工序中,反复进行天线片AS的输送状态和停止状态(进行紫外线照射的状态)。在迅速输送天线AN时,输送滚子97通过施加于天线片AS的张力而上升。
一个实施方式的固化工序也可以使用热固化装置进行。即,当在分配器2处涂覆了环氧类树脂等热固化型粘合剂的情况下,在固化工序中,通过进行热固化处理来使粘合剂固化。
图22是与图20相同地构成为反复进行天线片AS的输送状态和停止状态的固化装置4B。固化装置4B和固化装置4A不同,具备多个热固化单元46。在各热固化单元46配置通过未图示的缆线供给电源来进行动作的热源。在天线片AS为停止状态时,驱动支承轴45以使支承轴45下降,边按压各热固化单元46对应的天线AN,边加热粘合剂使粘合剂固化。若加热完成,则驱动支承轴45以使支承轴45上升,并且进行天线片AS的输送。
此外,在图20中,在通过紫外线使导电膏固化的情况下,也可以取代内置有光源的紫外线固化单元43,使用经由玻璃板按压天线AN的按压单元,设置从宽度方向外部或斜上方对在停止状态下正被按压的天线AN上的导电膏照射紫外线的紫外线照射装置。
如图9所示,在一个实施方式中,也可以使多个紫外线固化单元43以与天线片AS的行进速度连动的方式循环移动,边按压天线AN边通过内置的光源照射紫外线,以使在照射紫外线时不使天线片AS成为停止状态。
同样地,在一个实施方式中,在使导电膏热固化的情况下,也可以构成为使多个热固化单元46以与天线片AS的行进速度连动的方式循环移动,边按压天线AN边进行加热。
Claims (10)
1.一种IC芯片搭载装置,其特征在于,具备:
输送部,其将在基材上连续地形成有嵌体用的多个天线的天线连续体以在各天线的规定的基准位置配置有粘合剂和IC芯片的状态在规定的输送面上进行输送;
检测部,其检测所述天线连续体中相邻的2个天线的间隔;
按压单元移动机构,其从待机位置按顺序送出具有按压面的多个按压单元,使各按压单元沿着所述输送面移动;以及
控制部,其基于由所述检测部检测出的间隔,控制从所述待机位置送出各按压单元的时间点,以使得通过各按压单元的按压面来按压所述输送面上的各天线的包括所述基准位置在内的规定区域。
2.根据权利要求1所述的IC芯片搭载装置,其特征在于,
所述粘合剂为光固化型,
所述IC芯片搭载装置具备光线照射部,该光线照射部对配置于正在被各按压单元按压的天线的粘合剂照射光线。
3.根据权利要求1所述的IC芯片搭载装置,其特征在于,
所述粘合剂为热固化型,
各按压单元具有加热设备,在按压所述天线的期间,通过所述加热设备对配置于所述天线的粘合剂进行加热。
4.根据权利要求1~3中的任一项所述的IC芯片搭载装置,其特征在于,
所述控制部针对各按压单元独立地控制从所述待机位置送出的时间点。
5.根据权利要求1~4中的任一项所述的IC芯片搭载装置,其特征在于,
所述按压单元移动机构使所述按压单元往复循环。
6.一种IC芯片搭载方法,其特征在于,
向在基材上连续地形成有嵌体用的多个天线的天线连续体的各天线的规定的基准位置配置粘合剂和IC芯片,并在规定的输送面上进行输送,
检测所述天线连续体中相邻的2个天线的间隔,
从待机位置送出具有按压面的多个按压单元,使各按压单元沿着所述输送面移动,
基于检测出的所述间隔,控制从所述待机位置送出各按压单元的时间点,以使得通过各按压单元的按压面来按压所述输送面上的各天线的包括所述基准位置在内的规定区域。
7.根据权利要求6所述的IC芯片搭载方法,其特征在于,
所述粘合剂为光固化型粘合剂,
对配置于正在被各按压单元按压的天线的粘合剂照射光线。
8.根据权利要求6所述的IC芯片搭载方法,其特征在于,
所述粘合剂为热固化型粘合剂,
各按压单元具有加热设备,在按压所述天线的期间,通过所述加热设备对配置于所述天线的粘合剂进行加热。
9.根据权利要求6~8中的任一项所述的IC芯片搭载方法,其特征在于,
针对各按压单元独立地控制从所述待机位置送出的时间点。
10.根据权利要求6~9中的任一项所述的IC芯片搭载方法,其特征在于,
使所述按压单元往复循环。
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