CN114801357A - 一种基于薄膜状人工石墨片的集成芯片用散热结构 - Google Patents
一种基于薄膜状人工石墨片的集成芯片用散热结构 Download PDFInfo
- Publication number
- CN114801357A CN114801357A CN202210457695.0A CN202210457695A CN114801357A CN 114801357 A CN114801357 A CN 114801357A CN 202210457695 A CN202210457695 A CN 202210457695A CN 114801357 A CN114801357 A CN 114801357A
- Authority
- CN
- China
- Prior art keywords
- engineering plastic
- plastic carrier
- artificial graphite
- heat
- metal gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021383 artificial graphite Inorganic materials 0.000 title claims abstract description 13
- 230000005855 radiation Effects 0.000 title description 3
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 25
- -1 graphite alkene Chemical class 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000007731 hot pressing Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical group C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920000090 poly(aryl ether) Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 4
- 238000000465 moulding Methods 0.000 claims 1
- 239000012255 powdered metal Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 abstract description 12
- 239000010439 graphite Substances 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开了一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层,工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。本结构中以工程塑料为载体,并将石墨烯以浆料的形式填充在工程塑料载体内部的凹槽中,并通过通孔与金属垫片层接触,该种形式可以最大程度的利用石墨烯材料的导热能力,并结合工程塑料出色的结构强度与韧性特点,从而既保证了散热能力,也获得了结构强度。
Description
技术领域
本发明涉及一种基于薄膜状人工石墨片的集成芯片用散热结构。
背景技术
非金属导热材料作为一种新型的导热材料,其重量、单价以及导热效果均优于现有的金属导热材料。
在芯片领域中,高计算量芯片在短期内会产生大量的热量,且由于其内部空间较小,无法通过有效的散热方式将热量导出,尤其是在安全性要求较高的场景中,会造成一定的安全隐患,轻则导致运算芯片以低功率进行运算,重则导致芯片的损坏。
同时,由于芯片的小型化发展趋势,往往散热结构还需要具有一定的结构强度,以保护芯片不被外来冲击力破坏。这也是两种发展趋势,一方面是柔性导热材料的持续发展,另一方面是具有一定结构强度的导热材料的持续发展。石墨烯材料具有较好的强度,但是由于韧性较差,所以并不能满足结构强度增强的需求。
与此同时,国外的研究人员将石墨烯填料用于工程塑料的载体填充中,取得了较好的效果,工程塑料由于其卓越的韧性特点以及耐腐耐磨性能,逐渐替代原有的金属材料,且工程塑料与常规石墨烯的联合使用,其更能有效的解决现有石墨烯材料易断裂,韧性差的劣势。
但工程塑料也存在一定的短板问题,即较差的导热性能以及热变形问题,针对该问题,不同的研发人员从不同的角度出发,一方面研发导热性能更优异的工程塑料粒子,另一方面研究更合理的叠层结构。
发明内容
为了解决现有技术的不足,本申请从叠层结构出发,提出了一种基于薄膜状人工石墨片的集成芯片用散热结构。
一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层。
为了提升连接强度并保证连接完成后的石墨烯导热层可以直接与金属垫片层接触,所述的工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。
进一步的,所述的金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.1-2s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷。
进一步的,石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙。
进一步的,石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2-5MPa。
进一步的,所述的工程塑料载体的材质为酚酞聚芳醚腈酮。
有益效果:
本结构中以工程塑料为载体,并将石墨烯以浆料的形式填充在工程塑料载体内部的凹槽中,并通过通孔与金属垫片层接触,该种形式可以最大程度的利用石墨烯材料的导热能力,并结合工程塑料出色的结构强度与韧性特点,从而既保证了散热能力,也获得了结构强度。
最后再通过金属垫片层将热量通过凸起尽量直接传递至石墨烯导热层中,从而减小了不同导热介质间的转换,以最大程度的将热量高效的进行导出。
附图说明
图1是一种复合散热结构的爆炸图;
图2是一种复合散热结构的整体结构示意图;
图3是含有加强柱的工程塑料载体的结构示意图;
1.石墨烯导热层2.工程塑料载体3.金属垫片层。
具体实施方式
为了加深对本发明的理解,下面将结合实施例和附图对本发明作进一步详述,该实施例仅用于解释本发明,并不构成对本发明保护范围的限定。
实施示例:
一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层,工程塑料载体的材质为酚酞聚芳醚腈酮。
工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。
金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.5s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷。该种连接方式是利用工程塑料热熔型的特点,进行的无胶水形式的连接,同时避免熔融的工程塑料会导致石墨烯导热层的凸起全部暴露在工程塑料载体的表面,从而实现石墨烯导热层与金属垫片层之间的无间隙接触,以提升后续的导热效果。
石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙。
石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2.5MPa。在压力成型的条件下,可以防止石墨烯浆料在固化的过程中,内部产生气孔或其他膨胀缺陷,在实验时,发现未加压的条件下,相同用量的石墨烯浆料使用下,其厚度比加压条件下厚0.001-0.015mm。
在使用时,金属垫片层直接与待散热的芯片上表面接触,并可以根据芯片的实际形状,设计相对应的金属垫片层的表面结构,以保证金属垫片层与带散热芯片表面的充分接触。热量通过金属垫片层传递至石墨烯导热层中,并通过石墨烯导热层将热量最终散出,同时工程塑料载体提供较好的力学支撑,以提升整体散热结构的结构稳定性。
作为进一步改进,以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (6)
1.一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层。
2.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,所述的工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。
3.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,所述的金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.1-2s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷。
4.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙。
5.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2-5MPa。
6.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,所述的工程塑料载体的材质为酚酞聚芳醚腈酮。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210457695.0A CN114801357B (zh) | 2022-04-28 | 2022-04-28 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210457695.0A CN114801357B (zh) | 2022-04-28 | 2022-04-28 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114801357A true CN114801357A (zh) | 2022-07-29 |
CN114801357B CN114801357B (zh) | 2024-02-09 |
Family
ID=82509621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210457695.0A Active CN114801357B (zh) | 2022-04-28 | 2022-04-28 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114801357B (zh) |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101463936B1 (ko) * | 2013-08-19 | 2014-11-26 | 주식회사 휘닉스소재 | 그라핀코팅의 접착력이 우수한 반도체 패키지용 히트싱크 및 그 제조방법 |
WO2017043831A1 (ko) * | 2015-09-07 | 2017-03-16 | 주학식 | 전자파 흡수소멸과 차폐용 및 전자기기 고방열용 융합시트 및 그 제조방법 |
CN107562159A (zh) * | 2017-10-23 | 2018-01-09 | 南京旭羽睿材料科技有限公司 | 一种石墨烯电脑外置散热贴膜 |
CN107946264A (zh) * | 2017-12-01 | 2018-04-20 | 江苏奥尼克电气股份有限公司 | 石墨烯复合散热结构 |
US20180187987A1 (en) * | 2015-08-31 | 2018-07-05 | Jiangsu Cnano Technology Co., Ltd. | Thermally conductive structure and heat dissipation device |
US20200258808A1 (en) * | 2016-03-30 | 2020-08-13 | Parker-Hannifin Corporation | Thermal interface material |
CN112164680A (zh) * | 2020-08-24 | 2021-01-01 | 杰群电子科技(东莞)有限公司 | 一种裸芯封装结构及其封装方法 |
CN112406212A (zh) * | 2020-11-03 | 2021-02-26 | 东莞市鸿亿导热材料有限公司 | 一种应用于5g终端的烯碳导热膜 |
CN112455038A (zh) * | 2020-11-03 | 2021-03-09 | 东莞市鸿亿导热材料有限公司 | 一种高导热功率石墨膜 |
CN212864650U (zh) * | 2020-08-04 | 2021-04-02 | 苏州天煜新材料科技有限公司 | 一种复合式石墨烯散热膜 |
CN113594109A (zh) * | 2021-07-16 | 2021-11-02 | 深圳市立凡硅胶制品有限公司 | 热压成型的导热膜 |
CN114286581A (zh) * | 2020-09-27 | 2022-04-05 | 广州宏庆电子有限公司 | 一种复合散热膜及其制备方法 |
-
2022
- 2022-04-28 CN CN202210457695.0A patent/CN114801357B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101463936B1 (ko) * | 2013-08-19 | 2014-11-26 | 주식회사 휘닉스소재 | 그라핀코팅의 접착력이 우수한 반도체 패키지용 히트싱크 및 그 제조방법 |
US20180187987A1 (en) * | 2015-08-31 | 2018-07-05 | Jiangsu Cnano Technology Co., Ltd. | Thermally conductive structure and heat dissipation device |
WO2017043831A1 (ko) * | 2015-09-07 | 2017-03-16 | 주학식 | 전자파 흡수소멸과 차폐용 및 전자기기 고방열용 융합시트 및 그 제조방법 |
US20200258808A1 (en) * | 2016-03-30 | 2020-08-13 | Parker-Hannifin Corporation | Thermal interface material |
CN107562159A (zh) * | 2017-10-23 | 2018-01-09 | 南京旭羽睿材料科技有限公司 | 一种石墨烯电脑外置散热贴膜 |
CN107946264A (zh) * | 2017-12-01 | 2018-04-20 | 江苏奥尼克电气股份有限公司 | 石墨烯复合散热结构 |
CN212864650U (zh) * | 2020-08-04 | 2021-04-02 | 苏州天煜新材料科技有限公司 | 一种复合式石墨烯散热膜 |
CN112164680A (zh) * | 2020-08-24 | 2021-01-01 | 杰群电子科技(东莞)有限公司 | 一种裸芯封装结构及其封装方法 |
CN114286581A (zh) * | 2020-09-27 | 2022-04-05 | 广州宏庆电子有限公司 | 一种复合散热膜及其制备方法 |
CN112406212A (zh) * | 2020-11-03 | 2021-02-26 | 东莞市鸿亿导热材料有限公司 | 一种应用于5g终端的烯碳导热膜 |
CN112455038A (zh) * | 2020-11-03 | 2021-03-09 | 东莞市鸿亿导热材料有限公司 | 一种高导热功率石墨膜 |
CN113594109A (zh) * | 2021-07-16 | 2021-11-02 | 深圳市立凡硅胶制品有限公司 | 热压成型的导热膜 |
Also Published As
Publication number | Publication date |
---|---|
CN114801357B (zh) | 2024-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20100096130A (ko) | 광기전 모듈용 온도-제어체 | |
CN206389672U (zh) | 一种包边石墨片 | |
JPWO2010035788A1 (ja) | 発光素子搭載用基板及びその製造方法 | |
CN102391818A (zh) | 一种绝缘导热粘合剂及其制备方法 | |
CN109346448B (zh) | 一种石墨烯复合冷板及其制备方法 | |
CN114801357A (zh) | 一种基于薄膜状人工石墨片的集成芯片用散热结构 | |
CN112038653A (zh) | 一种增强型的双极板结构及制作方法 | |
CN209955447U (zh) | 一种高散热性能的覆铜板 | |
CN102469685A (zh) | 导热双面软硬结合基板及其制作方法 | |
CN109768019A (zh) | 一种功率模块用散热片及用其制成的功率模块 | |
CN209454063U (zh) | 一种ins薄膜模具 | |
CN210900183U (zh) | 一种通信用相变高导热垫片 | |
CN106158790A (zh) | 功率模块及其热界面结构 | |
CN110408177B (zh) | 一种具有单层填料结构的导热塑料及其制备方法和应用 | |
CN114292613A (zh) | 复合膜、倒装led芯片及其制造方法 | |
CN212342663U (zh) | 一种增强型的双极板结构 | |
CN217377780U (zh) | 一种耐磨型导热硅橡胶片 | |
CN220191301U (zh) | 一种易贴合的导热硅胶垫片 | |
CN212422429U (zh) | 一种富树脂覆铜板 | |
CN215512709U (zh) | 一种定向高导热石墨基热界面复合材料结构 | |
CN219555472U (zh) | 一种多层导热垫片 | |
CN218710113U (zh) | 一种高致密性的抗拉伸式石墨散热、导热胶带 | |
CN217921905U (zh) | 一种耐高温性硅胶皮 | |
CN108317775A (zh) | 一种冰箱管板式冷凝器强化换热装置 | |
CN103762297A (zh) | 一种led封装材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |