CN114801357B - 一种基于薄膜状人工石墨片的集成芯片用散热结构 - Google Patents
一种基于薄膜状人工石墨片的集成芯片用散热结构 Download PDFInfo
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- 229910021383 artificial graphite Inorganic materials 0.000 title claims abstract description 9
- 230000005855 radiation Effects 0.000 title claims abstract description 4
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000007731 hot pressing Methods 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 8
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- 239000000463 material Substances 0.000 claims abstract description 7
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- 238000002844 melting Methods 0.000 claims description 4
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- 238000000034 method Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
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- 239000002131 composite material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
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- 239000000945 filler Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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Abstract
本发明公开了一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层,工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。本结构中以工程塑料为载体,并将石墨烯以浆料的形式填充在工程塑料载体内部的凹槽中,并通过通孔与金属垫片层接触,该种形式可以最大程度的利用石墨烯材料的导热能力,并结合工程塑料出色的结构强度与韧性特点,从而既保证了散热能力,也获得了结构强度。
Description
技术领域
本发明涉及一种基于薄膜状人工石墨片的集成芯片用散热结构。
背景技术
非金属导热材料作为一种新型的导热材料,其重量、单价以及导热效果均优于现有的金属导热材料。
在芯片领域中,高计算量芯片在短期内会产生大量的热量,且由于其内部空间较小,无法通过有效的散热方式将热量导出,尤其是在安全性要求较高的场景中,会造成一定的安全隐患,轻则导致运算芯片以低功率进行运算,重则导致芯片的损坏。
同时,由于芯片的小型化发展趋势,往往散热结构还需要具有一定的结构强度,以保护芯片不被外来冲击力破坏。这也是两种发展趋势,一方面是柔性导热材料的持续发展,另一方面是具有一定结构强度的导热材料的持续发展。石墨烯材料具有较好的强度,但是由于韧性较差,所以并不能满足结构强度增强的需求。
与此同时,国外的研究人员将石墨烯填料用于工程塑料的载体填充中,取得了较好的效果,工程塑料由于其卓越的韧性特点以及耐腐耐磨性能,逐渐替代原有的金属材料,且工程塑料与常规石墨烯的联合使用,其更能有效的解决现有石墨烯材料易断裂,韧性差的劣势。
但工程塑料也存在一定的短板问题,即较差的导热性能以及热变形问题,针对该问题,不同的研发人员从不同的角度出发,一方面研发导热性能更优异的工程塑料粒子,另一方面研究更合理的叠层结构。
发明内容
为了解决现有技术的不足,本申请从叠层结构出发,提出了一种基于薄膜状人工石墨片的集成芯片用散热结构。
一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层。
为了提升连接强度并保证连接完成后的石墨烯导热层可以直接与金属垫片层接触,所述的工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。
进一步的,所述的金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.1-2s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷。
进一步的,石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙。
进一步的,石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2-5MPa。
进一步的,所述的工程塑料载体的材质为酚酞聚芳醚腈酮。
有益效果:
本结构中以工程塑料为载体,并将石墨烯以浆料的形式填充在工程塑料载体内部的凹槽中,并通过通孔与金属垫片层接触,该种形式可以最大程度的利用石墨烯材料的导热能力,并结合工程塑料出色的结构强度与韧性特点,从而既保证了散热能力,也获得了结构强度。
最后再通过金属垫片层将热量通过凸起尽量直接传递至石墨烯导热层中,从而减小了不同导热介质间的转换,以最大程度的将热量高效的进行导出。
附图说明
图1是一种复合散热结构的爆炸图;
图2是一种复合散热结构的整体结构示意图;
图3是含有加强柱的工程塑料载体的结构示意图;
1.石墨烯导热层2.工程塑料载体3.金属垫片层。
具体实施方式
为了加深对本发明的理解,下面将结合实施例和附图对本发明作进一步详述,该实施例仅用于解释本发明,并不构成对本发明保护范围的限定。
实施示例:
一种基于薄膜状人工石墨片的集成芯片用散热结构,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层,工程塑料载体的材质为酚酞聚芳醚腈酮。
工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔。
金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.5s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷。该种连接方式是利用工程塑料热熔型的特点,进行的无胶水形式的连接,同时避免熔融的工程塑料会导致石墨烯导热层的凸起全部暴露在工程塑料载体的表面,从而实现石墨烯导热层与金属垫片层之间的无间隙接触,以提升后续的导热效果。
石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙。
石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2.5MPa。在压力成型的条件下,可以防止石墨烯浆料在固化的过程中,内部产生气孔或其他膨胀缺陷,在实验时,发现未加压的条件下,相同用量的石墨烯浆料使用下,其厚度比加压条件下厚0.001-0.015mm。
在使用时,金属垫片层直接与待散热的芯片上表面接触,并可以根据芯片的实际形状,设计相对应的金属垫片层的表面结构,以保证金属垫片层与带散热芯片表面的充分接触。热量通过金属垫片层传递至石墨烯导热层中,并通过石墨烯导热层将热量最终散出,同时工程塑料载体提供较好的力学支撑,以提升整体散热结构的结构稳定性。
作为进一步改进,以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (2)
1.一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,包括工程塑料载体以及填充在工程塑料载体内部的石墨烯导热层;工程塑料载体的顶部热压有呈片状的金属垫片层,所述金属垫片层的外表面涂覆有防腐涂层;
工程塑料载体的上表面设有凹槽,凹槽的底端设有若干个用于石墨烯导热层凸出的通孔,所述的石墨烯导热层通过浆料浇筑的形式,嵌入在凹槽内部,并穿过通孔,所述的金属垫片通过热压的方式热压在工程塑料载体的上表面,热压温度高于工程材料的熔点0-10℃,热压时间为0.1-2s,热压完成后,工程塑料载体的表面无水滴状胶水凝固缺陷,石墨烯导热层与金属垫片层之间的接触处无空隙,并在接触处涂覆粉末状金属,涂覆完成后通高频电流熔融,保证接触处无间隙,石墨烯导热层在浆料浇筑以及成型过程中,均保证表面一定的压力作用,压强为2-5MPa。
2.根据权利要求1所述的一种基于薄膜状人工石墨片的集成芯片用散热结构,其特征在于,所述的工程塑料载体的材质为酚酞聚芳醚腈酮。
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