CN112455038A - 一种高导热功率石墨膜 - Google Patents
一种高导热功率石墨膜 Download PDFInfo
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Abstract
本发明属于导热散热材料技术领域，具体公开了一种高导热功率石墨膜，从下到上依次包括PET膜、第一导热胶层、内部导热层、第二导热胶层、缓冲层、阻燃层和PE膜；第一导热胶层包括金属基层和硅胶层，第二导热胶层上端面设置有网格结构，网格内填充有散热鳞片；通过凹凸结构配合，增大接触面积，使热量可以在平面快速扩散传递；内部导热层设置有相变型导热材料，在高温时由固态转变为固态，具有较大的储热能力，而且能够保证相变体积不会发生大幅度的变化，增强石墨膜的导热系数，提高石墨膜的热稳定性和可靠性，使石墨膜具备了热容效果，增加散热效率，满足高耗能电子设备的散热需求。
Description
技术领域
本发明属于导热散热材料技术领域，具体涉及一种高导热功率石墨膜。
背景技术
随着5G时代的到来，5G手机芯片处理能力有望达到4G手机的 5倍,随着5G手机功能越来越强大、处理能力越来越强的同时功耗也随之增加，手机发热密度绝对值也将增长，因此5G手机将面临着更大的散热压力。另外受5G手机天线数量增加，手机机身材质逐渐向非金属靠拢，同时5G手机越来越轻薄化、紧凑，对于手机的散热设计也越来越具有难度。
人工石墨片散热是目前手机采用的主流散热方式。人工导热石墨膜是在极高温度环境下，制得的一种碳分子高结晶态石墨膜，具有高导热系数，低热阻，重量轻等优点，可与金属、塑胶、不干胶等材料自由组合扩展设计功能,被广泛应用于移动通信等领域，但人工导热石墨膜单体厚度受到限制，技术路线停留在75umPI烧制40um规格石墨导热膜，虽具备优异的导热系数，但因导热通道受限，无法实现高的导热功率，远不能满足5G系列的散热需求。
发明内容
本发明的目的在于：针对现有技术的不足，提供一种高导热功率石墨膜，以解决现有的导热膜散热功率不足、易燃烧和抗冲击能力差的问题。
为了实现上述目的，本发明采用如下技术方案：
一种高导热功率石墨膜，从下到上依次包括PET膜、第一导热胶层、内部导热层、第二导热胶层、缓冲层、阻燃层和PE膜；所述第一导热胶层包括金属基层和设置于所述金属基层上端面的硅胶层，所述金属基层设置有第一凹槽，所述硅胶层设置有与所述第一凹槽相配合的第一凸起；所述第二导热胶层上端面设置有网格结构，所述网格内填充有散热鳞片；所述内部导热层从内到外依次为石墨烯层、相变型导热层和第三导热胶层；述缓冲层和所述阻燃层接触的表面设置有若干个第二凸起，若干所述第二凸起呈阵列排布。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述散热鳞片为鳞片石墨，所述散热鳞片的导热系数≥1300W/m·K。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述第一凹槽呈方形或梯形结构，所述第一凹槽的深度为6μm-10μm；所述第一凸起呈方形或梯形结构，所述第一凸起的高度为6μm-10μm。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述相变型导热层为固固相变导热材料，相变温度为30°-70°。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述固固相变导热材料为石蜡、多元醇、聚乙烯和聚乙二醇中的一种。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述石墨膜沿纵向设置有多个导热通道，所述导热通道内填充有压敏型导热胶；所述压敏型导热胶为填充有导热填料的丙烯酸压敏胶、有机硅压敏胶和聚氨酯压敏胶中的一种。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述石墨烯层中的石墨烯纯度为99.0％-99.65％，所述石墨烯层的厚度为12μm -20μm，所述石墨烯层的热扩散系数≥900mm2/s。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述金属基层为铜、铝或钛箔层中的一种，所述缓冲层材料为聚苯乙烯、聚乙烯、聚氨酯、聚氯乙烯材料中的一种。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述阻燃层包括聚酯层、尼龙薄层和聚酰胺树脂层；所述聚酯层、尼龙薄层和聚酰胺树脂层之间通过导热胶粘接。
作为本发明所述的一种高导热功率石墨膜的一种改进，所述石墨膜的导热系数为1250～1500W/m·K。
本发明的有益效果在于：本发明提供了一种高导热功率石墨膜，从下到上依次包括PET膜、第一导热胶层、内部导热层、第二导热胶层、缓冲层、阻燃层和PE膜；所述第一导热胶层包括金属基层和硅胶层，所述金属基层和所述硅胶层之间通过凹凸结构配合，增大其接触面积，使热量可以在平面快速扩散传递；所述第二导热胶层上端面设置有网格结构，所述网格内填充有散热鳞片；这种结构设计，能够有效提高第二导热胶层的导热效率，增大其散热量。本发明中的内部导热层设置有相变型导热材料，在高温时由固态转变为固态，其具有较大的储热能力，而且能够保证相变体积不会发生大幅度的变化，增强石墨膜的导热系数，提高石墨膜的热稳定性和可靠性，同时，所述相变型导热层设置于所述石墨烯层、所述第一导热胶层、所述第二导热胶层和所述第三导热胶层形成的密闭空间内，使导热膜具备了热容效果，增加导热效率，能够有效防止相变型导热层由于温度过高出现固液相变并流动溢出的情况。
附图说明
图1为本发明实施例1的结构示意图；
图2为本发明实施例1第二导热胶层的结构示意图；
图3为本发明实施例2的结构示意图。
其中，1-PET膜；2-第一导热胶层；21-金属基层；22-硅胶层；3- 内部导热层；31-第三导热胶层；32-相变型导热层；33-石墨烯层；4- 第二导热胶层；41-网格；5-缓冲层；6-阻燃层；7-PE膜；8-压敏型导热胶。
具体实施方式
在本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”、水平”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
以下结合附图和具体实施例对本发明作进一步详细说明，但不作为对本发明的限定。
实施例1
如图1和图2所示，本发明提供的一种高导热功率石墨膜，从下到上依次包括PET膜1、第一导热胶层2、内部导热层3、第二导热胶层4、缓冲层5、阻燃层6和PE膜7；第一导热胶层2包括金属基层21和设置于金属基层21上端面的硅胶层22，金属基层21设置有第一凹槽，硅胶层22设置有与第一凹槽相配合的第一凸起；金属基层21和硅胶层22之间通过凹凸结构配合，增大其接触面积，使热量可以在平面快速扩散传递；第二导热胶层4上端面设置有网格41，网格41内填充有散热鳞片；网格41填充有散热鳞片能够有效提高第二导热胶层4的导热效率，增大其散热量。内部导热层3从内到外依次为石墨烯层33、相变型导热层32和第三导热胶层31；本发明中的相变型导热材料在高温时由固态转变为固态，其具有较大的储热能力，能够保证相变体积不会发生大幅度的变化，增强石墨膜的导热系数，提高石墨膜的热稳定性和可靠性，同时，相变型导热层32设置于石墨烯层33、第一导热胶层2、第二导热胶层4和第三导热胶层31形成的密闭空间内，使导热膜具备了热容效果，增加导热效率，能够有效防止相变型导热层32由于温度过高出现固液相变并流动溢出的情况。缓冲层5和阻燃层6接触的表面设置有若干个第二凸起，若干第二凸起呈阵列排布。第二凸起的设计，能够有效提高热量的传导散发，增大接触面积，使热量在层与层之间快速传递，增强石墨膜的热扩散系数，同时进一步起到了缓冲的作用。
其中，PET膜1的机械性能优良，其强韧性是所有热塑性塑料中最好的，抗张强度和抗冲击强度比一般薄膜高很多；且抗张力性能好，尺寸稳定，PET膜1还具有优良的耐热、耐寒性和良好的耐化学药品性和耐油性。PE膜7有很好的延伸性，延伸率在150-300％之间，PE膜7能够保护石墨膜在生产加工，运输，贮存和使用过程中不受污染，腐蚀，划伤，保护原有的光洁亮泽的表面，从而提高石墨膜的质量。
优选地，散热鳞片为鳞片石墨，散热鳞片的导热系数≥ 1300W/m·K。该鳞片石墨由超厚PI(原料)烧制而成，在导热性能上有质的跃升，堆叠成模型后，其导热性能与第二导热胶层4导热性能吻合，大大提高了第二热胶层的导热系数。
优选地，第一凹槽呈方形或梯形结构，第一凹槽的深度为6μm-10 μm；第一凸起呈方形或梯形结构，第一凸起的高度为6μm-10μm。这种结构设计，能够有效增大金属基层21与硅胶层22接触面积，提高金属基层21与硅胶层22的热扩散系数，同时兼顾金属基层21和硅胶层22的厚度，避免其厚度过大对热扩散系数的影响。
优选地，相变型导热层32为固固相变导热材料，相变温度为 30°-70°，固固相变导热材料为石蜡、多元醇、聚乙烯和聚乙二醇中的一种。固固相变导热材料具有储热能力强、相变体积变化微小、没有明显的相分离、相变过程无毒无害和具有很好的延展性等特点，能够有效提高石墨膜的传热均匀性和热扩散系数，提高石墨膜的热稳定性和可靠性。
优选地，石墨烯层33中的石墨烯纯度为99.0％-99.65％，石墨烯层33的厚度为12μm-20μm，石墨烯层33的热扩散系数≥900mm2/s。能够有效提高石墨膜的导热系数，满足高导热功率电子设备的导热需求。
优选地，金属基层21为铜、铝或钛箔层中的一种，缓冲层5材料为聚苯乙烯、聚乙烯、聚氨酯、聚氯乙烯材料中的一种。铜、铝和钛箔层具有很好的导热效果，具有优异的延展性，便于加工，同时能够有效屏蔽电磁干扰，防止外界电磁波对发热源造成不良影响。
优选地，阻燃层6包括聚酯层、尼龙薄层和聚酰胺树脂层；聚酯层、尼龙薄层和聚酰胺树脂层之间通过导热胶粘接。聚酯层具有耐热、抗冲击、折射率高和加工性能好的优点，尼龙薄层具有透明性好、抗张拉力、耐磨性能好和耐热性好的优点，聚酰胺树脂层具有耐热性、耐磨损性、耐化学药品性和自润滑性，且摩擦系数低，有一定的阻燃性，易于加工，适于用玻璃纤维和其它填料填充增强改性，通过上述结构配合，达到了阻燃效果优异的特点，同时是石墨膜具有耐热性、耐磨损性、耐化学药品性的特性，增加了石墨膜的抗张拉力性能，提高了石墨膜的稳定性。
优选地，石墨膜的导热系数为1250～1500W/m·K。通过上述的结构设计，使石墨膜具有高导热性，满足高耗能电子设备的散热需求。
实施例2
如图3所示，与实施例1不同的是，本实施例中的石墨膜沿纵向设置有多个导热通道，导热通道内填充有压敏型导热胶8；压敏型导热胶8为填充有导热填料的丙烯酸压敏胶、有机硅压敏胶和聚氨酯压敏胶中的一种。这种结构设计，缩短了热量于各个层之间的流通时间，提高了石墨膜纵向导热系数，提高了石墨膜的传热效率，同时增加了石墨膜的导热通道，实现快速散热，满足高耗能电子设备的散热需求。
其他结构同实施例1，这里不再赘述。
对比例1
与实施例1不同的是，本对比例的内部导热层为石墨烯层。
其他结构同实施例1，这里不再赘述。
对比例2
与实施例1不同的是，本对比例的石墨膜无缓冲层。
其他结构同实施例1，这里不再赘述。
分别对实施例1～2和对比例1～2的石墨膜进行性能测试，测试结果如表1所示：
表1
由表1的的性能测试结果可知，通过对石墨膜性能测试获取的数据进行对比，于第二导热胶层上设置缓冲层，能够有效提高石墨膜的抗冲击强度，提高石墨膜的稳定性。内部导热层设置为石墨烯层、相变型导热层和第三导热胶层，增加了石墨膜的散热通道，能够有效提高石墨膜的热扩散系数和导热系数，同时，相变型导热层具有储热效果，能够吸收部分热量。由表中数据可知，本申请高导热功率石墨膜的热扩散系数可达到1400mm2/s，导热系数可达到1500W/(m*K)，对比普通的人工石墨膜，其导热通道几倍增加，其散热效率远高于目前的人工石墨散热片。同时，一种高导热功率石墨膜的结构设计，使其具有很好的柔韧性，一致性，也具有良好的再加工性，一种高导热功率石墨膜具有弹性，可裁切冲压成任意形状，并可多次弯折，充分适应和满足手机的使用空间和位置，解决5G终端中热量的聚集。
根据上述说明书的揭示和教导，本发明所属领域的技术人员还能够对上述实施方式进行变更和修改。因此，本发明并不局限于上述的具体实施方式，凡是本领域技术人员在本发明的基础上所作出的任何显而易见的改进、替换或变型均属于本发明的保护范围。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本发明构成任何限制。
Claims (10)
1.一种高导热功率石墨膜，其特征在于：从下到上依次包括PET膜、第一导热胶层、内部导热层、第二导热胶层、缓冲层、阻燃层和PE膜；
所述第一导热胶层包括金属基层和设置于所述金属基层上端面的硅胶层，所述金属基层设置有第一凹槽，所述硅胶层设置有与所述第一凹槽相配合的第一凸起；
所述第二导热胶层上端面设置有网格结构，所述网格内填充有散热鳞片；
所述内部导热层从内到外依次为石墨烯层、相变型导热层和第三导热胶层；
所述缓冲层和所述阻燃层接触的表面设置有若干个第二凸起，若干所述第二凸起呈阵列排布。
2.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述散热鳞片为鳞片石墨，所述散热鳞片的导热系数≥1300W/m·K。
3.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述第一凹槽呈方形或梯形结构，所述第一凹槽的深度为6μm-10μm；
所述第一凸起呈方形或梯形结构，所述第一凸起的高度为6μm-10μm。
4.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述相变型导热层为固固相变导热材料，相变温度为30°-70°。
5.根据权利要求4所述的一种高导热功率石墨膜，其特征在于：
所述固固相变导热材料为石蜡、多元醇、聚乙烯和聚乙二醇中的一种。
6.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述石墨膜沿纵向设置有多个导热通道，所述导热通道内填充有压敏型导热胶；所述压敏型导热胶为填充有导热填料的丙烯酸压敏胶、有机硅压敏胶和聚氨酯压敏胶中的一种。
7.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述石墨烯层中的石墨烯纯度为99.0％-99.65％，所述石墨烯层的厚度为12μm-20μm，所述石墨烯层的热扩散系数≥900mm2/s。
8.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述金属基层为铜、铝或钛箔层中的一种，所述缓冲层材料为聚苯乙烯、聚乙烯、聚氨酯、聚氯乙烯材料中的一种。
9.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：
所述阻燃层包括聚酯层、尼龙薄层和聚酰胺树脂层；所述聚酯层、尼龙薄层和聚酰胺树脂层之间通过导热胶粘接。
10.根据权利要求1所述的一种高导热功率石墨膜，其特征在于：所述石墨膜的导热系数为1250～1500W/m·K。
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| CN114373648A (zh) * | 2021-06-11 | 2022-04-19 | 东莞市川东电子科技有限公司 | 一种具有一体机散热结构的分体式机械键盘 |
| CN114771040A (zh) * | 2022-03-17 | 2022-07-22 | 株洲时代华昇新材料技术有限公司 | 一种石墨叠层复合材料及其制备方法 |
| CN114801357A (zh) * | 2022-04-28 | 2022-07-29 | 安徽碳华新材料科技有限公司 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
| WO2023095081A1 (en) * | 2021-11-29 | 2023-06-01 | Innovusion (suzhou) Co., Ltd. | Thermally conductive and vibration-isolating interface material |
| CN116423939A (zh) * | 2023-04-28 | 2023-07-14 | 武汉长盈通热控技术有限公司 | 一种快速吸热的热失控防护材料及其制备方法 |
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| CN114373648A (zh) * | 2021-06-11 | 2022-04-19 | 东莞市川东电子科技有限公司 | 一种具有一体机散热结构的分体式机械键盘 |
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| CN114771040A (zh) * | 2022-03-17 | 2022-07-22 | 株洲时代华昇新材料技术有限公司 | 一种石墨叠层复合材料及其制备方法 |
| CN114801357A (zh) * | 2022-04-28 | 2022-07-29 | 安徽碳华新材料科技有限公司 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
| CN114801357B (zh) * | 2022-04-28 | 2024-02-09 | 安徽碳华新材料科技有限公司 | 一种基于薄膜状人工石墨片的集成芯片用散热结构 |
| CN116423939A (zh) * | 2023-04-28 | 2023-07-14 | 武汉长盈通热控技术有限公司 | 一种快速吸热的热失控防护材料及其制备方法 |
| CN116423939B (zh) * | 2023-04-28 | 2023-11-03 | 武汉长盈通热控技术有限公司 | 一种快速吸热的热失控防护材料及其制备方法 |
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